CN105632660B - High heat conduction low resin mica tape and preparation method thereof - Google Patents
High heat conduction low resin mica tape and preparation method thereof Download PDFInfo
- Publication number
- CN105632660B CN105632660B CN201410603330.XA CN201410603330A CN105632660B CN 105632660 B CN105632660 B CN 105632660B CN 201410603330 A CN201410603330 A CN 201410603330A CN 105632660 B CN105632660 B CN 105632660B
- Authority
- CN
- China
- Prior art keywords
- preparation
- mica
- mica tape
- heat filling
- mica paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of high heat conduction low resin mica tape of the invention, it is made up of mica paper, gluing oxidant layer and scrim cloth, and mica paper, gluing oxidant layer and scrim cloth are sequentially overlapped from the bottom to top, scrim cloth surface even spread has heat filling, and gluing oxidant layer is overlapped with being coated with the scrim cloth of heat filling.The preparation method of the high heat conduction low resin mica tape includes：First the heat filling of selection is surface-treated with surface conditioning agent；Heat filling after processing is dispersed in binding agent, by obtained glue-coating containing filler on ready fiber cloth surface；The fiber cloth being coated with after glue is subjected to baking processing, and in a face adhesive coating on its surface, combined mica paper and is surface-treated again by adhesive, obtains mica tape just finished product；Baking processing is carried out again, and winds, cut, and high heat conduction low resin mica tape finished product is made.The product excellent electrical properties of the present invention, composite performance are excellent, not stratified, not dry linting and steady quality.
Description
Technical field
The present invention relates to a kind of mica tape and its preparation technology, more particularly to a kind of heat conduction low resin mica tape and its preparation side
Method.
Background technology
It is a kind of composite of polymer matrix as the mica tape of motor critical material, heat conductivility is poor, in motor
During long-time intensive work, motor can produce higher temperature rise (some portion of temperature of motor and surrounding cooling medium
Temperature difference), prolonged hot environment can make generator stator winding insulation material aging occur, influence the service life of motor.
Mica tape is usually the composite being made up of mica paper, supporting material, adhesive.This composite of mica tape
In, adhesive and supporting material thermal conductivity factor are all smaller.The key of high heat conduction low resin mica tape research and development is exactly to improve mica tape
The small part of middle thermal conductivity factor, conventional method is that heat filling is added in the small part of thermal conductivity factor, works as heat filling
Consumption contact is formed when reaching a certain critical value, between heat filling particle and is interacted, formed and led in mica tape system
Heat supply network chain, reaches the effect for improving mica tape thermal conductivity factor.
CN102337097A Chinese patent literatures disclose it is a kind of " powder-filled high-thermal-conductivity mica tape adhesive
Preparation method ", it is related to the preparation of powder-filled high-thermal-conductivity mica tape adhesive, and adhesive matrix resin is paulownia horse acid
Acid anhydride-epoxy type usual resins.CN102820110A Chinese patent literatures disclose a kind of " glass cloth reinforcement high heat conduction mica tape
And preparation method thereof ", the patent document is related to a kind of glass cloth reinforcement high heat conduction mica tape and its preparation, and filler is added to gluing
In agent, its mica tape thermal conductivity factor reaches 0.25W/mK.CN103198908A Chinese patent literatures disclose one kind, and " height is led
Hot epoxy little-glue mica tape and preparation method thereof ".From the point of view of the domestic existing patent document on high heat conduction mica tape, its is main
It is the method that heat filling is directly filled using adhesive, the raising of general filer content is the content for being limited by adhesive；Especially
It is few adhesive tape, because glue content is few, and the volume loading of filler is difficult to improve, though loading improve also bring along it is compound
The problem of poor-performing.
The content of the invention
The technical problems to be solved by the invention are to overcome the shortcomings of to mention with defect that there is provided one in background above technology
Kind excellent electrical properties, composite performance are excellent, not stratified, not dry linting and steady quality high heat conduction low resin mica tape, also corresponding
A kind of preparation method of simple, the suitable VPI of technique high heat conduction low resin mica tape is provided.
In order to solve the above technical problems, technical scheme proposed by the present invention is a kind of high heat conduction low resin mica tape, the mica
Band is made up of mica paper, gluing oxidant layer and scrim cloth, and mica paper, gluing oxidant layer and scrim cloth are folded successively from the bottom to top
Plus, scrim cloth surface even spread has heat filling, and the gluing oxidant layer is the fiber cloth with being coated with heat filling
Layer is overlapped.
In above-mentioned high heat conduction low resin mica tape, it is preferred that the mica paper be non-calcinated mica paper, mix mica paper or
Synthetic mica paper, and the thickness of mica paper is 0.05mm~0.10mm.The gluing oxidant layer is main by organic siliconresin, polyester tree
In fat, epoxy resin, acrylate any one or at least two mixture composition.The matrix of the scrim cloth
Can be electrician's alkali-free glass fiber cloth, polyester non-woven fabric, silicon nitride fiber cloth, boron nitride fiber cloth, silicon carbide fibre cloth, brocade
Any one in synthetic fibre, polyvinyl chloride fibre or acrylic fibers, but preferably electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth is
0.025mm~0.060mm.
As a total technical concept, the present invention also provides a kind of preparation side of above-mentioned high heat conduction low resin mica tape
Method, comprises the following steps：
(1) first the heat filling of selection is surface-treated with surface conditioning agent；
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, obtains glue containing filler, it is standby
With；
(3) glue containing filler of above-mentioned preparation is coated with ready fiber cloth surface；The thickness of fiber cloth is preferably
0.025mm~0.060mm, fiber cloth surface is coated uniformly on by the upper glue roller of at least one by described glue containing filler；
(4) fiber cloth after above-mentioned coating glue containing filler is subjected to baking processing, and wound；
(5) again by the fiber cloth after winding again uncoiling, and its surface one side by rubber roll coating adhesive, and
Mica paper uncoiling is drawn in fiber cloth, combined mica paper and is surface-treated again (at surface herein by adhesive
Reason is mica flake in built up mica paper, while preventing mica from bringing back to viscous), obtain mica tape just finished product；
(6) carry out baking processing to finished product at the beginning of above-mentioned mica tape, and wind, cut (by after mica tape uncoiling by dividing
The machine of cutting cuts into the width of needs), high heat conduction low resin mica tape finished product is made.
Above-mentioned preparation method, it is preferred that in the step (1), the surface conditioning agent of selection for silane coupler (preferably
Silane coupler KH-560) ethanol solution, the consumption of the silane coupler is the 3%~5% of thermal conductivity filler quality, described
The consumption of ethanol is 1~3 times of heat filling volume.In the step (1), the concrete operations being surface-treated are preferably：
The heat filling is added to ball-milling treatment 2h~5h in described surface conditioning agent, then is put into baking oven after vacuum filtration
Dried in (oven temperature may be set to 90 DEG C or so), finally take out sealing standby.
Above-mentioned preparation method, it is preferred that in the step (2), the binding agent of selection is polyester adhesive, the polyester adhesive
Polyester solid content in stick is that solvent in 1%~3%, polyester adhesive is butanone and the mixed solvent of toluene, and butanone
Mass ratio with toluene is 10: 1~1: 1；When heat filling is dispersed in into binding agent, the addition of heat filling is bonding
8~10 times of polyester solid content in agent, and the dispersant of thermal conductivity filler quality 2%~5% is added in dispersion process, and divide at a high speed
1h~2h is dissipated, finally obtained glue containing filler is cooled to after room temperature, is sealed standby.
Above-mentioned preparation method, it is preferred that in the step (4), baking processing refers to by drying tunnel at 85 DEG C~90 DEG C
Lower baking 1min~5min, is wound after baking processing by appropriate disk footpath or weight.
Above-mentioned preparation method, it is preferred that in the step (5), the adhesive of selection is organic siliconresin, polyester tree
In fat, epoxy resin, acrylate any one or at least two mixture, the solid content in the adhesive is
10%~30%, the consumption of the adhesive is 80~290g/m according to mica tape mass area ratio2In 4~45g/m2In the range of
Change.
Above-mentioned preparation method, it is preferred that in the step (5), the mica paper of selection is non-calcinated mica paper, mix cloud
Female paper or synthetic mica paper, and the thickness of mica paper is 0.05mm~0.10mm.
Above-mentioned preparation method, it is preferred that in the step (6), baking processing refers to by drying tunnel at 85 DEG C~115 DEG C
Lower baking 1min~10min, is wound after baking processing by appropriate disk footpath or weight.
The above-mentioned technical proposal of the present invention is based primarily upon following principle：Using fiber cloth, (particularly electrician's alkali-free glass is fine
Wei Bu) surface is repeatedly coated with the polyester adhesive containing heat filling, after baking, heat filling is uniformly more wrapped glass
Glass fiber cloth surface, is used after winding as mica tape raw materials for production；It is multiple again by common low resin mica tape photoresist coating process
The heat filling on glass fabric surface can preferably fill mica tape adhesive after conjunction so that mica paper in mica tape system
Adhesive between glass fabric is internally formed heat conduction network chain, and this can not only effectively improve mica tape thermal conductivity factor, and
Electric property and mechanical performance influence on mica tape is little.
Compared with prior art, the advantage of the invention is that：
(1) high heat conduction low resin mica tape of the invention is by using different filler feed postitions so that mica tape finished product
Thermal conductivity factor standard reach 0.35~0.45W/mK, be general 2 times or so of low resin mica tape, this can effectively reduce motor
Temperature rise, increase motor service life, improve design of electrical motor power；
(2) high heat conduction low resin mica tape of the invention has that excellent electrical properties, composite performance are excellent, not stratified, do not fall
Powder and steady quality；
(3) simple production process of high heat conduction low resin mica tape of the present invention, is adapted to VPI (vacuum pressure impregnations, for handling
The insulating materials such as motor coil) technique.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is the structural representation of high heat conduction low resin mica tape of the present invention.
Fig. 2 is the preparation technology schematic diagram of scrim cloth in the embodiment of the present invention.
Fig. 3 is the preparation technology schematic diagram of high heat conduction low resin mica tape in the embodiment of the present invention.
Marginal data：
1st, unreeling structure；2nd, steeping vat；3rd, the first upper glue roller；4th, the first drying tunnel；5th, the second upper glue roller；6th, the second drying tunnel；
7th, rolling-up mechanism；8th, rubber roller；9th, surface coating mechanism；10th, the 3rd drying tunnel；11st, mica paper；12nd, gluing oxidant layer；13rd, fiber
Layer of cloth；
Embodiment
It is below the embodiment of the present invention.Unless otherwise defined, all technical terms used hereinafter with
The implication that those skilled in the art are generally understood that is identical.Technical term used herein is intended merely to describe specific embodiment
Purpose, be not intended to and limit the scope of the invention.Unless otherwise specified, the various former materials used in the present invention
Material, reagent, instrument and equipment etc. can be commercially available by market or can be prepared by existing method.
A kind of high heat conduction low resin mica tape of the invention, the mica tape is by mica paper 11, gluing oxidant layer 12 and scrim cloth
13 are constituted, and mica paper 11, gluing oxidant layer 12 and scrim cloth 13 are sequentially overlapped from the bottom to top, and the surface of scrim cloth 13 is uniformly applied
Heat filling is furnished with, gluing oxidant layer 12 is overlapped with being coated with the scrim cloth 13 of heat filling.Cloud in the present embodiment
Female paper 11 is non-calcinated mica paper, mix mica paper or synthetic mica paper, and the thickness of mica paper 11 is 0.05mm~0.10mm.
Gluing oxidant layer 12 is main by any one in organic siliconresin, polyester resin, epoxy resin, acrylate or at least two
The mixture composition planted.The matrix of scrim cloth 13 is electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth 13 is
0.025mm~0.060mm.
The preparation method of above-mentioned high heat conduction low resin mica tape, comprises the following steps：
(1) first the heat filling of selection is surface-treated with surface conditioning agent；The surface conditioning agent of selection is silane
Coupling agent KH-560 ethanol solution, the consumption of silane coupler is the 3%~5% of thermal conductivity filler quality, and the consumption of ethanol is
1~3 times of heat filling volume；The concrete operations being surface-treated are：Heat filling is added to ball in surface conditioning agent
Mill processing 2h~5h, then be put into baking oven (oven temperature be 90 DEG C or so) and dry after vacuum filtration, finally take out sealing standby
With；
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, obtains glue containing filler, it is standby
With；The binding agent of selection is polyester adhesive, during the polyester solid content in the polyester adhesive is 1%~3%, polyester adhesive
Solvent be the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 1: 1；Heat filling is dispersed in viscous
When tying agent, the addition of heat filling is 8~10 times of polyester solid content in binding agent, and heat filling is added in dispersion process
Obtained glue containing filler, is finally cooled to after room temperature, seals by the dispersant of quality 2%~5%, and scattered 1h~2h at a high speed
It is standby；
(3) as shown in Fig. 2 ready electrician's alkali-free glass fiber cloth (thickness is 0.025mm~0.060mm) is passed through
Unreeling structure 1 is unreeled, and electrician's alkali-free glass fiber cloth after unreeling is submerged initially in the steeping vat 2 equipped with the glue containing filler
Dipping process is carried out, its surface is coated with the glue containing filler of above-mentioned preparation；
(4) as shown in Fig. 2 the bottom surface for making electrician's alkali-free glass fiber cloth by the first upper glue roller 3 again after impregnation carries out the
One of gluing, carries out pre-bake treatment by the first drying tunnel 4 after first of gluing, then makes electrician by the second upper glue roller 5 again
The bottom surface of alkali-free glass fiber cloth carries out second gluing, and baking processing, preliminary drying are carried out by the second drying tunnel 6 after second gluing
Roasting processing and baking processing are baking 1min~5min at 85 DEG C~90 DEG C；Appropriate disk footpath or weight are pressed after baking processing
Wound by rolling-up mechanism 7；
(5) as shown in figure 3, by electrician's alkali-free glass fiber cloth after winding by the uncoiling again again of unreeling structure 1, and
The one side on its surface by the adhesive coating of rubber roller 8, the adhesive that the present embodiment is selected is organic siliconresin, polyester resin,
In epoxy resin, acrylate any one or at least two mixture, the solid content in the adhesive is 10%
~30%, the consumption of the adhesive is 80~290g/m according to mica tape mass area ratio2In 4~45g/m2In the range of change,
At the same time, mica paper 11 (thickness is 0.05mm~0.10mm) uncoiling is drawn to by the electrician after rubber by unreeling structure 1
On alkali-free glass fiber cloth, finally by mica paper after compound of 9 pairs of surface coating mechanism and it is surface-treated, obtains mica
With first finished product；
(6) baking processing is carried out to finished product at the beginning of above-mentioned mica tape by the 3rd drying tunnel 10, baking processing refers to pass through
Drying tunnel bakees 1min~10min at 85 DEG C~115 DEG C, and rolling-up mechanism 7 is passed through by appropriate disk footpath or weight after baking processing
Wound, will finally cut into the width of needs after mica tape uncoiling by cutting machine, be made high heat conduction low resin mica tape into
Product.
For the ease of understanding the present invention, more complete is made to the present invention below in conjunction with Figure of description and preferred embodiment
Face, meticulously describe, but protection scope of the present invention is not limited to embodiment in detail below.
Embodiment：
A kind of high heat conduction low resin mica tape of the invention as shown in Figure 1, the mica tape is by mica paper 11, the and of gluing oxidant layer 12
Scrim cloth 13 is constituted, and mica paper 11, gluing oxidant layer 12 and scrim cloth 13 are sequentially overlapped from the bottom to top, the table of scrim cloth 13
Face even spread has heat filling, and gluing oxidant layer 12 is overlapped with being coated with the scrim cloth 13 of heat filling.This implementation
Mica paper 11 in example is non-calcinated mica paper, and the thickness of mica paper 11 is 0.10mm.Gluing oxidant layer 12 is main by polyester tree
The mixture composition of fat and epoxy resin.The matrix of scrim cloth 13 is electrician's alkali-free glass fiber cloth, and scrim cloth 13
Matrix thickness is 0.04mm.
The preparation method of the above-mentioned high heat conduction low resin mica tape of the present embodiment, comprises the following steps：
(1) first the heat filling of selection is surface-treated with surface conditioning agent；The surface conditioning agent of selection is silane
Coupling agent KH-560 ethanol solution, the consumption of silane coupler is the 3% of thermal conductivity filler quality, and the consumption of ethanol is filled out for heat conduction
Expect volume 2.5 times；The concrete operations being surface-treated are：Heat filling is added to ball-milling treatment 2h in surface conditioning agent
~5h, then drying in baking oven (oven temperature is 90 DEG C or so) is put into after vacuum filtration, finally take out sealing standby；
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, obtains glue containing filler, it is standby
With；The binding agent of selection is polyester adhesive, and the polyester solid content in the polyester adhesive is molten in 2%, polyester adhesive
Agent is the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 1: 1；Heat filling is dispersed in binding agent
When, the addition of heat filling is 10 times of polyester solid content in binding agent, and thermal conductivity filler quality 2% is added in dispersion process
Dispersant, obtained glue containing filler is finally cooled to after room temperature, sealing is standby by and scattered 1h~2h at a high speed；
(3) as shown in Fig. 2 ready electrician's alkali-free glass fiber cloth (thickness is 0.04mm) is passed through into unreeling structure 1
Unreeled, electrician's alkali-free glass fiber cloth after unreeling is submerged initially in the steeping vat 2 equipped with the glue containing filler and carries out impregnation
Processing, makes its surface be coated with the glue containing filler of above-mentioned preparation；
(4) as shown in Fig. 2 the bottom surface for making electrician's alkali-free glass fiber cloth by the first upper glue roller 3 again after impregnation carries out the
One of gluing, carries out pre-bake treatment by the first drying tunnel 4 after first of gluing, then makes electrician by the second upper glue roller 5 again
The bottom surface of alkali-free glass fiber cloth carries out second gluing, and baking processing, preliminary drying are carried out by the second drying tunnel 6 after second gluing
Roasting processing and baking processing are baking 1min~5min at 85 DEG C~90 DEG C；Appropriate disk footpath or weight are pressed after baking processing
Wound by rolling-up mechanism 7；
(5) as shown in figure 3, by electrician's alkali-free glass fiber cloth after winding by the uncoiling again again of unreeling structure 1, and
The one side on its surface is by the adhesive coating of rubber roller 8, and the adhesive that the present embodiment is selected is polyester resin and epoxy resin
Solid content in mixture, the adhesive is 24%, the consumption of the adhesive according to mica tape mass area ratio be 80~
290g/m2In 4~45g/m2In the range of change, at the same time, by unreeling structure 1 by mica paper 11 (thickness be 0.05mm~
0.10mm) uncoiling is drawn on electrician's alkali-free glass fiber cloth after rubber, finally by 9 pairs of surface coating mechanism it is compound after
Mica paper is simultaneously surface-treated, and obtains mica tape just finished product；
(6) baking processing is carried out to finished product at the beginning of above-mentioned mica tape by the 3rd drying tunnel 10, baking processing refers to pass through
Drying tunnel bakees 1min~10min at 85 DEG C~115 DEG C, and rolling-up mechanism 7 is passed through by appropriate disk footpath or weight after baking processing
Wound, will finally cut into the width of needs after mica tape uncoiling by cutting machine, be made high heat conduction low resin mica tape into
Product.
Claims (8)
1. a kind of preparation method of high heat conduction low resin mica tape, the mica tape is made up of mica paper, gluing oxidant layer and scrim cloth,
And mica paper, gluing oxidant layer and scrim cloth are sequentially overlapped from the bottom to top, it is characterised in that：The scrim cloth surface is uniformly applied
Heat filling is furnished with, the gluing oxidant layer is overlapped with being coated with the scrim cloth of heat filling, and the preparation method is specific
Comprise the following steps：
（1）First the heat filling of selection is surface-treated with surface conditioning agent；
（2）Heat filling after above-mentioned surface treatment is dispersed in binding agent, glue containing filler is obtained, it is standby；Choosing
Binding agent is polyester adhesive, and the polyester solid content in the polyester adhesive is the solvent in 1%~3%, polyester adhesive
It is 10: 1~1: 1 for the mass ratio of butanone and the mixed solvent of toluene, and butanone and toluene；Heat filling is dispersed in viscous
When tying agent, the addition of heat filling is 8~10 times of polyester solid content in binding agent, and heat filling is added in dispersion process
The dispersant of quality 2%~5%, and scattered 1h~2h at a high speed；
（3）The glue containing filler of above-mentioned preparation is coated with ready fiber cloth surface；
（4）Fiber cloth after above-mentioned coating glue containing filler is subjected to baking processing, and wound；
（5）Again by the fiber cloth after winding again uncoiling, and in a face adhesive coating on its surface, it is combined again by adhesive
Mica paper is simultaneously surface-treated, and obtains mica tape just finished product；
（6）Baking processing is carried out to finished product at the beginning of above-mentioned mica tape, and winds, cut, high heat conduction low resin mica tape finished product is made.
2. preparation method according to claim 1, it is characterised in that：The mica paper is non-calcinated mica paper, mix cloud
Female paper or synthetic mica paper, and the thickness of mica paper is 0.05mm~0.10mm；The gluing oxidant layer it is main by organic siliconresin,
In polyester resin, epoxy resin, acrylate any one or at least two mixture composition；The scrim cloth
Matrix be electrician's alkali-free glass fiber cloth, and scrim cloth matrix thickness be 0.025mm~0.060mm.
3. preparation method according to claim 1, it is characterised in that the step（1）In, the surface conditioning agent of selection is
The ethanol solution of silane coupler, the consumption of the silane coupler is the 3%~5% of thermal conductivity filler quality, the use of the ethanol
Measure as 1~3 times of heat filling volume.
4. preparation method according to claim 3, it is characterised in that the step（1）In, what is be surface-treated is specific
Operate and be：The heat filling is added to ball-milling treatment 2h~5h in described surface conditioning agent, then put after vacuum filtration
Enter in baking oven and dry, finally take out sealing standby.
5. according to preparation method according to any one of claims 1 to 4, it is characterised in that the step（4）In, at baking
Reason refers to bakee 1min~5min at 85 DEG C~90 DEG C by drying tunnel, received after baking processing by appropriate disk footpath or weight
Volume.
6. according to preparation method according to any one of claims 1 to 4, it is characterised in that the step（5）In, selection
Adhesive is any one in organic siliconresin, polyester resin, epoxy resin, acrylate or at least two mixing
Solid content in thing, the adhesive is 10%~30%, and the consumption of the adhesive is 80~290 according to mica tape mass area ratio
g/m2In 4~45 g/ m2In the range of change.
7. according to preparation method according to any one of claims 1 to 4, it is characterised in that the step（5）In, selection
Mica paper is non-calcinated mica paper, mix mica paper or synthetic mica paper, and the thickness of mica paper is 0.05mm~0.10mm.
8. according to preparation method according to any one of claims 1 to 4, it is characterised in that the step（6）In, at baking
Reason refers to bakee 1min~10min at 85 DEG C~115 DEG C by drying tunnel, carried out after baking processing by appropriate disk footpath or weight
Winding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410603330.XA CN105632660B (en) | 2014-10-30 | 2014-10-30 | High heat conduction low resin mica tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410603330.XA CN105632660B (en) | 2014-10-30 | 2014-10-30 | High heat conduction low resin mica tape and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105632660A CN105632660A (en) | 2016-06-01 |
| CN105632660B true CN105632660B (en) | 2017-08-11 |
Family
ID=56047478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410603330.XA Active CN105632660B (en) | 2014-10-30 | 2014-10-30 | High heat conduction low resin mica tape and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105632660B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134328B (en) * | 2017-04-21 | 2019-01-25 | 南通中菱电力科技股份有限公司 | A kind of preparation method of few ageing-resistant mica tape of glue-type |
| CN108384479B (en) * | 2018-02-01 | 2019-12-03 | 苏州太湖电工新材料股份有限公司 | Adhesive of high thermal conductivity low resin mica tape and preparation method thereof and low resin mica tape |
| CN109454970B (en) * | 2018-11-08 | 2020-11-03 | 哈尔滨电机厂有限责任公司 | Manufacturing method of high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape |
| CN109778585B (en) * | 2019-01-09 | 2021-08-24 | 苏州巨峰电气绝缘系统股份有限公司 | Heat-conducting paper and preparation method thereof |
| CN110387210B (en) * | 2019-07-31 | 2021-10-19 | 中广核达胜加速器技术有限公司 | EB (Epstein-Barr) curing-based adhesive and preparation method of mica tape with same |
| CN111452467A (en) * | 2020-05-07 | 2020-07-28 | 上海均达科技发展有限公司 | Epoxy less-glue polyester non-woven fabric glass powder mica tape |
| CN112659695B (en) * | 2020-12-21 | 2023-03-31 | 四川东材科技集团股份有限公司 | High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof |
| CN114523741B (en) * | 2022-04-19 | 2022-07-29 | 浙江荣泰电工器材股份有限公司 | High-strength high-tensile high-modulus mica plate for thermal runaway management of new energy automobile |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227389A (en) * | 1998-02-27 | 1999-09-01 | 株式会社日立制作所 | Insulating material and windings thereby |
| CN101262152A (en) * | 2007-03-06 | 2008-09-10 | 株式会社东芝 | Coil insulator, armature coil insulated by the coil insulator and electrical rotating machine having the armature coil |
| CN103198908A (en) * | 2013-04-01 | 2013-07-10 | 株洲时代电气绝缘有限责任公司 | High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape |
| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009290973A (en) * | 2008-05-28 | 2009-12-10 | Toshiba Corp | Stator coil of rotating electrical machine, its manufacturing method and rotating electrical machine |
-
2014
- 2014-10-30 CN CN201410603330.XA patent/CN105632660B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1227389A (en) * | 1998-02-27 | 1999-09-01 | 株式会社日立制作所 | Insulating material and windings thereby |
| CN101262152A (en) * | 2007-03-06 | 2008-09-10 | 株式会社东芝 | Coil insulator, armature coil insulated by the coil insulator and electrical rotating machine having the armature coil |
| CN103198908A (en) * | 2013-04-01 | 2013-07-10 | 株洲时代电气绝缘有限责任公司 | High thermal conductivity epoxy few adhesive mica tape and preparation method of high thermal conductivity epoxy few glue mica tape |
| CN103400665A (en) * | 2013-08-05 | 2013-11-20 | 桂林理工大学 | Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105632660A (en) | 2016-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105632660B (en) | High heat conduction low resin mica tape and preparation method thereof | |
| CN106626626B (en) | A kind of high thermal conductivity film reinforcement mica tape and its preparation method and application | |
| CN103198908B (en) | A kind of preparation method of high heat conduction epoxy low resin mica tape | |
| CN102693791B (en) | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof | |
| CN102398395B (en) | One-side glass cloth reinforced rich gelatine powder mica tape, manufacturing method thereof and purpose thereof | |
| CN106531288A (en) | Dry mica tape and preparation method thereof | |
| CN111546722B (en) | Reinforced high-thermal-conductivity mica tape and preparation method thereof | |
| CN202711885U (en) | High heat conduction and high air permeability little glue mica tape | |
| CN102509594B (en) | Fire-retardant binding belt for cable and manufacturing method therefor | |
| CN103440902A (en) | Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof | |
| CN102855999A (en) | Water-blocking tape for electricity cable | |
| CN105047256B (en) | Mica tape of the curing accelerator containing microcapsules and preparation method thereof | |
| CN105754273B (en) | A kind of polymer/nanometer film for obstructing steam and preparation method thereof | |
| CN103700456A (en) | Mica tape production method without using organic solvent | |
| CN102982926A (en) | Fabrication method of compound mica tape and mica tape | |
| CN103350553A (en) | Single-side reinforcing mica tape | |
| CN103514978A (en) | Double-faced organic silicon polyimide film dry mica paper tape and preparation method thereof | |
| CN201104310Y (en) | Mica tape | |
| CN103515034A (en) | Double-faced mica tape and preparation method thereof | |
| CN109545454A (en) | A kind of wire and cable basalt fiber cloth fire resistant belt and preparation method thereof | |
| CN112289528A (en) | Method for manufacturing calcined mica tape and calcined mica tape | |
| CN102290901B (en) | Composite slot wedge used for motor rotor and manufacturing method thereof | |
| CN208855158U (en) | A kind of glass fiber membrane enhancing synthetic mica tape | |
| CN103280253A (en) | Anticorona semiconductor mica tape, preparation method and usage of anticorona semiconductor mica tape | |
| CN208385104U (en) | A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180816 Address after: 412199 Industrial Park, Lukou Economic Development Zone, Zhuzhou County, Zhuzhou, Hunan Patentee after: Zhuzhou Times Electric Insulation Co., Ltd. Address before: 412000 Haitian Road, Tianyuan District, Zhuzhou, Hunan Province, No. 18 Patentee before: Zhuzhou Shidai New Material Sci-Tech Co., Ltd. |
|
| TR01 | Transfer of patent right |