CN106563989B - 一种抛光后蓝宝石晶片的装夹方法 - Google Patents

一种抛光后蓝宝石晶片的装夹方法 Download PDF

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CN106563989B
CN106563989B CN201610844819.5A CN201610844819A CN106563989B CN 106563989 B CN106563989 B CN 106563989B CN 201610844819 A CN201610844819 A CN 201610844819A CN 106563989 B CN106563989 B CN 106563989B
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sapphire wafer
clamping
electromagnetic worktable
polishing
detent
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秦光临
蔡金荣
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Tunghsu Group Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/161—Dops, dop holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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Abstract

本发明提供的一种抛光后蓝宝石晶片的装夹方法，步骤简单，制备方便，抛光后蓝宝石晶片的装夹过程中不会产生划痕，且装夹的夹持力可以通过调节电磁工作台的电流强度来控制，保证装夹的蓝宝石晶片不会出现划动，避免蓝宝石晶片外周形状加工过程中因为滑片造成蓝宝石晶片表面划伤，提高了整体的工作效率，成本较低，更能满足使用者的需求。

Description

一种抛光后蓝宝石晶片的装夹方法
技术领域
本发明涉及蓝宝石技术领域，特别是涉及一种抛光后蓝宝石晶片的装夹方法。
背景技术
蓝宝石晶体具有优良的光学性能、物理性能和稳定的化学性能。广泛应用于高亮度LED衬底材料、各种光学元器件、窗口材料。A向蓝宝石晶片的抛光过程时长达到15至25个小时，在抛光过程中会出现崩边、崩角以及边缘微裂纹等缺陷，抛光后需要对外周形状进行再次加工，消除抛光过程中产生的崩边、崩角以及边缘微裂纹等缺陷。目前的装夹手段主要为真空吸附，存在工作台表面有脏污以及其它硬质固体颗粒物，在装夹过程中会对抛光后的蓝宝石晶片表面产生划痕，且装夹的夹持力小，不可调节，在外周形状加工过程中会产生滑片，在抛光后的蓝宝石晶片表面产生划痕，需要进行再次抛光。
发明内容
本发明的目的是提供一种抛光后蓝宝石晶片的装夹方法，解决现有装夹手段主要为真空吸附，存在工作台表面有脏污以及其它硬质固体颗粒物，在装夹过程中会对抛光后的蓝宝石晶片表面产生划痕，且装夹的夹持力小，不可调节，在外周形状加工过程中会产生滑片，在抛光后的蓝宝石晶片表面产生划痕的问题。
为解决以上问题本发明所采用的方案：
一种抛光后蓝宝石晶片的装夹方法，其装夹方法如下：
（1）用无水乙醇清洁电磁工作台表面及压板表面，清洁2-4次；
（2）将无尘PE静电膜贴在电磁工作台表面及压板表面；
（3）将卡位导向条放置在电磁工作台侧面；
（4）将抛光后的蓝宝石晶片紧贴卡位导向条放置在电磁工作台表面上；
（5）将压板紧贴卡位导向条放置在蓝宝石晶片表面上；
（6）开启电磁工作台电源，使电磁工作台处于工作状态；
（7）用手轻推蓝宝石晶片的一侧，检查蓝宝石晶片是否被夹持牢固；
（8）将卡位导向条移除，蓝宝石晶片装夹完成；
（9）启动机床，对蓝宝石晶片进行外周形状加工，直至加工结束；
（10）关闭电磁工作台电源，使电磁工作台处于退磁状态，等待10-20秒退磁完成，依次取下压板、蓝宝石晶片；
（11）将无尘PE静电膜移除；
（12）重复步骤（1）至（11）装夹并加工下一片蓝宝石晶片。
上述的一种抛光后蓝宝石晶片的装夹方法，其中，所述步骤（1）每次清洁时间为5-10min。
上述的一种抛光后蓝宝石晶片的装夹方法，其中，所述电磁工作台工作电压为220V，功率为15W，吸引力为1200N。
本方案的有益效果：
本发明提供的一种抛光后蓝宝石晶片的装夹方法，步骤简单，制备方便，抛光后蓝宝石晶片的装夹过程中不会产生划痕，且装夹的夹持力可以通过调节电磁工作台的电流强度来控制，保证装夹的蓝宝石晶片不会出现划动，避免蓝宝石晶片外周形状加工过程中因为滑片造成蓝宝石晶片表面划伤，提高了整体的工作效率，成本较低，更能满足使用者的需求。
具体实施方式
无水乙醇质量百分比含量为99.9%，购自于深圳市华昌化工有限公司。
实施例一：一种抛光后蓝宝石晶片的装夹方法，其装夹方法如下：
（1）用无水乙醇清洁电磁工作台表面及压板表面，清洁3次，每次清洁时间为8min；
（2）将无尘PE静电膜贴在电磁工作台表面及压板表面；
（3）将卡位导向条放置在电磁工作台侧面；
（4）将抛光后的蓝宝石晶片紧贴卡位导向条放置在电磁工作台表面上；
（5）将压板紧贴卡位导向条放置在蓝宝石晶片表面上；
（6）开启电磁工作台电源，使电磁工作台处于工作状态，所述电磁工作台工作电压为 220V，功率为15W，吸引力为1200N；
（7）用手轻推蓝宝石晶片的一侧，检查蓝宝石晶片是否被夹持牢固；
（8）将卡位导向条移除，蓝宝石晶片装夹完成；
（9）启动机床，对蓝宝石晶片进行外周形状加工，直至加工结束；
（10）关闭电磁工作台电源，使电磁工作台处于退磁状态，等待16秒退磁完成，依次取下压板、蓝宝石晶片；
（11）将无尘PE静电膜移除；
（12）重复步骤（1）至（11）装夹并加工下一片蓝宝石晶片。
实施例二：一种抛光后蓝宝石晶片的装夹方法，其装夹方法如下：
（1）用无水乙醇清洁电磁工作台表面及压板表面，清洁2次，每次清洁时间为6min；
（2）将无尘PE静电膜贴在电磁工作台表面及压板表面；
（3）将卡位导向条放置在电磁工作台侧面；
（4）将抛光后的蓝宝石晶片紧贴卡位导向条放置在电磁工作台表面上；
（5）将压板紧贴卡位导向条放置在蓝宝石晶片表面上；
（6）开启电磁工作台电源，使电磁工作台处于工作状态，所述电磁工作台工作电压为 220V，功率为15W，吸引力为1200N；
（7）用手轻推蓝宝石晶片的一侧，检查蓝宝石晶片是否被夹持牢固；
（8）将卡位导向条移除，蓝宝石晶片装夹完成；
（9）启动机床，对蓝宝石晶片进行外周形状加工，直至加工结束；
（10）关闭电磁工作台电源，使电磁工作台处于退磁状态，等待18秒退磁完成，依次取下压板、蓝宝石晶片；
（11）将无尘PE静电膜移除；
（12）重复步骤（1）至（11）装夹并加工下一片蓝宝石晶片。
实施例三：一种抛光后蓝宝石晶片的装夹方法，其装夹方法如下：
（1）用无水乙醇清洁电磁工作台表面及压板表面，清洁4次，每次清洁时间为6min；
（2）将无尘PE静电膜贴在电磁工作台表面及压板表面；
（3）将卡位导向条放置在电磁工作台侧面；
（4）将抛光后的蓝宝石晶片紧贴卡位导向条放置在电磁工作台表面上；
（5）将压板紧贴卡位导向条放置在蓝宝石晶片表面上；
（6）开启电磁工作台电源，使电磁工作台处于工作状态所述电磁工作台工作电压为220V，功率为15W，吸引力为1200N；
（7）用手轻推蓝宝石晶片的一侧，检查蓝宝石晶片是否被夹持牢固；
（8）将卡位导向条移除，蓝宝石晶片装夹完成；
（9）启动机床，对蓝宝石晶片进行外周形状加工，直至加工结束；
（10）关闭电磁工作台电源，使电磁工作台处于退磁状态，等待17秒退磁完成，依次取下压板、蓝宝石晶片；
（11）将无尘PE静电膜移除；
（12）重复步骤（1）至（11）装夹并加工下一片蓝宝石晶片。
本发明提供的一种抛光后蓝宝石晶片的装夹方法，步骤简单，制备方便，抛光后蓝宝石晶片的装夹过程中不会产生划痕，且装夹的夹持力可以通过调节电磁工作台的电流强度来控制，保证装夹的蓝宝石晶片不会出现划动，避免蓝宝石晶片外周形状加工过程中因为滑片造成蓝宝石晶片表面划伤，提高了整体的工作效率，成本较低，更能满足使用者的需求。
仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围内。因此，本发明的保护范围应该以权利要求书的保护范围为准。

Claims (3)

1.一种抛光后蓝宝石晶片的装夹方法，其特征为，其装夹方法如下：
（1）用无水乙醇清洁电磁工作台表面及压板表面，清洁2-4次；
（2）将无尘PE静电膜贴在电磁工作台表面及压板表面；
（3）将卡位导向条放置在电磁工作台侧面；
（4）将抛光后的蓝宝石晶片紧贴卡位导向条放置在电磁工作台表面上；
（5）将压板紧贴卡位导向条放置在蓝宝石晶片表面上；
（6）开启电磁工作台电源，使电磁工作台处于工作状态；
（7）用手轻推蓝宝石晶片的一侧，检查蓝宝石晶片是否被夹持牢固；
（8）将卡位导向条移除，蓝宝石晶片装夹完成；
（9）启动机床，对蓝宝石晶片进行外周形状加工，直至加工结束；
（10）关闭电磁工作台电源，使电磁工作台处于退磁状态，等待10-20秒退磁完成，依次取下压板、蓝宝石晶片；
（11）将无尘PE静电膜移除；
（12）重复步骤（1）至（11）装夹并加工下一片蓝宝石晶片。
2.如权利要求1所述的一种抛光后蓝宝石晶片的装夹方法，其特征为，步骤（1）每次清洁时间为5-10min。
3.如权利要求1所述的一种抛光后蓝宝石晶片的装夹方法，其特征为，所述电磁工作台工作电压为220V，功率为15W，吸引力为1200N。
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