CN103440902B - Be applicable to high-permeability mica tape of pure epoxy VPI insulating resin and preparation method thereof - Google Patents
Be applicable to high-permeability mica tape of pure epoxy VPI insulating resin and preparation method thereof Download PDFInfo
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Abstract
The present invention relates to high-permeability mica tape being applicable to pure epoxy VPI insulating resin and preparation method thereof, mica tape comprises mica paper layer, the reinforcing material bed of material, adhesive layer, adhesive layer is the powder adhesive of spot distribution in mica paper layer and supporting material bed boundary, between the powder adhesive of spot distribution, there is a large amount of pore channel, powder adhesive is epoxy hardener; High-permeability mica tape is also containing the latency Epoxy curing accelerators be distributed in mica paper layer, the reinforcing material bed of material and pore channel, all any chemical reaction is there is not in epoxy hardener and latency Epoxy curing accelerators below 110 DEG C, in VPI dipping lacquer process, all can not dissolve and enter into pure epoxy VPI insulating resin.Low resin mica tape of the present invention has expanded the range of application of epoxy resin as insulating material, greatly reduces the requirement of epoxy VPI insulating resin to dip painting installation and technique, reduces energy consumption, saved use cost.
Description
Technical field
The invention belongs to few glue vacuum pressure impregnation (VPI) insulation processing technical field, be specifically related to a kind ofly be applicable to high-permeability mica tape of pure epoxy VPI insulating resin and preparation method thereof.
Background technology
At present, large high-voltage motor mainly adopts few glue vacuum pressure impregnation (VPI) and many rubber mouldings to press two kinds of insulating treatment process.20 century 70s, the western room of the U.S. electrically etc. trans-corporation to propose the few gel of electrical machine insulation theoretical, bring into use the new technology that insulate of the VPI using low resin mica tape as main insulation material to produce high-voltage motor.Because few glue VPI main insulation improves mica content, on the one hand can significantly thinning insulation thickness, also improve the proof voltage of motor, the various aspects of performance such as Inverter fed motor simultaneously, make high-voltage motor technical merit have qualitative leap, therefore obtain and apply more widely.
Insulation system at present for high-voltage motor mainly uses epoxy type VPI resin, in order to ensure that epoxy VPI resin can fully solidify, usually need in resin system to add epoxy hardener and curing accelerator, relatively more conventional epoxy hardener and promoter comprise latency amine, glyoxaline compound, metal salt complex and liquid anhydrides.Wherein the latency of amine and imidazole curing agent is usually all poor, make resin in use viscosity growth very fast, cannot ensure that the long-term stability of resin uses, use the electric property of the curable epoxide thing of such curing accelerator, particularly hot lower dielectric loss is poor simultaneously; Although the latency of metal salt complex comparatively amine and imidazoles good, but be generally solid, one side solubility is in the epoxy lower, addition is restricted, cannot ensure that resin fully solidifies, therefore usually can only use together as curing accelerator complex acid anhydride curing agents, if addition is too large on the other hand also can produce larger impact to the storage stability of epoxy VPI resin and electric property, greatly shorten the pot life of VPI resin; And during using liquid acid anhydrides as curing agent; because epoxy and acid anhydrides itself react slowly; need just can react more than 180 DEG C; by adding a small amount of metal salt complex as curing accelerator in matching used low resin mica tape; can ensure that epoxy anhydride resin fully solidifies at relatively low temperature; insulation electrical excellent performance after solidification; be state-of-the-art insulation system in current prior art in the world, such as Siemens, ABB etc. are high-voltage motor insulated all uses this insulation system.But also still there are some problems in this technology, on the one hand such low resin mica tape containing promoter all uses epoxy resin as the adhesive of mica paper and supporting material, the metal salt complex type Epoxy curing accelerators added can impel the epoxyn generation cross-linking reaction in mica tape, make mica tape hardening embrittlement and cannot normally using gradually in storage process, metal salt complex type curing accelerator on the other hand in such mica tape, epoxy anhydride VPI resin constantly can be entered in dipping lacquer process, reaction facilitation is played to epoxy anhydride resin, resin viscosity is constantly increased in dipping lacquer process, greatly shorten the pot life of VPI resin, in addition, the anhydride curing agent very easily moisture absorption in the epoxy anhydride VPI resin that this system uses, for ensureing that epoxy anhydride VPI resin can steady in a long-termly use, require high to VPI dip painting installation and technique for applying, application cost is larger, greatly limit its range of application.Therefore develop one and there is more than 3 years overlength pot lives, completely without any the pure epoxy type VPI insulating resin of curing agent, and fully can solidify this pure epoxy VPI insulating resin, and self there is better storage stability, the low resin mica tape not affecting pure epoxy VPI insulating resin overlength pot life has very important significance.
The applicant has submitted the patent application that name is called " preparation method of high-permeability mica tape " in 2011, this patent application publication number is CN102412041A.In the disclosure in this patent, applicant's creative use has the mica paper of highly-breathable, by the solvent-free pressed powder resin of softening point at 40 DEG C ~ 180 DEG C, evenly be sprayed at mica paper surface, through the melt bonded mica paper of roller hot rolling and glass cloth, powdex after melting is that point-like is uniformly distributed, there is a large amount of pore channel between points, maintain the gas permeability that mica tape is high, new approaches are provided for preparing high-permeability mica tape, highly-breathable more excellent compared with existing mica tape technology of preparing can be obtained, shorten the penetration period of VPI resin, meet Large-scale High-Pressure generating set, electric pressure is 13.8-27kV, the application requirement of the main insulation VPI process of the coil (rod) of monolateral insulation thickness 3-8mm.But whether can based on the method, while not affecting mica tape highly-breathable performance, give other function of mica tape (such as there is the storage stability of overlength, fully can solidify the pure epoxy VPI insulating resin without curing agent, extend the functions such as the pot life of pure epoxy VPI insulating resin) be not expected.
The applicant is on existing Research foundation, in preparation, there is better storage stability for this technique further, and the pure epoxy VPI insulated impregnating resin that can fully solidify without curing agent, and large quantity research has been carried out in the high-permeability mica tape aspect not affecting pure epoxy VPI insulating resin storage stability, and propose the present invention.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art, provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin.
The present invention also provides a kind of preparation method being applicable to the high-permeability mica tape of pure epoxy VPI insulating resin simultaneously.
For solving above technical problem, a kind of technical scheme that the present invention takes is as follows:
A kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, described pure epoxy VPI insulating resin refers to the epoxy VPI insulating resin not containing any curing agent and curing accelerator, high-permeability mica tape comprises mica paper layer, the reinforcing material bed of material and the adhesive layer between mica paper layer and the reinforcing material bed of material, described adhesive layer comprises point-like and is evenly distributed on powder adhesive on mica paper layer and supporting material bed boundary, a large amount of pore channels is there is between the powder adhesive of spot distribution, particularly, described powder adhesive is epoxy hardener, described high-permeability mica tape is also containing 8 ~ 20g/m
2latency Epoxy curing accelerators, described latency Epoxy curing accelerators is distributed in mica paper layer, the reinforcing material bed of material and described pore channel, all any chemical reaction is there is not in described epoxy hardener and latency Epoxy curing accelerators below 100 DEG C, in the VPI dipping lacquer process using pure epoxy VPI insulating resin, all can not dissolve and enter into pure epoxy VPI insulating resin, described high-permeability mica tape is after use pure epoxy VPI insulating resin carries out VPI dipping lacquer, and at 120 DEG C ~ 170 DEG C temperature, the time fully needed for solidification of completing was lower than 12 hours.
Further, described high-permeability mica tape is after use pure epoxy VPI insulating resin carries out VPI dipping lacquer, and at 120 DEG C ~ 170 DEG C temperature, the time completed fully needed for solidification is 10 ~ 12 hours.
Further, described epoxy hardener can and be preferably the mixture that terminal carboxyl polyester resin or itself and solid acid anhydrides form.
Preferably, the acid number of described terminal carboxyl polyester resin is 50 ~ 150mgKOH/g, number-average molecular weight Mn is 2000 ~ 50000, and softening point is 100 ~ 180 DEG C; The anhydride equivalent of described solid acid anhydrides is 150 ~ 200, and fusing point is 60 ~ 150 DEG C.
Particularly, described solid acid anhydrides can for being selected from one or more the combination in phthalic anhydride, succinyl oxide, carbic anhydride, trimellitic anhydride, styrene-maleic anhydride copolymer.
The consumption of described epoxy hardener is preferably 8 ~ 20g/m
2mica tape.
According to the present invention, described latency Epoxy curing accelerators can for being selected from the mixture of one or more compositions in zinc naphthenate, isooctyl acid zinc, zinc neodecanoate, chromium acetylacetonate, aluminium acetylacetonate.
Preferably, the mica paper of the mica paper layer described in formation is the non-calcinated large scale muscovite paper of thickness 0.05 ~ 0.20mm.The weight per unit area of mica paper is 80 ~ 220g/m
2, air permeability is 2-300s/100cm
3.
Preferably, the material of the described reinforcing material bed of material is electrician's level alkali-free glass fiber cloth of thickness 0.010 ~ 0.060mm.The weight per unit area of electrician's level alkali-free glass fiber cloth is 15 ~ 50g/m
2.
The another technical scheme that the present invention takes is: a kind of above-mentioned preparation method being applicable to the high-permeability mica tape of pure epoxy VPI insulating resin, it comprises the steps:
(1) particle diameter, is prepared for powder adhesive described in 90 ~ 120 objects;
(2), be dissolved or dispersed in solvent by latency Epoxy curing accelerators, preparation solid content is solution or the dispersion liquid of the latency Epoxy curing accelerators of 10% ~ 40%;
(3), mica paper unreels, and on mica paper, spray powder adhesive prepared by step (1);
(4), the mica paper preheating of having sprayed powder adhesive is made powder adhesive partial melting, supporting material unreels simultaneously, make the hot pressing under the hot pressing function of hot-pressing roller of mica paper and supporting material be compounded to form mica tape blank, after hot pressing, powder adhesive is still uniformly distributed in point-like on the interface of mica paper and supporting material;
(5), on mica tape blank, spray solution or the dispersion liquid of the latency Epoxy curing accelerators that step (2) is prepared, make solution or dispersion liquid penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the solvent in the mica tape blank of step (5) dry and remove, rolling, cuts, and obtains described high-permeability mica tape.
According to a concrete aspect of the present invention, described powder adhesive is the mixture that terminal carboxyl polyester resin and solid acid anhydrides form, step (1) is specifically implemented as follows: terminal carboxyl polyester resin and solid acid anhydrides are mixed, extruded by double screw extruder, in less than 10 DEG C pulverizing, sieve.
Further, in step (2), solvent can and be preferably acetone, methylethylketone, the mixture of one or more in toluene; In step (4), the temperature of hot pressing can and be preferably 100 DEG C ~ 160 DEG C; In step (6), solvent is dried except carrying out at temperature 80 DEG C ~ 110 DEG C.
Due to the employing of above technical scheme, the present invention compared with prior art tool has the following advantages:
1, the present invention selects epoxy hardener (particularly terminal carboxyl polyester resin or itself and solid acid anhydrides form mix powder) as adhesive, both the effect of epoxy curing agent had been played, also the effect of bonding mica paper and supporting material adhesive is played, under lower stoving temperature, get final product rapid curing on the one hand without the pure epoxy VPI insulating resin of curing agent, serve the effect of epoxy hardener; The adhesive layer of even spot distribution, also assures that and the gas permeability that mica tape tool is higher improve the impregnability of mica tape, be conducive to pure epoxy VPI insulating resin quick and complete immersion mica tape main insulating layer simultaneously;
2, the latency Epoxy curing accelerators contained in the mica paper layer of mica tape of the present invention and the reinforcing material bed of material, can accelerate the curing rate of pure epoxy VPI insulating resin further, reduce curing temperature, improves the electric property of main insulation after solidification; Latency Epoxy curing accelerators simultaneously can not enter into pure epoxy VPI insulating resin in dipping lacquer process, can ensure the pot life of the original storage stability of pure epoxy VPI insulating resin and overlength;
3, between the latency Epoxy curing accelerators in the adhesive selected in low resin mica tape of the present invention and mica paper and supporting material, all any chemical reaction is there is not below 110 DEG C, thus avoid when using epoxy resin as adhesive in prior art low resin mica tape, easily and the problem of Epoxy curing accelerators generation cross-linking reaction and hardening embrittlement, thus ensure that the extended storage stability of low resin mica tape, substantially prolongs its pot life.Adhesive also can not dissolve and enter into pure epoxy VPI insulating resin in dipping lacquer process simultaneously, also ensure that the extended storage stability of pure epoxy VPI insulating resin;
4, low resin mica tape of the present invention is used, directly can solidify the pure epoxy VPI resin without any curing agent and curing accelerator, and can low temperature fast curing be realized, produce any solidification fugitive constituent hardly, improve electrical insulation properties, expand the range of application of epoxy resin as insulating material, solved the problem that existing epoxy anhydride type VPI insulating resin is responsive to air humidity, high to the requirement of dip painting installation and technique, reduce the use cost of epoxy type VPI insulating resin.
5, low resin mica tape of the present invention and pure epoxy VPI resin reach the overlength pot life of more than 3 years, expand the range of application of epoxy resin as insulating material, and greatly reduce the requirement of epoxy type VPI insulating resin to dip painting installation and technique, reduce energy consumption, save use cost.High-permeability mica tape prepared by the present invention coordinates the pure epoxy VPI insulating resin without curing agent, can be applicable to the insulation processing of all kinds of motor or electric equipment products, be specially adapted to Large-scale High-Pressure generator and motor, the coil of electric pressure 6-27kV, monolateral insulation thickness 1-7mm or the main insulation VPI treatment process of line rod.
Accompanying drawing explanation
Fig. 1 is the structural representation according to high-permeability mica tape of the present invention;
Fig. 2 is the process chart of the preparation method of high-permeability mica tape of the present invention;
Wherein: A, mica paper layer; B, the reinforcing material bed of material; C, adhesive layer; D, latency Epoxy curing accelerators; E, pore channel.
Embodiment
The invention provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin.See Fig. 1, high-permeability mica tape comprises mica paper layer A, reinforcing material bed of material C and the adhesive layer B between mica paper layer A and reinforcing material bed of material C.Wherein adhesive layer B comprises multiple point-like and is evenly distributed on powder adhesive on mica paper layer A and reinforcing material bed of material C interface.A large amount of pore channel E is formed between point-like powder adhesive.Mica paper layer A can and be preferably non-calcinated large scale muscovite paper, the thickness of mica paper can be 0.1 ~ 0.2mm, and mass area ratio can be 80 ~ 220g/m
2, air permeability is 2-300s/100cm
3.Reinforcing material bed of material C can be electrician's level alkali-free glass fiber cloth, and supporting material layer thickness is within the scope of 0.010 ~ 0.060mm, and weight per unit area is 15 ~ 50g/m
2.Unlike the prior art, in the present invention, the powder adhesive forming adhesive layer B is epoxy hardener (being specially the mix powder that terminal carboxyl polyester resin powder or itself and solid acid anhydrides form).The consumption of powder adhesive can be 8 ~ 20g/m
2.In addition, mica tape is also containing 8 ~ 20g/m
2latency Epoxy curing accelerators D, this latency Epoxy curing accelerators D is mainly distributed in mica paper layer A and reinforcing material bed of material C, is distributed on a small quantity in the pore channel E of adhesive layer B.
See Fig. 2, high-permeability mica tape of the present invention prepares by following steps:
(1), preparing particle diameter is 90 ~ 120 object powder adhesives;
(2), by latency Epoxy curing accelerators dissolve (or dispersion) in solvent (such as acetone, methylethylketone, toluene etc.), preparation solid content is the solution (or dispersion liquid) of the latency Epoxy curing accelerators of 10% ~ 40%;
(3), mica paper unreels and on mica paper, sprays powder adhesive prepared by step (1);
(4), the mica paper preheating of having sprayed powder adhesive is made powder adhesive partial melting, supporting material unreels simultaneously, make the hot pressing under the hot pressing function of hot-pressing roller of mica paper and supporting material be compounded to form mica tape blank, after hot pressing, powder adhesive is still uniformly distributed in point-like on the interface of mica paper and supporting material;
(5), on mica tape blank, spray the solution (or dispersion liquid) of the latency Epoxy curing accelerators that step (2) is prepared, make solution (or dispersion liquid) penetrate in whole mica tape blank, wherein preferably adopt highly pressurised liquid spraying process to implement to spray;
(6), by the solvent in the mica tape blank of step (5) dry except (temperature can be 80 DEG C ~ 120 DEG C), rolling, cuts, and obtains high-permeability mica tape of the present invention.
Below in conjunction with specific embodiment, such scheme is described further.Should be understood that these embodiments are for illustration of general principle of the present invention, principal character and advantage, and the present invention does not limit by the scope of following examples.The implementation condition adopted in embodiment can do further adjustment according to specific requirement, and not marked implementation condition is generally the condition in normal experiment.
Embodiment 1
The present embodiment provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, and its structure as shown in Figure 1.In this mica tape, powder adhesive is terminal carboxyl polyester resin (number-average molecular weight Mn is 20000, and acid number is 85mgKOH/g); Mica paper layer A is non-calcinated large scale muscovite paper, and thickness is 0.11mm, and its gas permeability is 172s/100cm
3, mass area ratio is 181g/m
2; Reinforcing material bed of material C is electrician's level alkali-free glass fiber cloth, and thickness is 0.032mm, and mass area ratio is 23.1g/m
2.Latency Epoxy curing accelerators D is zinc naphthenate.
The preparation method of high-permeability mica tape is as follows:
(1), terminal carboxyl polyester resin low temperature grinding and sieving at 0 DEG C is obtained the powder adhesive that particle diameter is 90 orders, melt temperature is 135 DEG C;
(2), by zinc naphthenate be dissolved in acetone, obtain the curing accelerator solution of 25wt% solid content;
(3), mica paper unreels, by 15g/m
2consumption spray step (1) powder adhesive prepared;
(4), step (3) has been sprayed the mica paper of powder adhesive through 130 DEG C of preheatings, supporting material unreels simultaneously, makes the hot pressing under hot-pressing roller hot pressing function (140 DEG C, 0.5MPa) of supporting material and mica paper be combined into mica tape blank;
(5), by curing accelerator 16g/m
2consumption on mica tape blank, spray the curing accelerator solution that step (2) prepares, make solution penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the baking carrying out solvent in the mica tape blank of step (5) at 100 DEG C remove, rolling afterwards, cuts, and to obtain final product.
The high-permeability mica tape gross mass that gained is applicable to pure epoxy VPI insulating resin is 222.1g/m
2, thickness is 0.160mm, and terminal carboxyl polyester adhesive content is 15g/m
2, the total content of latency Epoxy curing accelerators zinc naphthenate is 16g/m
2, air permeability is 275s/100cm
3, deflection 23N/m.
Embodiment 2
The present embodiment provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, and its structure as shown in Figure 1.In this mica tape, powder adhesive is terminal carboxyl polyester resin (number-average molecular weight Mn is 30000, and acid number is 75mgKOH/g) and anhydride equivalent is that the carbic anhydride of 170 is by weight 1:1 composition; Mica paper layer A is non-calcinated large scale muscovite paper, and thickness is 0.11mm, and its gas permeability is 165s/100cm
3, mass area ratio is 178g/m
2; Reinforcing material bed of material C is electrician's level alkali-free glass fiber cloth, and thickness is 0.035mm, and mass area ratio is 28.3g/m
2.Latency Epoxy curing accelerators D is that zinc naphthenate and chromium acetylacetonate form by weight 2:1.
The preparation method of high-permeability mica tape is as follows:
(1), by terminal carboxyl polyester resin and carbic anhydride mix by 1:1 weight ratio, and extruded by double screw extruder, at 0 DEG C, low temperature grinding and sieving obtains particle diameter is 100 orders, and melt temperature is the powder adhesive of 135 DEG C;
(2), by zinc naphthenate and chromium acetylacetonate be dissolved in toluene by weight 1:1, obtain the curing accelerator solution of 20wt% solid content;
(3), mica paper unreels, by 16g/m
2consumption spray step (1) powder adhesive prepared;
(4), step (3) has been sprayed the mica paper of powder adhesive through 140 DEG C of preheatings, supporting material unreels simultaneously, makes the hot pressing under hot-pressing roller hot pressing function (150 DEG C, 0.5MPa) of supporting material and mica paper be combined into mica tape blank;
(5), by curing accelerator 15g/m
2consumption on mica tape blank, spray the curing accelerator solution that step (2) prepares, make solution penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the baking carrying out solvent in the mica tape blank of step (5) at 110 DEG C remove, rolling afterwards, cuts, and to obtain final product.
The high-permeability mica tape gross mass that gained is applicable to pure epoxy VPI insulating resin is 237.3g/m
2, thickness is 0.160mm, and curable epoxide agent content is 16g/m
2, the content of latency Epoxy curing accelerators is 15g/m
2, air permeability is 258s/100cm3, deflection 22N/m.
Embodiment 3
The present embodiment provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, and its structure as shown in Figure 1.In this mica tape, powder adhesive is that terminal carboxyl polyester resin (number-average molecular weight Mn is 28000, and acid number is 58mgKOH/g) and acid number are 870, fusing point is that the trimellitic anhydride of 167 DEG C is by weight 1:1 composition; Mica paper layer A is non-calcinated large scale muscovite paper, and thickness is 0.10mm, and its gas permeability is 155s/100cm
3, mass area ratio is 162g/m
2; Reinforcing material bed of material C is electrician's level alkali-free glass fiber cloth, and thickness is 0.032mm, and mass area ratio is 23.3g/m2.Latency Epoxy curing accelerators D is that zinc neodecanoate and aluminium acetylacetonate form by weight 1:1.
The preparation method of high-permeability mica tape is as follows:
(1), by terminal carboxyl polyester resin and trimellitic anhydride mix by 1:1 weight ratio, and extruded by double screw extruder, at 0 DEG C, low temperature grinding and sieving obtains particle diameter is 110 orders, and melt temperature is the powder adhesive of 145 DEG C;
(2), by zinc neodecanoate and aluminium acetylacetonate be dissolved in toluene by weight 1:1, obtain the curing accelerator solution of 25wt% solid content;
(3), mica paper unreels, by 14g/m
2consumption spray step (1) powder adhesive prepared;
(4), step (3) has been sprayed the mica paper of powder adhesive through 140 DEG C of preheatings, supporting material unreels simultaneously, makes the hot pressing under hot-pressing roller hot pressing function (150 DEG C, 0.5MPa) of supporting material and mica paper be combined into mica tape blank;
(5), by curing accelerator 15g/m
2consumption on mica tape blank, spray the curing accelerator solution that step (2) prepares, make solution penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the baking carrying out solvent in the mica tape blank of step (5) at 110 DEG C remove, rolling afterwards, cuts, and to obtain final product.
The high-permeability mica tape gross mass that gained is applicable to pure epoxy VPI insulating resin is 214.3g/m
2, thickness is 0.148mm, and curable epoxide agent content is 14g/m
2, the content of latency Epoxy curing accelerators is 15g/m
2, air permeability is 263s/100cm
3, deflection 22N/m.
Embodiment 4
The present embodiment provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, and its structure as shown in Figure 1.In this mica tape, powder adhesive is that terminal carboxyl polyester resin (number-average molecular weight Mn is 20000, and acid number is 95mgKOH/g) and acid number are 420, fusing point is that the styrene-maleic anhydride copolymer of 142 DEG C is by weight 1:2 composition; Mica paper layer A is non-calcinated large scale muscovite paper, and thickness is 0.10mm, and its gas permeability is 170s/100cm
3, mass area ratio is 161g/m
2; Reinforcing material bed of material C is electrician's level alkali-free glass fiber cloth, and thickness is 0.032mm, and mass area ratio is 23.2g/m
2.Latency Epoxy curing accelerators D is that zinc neodecanoate and aluminium acetylacetonate form by weight 1:1.
The preparation method of high-permeability mica tape is as follows:
(1), by terminal carboxyl polyester resin and styrene-maleic anhydride copolymer mix by 1:2 weight ratio, and extruded by double screw extruder, at 0 DEG C, low temperature grinding and sieving obtains particle diameter is 120 orders, and melt temperature is the powder adhesive of 140 DEG C;
(2), by zinc neodecanoate and aluminium acetylacetonate be dissolved in toluene by weight 1:1, obtain the curing accelerator solution of 25wt% solid content;
(3), mica paper unreels, by 18g/m
2consumption spray step (1) powder adhesive prepared;
(4), step (3) has been sprayed the mica paper of powder adhesive through 130 DEG C of preheatings, supporting material unreels simultaneously, makes the hot pressing under hot-pressing roller hot pressing function (140 DEG C, 0.5MPa) of supporting material and mica paper be combined into mica tape blank;
(5), by curing accelerator 15g/m
2consumption on mica tape blank, spray the curing accelerator solution that step (2) prepares, make solution penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the baking carrying out solvent in the mica tape blank of step (5) at 110 DEG C remove, rolling afterwards, cuts, and to obtain final product.
The high-permeability mica tape gross mass that gained is applicable to pure epoxy VPI insulating resin is 218.2g/m
2, thickness is 0.148mm, and curable epoxide agent content is 18g/m
2, the content of latency Epoxy curing accelerators is 15g/m
2, air permeability is 256s/100cm
3, deflection 24N/m.
Embodiment 5
The present embodiment provides a kind of high-permeability mica tape being applicable to pure epoxy VPI insulating resin, and its structure as shown in Figure 1.In this mica tape, powder adhesive is that terminal carboxyl polyester resin (number-average molecular weight Mn is 20000, and acid number is 95mgKOH/g) and acid number are 460, fusing point is that the succinyl oxide of 120 DEG C is by weight 1:1 composition; Mica paper layer A is non-calcinated large scale muscovite paper, and thickness is 0.10mm, and its gas permeability is 158s/100cm
3, mass area ratio is 165g/m
2; Reinforcing material bed of material C is electrician's level alkali-free glass fiber cloth, and thickness is 0.032mm, and mass area ratio is 24.0g/m
2.Latency Epoxy curing accelerators D is zinc neodecanoate.
The preparation method of high-permeability mica tape is as follows:
(1), by terminal carboxyl polyester resin and succinyl oxide mix by 1:1 weight ratio, and extruded by double screw extruder, at 0 DEG C, low temperature grinding and sieving obtains particle diameter is 120 orders, and melt temperature is the powder adhesive of 135 DEG C;
(2), by zinc neodecanoate be dissolved in toluene, obtain the curing accelerator solution of 25wt% solid content;
(3), mica paper unreels, by 20g/m
2consumption spray step (1) powder adhesive prepared;
(4), step (3) has been sprayed the mica paper of powder adhesive through 130 DEG C of preheatings, supporting material unreels simultaneously, makes the hot pressing under hot-pressing roller hot pressing function (135 DEG C, 0.5MPa) of supporting material and mica paper be combined into mica tape blank;
(5), by curing accelerator 18g/m
2consumption on mica tape blank, spray the curing accelerator solution that step (2) prepares, make solution penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the baking carrying out solvent in the mica tape blank of step (5) at 110 DEG C remove, rolling afterwards, cuts, and to obtain final product.
The high-permeability mica tape gross mass that gained is applicable to pure epoxy VPI insulating resin is 227g/m
2, thickness is 0.148mm, and curable epoxide agent content is 20g/m
2, the content of latency Epoxy curing accelerators is 18g/m
2, air permeability is 289s/100cm
3, deflection 26N/m.
Comparative example 1
Use epoxy powder as adhesive, prepare high-permeability mica tape, preparation process material requested is as follows:
1) epoxy powder, this resin epoxy equivalent weight is 1100g/ equivalent, softening point 105 DEG C;
2) mass area ratio is 178g/m
2muscovite paper, and spray 1g/m in advance
2zinc naphthenate promoter preliminary treatment is carried out to mica paper, gas permeability is 123s/100cm
3;
3) mass area ratio is 23.5g/m
2glass cloth, and spray 1.5g/m in advance
2zinc naphthenate preliminary treatment is carried out to glass cloth;
4) zinc naphthenate/epoxy resin (mass ratio 1:1) solution of 15% solid content.
Preparation process: mica paper is after unreeling, spray epoxy powder resin, after 100 DEG C of preheatings, compound is completed under being distributed in 110 DEG C of hot-pressing roller effects with glass, then on mica paper, zinc naphthenate/epoxy resin (mass ratio 1:1) solution is coated with through secondary dip-coating, desolventize through 100 DEG C of heating bakings, rolling obtains common high-permeability mica tape after cutting again.
Gained low resin mica tape gross mass is 211g/m
2, thickness is 0.150mm, and adhesive content is: 12.5g/m
2, air permeability is 259s/100cm
3, deflection 26N/m.
Comparative example 2
This comparative example provides a kind of containing promoter low resin mica tape, material requested and preparation process as follows:
Material requested comprises: 1) containing solvent epoxyn, and epoxy resin is modification high viscosity liquid epoxy resin, and epoxide equivalent is 265g/ equivalent, and solvent is acetone, and epoxy resin solid content is 25%; 2) mass area ratio is 180g/m
2non-calcinated muscovite paper, gas permeability is 167s/100cm
3; 3) mass area ratio is 23.5g/m
2glass cloth, zinc naphthenate/epoxy resin (mass ratio 1:1) solution of 15% solid content.
Preparation process: glass cloth is after unreeling, dipping is containing solvent epoxyn, desolventize with drying under 120 DEG C of heat effects after mica paper compound, then on mica paper, zinc naphthenate/epoxy resin (mass ratio 1:1) solution is coated with through secondary dip-coating, desolventize through 110 DEG C of heating bakings again, obtain after cutting finally by rolling containing promoter low resin mica tape.
Gross mass containing promoter low resin mica tape is 223.5g/m
2, thickness 0.150mm, adhesive content is: 20g/m
2, air permeability is 1572s/100cm
3, deflection 32N/m, zinc naphthenate content is 2g/m
2.
See table 1, there is shown wrapped 8 layers of embodiment 1 ~ 5, the main insulation of bar dipping of the low resin mica tape of comparative example 1 and 2 is without solidification situation, the electric property after the pure epoxy VPI insulating resin of curing agent, and the stable storing performance of low resin mica tape.This pure epoxy VPI insulating resin is simple molecular clock bisphenol F epoxy resin, and not containing any epoxy hardener and promoter, at 60 DEG C, rotary viscosity is 78mPa*s, deposits the viscosity after 3 years and increase almost nil at 70 DEG C.As can be seen from Table 1, can fully solidify in the line rod short period at a lower temperature of embodiment 1 ~ 5, excellent electric properties, and comparative example also fails fully to solidify pure epoxy VPI insulating resin under the higher temperature long period, electric property is relatively poor; And the low resin mica tape of the embodiment of the present invention has better storage stability and longer pot life relative to low resin mica tape prepared by comparative example.
Table 1
Above-described embodiment is only for illustrating technical conceive of the present invention and feature; its object is to person skilled in the art can be understood content of the present invention and implement according to this; can not limit the scope of the invention with this; all equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (9)
1. one kind is applicable to the preparation method of the high-permeability mica tape of pure epoxy VPI insulating resin, described pure epoxy VPI insulating resin refers to the epoxy VPI insulating resin not containing any curing agent and curing accelerator, described high-permeability mica tape comprises mica paper layer (A), the reinforcing material bed of material (C) and the adhesive layer (B) be positioned between mica paper layer (A) and the reinforcing material bed of material (C), described adhesive layer (B) is evenly distributed on the powder adhesive on mica paper layer (A) and the reinforcing material bed of material (C) interface for point-like, a large amount of pore channels (E) is there is between the powder adhesive of spot distribution, it is characterized in that: described powder adhesive is epoxy hardener, described high-permeability mica tape is also containing 8 ~ 20g/m
2latency Epoxy curing accelerators (D), described latency Epoxy curing accelerators (D) is distributed in described mica paper layer (A), the reinforcing material bed of material (C) and described pore channel (E), all any chemical reaction is there is not in described epoxy hardener and described latency Epoxy curing accelerators below 110 DEG C, in the VPI dipping lacquer process using pure epoxy VPI insulating resin, all can not dissolve and enter into pure epoxy VPI insulating resin, described high-permeability mica tape is after use pure epoxy VPI insulating resin carries out VPI dipping lacquer, and at 120 DEG C ~ 170 DEG C temperature, the time fully needed for solidification of completing, described preparation method comprised the steps: lower than 12 hours
(1) particle diameter, is prepared for powder adhesive described in 90 ~ 120 objects;
(2), be dissolved or dispersed in solvent by latency Epoxy curing accelerators, preparation solid content is solution or the dispersion liquid of the latency Epoxy curing accelerators of 10% ~ 40%;
(3), mica paper unreels, and on mica paper, spray powder adhesive prepared by step (1);
(4), the mica paper preheating of having sprayed powder adhesive is made powder adhesive partial melting, supporting material unreels simultaneously, make the hot pressing under the hot pressing function of hot-pressing roller of mica paper and supporting material be compounded to form mica tape blank, after hot pressing, powder adhesive is still uniformly distributed in point-like on the interface of mica paper and supporting material;
(5), on mica tape blank, spray solution or the dispersion liquid of the latency Epoxy curing accelerators that step (2) is prepared, make solution or dispersion liquid penetrate in whole mica tape blank, wherein adopt highly pressurised liquid spraying process to implement to spray;
(6), by the solvent in the mica tape blank of step (5) dry and remove, rolling, cuts, and obtains described high-permeability mica tape.
2. the preparation method of high-permeability mica tape according to claim 1, is characterized in that: described epoxy hardener is the mixture that terminal carboxyl polyester resin or itself and solid acid anhydrides form.
3. the preparation method of high-permeability mica tape according to claim 2, is characterized in that: the acid number of described terminal carboxyl polyester resin is 50 ~ 150mgKOH/g, number-average molecular weight Mn is 2000 ~ 50000, and softening point is 100 ~ 180 DEG C; The anhydride equivalent of described solid acid anhydrides is 150 ~ 200, and fusing point is 60 ~ 150 DEG C.
4. the preparation method of the high-permeability mica tape according to Claims 2 or 3, is characterized in that: described solid acid anhydrides is one or more the combination be selected from phthalic anhydride, succinyl oxide, carbic anhydride, trimellitic anhydride, styrene-maleic anhydride copolymer.
5. the preparation method of high-permeability mica tape according to claim 1 and 2, is characterized in that: the consumption of described epoxy hardener is 8 ~ 20g/m
2mica tape.
6. the preparation method of high-permeability mica tape according to claim 1, is characterized in that: described latency Epoxy curing accelerators is the mixture of one or more compositions be selected from zinc naphthenate, isooctyl acid zinc, zinc neodecanoate, chromium acetylacetonate, aluminium acetylacetonate.
7. the preparation method of high-permeability mica tape according to claim 1, it is characterized in that: the mica paper of the mica paper layer (A) described in formation is the non-calcinated large scale muscovite paper of thickness 0.05 ~ 0.20mm, and weight per unit area is 80 ~ 220g/m
2, air permeability is 2 ~ 300s/100cm
3.
8. the preparation method of high-permeability mica tape according to claim 1, is characterized in that: the material of the described reinforcing material bed of material (C) is electrician's level alkali-free glass fiber cloth of thickness 0.010 ~ 0.060mm.
9. the preparation method of high-permeability mica tape according to claim 1, it is characterized in that: described powder adhesive is the mixture that terminal carboxyl polyester resin and solid acid anhydrides form, step (1) is specifically implemented as follows: terminal carboxyl polyester resin and solid acid anhydrides are mixed, extruded by double screw extruder, in less than 10 DEG C pulverizing, sieve.
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| CN103952110B (en) * | 2014-04-03 | 2015-12-09 | 中原工学院 | The method of the two spray of a kind of epoxy resin |
| CN105047256B (en) * | 2015-06-30 | 2017-07-14 | 株洲时代新材料科技股份有限公司 | Mica tape of the curing accelerator containing microcapsules and preparation method thereof |
| DE102015213815A1 (en) * | 2015-07-17 | 2017-01-19 | Siemens Aktiengesellschaft | Solid insulation material, use for this purpose and insulation system manufactured therewith |
| CN106816205A (en) * | 2015-12-01 | 2017-06-09 | 株洲时代新材料科技股份有限公司 | The preparation method of a kind of low resin mica tape and by its obtained low resin mica tape |
| EP3519479A1 (en) * | 2016-09-28 | 2019-08-07 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | Electrical insulation system based on epoxy resins for generators and motors |
| CN107527696A (en) * | 2017-08-30 | 2017-12-29 | 株洲时代新材料科技股份有限公司 | A kind of single-face polyester film adhesive-contented mica tapes and preparation method thereof and the application in high voltage wind-driven generator |
| CN110815960B (en) * | 2019-10-31 | 2022-07-26 | 上海电气电站设备有限公司 | Accelerant-containing expanded felt material and preparation method thereof |
| CN111584123B (en) * | 2020-05-18 | 2022-02-08 | 浙江博菲电气股份有限公司 | Less glue mica tape and its preparation method |
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