CN208385104U - A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape - Google Patents
A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape Download PDFInfo
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- CN208385104U CN208385104U CN201820913995.4U CN201820913995U CN208385104U CN 208385104 U CN208385104 U CN 208385104U CN 201820913995 U CN201820913995 U CN 201820913995U CN 208385104 U CN208385104 U CN 208385104U
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- China
- Prior art keywords
- mica paper
- adhesive layer
- thermal conductivity
- high thermal
- mica
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Abstract
The utility model discloses a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tapes, including mica paper, the mica paper outer end connects thermally conductive silica gel cloth by the first epoxy adhesive layer, and the thermally conductive silica gel cloth outer end connects alkali-free glass fiber cloth by the second epoxy adhesive layer.The utility model passes through setting mica paper and the first epoxy adhesive layer, highly heat-conductive material is added on mica paper, the thermal conductivity of mica paper can be improved, simultaneously, utilize the fenestral fabric on mica paper, the intensity that the first epoxy adhesive layer bonding mica sheet can be improved avoids low resin mica tape and the problem of flying powder and layering occurs；By the way that thermally conductive silica gel cloth, the safety for greatly protecting electric wire to use is arranged；By setting first layer ring adhesive and the second epoxy adhesive layer, makes the more firm lasting of the structural bond inside little-glue single-face glass mica paper tape, be advantageously implemented the purpose of high thermal conductivity low resin mica tape batch production.
Description
Technical field
The utility model relates to mica tape technical field, specially a kind of high thermal conductivity epoxy little-glue single-face glass mica powder
Band.
Background technique
Ac high-voltage generator stator winding insulation has adhesive-contented mica tapes die stamping insulation, middle adhesive-contented mica tape VPI exhausted in the prior art
Several systems such as edge and low resin mica tape VPI insulation.From comprehensive performance with from the point of view of long term growth, low resin mica tape VPI insulate nothing
It is suspected to be the developing direction of high-voltage motor insulated manufacturing technology.Compared with first two insulation system, in low resin mica tape VPI insulation
Mica content significantly improves, insulate in air-gap-free, overall performance is good, be conducive to improve insulation electric property, corona resistance with
Electrical life to improve the technical indicator of motor, service life and operational reliability, while enormously simplifying coil manufacture
Technique not only can shorten the production cycle, reduce manufacturing cost, and be conducive to improve coil insulation quality.In pervious development
In sample, low resin mica tape is extremely unstable, there is the problems such as winged powder, layering, is not able to satisfy mechanical wrapped coil process requirement, can not
It is produced in batches, can not meet the demand of electromechanics trade.For this purpose, it is proposed that a kind of high thermal conductivity epoxy little-glue single-face glass powder
Mica tape.
Utility model content
It is above-mentioned to solve the purpose of this utility model is to provide a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape
The problem of being proposed in background technique.
To achieve the above object, the utility model provides the following technical solutions: a kind of high thermal conductivity epoxy little-glue single-face glass
Mica paper tape, including mica paper, the mica paper outer end connect thermally conductive silica gel cloth, the thermally conductive silicon by the first epoxy adhesive layer
Adhesive plaster outer end connects alkali-free glass fiber cloth by the second epoxy adhesive layer.
Preferably, the mica paper outer end is equably formed with fenestral fabric.
Preferably, the mica paper is the big flake mica paper of organosilicon.
Preferably, the mica paper is the mica paper for being added to highly heat-conductive material.
Preferably, the thermally conductive silica gel cloth inner end is evenly provided with protrusion.
Preferably, the first epoxy adhesive layer and the second epoxy adhesive layer are modified epoxy adhesive layer.
Compared with prior art, the utility model has the beneficial effects that this kind of high thermal conductivity epoxy little-glue single-face glass powder cloud
Master tape adds highly heat-conductive material on mica paper, mica paper can be improved by setting mica paper and the first epoxy adhesive layer
Thermal conductivity, meanwhile, using the fenestral fabric on mica paper, the intensity of the first epoxy adhesive layer bonding mica sheet can be improved,
It avoids low resin mica tape and the problem of flying powder and layering occurs；By the way that thermally conductive silica gel cloth is arranged, can support by high voltage and metalwork
Puncture caused by short circuit, the safety for greatly protecting electric wire to use；By setting first layer ring adhesive and
Second epoxy adhesive layer makes the more firm lasting of the structural bond inside little-glue single-face glass mica paper tape, is advantageously implemented
The purpose of high thermal conductivity low resin mica tape batch production.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model structure sectional side view；
Fig. 3 is the utility model mica paper partial top view.
In figure: 1 mica paper, 2 thermally conductive silica gel cloth, 3 alkali-free glass fiber cloths, 4 first epoxy adhesive layers, 5 second epoxies are viscous
Close layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of high thermal conductivity epoxy little-glue single-face glass powder cloud
Master tape, including mica paper 1, the mica paper 1 are the big flake mica paper of organosilicon, and the big flake mica paper of organosilicon has better
The overall performance and security performance of electrical-coil has can be improved in permeability and fire resistance.The mica paper 1 is to be added to height to lead
The mica paper of hot material, and highly heat-conductive material is that manufactured highly heat-conductive material is filled in aluminium nitride and boron nitride mixing, is not only guaranteed
The thermal conductivity of mica tape, and the cost of mica tape can again reduced.And 1 outer end of mica paper is equably formed with latticed knot
Structure, 1 outer end of mica paper connect thermally conductive silica gel cloth 2 by the first epoxy adhesive layer 4, and thermally conductive 2 inner end of silica gel cloth is uniform
Ground is equipped with protrusion, with filling the first epoxy adhesive layer 4 by thermally conductive silica gel cloth 2 and mica paper 1 in raised interpenetration network shape structure
Divide bonding, also improve the intensity of first 4 pairs of mica paper 1 of epoxy adhesive layer bonding, low resin mica tape is avoided to occur flying powder and layering
The problem of, meanwhile, also maintain higher flexibility.And thermally conductive silica gel cloth 2 has superior stretching resistance and wear-resisting property, price
Material benefit, the thermal resistance that can be effectively reduced between electronic building brick and radiator, and have high dielectric strength, good thermal conductance is high
Chemical resistance can support short circuit caused by by the puncture of high voltage and metalwork, greatly electric wire be protected to use
Safety.Thermally conductive 2 outer end of silica gel cloth connects alkali-free glass fiber cloth 3, the alkali-free glass by the second epoxy adhesive layer 5
Fiber cloth 3 is alkali-free glass fiber cloth alkali-free glass fiber cloth, and alkali-free glass fibre has that good insulating, heat resistance be strong, anti-corruption
The advantages that corrosion is good and high mechanical strength.The first epoxy adhesive layer 4 and the second epoxy adhesive layer 5 are modified epoxy
Adhesive layer, modified epoxy adhesive layer has good ageing-resistant, resistance to acid and alkali performance, moreover, modified epoxy glue
Glutinous layer adhesive strength is high, makes the more firm lasting of the structural bond inside little-glue single-face glass mica paper tape, so that height be made to lead
Hot low resin mica tape batch production is possibly realized.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape, including mica paper (1), it is characterised in that: the mica paper
(1) outer end connects thermally conductive silica gel cloth (2) by the first epoxy adhesive layer (4), and thermally conductive silica gel cloth (2) outer end passes through the second ring
Oxygen adhesive layer (5) connects alkali-free glass fiber cloth (3).
2. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape according to claim 1, it is characterised in that: the cloud
Female paper (1) outer end is equably formed with fenestral fabric.
3. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape according to claim 1, it is characterised in that: the cloud
Female paper (1) is the big flake mica paper of organosilicon.
4. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape according to claim 1,2 or 3, it is characterised in that:
The mica paper (1) is the mica paper for being added to highly heat-conductive material.
5. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape according to claim 1, it is characterised in that: described to lead
Hot silica gel cloth (2) inner end is evenly provided with protrusion.
6. a kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape according to claim 1, it is characterised in that: described
One epoxy adhesive layer (4) and the second epoxy adhesive layer (5) are modified epoxy adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820913995.4U CN208385104U (en) | 2018-06-13 | 2018-06-13 | A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820913995.4U CN208385104U (en) | 2018-06-13 | 2018-06-13 | A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208385104U true CN208385104U (en) | 2019-01-15 |
Family
ID=64967322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820913995.4U Expired - Fee Related CN208385104U (en) | 2018-06-13 | 2018-06-13 | A kind of high thermal conductivity epoxy little-glue single-face glass mica paper tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208385104U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
-
2018
- 2018-06-13 CN CN201820913995.4U patent/CN208385104U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
| CN111276282B (en) * | 2020-01-06 | 2020-12-04 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 |
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| CF01 | Termination of patent right due to non-payment of annual fee |