CN106531288B - A kind of low resin mica tape and preparation method thereof - Google Patents

A kind of low resin mica tape and preparation method thereof Download PDF

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Publication number
CN106531288B
CN106531288B CN201610945613.1A CN201610945613A CN106531288B CN 106531288 B CN106531288 B CN 106531288B CN 201610945613 A CN201610945613 A CN 201610945613A CN 106531288 B CN106531288 B CN 106531288B
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oxidant layer
gluing oxidant
mica
inorganic filler
mica tape
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CN106531288A (en
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李忠良
田宗芳
曾亮
李鸿岩
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Zhuzhou Times Electric Insulation Co Ltd
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Zhuzhou Times Electric Insulation Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/06—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H01B19/04—Treating the surfaces, e.g. applying coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)

Abstract

The low resin mica tape of the present invention is made of the first gluing oxidant layer, mica paper, the second gluing oxidant layer and scrim cloth, and is from top to bottom sequentially overlapped, and the first gluing oxidant layer contains inorganic filler, and quality accounts for the 0.5%~3% of the first gluing oxidant layer gross mass.The second gluing oxidant layer contains inorganic filler, and quality accounts for the 0.5%~3% of the second gluing oxidant layer gross mass.The present invention uses rubber powder hot pressing combined mica paper and fiber cloth, then the preparation process being surface-treated improves VPI impregnating varnish permeability not only so that being formed in gluing oxidant layer compared with multichannel, and the use of solvent in production process can be reduced, reduce cost and environmental pollution；The low resin mica tape flexibility that is prepared is good, around-packing technology is good, with high gas permeability and impregnability, conducive to epoxy anhydride type and epoxy polyester type VPI insulating treatment process, suitable for Large-scale High-Pressure motor, generator and mega-kilowatt class generator group, voltage class is 10~27kV, the major insulation material of unilateral 2~7mm of insulation thickness.

Description

A kind of low resin mica tape and preparation method thereof
Technical field
The invention belongs to insulating materials technical fields more particularly to a kind of low resin mica tape and preparation method thereof.
Background technology
With being continuously increased for generating set voltage class and single-machine capacity, the requirement for motor insulation is continuously improved, Its insulation thickness is continuously increased, and maximum gauge reaches 7mm at present, in order to ensure that the major insulation material of high thickness can be by VPI resins It is quickly impregnated with, it is desirable that low resin mica tape has higher gas permeability and impregnability.A large amount of description of test, the performance of insulation system It is embodied jointly after being mixed with impregnating resin by mica tape, and adhesive is then the weight for influencing mica tape physical and chemical properties Want component.
Currently, low resin mica tape mainly uses the adhesive that modified epoxy type resin is prepared as adhesive, modified epoxy The wellability of mica tape and epoxy systems impregnating resin can be impacted, can also reduce the electric property of epoxy resin itself Superiority influences the overall performance and electric property of the higher insulation system of thickness.Lead to that motor feels hot is big, ageing-resistant performance Difference, it is difficult to be applied to the higher insulation system of high-voltage motor thickness.There is also low resin mica tape softnesses in technique for applying performance Property it is poor, wrapped when fly powder, the problems such as layering is serious, air permeability is smaller.
Invention content
The technical problem to be solved by the present invention is to overcome the shortcomings of to mention in background above technology and defect, provide one Kind highly-breathable and impregnability, the low resin mica tape and preparation method thereof suitable for VPI techniques.
In order to solve the above technical problems, technical solution proposed by the present invention is：
A kind of low resin mica tape, the low resin mica tape is by the first gluing oxidant layer, mica paper, the second gluing oxidant layer and fiber cloth Layer composition, and be from top to bottom sequentially overlapped, the first gluing oxidant layer contains inorganic filler, and it is total that quality accounts for the first gluing oxidant layer The 0.5%~3% of quality.The second gluing oxidant layer contains inorganic filler, and quality accounts for the 0.5% of the second gluing oxidant layer gross mass ~3%.
Above-mentioned technical proposal is based primarily upon following principle：The first gluing oxidant layer is close to the one side of mica paper, addition Inorganic filler is avoided that glue is distributed on mica paper surface at planar, is conducive to the formation of gas-permeable channels.In second gluing oxidant layer Be added nano-inorganic filler particle, both can to macromolecular chain generate blocking effect, slow down electrostrictive polymer poplar bundles starting and Development, improve insulation layer resistivity, so as to improve, extend insulating layer pressure-resistant time and improve insulating layer breakdown voltage；It again can be with Reduce the accumulation of insulating layer Space-charge, reduce space charge activity, improves insulating layer shelf depreciation ability.
Above-mentioned low resin mica tape, it is preferred that the mica paper is made of mica sheet, aramid fiber and inorganic filler, institute It is calcining white clouds master slice or mixed copy white clouds master slice to state mica sheet, wherein the quality of aramid fiber account for mica paper quality 5%~ 10%, the quality of inorganic filler accounts for the 0.5%~2% of mica paper quality；The thickness of the mica paper is 0.05~0.1mm.
It is based primarily upon following principle：Using aramid fiber and Inorganic Fillers Filled mica paper, using aramid fiber as skeleton, both The intensity of mica paper is improved, and improves the gas permeability of mica tape, assigns the excellent heat-resistant aging of insulation system, hot machine Tool intensity and insulation performance；On the one hand the addition of inorganic filler increases the micro channel of mica paper, improve porosity, enhances Capillarity improves permeability and on the other hand improves insulating properties.
Above-mentioned low resin mica tape, it is preferred that the scrim cloth is glass fabric, and thickness is 0.025~0.06mm.
Above-mentioned low resin mica tape, it is preferred that the inorganic filler is silica and/or boron nitride, the first adhesive The inorganic filler of layer and the addition of the second gluing oxidant layer is nano sized inorganic fillers, and filling is micron order with inorganic filler in mica paper Inorganic filler.
Above-mentioned low resin mica tape, it is preferred that the second gluing oxidant layer is mainly with the bisphenol A type epoxy resin of compounding Matrix, the second gluing oxidant layer gross mass account for the 3%~5% of mica tape gross mass.The inventive concept total as one, the present invention also carry For a kind of preparation method of above-mentioned low resin mica tape, include the following steps：
（1）Prepare rubber powder；
（2）Mica paper unreels；
（3）Rubber powder is uniformly spread by the one side of mica paper of the duster after unreeling；
（4）It the mica paper after rubber powder will be spread is sent into the first drying tunnel and bake；
（5）Fiber cloth is unreeled and is drawn to step（4）On mica paper afterwards, then fiber cloth and mica paper are led to together It is compound to cross a pair of of pressure roller progress hot pressing；
（6）The semi-finished product that hot pressing obtains after compound are surface-treated；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel to bake；
（8）Product after baking is wound, is cut, finished product is obtained.
Technique prepared by low resin mica tape, is based primarily upon following principle：Using rubber powder hot pressing combined mica paper and fiber cloth, Then the preparation process being surface-treated improves the infiltration of VPI impregnating varnishes not only so that being formed in gluing oxidant layer compared with multichannel Property, and the use of solvent in production process can be reduced, reduce cost and environmental pollution.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（1）The preparation process of middle rubber powder is：It will promote It is uniformly mixed with epoxy resin into agent, inorganic filler, then rubber powder will be made after mixed solution Freezing smashing, softening point is 80 DEG C~90 DEG C.In general the low epoxy bonds of softening point are poor, and the high epoxy bonds of softening point are good, softening point and bonding Property need to reach a best meeting point and could be suitble to prepare the mica tape of the present invention.
The preparation method of above-mentioned low resin mica tape, it is preferred that the epoxy resin is the bisphenol type epoxy tree of compounding Fat.Epoxy resin-base in first layer gluing oxidant layer can be single bisphenol A type epoxy resin, and effect is that combined mica piece is anti- Only mica tape loses powder.Epoxy resin-base in second layer gluing oxidant layer is compounding bisphenol A type epoxy resin, softening point and viscous Connecing property has the advantage of controllability for single epoxy, can reach suitable softening point and cementability to realize dry method Photoresist coating process.
The accelerating agent is that zinc Isoocatanoate or zinc naphthenate press 1 with end hydroxy butadiene:1 mass ratio proportioning mixing Solution, quality are the 4%~8% of adhesive gross mass.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（6）Middle surface treatment is by the another of mica paper On one side by rubber roller, one layer of epoxy adhesive containing inorganic filler and epoxy resin is coated；Epoxy is coated on mica paper surface The mode of adhesive advantageously reduces the glue content of mica tape, and the glue content of low resin mica tape of the present invention is 3%~5%；By After two drying tunnels bake, the epoxy adhesive of coating forms the first gluing oxidant layer in low resin mica tape, is close to mica paper, can be with The problem of ensureing that mica sheet is mutually combined closely, preventing mica tape from occurring picking in wrapped application process, fly powder and layering.
The preparation method of above-mentioned low resin mica tape, it is preferred that the epoxy resin is bisphenol A type epoxy resin or compounding Bisphenol A type epoxy resin；The solid content of coating epoxy adhesive epoxy resin is 2%~10%.
According to the principle of similar compatibility, resin in the adhesive of the adhesive and surface treatment of combined mica paper and fiber cloth It is all made of bisphenol A epoxide resin, is had in this way with the VPI resins of the VPI resins of epoxy anhydride system or epoxy polyester systems fabulous Compatibility and impregnability, can with the impregnating resin rapid osmotics of epoxy systems and complete wetting, formed after solidification one it is whole Body promotes the globality and electric property of insulation system, the advantages of being conducive to give full play to VPI techniques.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（5）In two pressure rollers temperature be 100 DEG C ~110 DEG C, pressure is 0.1~0.2MPa therebetween.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（4）In the first drying tunnel temperature be 120 DEG C ~130 DEG C, baking time is 2~5min；The step（7）In the second drying tunnel temperature be 110 DEG C~125 DEG C, baking time For 2~5min.
Compared with the prior art, the advantages of the present invention are as follows：
（1）The low resin mica tape finished product of the present invention has high gas permeability and impregnability, is conducive to epoxy anhydride type and ring Oxygen polyester-type VPI insulating treatment process can substantially shorten the VPI process times of coil, improve insulation compactness and bar extension Paint amount reduces air gap, to promote the electric property and operational reliability of motor；Suitable for Large-scale High-Pressure motor, generator With mega-kilowatt class generator group, voltage class is 10~27kV, the major insulation material of unilateral 2~7mm of insulation thickness.
（2）The low resin mica tape finished product of the present invention does not lose powder, adhesive content is few, flexibility is good, around-packing technology is good, is applicable in In machine packet and artificial wrapped.
（3）The low resin mica tape simple production process of the present invention, can effectively reduce cost and reduce environmental pollution.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention Some embodiments for those of ordinary skill in the art without creative efforts, can also basis These attached drawings obtain other attached drawings.
Fig. 1 is the structural schematic diagram of mica tape.
Fig. 2 is mica tape production technological process.
Marginal data：
1, the first gluing oxidant layer；2, mica paper；3, the second gluing oxidant layer；4, scrim cloth；5, mica paper unreeling structure；6、 Duster；7, the first drying tunnel；8, fiber cloth unreeling structure；9, pressure roller；10, surface coating mechanism；11, the second drying tunnel；12, it winds Mechanism.
Specific implementation mode
To facilitate the understanding of the present invention, it is done more entirely below in conjunction with Figure of description and preferred embodiment to inventing herein Face meticulously describes, but protection scope of the present invention is not limited to following specific examples.
Unless otherwise defined, all technical terms used hereinafter are generally understood meaning phase with those skilled in the art Together.Technical term used herein is intended merely to the purpose of description specific embodiment, is not intended to the limitation present invention's Protection domain.
Unless otherwise specified, various raw material, reagent, the instrument and equipment etc. used in the present invention can pass through city Field is commercially available or can be prepared by existing method.
Embodiment：
A kind of low resin mica tape of the present invention as shown in Figure 1, the mica tape is by the first gluing oxidant layer 1, mica paper 2, second Gluing oxidant layer 3 and scrim cloth 4 form, and are from top to bottom sequentially overlapped, and it is to receive that the first gluing oxidant layer, which contains inorganic filler, Rice silica, quality account for the 2% of the first gluing oxidant layer gross mass.It is nanometer that the second gluing oxidant layer, which contains inorganic filler, Silica, quality account for the 2% of the second gluing oxidant layer gross mass.
Mica paper in the present embodiment is made of calcining mica sheet, aramid fiber and inorganic filler, wherein aramid fiber Quality accounts for the 6.25% of mica paper quality, and the quality of inorganic filler accounts for the 1% of mica paper quality, and mica paper thickness is 0.05mm.This The gross mass of the second gluing oxidant layer of mica tape accounts for the 4.5% of mica tape gross mass in embodiment, and fiber cloth is glass fabric, Its thickness is 0.032mm.
The preparation method of above-mentioned low resin mica tape, comprises the steps of, as shown in Fig. 2：
（1）Prepare rubber powder：By the mixed solution after the evenly dispersed epoxy resin to compounding of nano silicon dioxide and accelerating agent Adhesive powder is made in Freezing smashing；Accelerating agent used is that zinc Isoocatanoate quality presses 1 with end hydroxy butadiene:1 mass ratio The mixed solution of proportioning, quality are the 8% of adhesive gross mass；Epoxy resin used is E12 epoxy resin and E24 asphalt mixtures modified by epoxy resin Fat is according to 2:1 mass ratio matches mixed compounding epoxy resin；
（2）Mica paper is unreeled by mica paper unreeling structure 5 with certain speed, is placed on conveyer belt；
（3）Rubber powder is uniformly spread by the one side of mica paper of the duster 6 after unreeling；
（4）It the mica paper after rubber powder will be spread is sent into the first drying tunnel 7 and bake, drying tunnel temperature is 120 DEG C, and the time is 2min；
（5）Fiber cloth is unreeled by fiber cloth unreeling structure 8 with certain speed and is placed on conveyer belt, and is drawn to step Suddenly（4）By a pair of of temperature it is together then 100 DEG C~110 DEG C by fiber cloth and mica paper, pressure is on mica paper afterwards It is compound that the pressure roller 9 of 0.1Mpa carries out hot pressing；
（6）The semi-finished product that hot pressing obtains after compound are surface-treated by surface coating mechanism 10, one layer of coating contains The adhesive solvent of nano silicon dioxide and E23 epoxy resin, wherein nano silicon dioxide quality accounts for epoxy adhesive quality 2%, E23 epoxy resin solid content are 2%；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel 11 to bake, temperature is 110 DEG C~125 DEG C, the time For 2min；
（8）Product after baking is wound by rolling-up mechanism 12 by disk diameter appropriate or weight, is obtained into after cutting Product.
Low resin mica tape finished product made from the present embodiment has highly-breathable and impregnability, is suitable for VPI techniques, and the cloud Master tape finished product does not lose powder, flexibility is good, around-packing technology is good.

Claims (10)

1. a kind of low resin mica tape, the low resin mica tape is by the first gluing oxidant layer, mica paper, the second gluing oxidant layer and scrim cloth Composition, and be from top to bottom sequentially overlapped, which is characterized in that the first gluing oxidant layer contains inorganic filler, and quality accounts for first The 0.5%~3% of gluing oxidant layer gross mass；The second gluing oxidant layer contains inorganic filler, and it is total that quality accounts for the second gluing oxidant layer The 0.5%~3% of quality, the second gluing oxidant layer is mainly using the bisphenol A type epoxy resin of compounding as matrix, the first gluing oxidant layer Inorganic filler with the addition of the second gluing oxidant layer is nano sized inorganic fillers.
2. low resin mica tape according to claim 1, which is characterized in that the mica paper by mica sheet, aramid fiber and Inorganic filler forms, and the mica sheet is calcining white clouds master slice or mixed copy white clouds master slice, wherein the quality of aramid fiber accounts for mica The 5%~10% of paper quality, the quality of inorganic filler account for the 0.5%~2% of mica paper quality.
3. low resin mica tape according to claim 1 or 2, which is characterized in that the inorganic filler be silica and/or Boron nitride, filling is micro inorganic fillers with inorganic filler in mica paper.
4. low resin mica tape according to claim 1 or 2, which is characterized in that the second gluing oxidant layer gross mass accounts for cloud The 3%~5% of master tape gross mass.
5. a kind of preparation method of low resin mica tape according to any one of claims 1-4, which is characterized in that include following step Suddenly：
（1）Prepare rubber powder；
（2）Mica paper unreels；
（3）Rubber powder is uniformly spread by the one side of mica paper of the duster after unreeling；
（4）It the mica paper after rubber powder will be spread is sent into the first drying tunnel and bake；
（5）Fiber cloth is unreeled and is drawn to step（4）On mica paper afterwards, fiber cloth and mica paper are then passed through one together It is compound that hot pressing is carried out to pressure roller；
（6）The semi-finished product that hot pressing obtains after compound are surface-treated；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel to bake；
（8）Product after baking is wound, is cut, finished product is obtained.
6. preparation method according to claim 5, which is characterized in that the step（1）The preparation process of middle rubber powder is：It will Accelerating agent, inorganic filler are uniformly mixed with epoxy resin, then rubber powder, softening point will be made after mixed solution Freezing smashing It is 80 DEG C~90 DEG C.
7. preparation method according to claim 6, which is characterized in that the epoxy resin is the bisphenol type epoxy of compounding Resin.
8. according to the preparation method described in claim 5,6 or 7, which is characterized in that the step（6）Middle surface treatment is by cloud The another side of female paper coats one layer of epoxy adhesive containing inorganic filler and epoxy resin by rubber roller；The epoxy resin Solid content for bisphenol A type epoxy resin or the bisphenol A type epoxy resin of compounding, epoxy resin is 2%~10%.
9. according to the preparation method described in claim 5,6 or 7, which is characterized in that the step（5）In two pressure rollers temperature It it is 100 DEG C~110 DEG C, pressure is 0.1~0.2MPa therebetween.
10. according to the preparation method described in claim 5,6 or 7, which is characterized in that the step（4）In the first drying tunnel temperature Degree is 120 DEG C~130 DEG C, and baking time is 2~5min；The step（7）In the second drying tunnel temperature be 110 DEG C~125 DEG C, Baking time is 2~5min.
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CN107134329A (en) * 2017-04-26 2017-09-05 晶锋集团（天长）高分子材料有限公司 A kind of preparation method of insulation mica tape
CN108864973B (en) * 2018-06-15 2023-06-23 苏州巨峰电气绝缘系统股份有限公司 High-temperature-resistant flame-retardant thin film less-adhesive mica tape
CN111519473A (en) * 2020-03-25 2020-08-11 株洲时代新材料科技股份有限公司 High-dielectric-property composite aramid paper
CN111560793A (en) * 2020-05-06 2020-08-21 平江县盛盈云母工业有限公司 Little-glue mica paper reinforced by fibers
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CN114496349B (en) * 2022-02-09 2023-09-26 浙江荣泰电工器材股份有限公司 Ultra-long high-temperature-resistant mica tape and preparation method thereof
CN116313229A (en) * 2023-03-20 2023-06-23 哈尔滨电机厂有限责任公司 High-heat-conductivity multi-glue epoxy glass fiber powder mica tape and manufacturing method thereof

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