CN101319086A - F level heating solvent-free solvent-impregnated resin suitable for subatmospheric pressure - Google Patents
F level heating solvent-free solvent-impregnated resin suitable for subatmospheric pressure Download PDFInfo
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- CN101319086A CN101319086A CNA2008100402979A CN200810040297A CN101319086A CN 101319086 A CN101319086 A CN 101319086A CN A2008100402979 A CNA2008100402979 A CN A2008100402979A CN 200810040297 A CN200810040297 A CN 200810040297A CN 101319086 A CN101319086 A CN 101319086A
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Abstract
The invention discloses a vacuum pressure F-grade heating solvent-free solvent impregnated resin, comprising the following compositions by weight portion: 100 portions of an epoxide resin, 2 to 4 portions of a stabilizing agent, 80 to 120 portions of fluid estolide and 10 to 20 portions of a plasticizer, wherein, the epoxide resin is a bisphenol A-type expoxide resin, the epoxide resin and the stabilizing agent are mixed into a composition A, the fluid estolide and the plasticizer are mixed into a composition B, and 100 portions of the composition A and 80 to 120 portions of the composition B are mixed. The composition A and the composition B are respectively packaged and stored and are used after mixed according to the ratio of 1 to 0.8-1.2. The solvent impregnated resin is used together with special dry mica tape and special moderate-resin mica tape which contain a curing accelerating agent and are matched with the solvent impregnated resin specially. The vacuum pressure F-grade heating solvent-free solvent impregnated resin has the advantages of innocuousness, innocuity, good thermal state mechanical intensity and low possibility of deformation.
Description
Technical field
The present invention relates to a kind of solvent impregnated resin, relate in particular to a kind of vacuum pressure impregnation resin that does not contain the styrenic reactive thinner, being applicable to that F level high-voltage motor, electrical equipment stator winding are whole soaks the whole of VPI and generator and soaks and coil VPI.The preparation, using method and the purposes that also relate to this solvent impregnated resin simultaneously.
Background technology
In high-voltage motor and generating set manufacturing technology, the performance of insulating material, the stability of life-time service is one of core technology of product.Improve the product temperature resistant grade, improve insulation system hot mechanical property, reduce " three wastes " quantity discharged in the production process, emphasis that problem such as cut down the consumption of energy, enhance productivity becomes domestic each tame dynamo-electric manufacturing concern gradually and paid close attention to.And vacuum pressure impregnation (VPI) broad application makes these developing direction that the possibility that realizes arranged.But, present domestic main flow, with solvent impregnated resin that VPI technology matches in, number average contains vinylbenzene isoreactivity thinner mostly, compares with few solvent paint though contain the solvent impregnated resin of vinylbenzene system, in process of production, volatile quantity decreases, and can participate in curing reaction, but still has following shortcoming: 1. styrenic material steam forces down, toxicity is very big, volatilization in a large number causes environmental pollution in solidification process, and the harm operator's is healthy; 2. in motor operation course, because the rising of temperature and the self vibration of equipment, the defective of insulation system on hot mechanical property may cause the insulating physical damage, and the hot physical strength of vinylbenzene system solvent impregnated resin ubiquity is relatively poor, the shortcoming that heat-drawn wire and second-order transition temperature are lower, this meeting serious threat is to the work-ing life of electric installation; 3. the cured article of this kind system there is no very big improvement and improves the space on electric property, and for improving insulation work field intensity, the attenuate insulation thickness helps little.
Therefore, be badly in need of the VPI solvent impregnated resin of a kind of brand-new easy volatile materials such as no vinylbenzene of exploitation.
Summary of the invention
One of technical problem to be solved by this invention is, at existing poisonous, the hot bad mechanical strength of solvent impregnated resin of vinylbenzene isoreactivity thinner, the shortcoming of easy deformation of containing, provide a kind of solvent impregnated resin that does not contain vinylbenzene isoreactivity thinner, to improve its hot physical strength and nontoxic.
Two of technical problem to be solved by this invention is that preparation, using method and the purposes of above-mentioned solvent impregnated resin is provided.
In order to solve the problems of the technologies described above, the present invention adopts following technical proposal:
The solvent-free impregnating resin of vacuum pressure F level heating dipping, each component comprises following component in weight part:
100 parts of Resins, epoxy
2～4 parts of stablizers
80～120 parts on liquid acid anhydrides
10～20 parts in softening agent
Wherein, described Resins, epoxy is bisphenol A type epoxy resin, is mixed into the A component with Resins, epoxy and stablizer, is mixed into the B component with liquid acid anhydrides and softening agent, with the mixed of 100 parts of A components and 80-120 part B component.
Wherein, stablizer can be one of them of 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, 3 parts, 3.5 parts, 3.8 parts and 4 parts;
The liquid acid anhydrides can be one of them of 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, 105 parts, 110 parts, 115 parts and 120 parts;
Softening agent can be specially one of them of 10 parts, 11 parts, 14 parts, 15 parts, 17 parts, 18 parts and 20 parts.
On the technique scheme basis, described liquid acid anhydrides is one or more the composition in methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride, the methyl carbic anhydride.
On the technique scheme basis, described softening agent is one or more the composition in Phthalic acid, diallyl ester, dioctyl phthalate (DOP), dioctyl terephthalate, diethyl phthalate, diisobutyl phthalate, O-phthalic ester butyl benzyl, phthalic acid two (methoxyethyl) ester, dibutyl phthalate, the trioctyl trimellitate.
On the technique scheme basis, described stablizer is a para benzoquinone, toluhydroquinone, MEHQ, Resorcinol, the 2-Tert. Butyl Hydroquinone, 2, the 5-di-tert-butyl hydroquinone, the 4-tert-butyl catechol, phenol, 1, the 3-dihydroxy-benzene, dihydroxyphenyl propane, 1, the 4-dihydroxy-benzene, 2-cresols, 1, the 2-dihydroxy-benzene, xylenol, 4-cresols, 3-cresols, beta naphthal, Trimethylhydroquinone, the 1-naphthols, 2, the 6-DI-tert-butylphenol compounds, 2, the 4-DI-tert-butylphenol compounds, the 2-tertiary butyl-4-methylphenol, to tert-octylphenol, 3, the composition of one or more in the 5-xylenol.
A kind of compound method that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating dipping, carry out set by step:
1) in Resins, epoxy, adds stablizer, be heated to 35 ℃～70 ℃ and stir, as the A component, and store with encloses container with this until whole dissolvings;
2) add softening agent in the liquid acid anhydrides, stirring at normal temperature is until uniform mixing,, and stores with encloses container as the B component with this;
3) in supply of material storage process, A, B two components are packed respectively, separate storage, the shelf lives 〉=December in 20 ℃ of encloses containers.
In above-mentioned using method, be applicable to the using method of the solvent-free impregnating resin of vacuum pressure F level heating:
During use, with 100 parts of A components, 80～120 parts of uniform mixing of B component, mixing temperature should be lower than 70 ℃, obtains the solvent impregnated resin of colourless or faint yellow homogeneous transparent.
In above-mentioned using method, the cure bake temperature: 130 ℃～160 ℃, 6～15 hours; Test tube method gel time: 3～20min.
A kind of purposes that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating, glue mica tape is used in solvent impregnated resin and the supporting specially with it extraordinary low resin mica tape that contains curing catalyst, the special type.
The purposes of the above-mentioned solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level is used for technique of vacuum pressure for dipping electrical, and the solvent impregnated resin temperature need heat and remain between 40 ℃～70 ℃.
On the technique scheme basis, solvent impregnated resin is in the vacuum pressure impregnation process, and gas is nitrogen or dry air in storage paint can and the impregnating autoclave, and the relative humidity of dry air should be at least less than 5%.
Advantage of the present invention is:
1. do not contain vinylbenzene isoreactivity thinner, clean environment firendly has reduced the generation of toxic and harmful in the production process, the development need that is fit to environmental protection, belong to environmentally friendly product, its outward appearance is colourless or faint yellow homogeneous transparent liquid, there is no mechanical impurity;
2. this kind solvent impregnated resin vapour pressure is minimum, can a large amount of volatilizations as vinylbenzene isoreactivity thinner under wet vacuum state, and cause resin viscosity to raise rapidly, and corrode vacuum pressure impregnation equipment;
3. viscosity is very little under heated condition, helps improving the vacuum pressure impregnation effect, can shorten the pressure impregnation time significantly, raises the efficiency to reduce cost;
4. hot setting is fast, in the solidification process mass loss little, it is big to hang the lacquer amount, can realize that single-steeping bakes and banks up with earth, and can satisfy the insulation processing requirement; And, compare with traditional solvent-free impregnating resin, owing to there is not the volatile matter discharging, the preliminary drying time shortens 50%～60%, under 130 ℃～160 ℃ conditions, its cure bake time is 6～15 hours.From then on get on very well in two aspects, and energy-saving effect highlights;
5. after being used the curing of extraordinary low resin mica tape or middle glue mica tape, insulation system is even, inner no air gap, and one-piece construction is closely knit, and electric property obviously improves, and has improved the anti-electricimpulse ability of insulation system, reduction equipment operation temperature rise;
6. the hot physical strength of cured product is obviously improved, and can effectively reduce in the motor operation course because the destruction of insulation that physical shock produces improves the reliability in the product operational process, prolongs product work-ing life;
7. the various composition purity of solvent impregnated resin are higher, and itself do not contain curing catalyst, thus solvent impregnated resin under the condition that moisture-free exists, id reaction speed is extremely low, the stability in storage excellence, viscosity increasess slowly, shelf lives and usage period prolong greatly.Put in the container of remaining silent, 70 ℃ of following storages reach 10 days, and 70 ℃ of following viscosity growth≤5mPas reach≤100mPas; Store under 100 ℃ and reach 20 hours, 70 ℃ of following viscosity growth≤2.5mPas;
Embodiment
Embodiment 1
A kind of solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level, each component comprises following component in weight part:
100 parts of Resins, epoxy
2 parts of toluhydroquinones
80 parts of methyl hexahydrophthalic anhydrides
10 parts of dibutyl phthalates
Wherein, described Resins, epoxy is bisphenol A type epoxy resin, is mixed into the A component with bisphenol A type epoxy resin and toluhydroquinone, is mixed into the B component with methyl hexahydrophthalic anhydride and dibutyl phthalate, with the mixed of 100 parts of A components and 80-120 part B component.B component wherein can be one of them of 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, 105 parts, 110 parts, 115 parts and 120 parts.
A kind of compound method that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating, carry out set by step:
1) in bisphenol A type epoxy resin, adds toluhydroquinone as stablizer, be heated to 35 ℃～70 ℃ and stir, as the A component, and store with encloses container with this until whole dissolvings;
2) add dibutyl phthalate as softening agent in methyl hexahydrophthalic anhydride, stirring at normal temperature is until uniform mixing,, and stores with encloses container as the B component with this;
3) in supply of material storage process, A, B two components are packed respectively, separate storage, the shelf lives 〉=December in 20 ℃ of encloses containers.
A kind of using method that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating:
During use, with 100 parts of A components, 80～120 parts of uniform mixing of B component, mixing temperature should be lower than 70 ℃, obtains the solvent impregnated resin of colourless or faint yellow homogeneous transparent.
In above-mentioned using method, the cure bake temperature: 130 ℃～160 ℃, 6～15 hours; Test tube method set time: 3～20min.
A kind of purposes that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating, glue mica tape is used in solvent impregnated resin and the supporting specially with it extraordinary low resin mica tape that contains curing catalyst, the special type.
The purposes of the above-mentioned solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level is used for technique of vacuum pressure for dipping electrical, and the solvent impregnated resin temperature need heat and remain between 40 ℃～70 ℃.
In the present embodiment, solvent impregnated resin is in the vacuum pressure impregnation process, and gas is nitrogen or dry air in storage paint can and the impregnating autoclave, and the relative humidity of dry air should be at least less than 5%.
Embodiment 2
In the present embodiment, stablizer is selected Trimethylhydroquinone for use, and acid anhydrides is selected the methyl carbic anhydride for use, and softening agent is selected O-phthalic ester butyl benzyl for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
2.2 parts of Trimethylhydroquinones
85 parts of methyl carbic anhydrides
12 parts of O-phthalic ester butyl benzyls
Other are identical with embodiment 1.
Embodiment 3
In the present embodiment, stablizer is selected Resorcinol for use, and acid anhydrides is selected the methyl carbic anhydride for use, and softening agent is selected dioctyl terephthalate for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
2.5 parts of Resorcinol
90 parts of methyl carbic anhydrides
15 parts of dioctyl terephthalates
Other are identical with embodiment 1.
Embodiment 4
In the present embodiment, stablizer is selected 4-cresols for use, and acid anhydrides is selected the methyl carbic anhydride for use, and softening agent is selected trioctyl trimellitate for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
2.5 parts in 4-cresols
90 parts of methyl carbic anhydrides
18 parts of trioctyl trimellitates
Other are identical with embodiment 1.
Embodiment 5
In the present embodiment, stablizer is selected for use tert-octylphenol, and acid anhydrides is selected methyl hexahydrophthalic anhydride for use, and softening agent is selected for use Phthalic acid, diallyl ester, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
To 2.8 parts of tert-octylphenols
95 parts of methyl hexahydrophthalic anhydrides
20 parts of Phthalic acid, diallyl esters
Other are identical with embodiment 1.
Embodiment 6
In the present embodiment, stablizer selects 3 for use, the 5-xylenol, and acid anhydrides is selected methyl tetrahydro phthalic anhydride for use, and softening agent is selected phthalic acid two (methoxyethyl) ester for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
3,3.2 parts of 5-xylenols
100 parts of methyl tetrahydro phthalic anhydrides
14 parts of phthalic acid two (methoxyethyl) esters
Other are identical with embodiment 1.
Embodiment 7
In the present embodiment, stablizer is selected para benzoquinone for use, and acid anhydrides is selected the methyl carbic anhydride for use, and softening agent is selected dioctyl terephthalate for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
3.5 parts of para benzoquinone
105 parts of methyl carbic anhydrides
17 parts of dioctyl terephthalates
Other are identical with embodiment 1.
Embodiment 8
In the present embodiment, stablizer is selected para benzoquinone for use, and acid anhydrides is selected methyl hexahydrophthalic anhydride for use, and softening agent is selected diethyl phthalate for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
3.5 parts of para benzoquinone
110 parts of methyl hexahydrophthalic anhydrides
11 parts of diethyl phthalates
Other are identical with embodiment 1.
Embodiment 9
In the present embodiment, stablizer is selected the 2-Tert. Butyl Hydroquinone for use, and acid anhydrides is selected methyl tetrahydro phthalic anhydride for use, and softening agent is selected diisobutyl phthalate for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
3.8 parts of 2-Tert. Butyl Hydroquinones
115 parts of methyl tetrahydro phthalic anhydrides
11 parts of diisobutyl phthalates
Other are identical with embodiment 1.
Embodiment 10
In the present embodiment, stablizer selects 2 for use, the 4-DI-tert-butylphenol compounds, and acid anhydrides is selected the methyl carbic anhydride for use, and softening agent is selected O-phthalic ester butyl benzyl for use, and each component comprises following component in weight part:
100 parts of bisphenol A type epoxy resins
2,4 parts of 4-DI-tert-butylphenol compounds
120 parts of methyl carbic anhydrides
11 parts of O-phthalic ester butyl benzyls
Other are identical with embodiment 1.
Claims (10)
1, a kind of solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level, each component comprises following component in weight part:
100 parts of Resins, epoxy
2～4 parts of stablizers
80～120 parts on liquid acid anhydrides
10～20 parts in softening agent
Wherein, described Resins, epoxy is bisphenol A type epoxy resin, is mixed into the A component with Resins, epoxy and stablizer, is mixed into the B component with liquid acid anhydrides and softening agent, with the mixed of 100 parts of A components and 80-120 part B component.
2, the solvent-free impregnating resin that is applicable to vacuum pressure F level heating according to claim 1 is characterized in that: described liquid acid anhydrides is one or more the composition in methyl tetrahydro phthalic anhydride, methyl hexahydrophthalic anhydride, the methyl carbic anhydride.
3, the solvent-free impregnating resin that is applicable to vacuum pressure F level heating according to claim 1 is characterized in that: described softening agent is one or more the composition in Phthalic acid, diallyl ester, dioctyl phthalate (DOP), dioctyl terephthalate, diethyl phthalate, diisobutyl phthalate, O-phthalic ester butyl benzyl, phthalic acid two (methoxyethyl) ester, dibutyl phthalate, the trioctyl trimellitate.
4, the solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level according to claim 1, it is characterized in that: described stablizer is a para benzoquinone, toluhydroquinone, MEHQ, Resorcinol, the 2-Tert. Butyl Hydroquinone, 2, the 5-di-tert-butyl hydroquinone, the 4-tert-butyl catechol, phenol, 1, the 3-dihydroxy-benzene, dihydroxyphenyl propane, 1, the 4-dihydroxy-benzene, 2-cresols, 1, the 2-dihydroxy-benzene, xylenol, 4-cresols, 3-cresols, beta naphthal, Trimethylhydroquinone, the 1-naphthols, 2, the 6-DI-tert-butylphenol compounds, 2, the 4-DI-tert-butylphenol compounds, the 2-tertiary butyl-4-methylphenol, to tert-octylphenol, 3, the composition of one or more in the 5-xylenol.
5, at the described compound method that is applicable to the solvent-free impregnating resin of vacuum pressure F level heating of one of claim 1 to 4, carry out set by step:
1) in Resins, epoxy, adds stablizer, be heated to 35 ℃～70 ℃ and stir, as the A component, and store with encloses container with this until whole dissolvings;
2) add softening agent in the liquid acid anhydrides, stirring at normal temperature is until uniform mixing,, and stores with encloses container as the B component with this;
3) in supply of material storage process, A, B two components are packed respectively, separate storage, the shelf lives 〉=December in 20 ℃ of encloses containers.
6, at the using method of the solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level of the acquisition of the described compound method of claim 5:
During use, with 100 parts of A components, 80～120 parts of uniform mixing of B component, mixing temperature should be lower than 70 ℃, obtains the solvent impregnated resin of colourless or faint yellow homogeneous transparent.
7, according to the using method of the solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level of the acquisition of the described compound method of claim 6, it is characterized in that: 130 ℃～160 ℃ of cure bake temperature, 6～15 hours time.
8, according to the purposes of the solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level of the acquisition of the described compound method of claim 6, glue mica tape is used in solvent impregnated resin and the supporting specially with it extraordinary low resin mica tape that contains curing catalyst, the special type.
9, the purposes of the solvent-free impregnating resin that is applicable to vacuum pressure F level heating of the acquisition of described compound method according to Claim 8, it is characterized in that: be used for technique of vacuum pressure for dipping electrical, the solvent impregnated resin temperature need heat and remain between 40 ℃～70 ℃.
10, according to the purposes of the solvent-free impregnating resin that is applicable to the heating of vacuum pressure F level of the acquisition of the described compound method of claim 9, it is characterized in that: solvent impregnated resin is in the vacuum pressure impregnation process, gas is nitrogen or dry air in storage paint can and the impregnating autoclave, and the relative humidity of dry air should be at least less than 5%.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101864058A (en) * | 2010-05-18 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof |
| CN101864059A (en) * | 2010-06-01 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Heat-resistant epoxy anhydride resin suitable for vacuum pressure impregnation (VPI) and preparing method and application thereof |
| CN102328478A (en) * | 2010-07-13 | 2012-01-25 | 上海同立电工材料有限公司 | Polysulfonamide fiber-containing dry mica tape and application thereof |
| CN103440902A (en) * | 2013-08-29 | 2013-12-11 | 苏州巨峰电气绝缘系统股份有限公司 | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof |
| CN105495528A (en) * | 2015-11-27 | 2016-04-20 | 天津大学 | Method for preparing high-bulk-density flavor nucleotides disodium mixed crystal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112721A (en) * | 1984-06-29 | 1986-01-21 | Mitsubishi Electric Corp | Thermosetting resin composition |
| EP1491566B1 (en) * | 2003-06-16 | 2007-02-28 | ABB Technology Ltd | Curable epoxy resin composition, and process for the production of shaped articles therefrom |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101864058A (en) * | 2010-05-18 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof |
| CN101864059A (en) * | 2010-06-01 | 2010-10-20 | 苏州巨峰电气绝缘系统股份有限公司 | Heat-resistant epoxy anhydride resin suitable for vacuum pressure impregnation (VPI) and preparing method and application thereof |
| CN102328478A (en) * | 2010-07-13 | 2012-01-25 | 上海同立电工材料有限公司 | Polysulfonamide fiber-containing dry mica tape and application thereof |
| CN103440902A (en) * | 2013-08-29 | 2013-12-11 | 苏州巨峰电气绝缘系统股份有限公司 | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof |
| CN103440902B (en) * | 2013-08-29 | 2016-01-20 | 苏州巨峰电气绝缘系统股份有限公司 | Be applicable to high-permeability mica tape of pure epoxy VPI insulating resin and preparation method thereof |
| CN105495528A (en) * | 2015-11-27 | 2016-04-20 | 天津大学 | Method for preparing high-bulk-density flavor nucleotides disodium mixed crystal |
| CN105495528B (en) * | 2015-11-27 | 2018-10-26 | 天津大学 | A method of preparing high heap density the sapidity nucleotide disodium mixed crystal |
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