CN113571309B - Installation structure and process of large-volume inductor for aerospace field - Google Patents
Installation structure and process of large-volume inductor for aerospace field Download PDFInfo
- Publication number
- CN113571309B CN113571309B CN202110839608.3A CN202110839608A CN113571309B CN 113571309 B CN113571309 B CN 113571309B CN 202110839608 A CN202110839608 A CN 202110839608A CN 113571309 B CN113571309 B CN 113571309B
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- inductor
- printed board
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- pin
- holes
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000009434 installation Methods 0.000 title description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000011900 installation process Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010205 computational analysis Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
Abstract
The invention discloses a larger-volume inductor mounting structure and a process for the aerospace field, wherein the structure comprises an inductor and a printed board; the printed board is positioned below the inductor, the inductor is fixedly connected with the printed board, and the pin surface of the inductor is arranged upwards; the inductor is provided with a plurality of pins, each pin is connected with one end of an extension wire, and the other end of the extension wire is connected with the printed board. The inductor can work reliably in a large number of levels of random vibration, fatigue fracture of the inductor pins can not be caused, and the environment adaptability of the whole product is improved.
Description
Technical Field
The invention belongs to the field of printed board preparation, and relates to a structure and a process for installing a large-volume inductor in the aerospace field.
Background
The existing large-size inductor mounting process comprises the following steps: an inductance pin with the size of phi 30 multiplied by 20mm and the weight of about 35g is directly welded on a controller printed board and fixed, and the inductance mounting process is only suitable for a controller to carry out a small-magnitude random vibration test in the aerospace field; during large-scale random vibration tests (e.g., 30g and above) performed by the controller, the inductor pins may be broken. The analysis reason is as follows: when the vibration magnitude in the Z direction is 30g, the inductance pin is stretched, the stress of the inductance pin is 9.46N (the weight of the inductance is 35g), the maximum tensile stress of each pin is 470MPa (the fixing effect of the silicon rubber and the binding on the inductance is not considered), the maximum tensile stress is equivalent to the strength limit of 450MPa of the material of the pin, but the pin is not broken due to the limitation of the silicon rubber and the binding and fixing; when the vibration magnitude in the X direction is 30g, namely the inductor is subjected to shear stress, the stress of the inductor pins is 7.7N, the maximum shear stress of each pin is 384MPa (the fixing effect of the silicon rubber and the binding on the elements is not considered), and the shear strength of the material is 243 MPa. Through computational analysis, the process of breaking the inductance pin is as follows: when the controller is carrying out the Z direction vibration, the inductance pin can receive a tensile power from top to bottom in the Z direction, makes the inductance vibrate along the Z direction, and inductance pin shaping department produces fatigue damage, and when carrying out the X direction vibration, the inductance pin receives the shearing force of a left right direction, and the solder joint root is the biggest stress point this moment, is the weakest department of pin promptly, along with experimental the going on, finally leads to the inductance pin fracture.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a larger-volume inductor mounting structure and a process for the aerospace field, so that the inductor can reliably work in a large number of levels of random vibration, the fatigue fracture of the inductor pin cannot be caused, and the environment adaptability of the whole product is improved.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a large-volume inductor mounting structure for the aerospace field comprises an inductor and a printed board;
the printed board is positioned below the inductor, the inductor is fixedly connected with the printed board, and the pin surface of the inductor is arranged upwards; the inductor is provided with a plurality of pins, each pin is connected with one end of an extension wire, and the other end of the extension wire is connected with the printed board.
Preferably, the extension wire is bent to form a stress bend.
Further, the stress bending radius is larger than 5 mm.
Preferably, the extension lead is nested with a heat shrinkable tube.
Preferably, two ends of the extension lead are respectively welded with the pins and the printed board.
Preferably, a soft heat conducting pad is arranged between the inductor and the printed board.
Preferably, a plurality of fastening lines are wound on the inductor and penetrate through the printed board to bind the inductor on the printed board.
Preferably, the inductor outer ring part is glued with silicon rubber.
A large-volume inductor installation process for the aerospace field based on any one of the installation structures comprises the steps of fixing an inductor on a printed board, wherein the pin surface of the inductor is arranged upwards; and then, one end of an extension wire is respectively welded on the four pins of the inductor in a winding welding mode, and the other end of the extension wire is welded on a corresponding pin bonding pad of the printed board.
Preferably, the specific process of fixing the inductor comprises the following steps: after the inductor is placed on the printed board, a soft heat conducting pad is arranged between the inductor and the printed board, and a plurality of fastening lines penetrate through the printed board to bind the inductor on the printed board; before the other end of the extension lead is welded to the printed board, the extension lead is subjected to forming treatment with radian larger than R5 mm; and finally, gluing and fixing the outer ring part of the inductor by using silicon rubber.
Compared with the prior art, the invention has the following beneficial effects:
according to the structure, the flexible connection mode of the inverted inductor and the extended lead is adopted, the pins of the inductor are connected with the bonding pads of the printed board through the extended lead, the flexible connection is realized, when vibration occurs, the extended lead is soft in texture, so that stress on the inductor can be absorbed, the stress is eliminated through bending, the inductor can reliably work in a large number of levels of random vibration, fatigue fracture of the pins of the inductor cannot be caused, and the environment adaptability of the whole product is improved.
Furthermore, stress bending formed by the lead is prolonged, and stress in the vibration test process is released conveniently.
Furthermore, the heat-shrinkable tube strengthens the insulating property on the premise of not influencing the use of the extension lead and absorbing stress.
Furthermore, the soft heat conducting pad is located between the inductor and the printed board so as to reduce friction between the inductor and the printed board, prevent mechanical damage of the inductor and play a certain role in vibration reduction.
Drawings
Fig. 1 is a schematic view of the mounting structure of the present invention.
Wherein: 1-a printed board; 2-inductance; 3-extending the wire; 4-soft heat conducting pad; 5-fastening the wire.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, the mounting structure of a large-volume inductor for the aerospace field according to the present invention includes an inductor 2, a printed board 1, and an extension wire 3; the diameter of the inductor with larger volume in the embodiment is not more than 35 mm.
The corresponding position of an inductor 2 is arranged on a printed board 1, and the position is reserved for binding the inductor 2 by fastening lines 5, specifically, the printed board 1 is provided with a large first hole at the center position of the inductor 2, the diameter of the first hole is not more than the inner diameter of the inductor 2, a plurality of small second holes are formed in the upper side and the lower side of the back of the inductor 2, and in the implementation, three second holes are respectively formed in the upper side and the lower side of the inductor 2.
The inductor 2 is located the printing board 1, the 2 centre of a circle of inductor is concentric with first hole centre of a circle, the pin face of inductor 2 sets up upwards, be provided with soft heat conduction pad 4 of about phi 30 size between inductor 2 and the printing board 1, soft heat conduction pad 4 adopts rubber in this embodiment, fill up soft heat conduction pad 4 to between inductor 2 and the printing board 1, in order to reduce the friction between inductor 2 and the printing board 1, prevent 2 mechanical damage of inductor, play certain damping effect simultaneously.
The inductor 2 is bound and fixed by the fastening lines 5, six second holes are formed in the outer edge of the package of the inductor 2 on the printed board 1, and the first hole in the middle of the package of the inductor 2 serves as a binding threading hole, and the inductor 2 is bound in a surrounding mode for multiple times, so that the inductor 2 body and the printed board 1 are fixed.
The inductor 2 is provided with a plurality of pins, the number of the pins of the inductor 2 in the embodiment is four, each pin is welded with one end of an extension wire 3, and the other end of the extension wire 3 is welded with a corresponding pin bonding pad on the printed board 1.
The extension lead 3 is sleeved with a phi 1.5 black heat-shrinkable tube for reinforcing insulation.
The extension wire 3 is subjected to a forming process of greater than R5mm arc to form a stress bend so as to relieve stress during the vibration test.
The specific installation process of the inductor installation structure comprises the following steps:
the inductor 2 is installed in a mode of 'flip chip + wire flexible connection', the pin of the inductor 2 is connected with the pad of the printed board 1 through a wire, the corresponding position of the inductor 2 is installed on the printed board 1, and the position is reserved for binding the inductor 2 by the fastening wire 5. The specific hole is formed by opening a larger first hole in the center of the installation inductor 2 of the printed board 1, the diameter of the first hole is not more than the inner diameter of the inductor 2, a plurality of smaller second holes are formed in the upper side and the lower side of the back of the installation inductor 2, and three second holes are respectively formed in the upper side and the lower side of the inductor 2.
A soft heat conducting pad 4 with the size of about phi 30 is cut, and the heat conducting pad is arranged between the inductor 2 and the printed board 1, so that friction between the inductor 2 and the printed board 1 is reduced, mechanical damage to the inductor 2 is prevented, and a certain vibration reduction effect is achieved.
Four pins of the inductor 2 are respectively welded with a black extension lead 3 with 5cm length of AF-250A 250V 19 x 0.16mm in a winding welding mode to be used as an extension line of the pins of the inductor 2, wherein the extension lead 3 is sleeved with a phi 1.5 black heat-shrinkable tube for strengthening insulation.
The 2 bodies of inductance adopt 5 ligatures of fastening line to be fixed, utilize on the printed board 1 that the 2 encapsulation of inductance is outer along last 6 second holes and the 2 encapsulation of inductance in the middle of the first hole as the ligature through wires hole, encircle the ligature many times to inductance 2, make 2 bodies of inductance and printed board 1 fixed.
And (3) carrying out forming treatment of a radian larger than R5mm on the extension lead 3 of the pin of the inductor 2 so as to release stress in the vibration test process, and welding the other end of the extension lead 3 to a corresponding pin bonding pad of the printed board 1.
The inductor 2 is bonded with silicone rubber in the circumferential direction.
In order to fully verify the effectiveness of the inductor mounting process in the invention, a random vibration test, a sinusoidal vibration test and an impact test of 30g magnitude are carried out on the controller, silicon rubber on the pin of the inductor 2 is removed after the test, and no crack is found on the pin of the inductor 2 and a welding spot under the microscope.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (5)
1. An inductor mounting structure for the aerospace field is characterized by comprising an inductor (2) and a printed board (1);
the size of the inductor (2) is phi 30 multiplied by 20mm, and the weight is 35g to 40 g;
the printed board (1) is positioned below the inductor (2), the inductor (2) is fixedly connected with the printed board (1), and the pin surface of the inductor (2) is arranged upwards; a plurality of pins are arranged on the inductor (2), each pin is connected with one end of an extension wire (3), and the other end of the extension wire (3) is connected with the printed board (1);
the extension lead (3) is arranged in a bending way to form a stress bend;
the stress bending radius is more than 5 mm;
a heat-shrinkable tube is nested on the extension lead (3);
a soft heat conducting pad (4) is arranged between the inductor (2) and the printed board (1);
a plurality of fastening lines (5) are wound on the inductor (2), and the fastening lines (5) penetrate through the printed board (1) to bind the inductor (2) on the printed board (1);
a first hole is formed in the center of the printed board (1) where the inductor (2) is installed, the diameter of the first hole does not exceed the inner diameter of the inductor (2), and a plurality of second holes are formed in the upper side and the lower side of the printed board after the inductor (2) is installed; six second holes in the outer edge of the inductor (2) in the package of the printed board (1) and a first hole in the middle of the inductor (2) in the package are used as binding threading holes.
2. The structure of claim 1, wherein the two ends of the extension lead (3) are soldered to the printed board (1).
3. The structure of claim 1, wherein the outer ring of the inductor (2) is made of silicone rubber.
4. An aerospace inductor mounting process based on the mounting structure of any one of claims 1-3, wherein the inductor (2) is first fixed on the printed board (1), and the pin surface of the inductor (2) is arranged to face upwards; and then, one end of an extension wire (3) is welded on the four pins of the inductor (2) respectively in a winding welding mode, and the other end of the extension wire (3) is welded on a corresponding pin bonding pad of the printed board (1).
5. The installation process of the inductor used in the aerospace field according to claim 4, wherein the specific process of fixing the inductor (2) is as follows: after the inductor (2) is placed on the printed board (1), a soft heat conducting pad (4) is arranged between the inductor (2) and the printed board (1), a first hole is formed in the central position of the printed board (1) where the inductor (2) is installed, the diameter of the first hole is not larger than the inner diameter of the inductor (2), and a plurality of second holes are formed in the upper side and the lower side of the printed board (1) where the inductor (2) is installed; six second holes on the outer edge of the packaging of the inductor (2) on the printed board (1) and a first hole in the middle of the packaging of the inductor (2) are used as binding threading holes, a plurality of fastening lines (5) penetrate through the binding threading holes of the printed board (1) to carry out multiple times of surrounding binding on the inductor (2), and the inductor (2) is bound on the printed board (1); before the other end of the extension lead (3) is welded to the printed board (1), the extension lead (3) is subjected to forming treatment with radian larger than R5 mm; and finally, the outer ring part of the inductor (2) is glued and fixed by using silicon rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110839608.3A CN113571309B (en) | 2021-07-23 | 2021-07-23 | Installation structure and process of large-volume inductor for aerospace field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110839608.3A CN113571309B (en) | 2021-07-23 | 2021-07-23 | Installation structure and process of large-volume inductor for aerospace field |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113571309A CN113571309A (en) | 2021-10-29 |
| CN113571309B true CN113571309B (en) | 2022-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110839608.3A Active CN113571309B (en) | 2021-07-23 | 2021-07-23 | Installation structure and process of large-volume inductor for aerospace field |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274369A (en) * | 1998-01-13 | 1999-10-08 | Lucent Technol Inc | Semiconductor device |
| CN106572606A (en) * | 2016-11-02 | 2017-04-19 | 北京卫星制造厂 | Separating device and printed circuit board integrated installation method |
| CN111081457A (en) * | 2020-01-16 | 2020-04-28 | 上海航天电子通讯设备研究所 | Mounting mode of satellite-borne planar transformer |
| CN111755406A (en) * | 2020-06-28 | 2020-10-09 | 西安微电子技术研究所 | Structure for reducing stress of welding spot of stress-free release device, manufacturing method and application |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2355112A (en) * | 1999-10-08 | 2001-04-11 | Nokia Mobile Phones Ltd | Controlling bondwire inductance by using chip as positional reference |
| CN103337352B (en) * | 2013-06-20 | 2016-06-29 | 张家港市华为电子有限公司 | A kind of pcb board high-frequency magnetic transformator |
| US11322286B2 (en) * | 2016-04-14 | 2022-05-03 | Signify Holding B.V. | Split transformer assembly |
| CN207529762U (en) * | 2017-09-29 | 2018-06-22 | 北京微科能创科技有限公司 | Ring-shaped inductors fixed seat, ring-shaped inductors and circuit board |
| JP2019161051A (en) * | 2018-03-14 | 2019-09-19 | シャープ株式会社 | Printed circuit |
| CN109494045A (en) * | 2018-10-19 | 2019-03-19 | 陕西航空电气有限责任公司 | A kind of transformer framework production method and transformer framework |
-
2021
- 2021-07-23 CN CN202110839608.3A patent/CN113571309B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274369A (en) * | 1998-01-13 | 1999-10-08 | Lucent Technol Inc | Semiconductor device |
| CN106572606A (en) * | 2016-11-02 | 2017-04-19 | 北京卫星制造厂 | Separating device and printed circuit board integrated installation method |
| CN111081457A (en) * | 2020-01-16 | 2020-04-28 | 上海航天电子通讯设备研究所 | Mounting mode of satellite-borne planar transformer |
| CN111755406A (en) * | 2020-06-28 | 2020-10-09 | 西安微电子技术研究所 | Structure for reducing stress of welding spot of stress-free release device, manufacturing method and application |
Non-Patent Citations (1)
| Title |
|---|
| 航天产品整机的防振加固工艺;宋冬;《电子工艺技术》;20130118(第01期);全文 * |
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| CN113571309A (en) | 2021-10-29 |
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Address after: 715000 No. 36, Shanglinyuan 4th Road, high tech Zone, Xi'an, Shaanxi Applicant after: Xi'an micromotor Research Institute Co.,Ltd. Address before: 715000 No. 36, Shanglinyuan 4th Road, high tech Zone, Xi'an, Shaanxi Applicant before: XI'AN MICROMOTOR Research Institute |
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