CN105632660A - High-thermal-conductivity dry mica tape and preparation method therefor - Google Patents
High-thermal-conductivity dry mica tape and preparation method therefor Download PDFInfo
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Abstract
The invention discloses a high-thermal-conductivity dry mica tape, and the dry mica tape consists of mica paper, an adhesive layer, and a fiber cloth layer. Moreover, the mica paper, the adhesive layer and the fiber cloth layer are sequentially overlapped from the bottom to the top. The surface of the fiber cloth layer is uniformly coated with a heat conduction filling material, and the adhesive layer and the fiber cloth layer coated with the heat conduction filling material are overlapped. The preparation method for the mica tape comprises the steps: firstly carrying out the surface treatment of a selected heat conduction filling material through employing a surface treating agent; secondly dispersing the processed heat conduction filling material in an adhesive uniformly, and enabling the obtained adhesive liquid containing the filling material to coat the surface of prepared fiber cloth; thirdly carrying out the baking of the fiber cloth coated with the adhesive liquid, coating one face of the surface with the adhesive, carrying out the surface treatment of the composite mica paper through the adhesive, and obtaining an initial finished product of the mica tape; finally carrying out baking, winding and cutting, and obtaining the finished product of the high-thermal-conductivity dry mica tape. The high-thermal-conductivity dry mica tape is excellent in electrical performances and composite performances, is not layered, does not cause powder to fall, and is stable in quality.
Description
Technical field
The present invention relates to a kind of mica tape and preparation technology thereof, particularly relate to a kind of heat conduction low resin mica tape and preparation method thereof.
Background technology
As the composite that the mica tape of motor critical material is a kind of polymer-matrix, heat conductivility is poor, in the long-time intensive work process of motor, motor can produce higher temperature rise (temperature difference of the some portion of temperature of motor and surrounding cooling medium), it is aging that long hot environment can make generator stator winding insulation material occur, affects the service life of motor.
Mica tape is usually the composite being made up of mica paper, supporting material, adhesive. In this composite of mica tape, adhesive and supporting material heat conductivity are all smaller. The key of high heat conduction low resin mica tape research and development is exactly improve the part that heat conductivity in mica tape is little, conventional method is to be joined by heat filling in the part that heat conductivity is little, when the consumption of heat filling reaches a certain marginal value, form contact between heat filling granule and interact, mica tape system is formed heat conduction network chain, reaches to improve the effect of mica tape heat conductivity.
CN102337097A Chinese patent literature discloses one " preparation method that powder-filled high-thermal-conductivity mica tape sticks with glue agent ", it relates to powder-filled high-thermal-conductivity mica tape and sticks with glue the preparation of agent, and adhesive matrix resin is tong ma anhydride-epoxy type usual resins. CN102820110A Chinese patent literature discloses one " glass cloth reinforcement height heat conduction mica tape and preparation method thereof ", this patent documentation relates to a kind of glass cloth reinforcement height heat conduction mica tape and preparation thereof, filler adds to adhesive, and its mica tape heat conductivity reaches 0.25W/m K. CN103198908A Chinese patent literature discloses one " high heat conduction epoxy low resin mica tape and preparation method thereof ". From the domestic existing patent documentation about high heat conduction mica tape, it mainly adopts the method that heat filling directly filled by adhesive, and the raising of general filer content is the content being limited by adhesive; Especially lacking adhesive tape, owing to glue content is few, the volume loading of filler is difficult to improve, even if loading improves also brings along the problem that composite performance is poor.
Summary of the invention
The technical problem to be solved is, overcome the deficiency and defect mentioned in background above technology, there is provided that a kind of excellent electrical properties, composite performance be excellent, not stratified, not dry linting and stay-in-grade high heat conduction low resin mica tape, correspondingly provide the preparation method that a kind of technique is simple, be suitable for the high heat conduction low resin mica tape of VPI.
For solving above-mentioned technical problem, the technical scheme that the present invention proposes is a kind of high heat conduction low resin mica tape, this mica tape is made up of mica paper, adhesive layer and scrim cloth, and mica paper, adhesive layer and scrim cloth are sequentially overlapped from the bottom to top, described scrim cloth surface even spread has heat filling, described adhesive layer to be overlapped with the scrim cloth being coated with heat filling.
In above-mentioned high heat conduction low resin mica tape, it is preferred that described mica paper is non-calcinated mica paper, mixes and copy mica paper or synthetic mica paper, and the thickness of mica paper is 0.05mm��0.10mm. Described adhesive layer is mainly made up of the mixture of any one in organic siliconresin, polyester resin, epoxy resin, acrylate or at least two. The matrix of described scrim cloth can be any one in electrician's alkali-free glass fiber cloth, polyester non-woven fabric, silicon nitride fiber cloth, boron nitride fiber cloth, silicon carbide fibre cloth, chinlon, polyvinyl chloride fibre or acrylon, but it is preferably electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth is 0.025mm��0.060mm.
Conceive as a total technology, the preparation method that the present invention also provides for a kind of above-mentioned high heat conduction low resin mica tape, comprise the following steps:
(1) first with surface conditioning agent, the heat filling selected is carried out surface treatment;
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, must containing filler glue, standby;
(3) ready fiber cloth surface be coated with above-mentioned preparation containing filler glue; The thickness of fiber cloth is preferably 0.025mm��0.060mm, by the upper glue roller of at least one, the described glue containing filler is coated uniformly on fiber cloth surface;
(4) above-mentioned coating is carried out baking process rolling containing the fiber cloth after filler glue;
(5) again by the fiber cloth after rolling again uncoiling, and the one side on its surface is by rubber roll coating adhesive, and mica paper uncoiling is drawn in fiber cloth, by adhesive combined mica paper again and carry out surface treatment (surface treatment herein is mica flake in built up mica paper, prevent Muscovitum from bringing back to viscous simultaneously), obtain mica tape just finished product;
(6) above-mentioned mica tape just finished product is carried out baking process, and rolling, cut (by cutting into the width of needs after mica tape uncoiling by cutting machine), prepared high heat conduction low resin mica tape finished product.
Above-mentioned preparation method, preferably, in described step (1), the alcoholic solution that surface conditioning agent is silane coupler (preferred silane coupler KH-560) selected, the consumption of described silane coupler is the 3%��5% of heat filling quality, and the consumption of described ethanol is 1��3 times of heat filling volume. In described step (1), the concrete operations carrying out surface treatment are preferably: described heat filling joins ball-milling treatment 2h��5h in described surface conditioning agent, put in baking oven (oven temperature may be set to about 90 DEG C) dry more after vacuum filtration, finally take out sealing standby.
Above-mentioned preparation method, preferably, in described step (2), the binding agent selected is polyester adhesive, polyester solid content in this polyester adhesive is 1%��3%, solvent in polyester adhesive is the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 10: 1��1: 1; When heat filling is dispersed in binding agent, the addition of heat filling is 8��10 times of polyester solid content in binding agent, and dispersive process adds the dispersant of heat filling quality 2%��5%, and high speed dispersion 1h��2h, after finally the glue containing filler obtained being cooled to room temperature, seal standby.
Above-mentioned preparation method, it is preferred that in described step (4), baking process refers to and bakees 1min��5min at 85 DEG C��90 DEG C by drying tunnel, and baking carries out rolling by suitable dish footpath or weight after processing.
Above-mentioned preparation method, preferably, in described step (5), the adhesive selected is the mixture of any one or at least two in organic siliconresin, polyester resin, epoxy resin, acrylate, solid content in this adhesive is 10%��30%, and the consumption of this adhesive is 80��290g/m according to mica tape mass area ratio2At 4��45g/m2Change in scope.
Above-mentioned preparation method, it is preferred that in described step (5), the mica paper of selection is non-calcinated mica paper, mixes and copy mica paper or synthetic mica paper, and the thickness of mica paper is 0.05mm��0.10mm.
Above-mentioned preparation method, it is preferred that in described step (6), baking process refers to and bakees 1min��10min at 85 DEG C��115 DEG C by drying tunnel, and baking carries out rolling by suitable dish footpath or weight after processing.
The technique scheme of the present invention is based primarily upon following principle: adopt fiber cloth (particularly electrician's alkali-free glass fiber cloth) surface to be repeatedly coated with the polyester adhesive containing heat filling, after bakeing, make the uniform more blanketing fiberglass cloth surface of heat filling, namely use as mica tape raw materials for production after rolling; Again through common low resin mica tape photoresist coating process, after compound, the heat filling on glass fabric surface can fill mica tape adhesive preferably, the adhesive between mica paper and glass fabric is made in mica tape system to be internally formed heat conduction network chain, this not only can be effectively improved mica tape heat conductivity, and the electric property and mechanical impact to mica tape is little.
Compared with prior art, it is an advantage of the current invention that:
(1) the high heat conduction low resin mica tape of the present invention is by adopting different filler feed postition, the heat conductivity standard making mica tape finished product reaches 0.35��0.45W/m K, it it is general low resin mica tape about 2 times, this can effectively reduce the temperature rise of motor, increase the service life of motor, improve design of electrical motor power;
(2) the high heat conduction low resin mica tape of the present invention has that excellent electrical properties, composite performance be excellent, not stratified, not dry linting and steady quality;
(3) production technology of height heat conduction low resin mica tape of the present invention is simple, is suitable for VPI (vacuum pressure impregnation is used for processing the insulant such as motor coil) technique.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of height heat conduction low resin mica tape of the present invention.
Fig. 2 is the preparation technology schematic diagram of scrim cloth in the embodiment of the present invention.
Fig. 3 is the preparation technology schematic diagram of high heat conduction low resin mica tape in the embodiment of the present invention.
Marginal data:
1, unreeling structure; 2, steeping vat; 3, the first upper glue roller; 4, the first drying tunnel; 5, the second upper glue roller; 6, the second drying tunnel; 7, rolling-up mechanism; 8, rubber roller; 9, surface-coated mechanism; 10, the 3rd drying tunnel; 11, mica paper; 12, adhesive layer; 13, scrim cloth;
Detailed description of the invention
It it is below the specific embodiment of the present invention. Unless otherwise defined, the implication that all technical term used hereinafter is generally understood that with those skilled in the art is identical. Technical term used herein is intended merely to the purpose describing specific embodiment, is not intended to limit the scope of the invention. Unless otherwise specified, the various raw materials used in the present invention, reagent, instrument and equipment etc. all can be commercially available by market or can be prepared by existing method.
A kind of high heat conduction low resin mica tape of the present invention, this mica tape is made up of mica paper 11, adhesive layer 12 and scrim cloth 13, and mica paper 11, adhesive layer 12 and scrim cloth 13 are sequentially overlapped from the bottom to top, scrim cloth 13 surface even spread has heat filling, adhesive layer 12 to be overlapped with the scrim cloth 13 being coated with heat filling. Mica paper 11 in the present embodiment is non-calcinated mica paper, mixes and copy mica paper or synthetic mica paper, and the thickness of mica paper 11 is 0.05mm��0.10mm. Adhesive layer 12 is mainly made up of the mixture of any one in organic siliconresin, polyester resin, epoxy resin, acrylate or at least two. The matrix of scrim cloth 13 is electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth 13 is 0.025mm��0.060mm.
The preparation method of above-mentioned high heat conduction low resin mica tape, comprises the following steps:
(1) first with surface conditioning agent, the heat filling selected is carried out surface treatment; The alcoholic solution that surface conditioning agent is silane coupler KH-560 selected, the consumption of silane coupler is the 3%��5% of heat filling quality, and the consumption of ethanol is 1��3 times of heat filling volume; The concrete operations carrying out surface treatment are: heat filling joins ball-milling treatment 2h in surface conditioning agent��5h, then puts in baking oven (oven temperature is about 90 DEG C) dry after vacuum filtration, finally take out sealing standby;
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, must containing filler glue, standby; The binding agent selected is polyester adhesive, and the polyester solid content in this polyester adhesive is 1%��3%, and the solvent in polyester adhesive is the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 1: 1; When heat filling is dispersed in binding agent, the addition of heat filling is 8��10 times of polyester solid content in binding agent, and dispersive process adds the dispersant of heat filling quality 2%��5%, and high speed dispersion 1h��2h, after finally the glue containing filler obtained being cooled to room temperature, seal standby;
(3) as shown in Figure 2, ready electrician's alkali-free glass fiber cloth (thickness is 0.025mm��0.060mm) is unreeled by unreeling structure 1, electrician's alkali-free glass fiber cloth after unreeling is submerged initially in equipped with carrying out dipping process in the steeping vat 2 containing filler glue so that it is surface be coated with above-mentioned preparation containing filler glue;
(4) as shown in Figure 2, the bottom surface of electrician's alkali-free glass fiber cloth is made to carry out first gluing again through the first upper glue roller 3 after impregnation, pre-bake treatment is carried out by the first drying tunnel 4 after first gluing, then the bottom surface of electrician's alkali-free glass fiber cloth is made to carry out second gluing again through the second upper glue roller 5, carrying out baking process, pre-bake treatment and baking process by the second drying tunnel 6 after second gluing is all baking 1min��5min at 85 DEG C��90 DEG C; Baking carries out rolling by suitable dish footpath or weight by rolling-up mechanism 7 after processing;
(5) as shown in Figure 3, by the electrician's alkali-free glass fiber cloth after rolling by unreeling structure 1 uncoiling again again, and the one side on its surface is by rubber roller 8 adhesive coating, the adhesive that the present embodiment is selected is the mixture of any one or at least two in organic siliconresin, polyester resin, epoxy resin, acrylate, solid content in this adhesive is 10%��30%, and the consumption of this adhesive is 80��290g/m according to mica tape mass area ratio2At 4��45g/m2Change in scope, meanwhile, by unreeling structure 1, mica paper 11 (thickness is 0.05mm��0.10mm) uncoiling is drawn on the electrician's alkali-free glass fiber cloth after rubber, to the mica paper after compound and carry out surface treatment finally by surface-coated mechanism 9, obtain mica tape just finished product;
(6) by the 3rd drying tunnel 10, above-mentioned mica tape just finished product is carried out baking process, this baking process refers to and bakees 1min��10min at 85 DEG C��115 DEG C by drying tunnel, baking carries out rolling by suitable dish footpath or weight by rolling-up mechanism 7 after processing, finally will be cut into the width of needs after mica tape uncoiling by cutting machine, prepare high heat conduction low resin mica tape finished product.
For the ease of understanding the present invention, below in conjunction with Figure of description and preferred embodiment, the present invention is made more comprehensively, describes meticulously, but protection scope of the present invention is not limited to embodiment in detail below.
Embodiment:
A kind of high heat conduction low resin mica tape of the present invention as shown in Figure 1, this mica tape is made up of mica paper 11, adhesive layer 12 and scrim cloth 13, and mica paper 11, adhesive layer 12 and scrim cloth 13 are sequentially overlapped from the bottom to top, scrim cloth 13 surface even spread has heat filling, adhesive layer 12 to be overlapped with the scrim cloth 13 being coated with heat filling. Mica paper 11 in the present embodiment is non-calcinated mica paper, and the thickness of mica paper 11 is 0.10mm. Adhesive layer 12 is mainly made up of the mixture of polyester resin and epoxy resin. The matrix of scrim cloth 13 is electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth 13 is 0.04mm.
The preparation method of the high heat conduction low resin mica tape that the present embodiment is above-mentioned, comprises the following steps:
(1) first with surface conditioning agent, the heat filling selected is carried out surface treatment; The alcoholic solution that surface conditioning agent is silane coupler KH-560 selected, the consumption of silane coupler is the 3% of heat filling quality, and the consumption of ethanol is 2.5 times of heat filling volume; The concrete operations carrying out surface treatment are: heat filling joins ball-milling treatment 2h in surface conditioning agent��5h, then puts in baking oven (oven temperature is about 90 DEG C) dry after vacuum filtration, finally take out sealing standby;
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, must containing filler glue, standby; The binding agent selected is polyester adhesive, and the polyester solid content in this polyester adhesive is 2%, and the solvent in polyester adhesive is the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 1: 1; When heat filling is dispersed in binding agent, the addition of heat filling is 10 times of polyester solid content in binding agent, and adds the dispersant of heat filling quality 2% high speed dispersion 1h��2h in dispersive process, after finally the glue containing filler obtained being cooled to room temperature, seal standby;
(3) as shown in Figure 2, ready electrician's alkali-free glass fiber cloth (thickness is 0.04mm) is unreeled by unreeling structure 1, electrician's alkali-free glass fiber cloth after unreeling is submerged initially in equipped with carrying out dipping process in the steeping vat 2 containing filler glue so that it is surface be coated with above-mentioned preparation containing filler glue;
(4) as shown in Figure 2, the bottom surface of electrician's alkali-free glass fiber cloth is made to carry out first gluing again through the first upper glue roller 3 after impregnation, pre-bake treatment is carried out by the first drying tunnel 4 after first gluing, then the bottom surface of electrician's alkali-free glass fiber cloth is made to carry out second gluing again through the second upper glue roller 5, carrying out baking process, pre-bake treatment and baking process by the second drying tunnel 6 after second gluing is all baking 1min��5min at 85 DEG C��90 DEG C; Baking carries out rolling by suitable dish footpath or weight by rolling-up mechanism 7 after processing;
(5) as shown in Figure 3, by the electrician's alkali-free glass fiber cloth after rolling by unreeling structure 1 uncoiling again again, and the one side on its surface is by rubber roller 8 adhesive coating, the mixture that adhesive is polyester resin and epoxy resin that the present embodiment is selected, solid content in this adhesive is 24%, and the consumption of this adhesive is 80��290g/m according to mica tape mass area ratio2At 4��45g/m2Change in scope, meanwhile, by unreeling structure 1, mica paper 11 (thickness is 0.05mm��0.10mm) uncoiling is drawn on the electrician's alkali-free glass fiber cloth after rubber, to the mica paper after compound and carry out surface treatment finally by surface-coated mechanism 9, obtain mica tape just finished product;
(6) by the 3rd drying tunnel 10, above-mentioned mica tape just finished product is carried out baking process, this baking process refers to and bakees 1min��10min at 85 DEG C��115 DEG C by drying tunnel, baking carries out rolling by suitable dish footpath or weight by rolling-up mechanism 7 after processing, finally will be cut into the width of needs after mica tape uncoiling by cutting machine, prepare high heat conduction low resin mica tape finished product.
Claims (10)
1. one kind high heat conduction low resin mica tape, this mica tape is made up of mica paper, adhesive layer and scrim cloth, and mica paper, adhesive layer and scrim cloth are sequentially overlapped from the bottom to top, it is characterized in that: described scrim cloth surface even spread has heat filling, described adhesive layer to be overlapped with the scrim cloth being coated with heat filling.
2. high heat conduction low resin mica tape according to claim 1, it is characterised in that: described mica paper is non-calcinated mica paper, mixes and copy mica paper or synthetic mica paper, and the thickness of mica paper is 0.05mm��0.10mm; Described adhesive layer is mainly made up of the mixture of any one in organic siliconresin, polyester resin, epoxy resin, acrylate or at least two; The matrix of described scrim cloth is electrician's alkali-free glass fiber cloth, and the matrix thickness of scrim cloth is 0.025mm��0.060mm.
3. a preparation method for high heat conduction low resin mica tape as claimed in claim 1 or 2, comprises the following steps:
(1) first with surface conditioning agent, the heat filling selected is carried out surface treatment;
(2) heat filling after above-mentioned surface treatment is dispersed in binding agent, must containing filler glue, standby;
(3) ready fiber cloth surface be coated with above-mentioned preparation containing filler glue;
(4) above-mentioned coating is carried out baking process rolling containing the fiber cloth after filler glue;
(5) again by the fiber cloth after rolling again uncoiling, and at an adhesive coating on its surface, by adhesive combined mica paper again and carry out surface treatment, mica tape just finished product is obtained;
(6) above-mentioned mica tape just finished product is carried out baking process, and rolling, cut, prepare high heat conduction low resin mica tape finished product.
4. preparation method according to claim 3, it is characterized in that, in described step (1), the alcoholic solution that surface conditioning agent is silane coupler selected, the consumption of described silane coupler is the 3%��5% of heat filling quality, and the consumption of described ethanol is 1��3 times of heat filling volume.
5. preparation method according to claim 4, it is characterized in that, in described step (1), the concrete operations carrying out surface treatment are: described heat filling joins ball-milling treatment 2h��5h in described surface conditioning agent, put in baking oven dry more after vacuum filtration, finally take out sealing standby.
6. the preparation method according to any one of claim 3��5, it is characterized in that, in described step (2), the binding agent selected is polyester adhesive, polyester solid content in this polyester adhesive is 1%��3%, solvent in polyester adhesive is the mixed solvent of butanone and toluene, and the mass ratio of butanone and toluene is 10: 1��1: 1; When heat filling is dispersed in binding agent, the addition of heat filling is 8��10 times of polyester solid content in binding agent, and adds the dispersant of heat filling quality 2%��5% high speed dispersion 1h��2h in dispersive process.
7. the preparation method according to any one of claim 3��5, it is characterized in that, in described step (4), baking process refers to and bakees 1min��5min at 85 DEG C��90 DEG C by drying tunnel, and baking carries out rolling by suitable dish footpath or weight after processing.
8. the preparation method according to any one of claim 3��5, it is characterized in that, in described step (5), the adhesive selected is the mixture of any one or at least two in organic siliconresin, polyester resin, epoxy resin, acrylate, solid content in this adhesive is 10%��30%, and the consumption of this adhesive is 80��290g/m according to mica tape mass area ratio2At 4��45g/m2Change in scope.
9. the preparation method according to any one of claim 3��5, it is characterised in that in described step (5), the mica paper of selection is non-calcinated mica paper, mixes and copy mica paper or synthetic mica paper, and the thickness of mica paper is 0.05mm��0.10mm.
10. the preparation method according to any one of claim 3��5, it is characterized in that, in described step (6), baking process refers to and bakees 1min��10min at 85 DEG C��115 DEG C by drying tunnel, and baking carries out rolling by suitable dish footpath or weight after processing.
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| CN107134328A (en) * | 2017-04-21 | 2017-09-05 | 汪逸凡 | A kind of preparation method of the ageing-resistant mica tape of few glue-type |
| CN108384479A (en) * | 2018-02-01 | 2018-08-10 | 苏州太湖电工新材料股份有限公司 | Adhesive of high heat conduction low resin mica tape and preparation method thereof and low resin mica tape |
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| CN108384479B (en) * | 2018-02-01 | 2019-12-03 | 苏州太湖电工新材料股份有限公司 | Adhesive of high thermal conductivity low resin mica tape and preparation method thereof and low resin mica tape |
| CN108384479A (en) * | 2018-02-01 | 2018-08-10 | 苏州太湖电工新材料股份有限公司 | Adhesive of high heat conduction low resin mica tape and preparation method thereof and low resin mica tape |
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| CN110387210B (en) * | 2019-07-31 | 2021-10-19 | 中广核达胜加速器技术有限公司 | EB (Epstein-Barr) curing-based adhesive and preparation method of mica tape with same |
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| CN112659695A (en) * | 2020-12-21 | 2021-04-16 | 四川东材科技集团股份有限公司 | High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof |
| CN114523741A (en) * | 2022-04-19 | 2022-05-24 | 浙江荣泰电工器材股份有限公司 | High-strength high-tensile high-modulus mica plate for thermal runaway management of new energy automobile and preparation method thereof |
| CN114523741B (en) * | 2022-04-19 | 2022-07-29 | 浙江荣泰电工器材股份有限公司 | High-strength high-tensile high-modulus mica plate for thermal runaway management of new energy automobile |
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Effective date of registration: 20180816 Address after: 412199 Industrial Park, Lukou Economic Development Zone, Zhuzhou County, Zhuzhou, Hunan Patentee after: Zhuzhou Times Electric Insulation Co., Ltd. Address before: 412000 Haitian Road, Tianyuan District, Zhuzhou, Hunan Province, No. 18 Patentee before: Zhuzhou Shidai New Material Sci-Tech Co., Ltd. |
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