CN106572606A - Separating device and printed circuit board integrated installation method - Google Patents
Separating device and printed circuit board integrated installation method Download PDFInfo
- Publication number
- CN106572606A CN106572606A CN201610946087.0A CN201610946087A CN106572606A CN 106572606 A CN106572606 A CN 106572606A CN 201610946087 A CN201610946087 A CN 201610946087A CN 106572606 A CN106572606 A CN 106572606A
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- circuit board
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- printed circuit
- relay
- installation technology
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- 238000009434 installation Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 238000005516 engineering process Methods 0.000 claims description 49
- 238000003825 pressing Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 description 13
- 238000003754 machining Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000013569 fruit product Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Abstract
The invention discloses a separating device and printed circuit board integrated installation method, and the method comprises the steps: respectively installing a TO packaging device integrated installation assembly (1), an EL-type relay integrated installation assembly (2), and an E-type plane transformer integrated installation assembly (3); controlling the distance from the bottom surface of each assembly to a printed circuit board (4), and achieving the integrated installation. The method optimizes the conventional assembly flow of a separating device, improves the assembly precision, improves the welding point reliability of a wire, improves the overall heat-dissipation efficiency of the printed circuit board and the separating device, improves the overall anti-mechanical performance of the separating device and the printed circuit board, and achieves the overall disassembly and assembly of the separating device and the printed circuit board.
Description
Technical field
The present invention relates to a kind of discrete device and printed circuit method of plate installation.
Background technology
With the fast development of space flight electronic product, product miniaturization, the high density of interiors of products device, product function
The high efficiency of output is the development trend of current aerospace electron product, but incident is device installation difficulty, product tune
The problems such as examination disassembling operations difficulty；Many electronic products complete to become one-way operation after assembling, once there is problem, product
Dismounting again become extremely difficult, especially with some discrete devices such as TO packagings, E type flat surface transformers, EL types after
The installation of electrical equipment is especially prominent.
The assemble flow of conventional separators part it is complicated with it is lengthy and tedious, its operating process is generally：Discrete device and auxiliary assembling
Frock trial assembly → auxiliary assembly tooling welds → removes auxiliary with product structure part clamping → discrete device and printed circuit board wire
Assembly tooling → discrete device is helped to fix → discrete device sealing with product structure part.As fruit product completes to need to adjust phase after assembling
When closing design, the repeated disassembled and assembled of product can reduce the assembly precision of product, the tip-off repeatedly of solder joint and reduce solder joint with multiple weldering
Reliability, heat filling are smeared and increased the drop of dismounting repeatedly that thermal contact resistance reduces the heat dissipation of product, securing member repeatedly
Low screw strength and then reduce the mechanical ability of discrete device and printed circuit board.
The content of the invention
Present invention solves the technical problem that being：Overcome the deficiencies in the prior art, there is provided a kind of discrete device and printing electricity
Road plate integrative installation technology method, optimization discrete device tradition assemble flow, improve assembly precision, improve wire welding spot reliability,
Improve the overall mechanical of printed circuit board and the integral heat sink efficiency, raising discrete device and printed circuit board of discrete device
Can, realize discrete device and assemble with the integral demounting of printed circuit board.
The present invention technical solution be：A kind of discrete device and printed circuit board integrative installation technology method, including step
It is rapid as follows：
Step one, by TO packaging integrative installation technologies component install on a printed circuit board, TO packagings integration
Mounting assembly includes TO packagings, heat conductive pad and heat filling, base, support column, and installation method is as follows：
1.1st, by heat conductive pad and heat filling uniform application and it is pasted onto on base, there is bulge-structure, heat conductive pad on base
And heat filling is pasted onto the side without bulge-structure；TO packagings are fixedly mounted on heat conductive pad and heat filling；
1.2nd, support column is respectively and fixedly installed to into base not install on two jiaos of TO packagings side, support column one end
On base, the other end is arranged on printed circuit board so that and TO packagings upper surface and printed circuit board distance >=
2mm；
Step 2, by E type flat surface transformer integrative installation technologies component install on a printed circuit board, with TO packagings one
Body mounting assembly is located at printed circuit board homonymy, and E type flat surface transformer integrative installation technologies component includes that heat conductive pad and heat conduction are filled out
Material, transformator base, transformer pressing plate, one-component sulphurated siliastic, E type flat surface transformers, installation method is as follows：
2.1st, E types flat surface transformer is adhered on transformator base by one-component sulphurated siliastic, one-component sulfuration
Silicone rubber is located between E types flat surface transformer and transformator base；
2.2nd, by heat conductive pad and heat filling uniform application and it is pasted onto on transformer pressing plate, transformer pressing plate is compressed into E
Type flat surface transformer, heat conductive pad and heat filling are between transformer pressing plate, E type flat surface transformers；By transformer pressing plate two ends
Dock and fixedly mount with transformator base both sides mounting seat so that E type flat surface transformers are pressed on transformator base and transformation
Between device pressing plate；
2.3rd, transformator base is arranged on printed circuit board by the connecting pole of transformator base surrounding；
Step 3, by EL type relay integrative installation technologies component install on a printed circuit board, with TO packagings one
Change mounting assembly and be located at printed circuit board homonymy, EL type relay integrative installation technologies component includes relay base, electrostatic leakage
Printed board, EL type relays, installation steps are as follows：
3.1st, electrostatic leakage printed board is arranged on relay base, EL types relay is printed installed in electrostatic leakage
On plate, by EL type relays two ends by securing member and electrostatic leakage printed board, relay base；
3.2nd, relay base is connected by the support column of surrounding with printed circuit board；
Step 4, by TO packagings, E type flat surface transformers, EL types relay by wire and phase on printed circuit board
The pad answered is welded；
Step 5, adjustment base, transformator base, the bottom surface of relay base, make base, transformator base, relay
Base, transformator base, relay base are separately fixed at outside by the bottom surface of base apart from the highly consistent of printed circuit board
On structural member mounting surface.
In the step 1.1, in the range of 0.3mm～0.5mm, control TO is sealed the thickness of control heat conductive pad and heat filling
The distance of dress device edge and base bulge-structure is in the range of 1mm～2mm.
In the step 2.1, control one-component sulphurated siliastic thickness in the range of 0.3mm～0.5mm, put down by control E types
The distance at face transformator and transformator base edge is in 1mm～2mm.
In the step 2.2, the thickness of control heat conductive pad and heat filling is in the range of 0.25～0.38mm.
In the step 3.1, by connection EL types relay and relay base, the fastener end of electrostatic leakage printed board
Through unidirectional weld tabs, after being then passed through insulation sleeve, it is fixed；The securing member is screw.
In the step 3.1, control electrostatic leakage printed board thickness controls EL type relays in the range of 1.6mm～2mm
With relay base Edge Distance in the range of 1mm～2mm.
The distance range of the TO packaging parts, E types flat surface transformer or EL types relay wire solder joint and printed circuit board
For 10mm～15mm.
Heat filling is heat-conducting silicone grease in the heat conductive pad and heat filling.
Present invention advantage compared with prior art is：
(1) present invention changes the conventional mounting that conventional separators part is installed independently of one another with printed circuit board and wire is connected
Method, improves efficiency and installation accuracy that printed circuit board functional unit is installed, realizes discrete device with printed circuit board
Integral demounting is assembled.
(2) present invention change conventional separators part and printed circuit board connecting wire due to caused by repeated disassembled and assembled solder joint receive
Power, printed circuit avoids the tip-off repeatedly of solder joint with discrete device integrative installation technology, improves welding spot reliability；Change simultaneously
In the links such as Product Assembly, maintenance, debugging between discrete device and printed circuit board connecting wire tip-off repeatedly-multiple weldering-solution
The lengthy and tedious operation sequence and flow process of weldering-multiple weldering, realizes discrete device dismounting integrated with printed circuit；
(3) present invention changes common PCB and discrete device relative distribution and single heat dissipation path, printed board with point
The heat dissipation path for realizing cross multi-channel from device integrative installation technology is set up, and improves the entirety of printed circuit board and discrete device
Heat dissipation；
(4) present invention change traditional printed circuit board and discrete device disperse to install, the mechanical pattern of stress alone,
Printed board improves the integral rigidity of printed circuit board with discrete device integrative installation technology, changes the stress ring of each discrete device
Border, improves mechanical environment capacity.
Description of the drawings
Fig. 1 is discrete device of the present invention and printed circuit board integrative installation technology schematic three dimensional views.
Fig. 2 is TO packagings integrative installation technology basic structure schematic diagram of the present invention；
Fig. 3 is TO packagings integrative installation technology schematic three dimensional views of the present invention；
Fig. 4 is E types flat surface transformer integrative installation technology basic structure schematic diagram of the present invention；
Fig. 5 is E types flat surface transformer integrative installation technology schematic three dimensional views of the present invention；
Fig. 6 is EL types relay integrative installation technology basic structure schematic diagram of the present invention；
Fig. 7 is EL types relay integrative installation technology schematic three dimensional views of the present invention.
Specific embodiment
As shown in figure 1, discrete device includes with printed circuit board integrative installation technology：TO packaging integrative installation technology components
1st, EL types relay integrative installation technology component 2, the installation of E type flat surface transformer integrative installation technologies component 3.
As shown in Figure 2 and Figure 3, TO packagings integrative installation technology component 1 includes：TO packagings 7, heat conductive pad and heat conduction
Filler 8, base 9, support column 10 (detachable)；
As shown in Figure 4, Figure 5, E types flat surface transformer integrative installation technology component 3 includes：Heat conductive pad and heat filling 8, transformation
Device base 11, transformer pressing plate 12, one-component sulphurated siliastic 13, E types flat surface transformer 14；
As shown in Figure 6, Figure 7, EL types relay integrative installation technology component 2 includes：Relay base 17, electrostatic leakage is printed
Plate 18, unidirectional weld tabs 19, insulation sleeve 20, EL types relay 21；
As shown in figure 1, a kind of discrete device and printed circuit board integrative installation technology method, including step is as follows：
(1) as shown in Figure 2 and Figure 3, TO packaging integrative installation technology groups are completed by trip bolt and reserved screwed hole
The integrative installation technology of part 1 and printed circuit board 4, Design and Machining and installation steps it is as follows：
A) Design and Machining part base 9, support column 10 (detachable) first；L1, H, h, a tetra- in figure are should be noted that during design
The selection of size:H is highly determined by h, L1 and printed board away from structure mounting surface；H is between safety of the TO packagings away from printed board
Away from, answer >=2mm, the design of h values to include the thickness of heat conductive pad+heat-conducting glue 8, heat conductive pad and the thickness of heat filling 8 are 0.3～0.5mm；
L1 for welding lead 5 radius bend be the wire solder joint of TO packaging parts 7 and printed circuit board 4 distance, generally 10～15mm,
It is advisable with 10mm；" a " value is TO packagings 7 away from the Distances Between Neighboring Edge Points of base 9, and general 1～2mm (a week), the value is dispensing sealing
Use.The thickness of base 9 is advisable with 1.5～2mm；Base 9 should be reserved and structural member (base of module or whole machine) 6 connection screw threads,
The position of fishing line, device pin and dispensing sealing should being avoided simultaneously, being advisable with M2.5 screw threads, depth is typically with 3～5 pitch
Preferably.
B) heat conductive pad+heat filling 8 is uniformly pasted and is applied on base 9；Heat conduction in heat conductive pad and heat filling 8 is filled out
Expect for heat-conducting silicone grease.
C) TO packagings 7 are positioned on heat conductive pad+heat filling 8, are fixed with base 9 by trip bolt；
D) support column (detachable) 10 is fixed by trip bolt with base 9, leave on support column (detachable) 10 with
The screwed hole that printed circuit board 4 is installed；
(2) as shown in Figure 4, Figure 5, E types flat surface transformer integration peace is completed by trip bolt and reserved screwed hole
The integrative installation technology of arrangement 3 and printed circuit board 4, Design and Machining and installation steps it is as follows：
A) Design and Machining part transformator base 11, transformer pressing plate 12 first；
The selection of tetra- sizes of L2, H, h1, h2, b in figure is should be noted that during design；Wherein the size Selection of H is by L and printed board
Highly affect away from structure mounting surface, L2 is the radius bend of welding lead 5 on winding 15, generally 10～15mm is with 10mm
Preferably；H1 is the thickness of heat conductive pad+heat filling 8, is advisable with 0.25～0.38mm, and purpose damages magnetic core to prevent rigid contact；
H2 be the thickness of one-component sulphurated siliastic 13, generally 0.3～0.5mm；B is E types flat surface transformer 14 and transformator base 11
Back gauge value, general 1～2mm (a week), the back gauge is dispensing sealing.The design of transformator base is considered as including including winding 15
Largest enveloping space.The upper pillar stand of transformator base 11 should be designed to logical screwed hole, be advisable with the logical screw thread of M2.5, and top is
Use with printed circuit board integrative installation technology, thread portions are reserved to be connected spiral shell with structural member (base of module or whole machine) 6
Stricture of vagina.
B) E types flat surface transformer 14 is adhered on transformator base 11 by one-component sulphurated siliastic 13, bonding process
In should control bondline thickness h2 and transformator and transformator base back gauge b value；
C) heat conductive pad+heat filling 8 is uniformly pasted and is applied on transformer pressing plate 12, should during pasting and smearing
Gap h1 between control transformation pressing plate 12 and magnetic core of transformer；
D) check whether transformer pressing plate 12 compresses E types flat surface transformer 14；
E) transformer pressing plate 12 is fixed by securing member with transformator base 11, is left on transformator base 11 and printing
The screwed hole that circuit board 4 is installed；
(3) as shown in Figure 6, Figure 7, EL type relay integrative installation technology groups are completed by trip bolt and reserved screwed hole
The integrative installation technology of part 2 and printed circuit board 4, Design and Machining and installation steps it is as follows：
A) Design and Machining part relay base 17 first, insulation sleeve 20；L3, H, h, c tetra- in figure are should be noted that during design
The selection of size；Wherein the size Selection of H is highly affected by h, L3 and printed board away from structure mounting surface；H is EL types relay 21
Away from the safe spacing of printed board, should >=2mm, the design of h values should be including the thickness of electrostatic leakage printed board 18, electrostatic leakage printed board 18
Generally 1.6～2mm；L3 for welding lead 5 radius bend, generally 10～15mm；C values are EL types relay 21 and relay
The spacing of device base 17, general 1～2mm (a week), the spacing is dispensing sealing.Relay base thickness is advisable with 1.5～2mm；
Should reserve on relay base 17 and structural member (base of module or whole machine) 6 connection screw threads, on the upper pillar stand of relay base 17
Screw thread is designed with transformator base 11, and screw thread is designed with base 9 on non-column.Relay insulation sleeve 20 (insulant, generally
Polyimides) realize relay insulating mounting.
B) electrostatic leakage printed board 18 is placed on relay base 17, is installed under EL types relay 21；
C) using screw fastener EL types relay 21 is fixed on according to the order of insulation sleeve 20 after first unidirectional weld tabs 19
On relay base 17；
D) unidirectional weld tabs 19 and the welding by electrostatic leakage printed board 18 are completed by welding lead 8；Relay base 17
On be reserved with printed circuit board 4 install screwed hole.
(4) TO packagings 7, E types flat surface transformer 14, EL types relay 21 and the welding lead 5 of printed circuit board 4 are completed
Welding.
(5) component after discrete device and printed circuit board integrative installation technology is fixed on by structural member by trip bolt
On (base of module or whole machine) 6, Product Assembly is completed.
The content not being described in detail in description of the invention belongs to the known technology of those skilled in the art.
Claims (8)
1. a kind of discrete device and printed circuit board integrative installation technology method, it is characterised in that as follows including step：
Step one, by TO packagings integrative installation technology component (1) on printed circuit board (4), TO packagings one
Change mounting assembly (1) including TO packagings (7), heat conductive pad and heat filling (8), base (9), support column (10), installation side
Method is as follows：
1.1st, by heat conductive pad and heat filling (8) uniform application and it is pasted onto on base (9), base has bulge-structure on (9), leads
Heat pad and heat filling (8) are pasted onto the side without bulge-structure；TO packagings (7) are fixedly mounted on into heat conductive pad and are led
On hot filler (8)；
1.2nd, support column (10) is respectively and fixedly installed to into base (9) not install on two jiaos of TO packagings (7) side, is supported
Post (10) one end be arranged on base (9) on, the other end be arranged on printed circuit board (4) so that TO packagings (7) upper surface with
Printed circuit board (4) distance >=2mm；
Step 2, by E types flat surface transformer integrative installation technology component (3) on printed circuit board (4), with TO packagings
, positioned at printed circuit board (4) homonymy, E types flat surface transformer integrative installation technology component (3) is including heat conduction for integrative installation technology component (1)
Pad and heat filling (8), transformator base (11), transformer pressing plate (12), one-component sulphurated siliastic (13), E types plane become
Depressor (14), installation method is as follows：
2.1st, E type flat surface transformers (14) is adhered on transformator base (11) by one-component sulphurated siliastic (13), it is single
Component sulphurated siliastic (13) is between E type flat surface transformers (14) and transformator base (11)；
2.2nd, by heat conductive pad and heat filling (8) uniform application and it is pasted onto on transformer pressing plate (12), by transformer pressing plate
(12) E type flat surface transformers (14) is compressed, heat conductive pad and heat filling (8) are in transformer pressing plate (12), E type flat surface transformers
(14) between；Transformer pressing plate (12) two ends are docked and fixedly mounted with transformator base (11) both sides mounting seat so that E types
Flat surface transformer (14) is pressed between transformator base (11) and transformer pressing plate (12)；
2.3rd, by the connecting pole of transformator base (11) surrounding by transformator base (11) on printed circuit board (4)；
Step 3, by EL types relay integrative installation technology component (2) on printed circuit board (4), with TO packagings one
, positioned at printed circuit board (4) homonymy, EL types relay integrative installation technology component (2) is including relay pad for body mounting assembly (1)
Seat (17), electrostatic leakage printed board (18), EL type relays (21), installation steps are as follows：
3.1st, by electrostatic leakage printed board (18) on relay base (17), by EL type relays (21) installed in electrostatic
Release in printed board (18), by EL type relay (21) two ends by securing member and electrostatic leakage printed board (18), relay pad
Seat (17)；
3.2nd, relay base (17) is connected by the support column (10) of surrounding with printed circuit board (4)；
Step 4, by TO packagings (7), E type flat surface transformers (14), EL type relays (21) by wire (5) with print
Corresponding pad is welded on circuit board (4)；
Step 5, adjustment base (9), transformator base (11), the bottom surface of relay base (17), make base (9), transformer pad
Seat (11), the bottom surface of relay base (17) apart from the highly consistent of printed circuit board (4), by base (9), transformator base
(11), relay base (17) is separately fixed on outer structural parts (6) mounting surface.
2. a kind of discrete device according to claim 1 and printed circuit board integrative installation technology method, it is characterised in that：Institute
In stating step 1.1, the thickness of control heat conductive pad and heat filling (8) controls TO packagings in the range of 0.3mm～0.5mm
(7) distance of edge and base (9) bulge-structure is in the range of 1mm～2mm.
3. a kind of discrete device according to claim 1 and 2 and printed circuit board integrative installation technology method, its feature exists
In：In the step 2.1, control one-component sulphurated siliastic (13) thickness controls E type planes in the range of 0.3mm～0.5mm
The distance at transformator (14) and transformator base (11) edge is in 1mm～2mm.
4. a kind of discrete device according to claim 3 and printed circuit board integrative installation technology method, it is characterised in that：Institute
In stating step 2.2, the thickness of control heat conductive pad and heat filling (8) is in the range of 0.25～0.38mm.
5. a kind of discrete device according to claim 1 and 2 and printed circuit board integrative installation technology method, its feature exists
In：In the step 3.1, by connection EL type relays (21) with relay base (17), electrostatic leakage printed board (18) it is tight
Firmware end passes through unidirectional weld tabs (19), after being then passed through insulation sleeve (20), is fixed；The securing member is screw.
6. a kind of discrete device according to claim 5 and printed circuit board integrative installation technology method, it is characterised in that：Institute
In stating step 3.1, control electrostatic leakage printed board (18) thickness in the range of 1.6mm～2mm, control EL type relays (21) with
Relay base (17) Edge Distance is in the range of 1mm～2mm.
7. a kind of discrete device according to claim 1 and 2 and printed circuit board integrative installation technology method, its feature exists
In：The TO packaging parts (7), E type flat surface transformers (14) or EL type relay (21) wire solder joints and printed circuit board (4)
Distance range is 10mm～15mm.
8. a kind of discrete device according to claim 1 and 2 and printed circuit board integrative installation technology method, its feature exists
In：Heat filling is heat-conducting silicone grease in the heat conductive pad and heat filling (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610946087.0A CN106572606B (en) | 2016-11-02 | 2016-11-02 | A kind of discrete device and printed circuit board integrative installation technology method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610946087.0A CN106572606B (en) | 2016-11-02 | 2016-11-02 | A kind of discrete device and printed circuit board integrative installation technology method |
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| Publication Number | Publication Date |
|---|---|
| CN106572606A true CN106572606A (en) | 2017-04-19 |
| CN106572606B CN106572606B (en) | 2018-12-21 |
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| CN201610946087.0A Expired - Fee Related CN106572606B (en) | 2016-11-02 | 2016-11-02 | A kind of discrete device and printed circuit board integrative installation technology method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107734875A (en) * | 2017-11-30 | 2018-02-23 | 天津光电通信技术有限公司 | A kind of pcb board is welded light power meter clamping kit structure and fixing means |
| CN109698453A (en) * | 2018-12-29 | 2019-04-30 | 中电科仪器仪表有限公司 | A kind of USB female connector welder and method |
| CN111081457A (en) * | 2020-01-16 | 2020-04-28 | 上海航天电子通讯设备研究所 | Mounting mode of satellite-borne planar transformer |
| CN113571309A (en) * | 2021-07-23 | 2021-10-29 | 西安微电机研究所 | Installation structure and process of large-volume inductor for aerospace field |
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| WO2010130654A1 (en) * | 2009-05-12 | 2010-11-18 | Würth Elektronik Ics Gmbh & Co. Kg | Pluggable varistor |
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