CN105513725A - Compound mica tape and preparation method thereof - Google Patents
Compound mica tape and preparation method thereof Download PDFInfo
- Publication number
- CN105513725A CN105513725A CN201610061431.8A CN201610061431A CN105513725A CN 105513725 A CN105513725 A CN 105513725A CN 201610061431 A CN201610061431 A CN 201610061431A CN 105513725 A CN105513725 A CN 105513725A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- mica tape
- adhesive
- parts
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
- B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
- B32B19/06—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
Abstract
The invention discloses a compound mica tape which sequentially comprises a mica paper layer, a first adhesive layer, a second adhesive layer and a reinforced material layer. Each layer is overlapped to form the compound mica tape. The first adhesive layer comprises, by weight parts, 30-40 parts of polyester modified silicone resin, 0.1-1 part of surface modified nanometer aluminum oxide, 30-50 parts of organic solvents and 5-10 parts of zinc naphthenate. The second adhesive layer comprises, by weight parts, 40-60 parts of epoxy resin, 10-20 parts of maleic anhydride, 1-5 parts of dioctyl phthalate and 10-20 parts of unsaturated polyesterimide resin. The compound mica tape has good overall performance, and particularly has good mechanical property and heat-conducting property.
Description
Technical field
The invention belongs to low resin mica tape manufacturing technology field, particularly relate to a kind of low resin mica tape of MULTILAYER COMPOSITE.
Background technology
At present, motor is towards voltage levels, the future developments such as high power, Large Copacity, high-performance, impel electrical machine insulation to following several future development: (1) high thermal endurance class, the raising of the electric pressure of machine operation, the increase of capacity, make motor operationally liberated heat increase considerably, therefore must improve the normal use of the thermal endurance class guarantee motor of insulating material; (2) high-performance, comprises electric property, mechanical performance, chemical resistance, environment resistant etc.; (3) thinning insulation thickness, due to the increase of motor heat release, for ensureing the instructions for use of motor, must reduce electric machine temperature rise, therefore needing to reduce insulation thickness; (4) low cost, comprises the raw material using low cost, and the aspect such as the technology of low cost and quality control.
Mica tape is motor particularly irreplaceable the most key insulating material in large-scale, high-voltage motor.The primary base material of mica tape comprises the part compositions such as mica paper, supporting material, adhesive.In mica tape, adhesive plays the important function of bonding mica paper and supporting material, although its content is only 4% ~ 11% in low resin mica tape, the performance of adhesive but greatly affects electric property and the thermal endurance class of mica tape.And for dissimilar VPI resin, need different low resin mica tape adhesive supporting with it, such as, epoxy anhydride VPI resin self is not containing promoter, be difficult to solidification, so need the low resin mica tape using epoxy resin as adhesive also containing promoter supporting, and promoter also has variety classes, as organic carboxylate, acetylacetonate and modified amine etc.; And for the VPI resin that self can be heating and curing, then usually select not containing the adhesive of promoter, to ensure the long-time stability of resin; For the VPI resin of unsaturated polyester type, the adhesive of usual mica tape can select polyester-type with unsaturated bond or acrylic ester type adhesive, to guarantee its reacting phase capacitive; In order to ensure and the compatibility of silicone based VPI resin and thermal endurance, then usual supporting employing organic siliconresin is as the adhesive of mica tape.
For superhuge High-voltage generator set and various mine motor, on the one hand to ensure its heat resistance, also need to carry out toughening modifying to mica tape adhesive on the other hand, to improve the ability of its opposing thermal stress, mechanical stress and vibration; But mica tape of the prior art is often difficult to take into account two kinds of performances simultaneously.
Summary of the invention
The present invention proposes to adopt double-layer glue stick to overcome heat transfer property and the new technical problem that can cannot take into account of machinery for mica tape.Be exactly in mica tape, increase a high heat transfer adhesive layer improved specifically, ensure that motor can use under circumstances, need adhesive to have good mechanical performance, corrosion resistance and environment resistant.
Technical scheme of the present invention is achieved in the following ways:
A kind of composite mica tape, comprise mica paper layer, the first adhesive layer, the second adhesive layer, layers of reinforcement successively, the laminating formation composite mica tape of each layer, ground floor is made up of according to weight portion following material, polyester modified organic silicon resin 30-40 part, surface-modified nano aluminium oxide 0.1-1 part, organic solvent 30-50 part, zinc naphthenate 5-10 part; Wherein said second adhesive layer is made up of according to weight portion following material: epoxy resin 40-60 part, cis-butenedioic anhydride 10-20 part, dioctyl phthalate 1-5 part, unsaturated polyester-imide resin 10-20 part; Described reinforcing material is the one in glass fabric, polyimide film, polyester fiber non-woven fabric.
Described mica paper is large flake mica paper.
Described reinforcing material is preferably glass fabric, is more preferably flat glass fiber woven fabric.
A preparation method for composite mica tape, comprises the following steps:
1) by polyester modified organic silicon resin, surface-modified nano aluminium oxide, organic solvent is proportionally placed in reactor and stirs, be heated to 100-110 DEG C, insulation 30-60min, add zinc naphthenate again and be heated to 120-130 DEG C of insulation reaction 10-20 minute, the first adhesive can be obtained;
2) epoxy resin, cis-butenedioic anhydride, dioctyl phthalate, unsaturated polyester-imide resin proportionally adds in reactor and is stirred and heated to 115-125 DEG C, and insulation 10-20min, can obtain the second adhesive;
3) the first adhesive layer is formed by the second adhesive coated to layers of reinforcement according to a conventional method, then be coated with at the first adhesive layer and apply the second adhesive layer, again mica paper is fitted on the second adhesive layer, finally heat at 80-120 DEG C, and be cut into the specification of needs.
Described conventional method is the mode of blade coating, spraying.
Described polyester modified organic silicon resin is polyurethane-modified organic siliconresin preferably.
The present invention adds the nano alumina particles with strong heat conduction function in the first adhesive layer, greatly strengthen the insulation property of mica tape, and adopt the polyester modified organic silicon resin with nano aluminium oxide with better affinity, ensure that the generation of the situations such as dry linting can not occur aluminium oxide; And the second adhesive layer has good bonding force, ensure that mica tape entirety has good mechanical performance.
Embodiment
Be described in detail below in conjunction with the technical scheme of specific embodiment to invention.
Embodiment 1
1) 1) by polyester modified organic silicon resin, surface-modified nano aluminium oxide, organic solvent is proportionally placed in reactor and stirs, be heated to 100 DEG C, insulation 30min, then add zinc naphthenate and be heated to 120 DEG C of insulation reaction 10 minutes, the first adhesive can be obtained;
2) epoxy resin, cis-butenedioic anhydride, dioctyl phthalate, unsaturated polyester-imide resin proportionally adds in reactor and is stirred and heated to 115 DEG C, and insulation 10min, can obtain the second adhesive;
3) the first adhesive layer is formed by the second adhesive coated to layers of reinforcement according to a conventional method, then be coated with at the first adhesive layer and apply the second adhesive layer, again mica paper is fitted on the second adhesive layer, finally heat at 80 DEG C, and be cut into the specification of needs.
Embodiment 2
1) by polyurethane-modified organic siliconresin, surface-modified nano aluminium oxide, organic solvent is proportionally placed in reactor and stirs, be heated to 110 DEG C, insulation 60min, then add zinc naphthenate and be heated to 130 DEG C of insulation reaction 20 minutes, the first adhesive can be obtained;
2) epoxy resin, cis-butenedioic anhydride, dioctyl phthalate, unsaturated polyester-imide resin proportionally adds in reactor and is stirred and heated to 125 DEG C, and insulation 20min, can obtain the second adhesive;
3) the first adhesive layer is formed by the second adhesive coated to layers of reinforcement according to a conventional method, then be coated with at the first adhesive layer and apply the second adhesive layer, again mica paper is fitted on the second adhesive layer, finally heat at 120 DEG C, and be cut into the specification of needs.
The present invention can summarize with other the concrete form without prejudice to spirit of the present invention or principal character.All embodiments of the present invention all can only be thought explanation of the present invention instead of restriction, every any trickle amendment done by technology contents of the present invention or equivalently to replace, and all belong within technical scheme of the present invention.
Claims (6)
1. a composite mica tape, comprises mica paper layer, the first adhesive layer, the second adhesive layer, layers of reinforcement successively, the laminating formation composite mica tape of each layer; Ground floor is made up of according to weight portion following material, polyester modified organic silicon resin 30-40 part, surface-modified nano aluminium oxide 0.1-1 part, organic solvent 30-50 part, zinc naphthenate 5-10 part; Described second adhesive layer is made up of according to weight portion following material: epoxy resin 40-60 part, cis-butenedioic anhydride 10-20 part, dioctyl phthalate 1-5 part, unsaturated polyester-imide resin 10-20 part; Described reinforcing material is the one in glass fabric, polyimide film, polyester fiber non-woven fabric.
2. composite mica tape according to claim 1, is characterized in that described mica paper is large flake mica paper.
3. composite mica tape according to claim 1, is characterized in that described reinforcing material is preferably glass fabric, is more preferably flat glass fiber woven fabric.
4. prepare a preparation method for composite mica tape according to any one of claim 1-3, comprise the following steps:
1) by polyester modified organic silicon resin, surface-modified nano aluminium oxide, organic solvent is proportionally placed in reactor and stirs, be heated to 100-110 DEG C, insulation 30-60min, add zinc naphthenate again and be heated to 120-130 DEG C of insulation reaction 10-20 minute, the first adhesive can be obtained;
2) epoxy resin, cis-butenedioic anhydride, dioctyl phthalate, unsaturated polyester-imide resin proportionally adds in reactor and is stirred and heated to 115-125 DEG C, and insulation 10-20min, can obtain the second adhesive;
3) the first adhesive layer is formed by the second adhesive coated to layers of reinforcement according to a conventional method, then be coated with at the first adhesive layer and apply the second adhesive layer, again mica paper is fitted on the second adhesive layer, finally heat at 80-120 DEG C, and be cut into the specification of needs.
5. method as claimed in claim 4, is characterized in that described conventional method is the mode of blade coating, spraying.
6. method as claimed in claim 4, is characterized in that described polyester modified organic silicon resin preferably polyurethane-modified organic siliconresin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061431.8A CN105513725B (en) | 2016-01-29 | 2016-01-29 | A kind of composite mica tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061431.8A CN105513725B (en) | 2016-01-29 | 2016-01-29 | A kind of composite mica tape and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105513725A true CN105513725A (en) | 2016-04-20 |
| CN105513725B CN105513725B (en) | 2017-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610061431.8A Expired - Fee Related CN105513725B (en) | 2016-01-29 | 2016-01-29 | A kind of composite mica tape and preparation method thereof |
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| CN (1) | CN105513725B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106205904A (en) * | 2016-06-20 | 2016-12-07 | 河南省亚安绝缘材料厂有限公司 | A kind of environmental protection composite insulating material |
| CN108766686A (en) * | 2018-06-05 | 2018-11-06 | 瑞安复合材料(深圳)有限公司 | A kind of low sheet resistance flexible insulating material and preparation method thereof |
| CN110233009A (en) * | 2019-05-23 | 2019-09-13 | 苏州苏绝电工材料股份有限公司 | A kind of manufacturing method and manufacturing device of high temperature resistant combined mica pipe |
| CN111477380A (en) * | 2020-04-16 | 2020-07-31 | 株洲时代电气绝缘有限责任公司 | Novel environment-friendly less-glue-powder mica tape and preparation method thereof |
| CN111627591A (en) * | 2020-05-18 | 2020-09-04 | 浙江博菲电气股份有限公司 | Method for preparing high-cohesiveness little-glue mica tape |
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| WO1998014959A1 (en) * | 1996-10-01 | 1998-04-09 | Schweizerische Isola-Werke | Mica tape for fire resistant electric isolations |
| CN101121878A (en) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | Thermally conductive material |
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN102254650A (en) * | 2011-03-30 | 2011-11-23 | 株洲时代电气绝缘有限责任公司 | Less-resin mica tape and preparation method thereof |
| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
| CN103594145A (en) * | 2013-10-15 | 2014-02-19 | 昆山市奋发绝缘材料有限公司 | High-heat-resistant composite insulating material and manufacturing method thereof |
| CN104388023A (en) * | 2014-10-31 | 2015-03-04 | 青岛昌安达药业有限公司 | Improved adhesive for waterproof coiled materials |
-
2016
- 2016-01-29 CN CN201610061431.8A patent/CN105513725B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998014959A1 (en) * | 1996-10-01 | 1998-04-09 | Schweizerische Isola-Werke | Mica tape for fire resistant electric isolations |
| CN101121878A (en) * | 2006-08-10 | 2008-02-13 | 国家淀粉及化学投资控股公司 | Thermally conductive material |
| CN101186796A (en) * | 2007-12-06 | 2008-05-28 | 上海交通大学 | Method for preparing epoxy resin adhesive |
| CN102254650A (en) * | 2011-03-30 | 2011-11-23 | 株洲时代电气绝缘有限责任公司 | Less-resin mica tape and preparation method thereof |
| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
| CN103594145A (en) * | 2013-10-15 | 2014-02-19 | 昆山市奋发绝缘材料有限公司 | High-heat-resistant composite insulating material and manufacturing method thereof |
| CN104388023A (en) * | 2014-10-31 | 2015-03-04 | 青岛昌安达药业有限公司 | Improved adhesive for waterproof coiled materials |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106205904A (en) * | 2016-06-20 | 2016-12-07 | 河南省亚安绝缘材料厂有限公司 | A kind of environmental protection composite insulating material |
| CN106205904B (en) * | 2016-06-20 | 2017-06-27 | 河南省亚安绝缘材料厂有限公司 | A kind of environmentally friendly composite insulating material |
| CN108766686A (en) * | 2018-06-05 | 2018-11-06 | 瑞安复合材料(深圳)有限公司 | A kind of low sheet resistance flexible insulating material and preparation method thereof |
| CN110233009A (en) * | 2019-05-23 | 2019-09-13 | 苏州苏绝电工材料股份有限公司 | A kind of manufacturing method and manufacturing device of high temperature resistant combined mica pipe |
| CN110233009B (en) * | 2019-05-23 | 2020-10-23 | 苏州苏绝电工材料股份有限公司 | Manufacturing method and manufacturing device of high-temperature-resistant composite mica pipe |
| CN111477380A (en) * | 2020-04-16 | 2020-07-31 | 株洲时代电气绝缘有限责任公司 | Novel environment-friendly less-glue-powder mica tape and preparation method thereof |
| CN111477380B (en) * | 2020-04-16 | 2021-10-12 | 株洲时代电气绝缘有限责任公司 | Novel environment-friendly less-glue-powder mica tape and preparation method thereof |
| CN111627591A (en) * | 2020-05-18 | 2020-09-04 | 浙江博菲电气股份有限公司 | Method for preparing high-cohesiveness little-glue mica tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105513725B (en) | 2017-12-26 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20171204 Address after: No. 108, Wu Hang middle western road, Changle City, Fuzhou, Fujian Applicant after: Lin Zhong Address before: 266000 Shandong province Qingdao City, Inner Mongolia Road No. 30 Building No. 5 Applicant before: Hao Fu |
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Effective date of registration: 20190822 Address after: 411100 No. 6 Green Road, German Industrial Park, Xiangtan High-tech Zone, Hunan Province Patentee after: XIANGTAN INSULATION MATERIAL FACTORY Co.,Ltd. Address before: 350200 No. 108 Xiyang Middle Road, Wuhang, Changle City, Fuzhou City, Fujian Province Patentee before: Lin Zhong |
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| TR01 | Transfer of patent right | ||
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Granted publication date: 20171226 Termination date: 20220129 |
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| CF01 | Termination of patent right due to non-payment of annual fee |