CN106572606B - A kind of discrete device and printed circuit board integrative installation technology method - Google Patents
A kind of discrete device and printed circuit board integrative installation technology method Download PDFInfo
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- CN106572606B CN106572606B CN201610946087.0A CN201610946087A CN106572606B CN 106572606 B CN106572606 B CN 106572606B CN 201610946087 A CN201610946087 A CN 201610946087A CN 106572606 B CN106572606 B CN 106572606B
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- circuit board
- base
- printed circuit
- transformer
- relay
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- 238000009434 installation Methods 0.000 title claims abstract description 73
- 238000005516 engineering process Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 238000003825 pressing Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 230000003447 ipsilateral effect Effects 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 description 13
- 238000007789 sealing Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000013569 fruit product Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of discrete device and printed circuit board integrative installation technology method, TO packaging integrative installation technology component (1), EL type relay integrative installation technology component (2), E type flat surface transformer integrative installation technology component (3) are installed respectively, each component bottom plane is controlled at a distance from printed circuit board (4), realizes integrative installation technology.The present invention optimizes discrete device tradition assemble flow, the integral heat sink efficiency improve assembly precision, improve conducting wire welding spot reliability, improving printed circuit board and discrete device, the whole mechanical performance for improving discrete device and printed circuit board, and the integral demounting for realizing discrete device and printed circuit board assembles.
Description
Technical field
The present invention relates to a kind of discrete devices and printed circuit method of plate installation.
Background technique
With the fast development of space flight electronic product, product miniaturization, the high density of interiors of products device, product function
The high efficiency of output is the development trend of current aerospace electron product, but incident is that device is difficult to install, product tune
Try the problems such as disassembling operations difficulty；Many electronic products become one-way operation after completing assembly, once problem, product occurs
Dismounting again become extremely difficult, especially with some discrete devices for example TO packaging, E type flat surface transformer, EL type after
The installation of electric appliance is especially prominent.
The assemble flow complexity of conventional separators part with it is lengthy and tedious, operating process is general are as follows: discrete device and auxiliary assemble
Tooling trial assembly → auxiliary assembly tooling is removed auxiliary with product structure part clamping → discrete device is welded with printed circuit board conducting wire →
Assembly tooling → discrete device and product structure part is helped to fix → discrete device sealing.Adjustment phase is needed after completing assembly such as fruit product
When closing design, the repeated disassembled and assembled of product, which can reduce the assembly precision of product, the tip-off repeatedly of solder joint and multiple weldering, reduces solder joint
Reliability, heat filling smear repeatedly increase thermal contact resistance reduce the heat dissipation of product, fastener disassembly repeatedly drop
Low screw strength thereby reduces the mechanical ability of discrete device and printed circuit board.
Summary of the invention
Technical problem solved by the present invention is having overcome the deficiencies of the prior art and provide a kind of discrete device and printing electricity
Road plate integrative installation technology method, optimization discrete device tradition assemble flow, improve assembly precision, improve conducting wire welding spot reliability,
It improves the integral heat sink efficiency of printed circuit board and discrete device, improve the whole mechanical of discrete device and printed circuit board
Can, the integral demounting for realizing discrete device and printed circuit board assembles.
The technical solution of the invention is as follows: a kind of discrete device and printed circuit board integrative installation technology method, including step
It is rapid as follows:
Step 1: on a printed circuit board by the installation of TO packaging integrative installation technology component, TO packaging integration
Mounting assembly includes TO packaging, heat conductive pad and heat filling, base, support column, and installation method is as follows:
1.1, heat conductive pad and heat filling are uniformly smeared and is pasted on base, there is bulge-structure, heat conductive pad on base
And heat filling is pasted onto the side of not bulge-structure；TO packaging is fixedly mounted on heat conductive pad and heat filling；
1.2, support column is respectively and fixedly installed to base not install in the two corners of TO packaging side, support column one end
Be mounted on base, the other end is mounted on printed circuit board so that TO packaging upper surface and printed circuit board distance >=
2mm；
Step 2: on a printed circuit board by the installation of E type flat surface transformer integrative installation technology component, with TO packaging one
It is ipsilateral that body mounting assembly is located at printed circuit board, and E type flat surface transformer integrative installation technology component includes heat conductive pad and thermally conductive fills out
Material, transformer base, transformer pressing plate, one-component sulphurated siliastic, E type flat surface transformer, installation method are as follows:
2.1, E type flat surface transformer is adhered on transformer base by one-component sulphurated siliastic, one-component vulcanization
Silicon rubber is between E type flat surface transformer and transformer base；
2.2, heat conductive pad and heat filling are uniformly smeared and is pasted on transformer pressing plate, transformer pressing plate is compressed into E
Type flat surface transformer, heat conductive pad and heat filling are between transformer pressing plate, E type flat surface transformer；By transformer pressing plate both ends
It is butted against and fixed installation with transformer base two sides mounting base, so that E type flat surface transformer is pressed on transformer base and transformation
Between device pressing plate；
2.3, transformer base is mounted on printed circuit board by the connecting column of transformer base surrounding；
Step 3: on a printed circuit board by the installation of EL type relay integrative installation technology component, with TO packaging one
Change mounting assembly and is located at that printed circuit board is ipsilateral, and EL type relay integrative installation technology component includes relay base, electrostatic leakage
Printed board, EL type relay, installation steps are as follows:
3.1, electrostatic leakage printed board is mounted on relay base, EL type relay is mounted on electrostatic leakage printing
On plate, the type relay both ends EL are passed through into fastener and electrostatic leakage printed board, relay base；
3.2, relay base is connect by the support column of surrounding with printed circuit board；
Step 4: TO packaging, E type flat surface transformer, EL type relay are passed through conducting wire and phase on printed circuit board
The pad answered is welded；
Step 5: the bottom surface of adjustment base, transformer base, relay base, makes base, transformer base, relay
Height of the bottom surface of base apart from printed circuit board is consistent, and base, transformer base, relay base are separately fixed at outside
On structural member mounting surface.
In the step 1.1, the thickness of control heat conductive pad and heat filling is within the scope of 0.3mm~0.5mm, control TO envelope
Dress device edge is at a distance from base bulge-structure within the scope of 1mm~2mm.
In the step 2.1, one-component sulphurated siliastic thickness is controlled within the scope of 0.3mm~0.5mm, and control E type is flat
Face transformer is at a distance from transformer base edge in 1mm~2mm.
In the step 2.2, the thickness of control heat conductive pad and heat filling is within the scope of 0.25~0.38mm.
In the step 3.1, the fastener end of EL type relay and relay base, electrostatic leakage printed board will be connected
Across unidirectional weld tabs, after being then passed through insulation sleeve, it is fixed；The fastener is screw.
In the step 3.1, electrostatic leakage printed board thickness is controlled within the scope of 1.6mm~2mm, controls EL type relay
With relay base Edge Distance within the scope of 1mm~2mm.
The distance range of the TO packaging part, E type flat surface transformer or EL type relay conducting wire solder joint and printed circuit board
For 10mm~15mm.
Heat filling is heat-conducting silicone grease in the heat conductive pad and heat filling.
The advantages of the present invention over the prior art are that:
(1) present invention changes the conventional mounting that conventional separators part is installed independently of one another with printed circuit board and conducting wire is connect
Method improves the efficiency and installation accuracy of the installation of printed circuit board functional unit, realizes discrete device and printed circuit board
Integral demounting assembly.
(2) present invention change conventional separators part and printed circuit board connecting wire solder joint as caused by repeated disassembled and assembled by
Power, printed circuit and discrete device integrative installation technology avoid the tip-off repeatedly of solder joint, improve welding spot reliability；It changes simultaneously
Multiple weldering-the solution of the tip-off-repeatedly of connecting wire between discrete device and printed circuit board in the links such as Product Assembly, maintenance, debugging
The lengthy and tedious operation sequence and process weld-welded again realize discrete device dismounting integrated with printed circuit；
(3) present invention changes common PCB and discrete device relative distribution and single heat dissipation path, printed board with point
The heat dissipation path for realizing cross multi-channel from device integrative installation technology is established, and the entirety of printed circuit board and discrete device is improved
Heat dissipation；
(4) present invention changes the mechanical mode of traditional printed circuit board and discrete device dispersion installation, stress alone,
Printed board and discrete device integrative installation technology improve the integral rigidity of printed circuit board, change the stress ring of each discrete device
Mechanical environment capacity is improved in border.
Detailed description of the invention
Fig. 1 is discrete device of the present invention and printed circuit board integrative installation technology schematic three dimensional views.
Fig. 2 is TO packaging integrative installation technology basic structure schematic diagram of the present invention；
Fig. 3 is TO packaging integrative installation technology schematic three dimensional views of the present invention；
Fig. 4 is E type flat surface transformer integrative installation technology basic structure schematic diagram of the present invention；
Fig. 5 is E type flat surface transformer integrative installation technology schematic three dimensional views of the present invention；
Fig. 6 is EL type relay integrative installation technology basic structure schematic diagram of the present invention；
Fig. 7 is EL type relay integrative installation technology schematic three dimensional views of the present invention.
Specific embodiment
As shown in Figure 1, discrete device and printed circuit board integrative installation technology include: TO packaging integrative installation technology component
1, the installation of EL type relay integrative installation technology component 2, E type flat surface transformer integrative installation technology component 3.
As shown in Figure 2 and Figure 3, TO packaging integrative installation technology component 1 includes: TO packaging 7, heat conductive pad and thermally conductive
Filler 8, base 9, support column 10 (detachable)；
As shown in Figure 4, Figure 5, E type flat surface transformer integrative installation technology component 3 includes: heat conductive pad and heat filling 8, transformation
Device base 11, transformer pressing plate 12, one-component sulphurated siliastic 13, E type flat surface transformer 14；
As shown in Figure 6, Figure 7, EL type relay integrative installation technology component 2 includes: relay base 17, electrostatic leakage printing
Plate 18, unidirectional weld tabs 19, insulation sleeve 20, EL type relay 21；
As shown in Figure 1, a kind of discrete device and printed circuit board integrative installation technology method, comprise the following steps that
(1) as shown in Figure 2 and Figure 3, TO packaging integrative installation technology group is completed by fastening screw and reserved threaded hole
The integrative installation technology of part 1 and printed circuit board 4, design processing and installation steps are as follows:
A) part base 9, support column 10 (detachable) are processed in design first；It should be noted that L1, H, h, a tetra- in figure when design
The selection of size: H is determined by h, L1 and printed board away from structure mounting surface height；H is TO packaging away between the safety of printed board
Away from answering >=2mm, the design of h value should include 8 thickness of heat conductive pad+heat-conducting glue, and heat conductive pad and heat filling 8 are with a thickness of 0.3~0.5mm；
L1 is the 7 conducting wire solder joint of radius bend, that is, TO packaging part of welding lead 5 at a distance from printed circuit board 4, generally 10~15mm,
It is advisable with 10mm；" a " value is TO packaging 7 away from 9 edge spacing of base, and general 1~2mm (one week), which is dispensing sealing
It uses.9 thickness of base is advisable with 1.5~2mm；Base 9 should reserve and structural member (pedestal of module or complete machine) 6 connection screw threads,
The position that should avoid fishing line, device pin and dispensing sealing simultaneously, is advisable, depth is generally with 3~5 screw pitch with M2.5 screw thread
Preferably.
B) heat conductive pad+heat filling 8 is uniformly pasted and is applied on base 9；It is thermally conductive in heat conductive pad and heat filling 8 to fill out
Material is heat-conducting silicone grease.
C) TO packaging 7 is placed on heat conductive pad+heat filling 8, it is fixed by fastening screw and base 9；
D) support column (detachable) 10 is fixed by fastening screw and base 9, on support column (detachable) 10 there are with
The threaded hole that printed circuit board 4 is installed；
(2) as shown in Figure 4, Figure 5, E type flat surface transformer integration peace is completed by fastening screw and reserved threaded hole
The integrative installation technology of arrangement 3 and printed circuit board 4, design processing and installation steps are as follows:
A) part transformer base 11, transformer pressing plate 12 are processed in design first；
It should be noted that the selection of tetra- sizes of L2, H, h1, h2, b in figure when design；Wherein the size selection of H is by L and printed board
It is influenced away from structure mounting surface height, L2 is the radius bend of welding lead 5 on winding 15, and generally 10~15mm is with 10mm
Preferably；H1 is the thickness of heat conductive pad+heat filling 8, is advisable with 0.25~0.38mm, and purpose is to prevent rigid contact, damages magnetic core；
H2 is 13 thickness of one-component sulphurated siliastic, generally 0.3~0.5mm；B is E type flat surface transformer 14 and transformer base 11
Back gauge value, general 1~2mm (one week), the back gauge are dispensing sealing.The design of transformer base is considered as including winding 15
Largest enveloping space.11 upper pillar stand of transformer base should be designed to logical threaded hole, be advisable with the logical screw thread of M2.5, top is
With printed circuit board integrative installation technology use, thread portions be reserve connect spiral shell with structural member (pedestal of module or complete machine) 6
Line.
B) E type flat surface transformer 14 is adhered on transformer base 11 by one-component sulphurated siliastic 13, bonding process
In should control bondline thickness h2 and transformer and transformer base back gauge b value；
C) heat conductive pad+heat filling 8 is uniformly pasted and is applied on transformer pressing plate 12, paste and answered during smearing
Control gap h1 between transformation pressing plate 12 and magnetic core of transformer；
D) check whether transformer pressing plate 12 compresses E type flat surface transformer 14；
E) transformer pressing plate 12 is fixed by fastener and transformer base 11, on transformer base 11 there are with printing
The threaded hole that circuit board 4 is installed；
(3) as shown in Figure 6, Figure 7, EL type relay integrative installation technology group is completed by fastening screw and reserved threaded hole
The integrative installation technology of part 2 and printed circuit board 4, design processing and installation steps are as follows:
A) part relay base 17, insulation sleeve 20 are processed in design first；It should be noted that L3, H, h, c tetra- in figure when design
The selection of size；Wherein the size selection of H is influenced by h, L3 and printed board away from structure mounting surface height；H is EL type relay 21
Safe spacing away from printed board, answers >=2mm, and the design of h value should include 18 thickness of electrostatic leakage printed board, electrostatic leakage printed board 18
Generally 1.6~2mm；L3 is the radius bend of welding lead 5, generally 10~15mm；C value is EL type relay 21 and relay
17 spacing of device base, general 1~2mm (one week), the spacing are dispensing sealing.Relay base thickness is advisable with 1.5~2mm；
Should be reserved on relay base 17 with structural member (pedestal of module or complete machine) 6 connection screw threads, on 17 upper pillar stand of relay base
Screw thread is designed with transformer base 11, and screw thread is designed with base 9 on non-column.Relay insulation sleeve 20 (insulating materials, generally
Polyimides) realize that relay is insulated.
B) electrostatic leakage printed board 18 is placed on relay base 17, is installed under EL type relay 21；
C) EL type relay 21 is fixed on according to the sequence of insulation sleeve 20 after first unidirectional weld tabs 19 using screw fastener
On relay base 17；
D) by welding lead 5 complete unidirectional weld tabs 19 with by the welding of electrostatic leakage printed board 18；Relay base 17
On be reserved with printed circuit board 4 install threaded hole.
(4) TO packaging 7, E type flat surface transformer 14, EL type relay 21 and 4 welding lead 5 of printed circuit board are completed
Welding.
(5) component after discrete device and printed circuit board integrative installation technology is fixed on by structural member by fastening screw
On (pedestal of module or complete machine) 6, Product Assembly is completed.
The content that description in the present invention is not described in detail belongs to the well-known technique of those skilled in the art.
Claims (8)
1. a kind of discrete device and printed circuit board integrative installation technology method, which is characterized in that comprise the following steps that
Step 1: TO packaging integrative installation technology component (1) is mounted on printed circuit board (4), TO packaging one
Changing mounting assembly (1) includes TO packaging (7), heat conductive pad and heat filling (8), base (9), support column (10), installation side
Method is as follows:
1.1, heat conductive pad and heat filling (8) are uniformly smeared and is pasted on base (9), base has bulge-structure on (9), leads
Heat pad and heat filling (8) are pasted onto the side of not bulge-structure；TO packaging (7) is fixedly mounted on heat conductive pad and is led
On hot filler (8)；
1.2, support column (10) is respectively and fixedly installed to base (9) not install in the two corners of TO packaging (7) side, is supported
Column (10) one end is mounted on base (9), and the other end is mounted on printed circuit board (4) so that TO packaging (7) upper surface with
Printed circuit board (4) distance >=2mm；
Step 2: E type flat surface transformer integrative installation technology component (3) is mounted on printed circuit board (4), with TO packaging
Integrative installation technology component (1) is located at that printed circuit board (4) is ipsilateral, and E type flat surface transformer integrative installation technology component (3) includes thermally conductive
Pad and heat filling (8), transformer base (11), transformer pressing plate (12), one-component sulphurated siliastic (13), E type plane become
Depressor (14), installation method is as follows:
2.1, E type flat surface transformer (14) is adhered on transformer base (11) by one-component sulphurated siliastic (13), it is single
Component sulphurated siliastic (13) is located between E type flat surface transformer (14) and transformer base (11)；
2.2, heat conductive pad and heat filling (8) are uniformly smeared and is pasted on transformer pressing plate (12), by transformer pressing plate
(12) E type flat surface transformer (14) are compressed, heat conductive pad and heat filling (8) are in transformer pressing plate (12), E type flat surface transformer
(14) between；Transformer pressing plate (12) both ends and transformer base (11) two sides mounting base are butted against and fixed installation, so that E type
Flat surface transformer (14) is pressed between transformer base (11) and transformer pressing plate (12)；
2.3, transformer base (11) is mounted on printed circuit board (4) by the connecting column of transformer base (11) surrounding；
Step 3: EL type relay integrative installation technology component (2) is mounted on printed circuit board (4), with TO packaging one
Body mounting assembly (1) is located at that printed circuit board (4) is ipsilateral, and EL type relay integrative installation technology component (2) includes relay pad
Seat (17), electrostatic leakage printed board (18), EL type relay (21), installation steps are as follows:
3.1, electrostatic leakage printed board (18) is mounted on relay base (17), EL type relay (21) is mounted on electrostatic
It releases on printed board (18), EL type relay (21) both ends is passed through into fastener and electrostatic leakage printed board (18), relay pad
Seat (17) connection；
3.2, relay base (17) is connect by the support column (10) of surrounding with printed circuit board (4)；
Step 4: TO packaging (7), E type flat surface transformer (14), EL type relay (21) are passed through conducting wire (5) and printing
Corresponding pad is welded on circuit board (4)；
Step 5: the bottom surface of adjustment base (9), transformer base (11), relay base (17), makes base (9), transformer pad
Seat (11), height of the bottom surface apart from printed circuit board (4) of relay base (17) are consistent, by base (9), transformer base
(11), relay base (17) is separately fixed on outer structural parts (6) mounting surface.
2. a kind of discrete device according to claim 1 and printed circuit board integrative installation technology method, it is characterised in that: institute
It states in step 1.1, the thickness of control heat conductive pad and heat filling (8) controls TO packaging within the scope of 0.3mm~0.5mm
(7) edge is at a distance from base (9) bulge-structure within the scope of 1mm~2mm.
3. a kind of discrete device according to claim 1 or 2 and printed circuit board integrative installation technology method, feature exist
In: in the step 2.1, one-component sulphurated siliastic (13) thickness is controlled within the scope of 0.3mm~0.5mm, controls E type plane
Transformer (14) is at a distance from transformer base (11) edge in 1mm~2mm.
4. a kind of discrete device according to claim 3 and printed circuit board integrative installation technology method, it is characterised in that: institute
It states in step 2.2, the thickness of control heat conductive pad and heat filling (8) is within the scope of 0.25~0.38mm.
5. a kind of discrete device according to claim 1 or 2 and printed circuit board integrative installation technology method, feature exist
In: in the step 3.1, by connect EL type relay (21) and relay base (17), electrostatic leakage printed board (18) it is tight
Firmware end passes through unidirectional weld tabs (19) and is fixed after being then passed through insulation sleeve (20)；The fastener is screw.
6. a kind of discrete device according to claim 5 and printed circuit board integrative installation technology method, it is characterised in that: institute
State in step 3.1, control electrostatic leakage printed board (18) thickness within the scope of 1.6mm~2mm, control EL type relay (21) with
Relay base (17) Edge Distance is within the scope of 1mm~2mm.
7. a kind of discrete device according to claim 1 or 2 and printed circuit board integrative installation technology method, feature exist
In: the TO packaging part (7), E type flat surface transformer (14) or EL type relay (21) conducting wire solder joint and printed circuit board (4)
Distance range is 10mm~15mm.
8. a kind of discrete device according to claim 1 or 2 and printed circuit board integrative installation technology method, feature exist
In: heat filling is heat-conducting silicone grease in the heat conductive pad and heat filling (8).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610946087.0A CN106572606B (en) | 2016-11-02 | 2016-11-02 | A kind of discrete device and printed circuit board integrative installation technology method |
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| CN201610946087.0A CN106572606B (en) | 2016-11-02 | 2016-11-02 | A kind of discrete device and printed circuit board integrative installation technology method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107734875B (en) * | 2017-11-30 | 2023-12-26 | 天津光电通信技术有限公司 | Combined pressing plate structure for PCB welding optical power meter and fixing method |
| CN109698453B (en) * | 2018-12-29 | 2020-04-21 | 中电科仪器仪表有限公司 | USB female connector welding device and method |
| CN111081457A (en) * | 2020-01-16 | 2020-04-28 | 上海航天电子通讯设备研究所 | Mounting mode of satellite-borne planar transformer |
| CN113571309B (en) * | 2021-07-23 | 2022-08-05 | 西安微电机研究所有限公司 | Installation structure and process of large-volume inductor for aerospace field |
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| WO2010130654A1 (en) * | 2009-05-12 | 2010-11-18 | Würth Elektronik Ics Gmbh & Co. Kg | Pluggable varistor |
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| DE202013102221U1 (en) * | 2013-05-22 | 2013-06-06 | Göpel electronic GmbH | AOI system for component and soldering point control of assembled printed circuit boards |
| CN103596365A (en) * | 2013-11-28 | 2014-02-19 | 上海空间电源研究所 | Installation structure of power tubes and printed circuit board |
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| CN106572606A (en) | 2017-04-19 |
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