CN208385103U - A kind of organosilicon little-glue single-face Kapton mica paper tape - Google Patents
A kind of organosilicon little-glue single-face Kapton mica paper tape Download PDFInfo
- Publication number
- CN208385103U CN208385103U CN201820913966.8U CN201820913966U CN208385103U CN 208385103 U CN208385103 U CN 208385103U CN 201820913966 U CN201820913966 U CN 201820913966U CN 208385103 U CN208385103 U CN 208385103U
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- CN
- China
- Prior art keywords
- heat
- mica paper
- face
- kapton
- conducting layer
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Abstract
The utility model discloses a kind of organosilicon little-glue single-face Kapton mica paper tapes, including mica paper, it is connected with each other between the mica paper and the reinforcing material bed of material by adhesive layer, the adhesive layer is located at heat-conducting layer upper and lower end face, the heat-conducting layer is formed by overlapping by vertical bar and transverse bar, and the heat-conducting layer upper end is fitted with modified organic silicon adhesive phase.The organosilicon little-glue single-face Kapton mica paper tape; pass through pressing; modified organic silicon adhesive lower end surface can be made to contact by adhesive layer with heat-conducting layer; heat-conducting layer alternates overlap joint by vertical bar and transverse bar; heat-conducting layer lower end is effectively bonded with the reinforcing material bed of material, keeps adhesive mixing filling effect and fitting effect more preferable, simultaneously; heat-conducting layer can resist extraneous strong puncture, also have extremely strong protective effect to coil.Kapton is set as the reinforcing material bed of material, more improves insulation performance and temperature tolerance.
Description
Technical field
The utility model relates to mica tape technical field, specially a kind of organosilicon little-glue single-face Kapton powder cloud
Master tape.
Background technique
Ac high-voltage generator stator winding insulation has adhesive-contented mica tapes die stamping insulation, middle adhesive-contented mica tape VPI exhausted in the prior art
Several systems such as edge and low resin mica tape VPI insulation.From comprehensive performance with from the point of view of long term growth, low resin mica tape VPI insulate nothing
It is suspected to be the developing direction of high-voltage motor insulated manufacturing technology.Compared with first two insulation system, in low resin mica tape VPI insulation
Mica content significantly improves, insulate in air-gap-free, overall performance is good, be conducive to improve insulation electric property, corona resistance with
Electrical life to improve the technical indicator of motor, service life and operational reliability, while enormously simplifying coil manufacture
Technique.Into 180 DEG C of heatproof or more different cloth traction motors, wind-driven generator, oil drilling, mine motors, frequency control over year
The demand of alternating current generator gradually increases, and the low resin mica tape for meeting its requirement is badly in need of exploitation.In pervious development type, few glue
Mica tape is extremely unstable, there is the problems such as winged powder, layering, is not able to satisfy mechanical wrapped coil process requirement, it is raw can not to carry out batch
It produces, can not meet the demand of electromechanics trade.Meanwhile it also not improving to coil protective effect.Therefore, it is proposed that it is a kind of
Organosilicon little-glue single-face Kapton mica paper tape.
Utility model content
The purpose of this utility model is to provide a kind of organosilicon little-glue single-face Kapton mica paper tapes, to solve
The problems mentioned above in the background art.
To achieve the above object, the utility model provides the following technical solutions: a kind of organosilicon little-glue single-face polyimides
Film mica paper tape, including mica paper are connected with each other between the mica paper and the reinforcing material bed of material by adhesive layer, described viscous
It closes layer and is located at heat-conducting layer upper and lower end face, the heat-conducting layer is formed by overlapping by vertical bar and transverse bar, and the heat-conducting layer upper end, which is fitted with, to be changed
Property silicone adhesive layer.
Preferably, the heat-conducting layer is with a thickness of 0.01~0.05mm.
Preferably, the modified organic silicon adhesive phase top surface edge is coated with a small amount of face glue.
Preferably, the vertical bar and transverse bar alternate superposition.
Preferably, the mica paper lower end is equipped with modified organic silicon adhesive phase.
Preferably, the reinforcing material bed of material is the very high Kapton of single side tensile strength.
Compared with prior art, the utility model has the beneficial effects that organic organosilicon little-glue single-face polyimides is thin
Film mica paper tape is passed through by setting mica paper, modified organic silicon adhesive, heat-conducting layer, vertical bar, the reinforcing material bed of material and transverse bar
Pressing, can be such that modified organic silicon adhesive lower end surface contacts by adhesive layer with heat-conducting layer, and heat-conducting layer passes through vertical bar and transverse bar
Overlap joint is alternateed, heat-conducting layer lower end is effectively bonded with the reinforcing material bed of material, makes adhesive mixing filling effect and fitting effect more
Good, effectively solution low resin mica tape is extremely unstable, there is the problems such as winged powder, layering, in addition, heat-conducting layer can be resisted, the external world is strong to be worn
Thorn, has extremely strong protective effect to coil；By setting Kapton as the reinforcing material bed of material, mica tape can be improved
Insulation performance and temperature tolerance.
Detailed description of the invention
Fig. 1 is the utility model local explosion structure diagram；
Fig. 2 is the partial structural diagram of the utility model；
The partial schematic sectional view of the position Fig. 3 the utility model.
In figure: 1 mica paper, 2 modified organic silicon adhesive phases, 3 vertical bars, 4 transverse bars, the 5 reinforcing material bed of materials, 6 heat-conducting layers, 7 are glued
Close layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of organosilicon little-glue single-face Kapton
Mica paper tape, including mica paper 1 are connected with each other between the mica paper 1 and the reinforcing material bed of material 5 by adhesive layer 7, described
The reinforcing material bed of material 5 is the very high Kapton of single side tensile strength.The adhesive layer 7 is located at 6 upper and lower end face of heat-conducting layer, institute
It states heat-conducting layer 6 to be formed by overlapping by vertical bar 3 and transverse bar 4, the vertical bar 3 and transverse bar 4 alternate superposition, 6 thickness of heat-conducting layer
For 0.01~0.05mm.6 upper end of heat-conducting layer is fitted with modified organic silicon adhesive phase 2, and 1 lower end of mica paper, which is equipped with, to be changed
Property silicone adhesive layer 2,2 top surface edge of modified organic silicon adhesive phase are coated with a small amount of face glue.The mica paper 1
It is big flake mica paper.The reinforcing material bed of material 5 is the very high Kapton of single side tensile strength.Kapton
Dielectric breakdown strength is very high, and Kapton thickness is uniform, and temperature resistant grade is high.The modified organic silicon adhesive phase 2 has
There are brilliant cold-and-heat resistent, ageing-resistant, electrical insulation capability and durable adhesive property.The reinforcing material bed of material 5, modified organic silicon bonding
Oxidant layer 2 and big flake mica paper 1 through it is compound, bake, wind, cut.The mica paper 1 is soft, is suitable for heatproof 180
DEG C or more asynchronous traction motor, wind-driven generator, oil field turn the coil of well, mine motor, frequency conversion timing AC motor, lead
With end lapped insulation.Make mica tape that there is better permeability using big flake mica paper 1, improves the entirety of electrical-coil
Performance improves electrical, Inverter fed motor, electrical life.The heat-conducting layer 6 is high-end thermally conductive compound using heat conductive silica gel, with
And will not solidification, characteristic that will not be conductive can be to avoid risks such as short circuits.Thermally conductive adhering and sealing silicon rubber is single
Component, heat-conducting type, room temperature curing organosilicon joint sealant.Heat-conducting silica gel sheet can be very good the gap of filling contact surface, will
Air squeezes out contact surface, and heat conductive silica gel is arranged to vertical bar 3 and transverse bar 4 alternates the mode of taking, and has the supplement of heat-conducting silica gel sheet,
Contact surface can be made preferably to come into full contact with, be truly realized aspectant contact.Reaction in temperature can achieve small as far as possible
The temperature difference.A kind of organic organosilicon little-glue single-face Kapton mica paper tape, it is organic by setting mica paper 1, modification
Silicone coupling oxidant layer 2, heat-conducting layer 6, vertical bar 3, the reinforcing material bed of material 5 and transverse bar 4 can make modified organic silicon adhesive by pressing
2 lower end surface of layer are contacted by adhesive layer 7 with heat-conducting layer 6, and heat-conducting layer 6 alternates overlap joint, heat-conducting layer 6 by vertical bar 3 and transverse bar 4
Lower end is effectively bonded with the reinforcing material bed of material 5, keeps adhesive mixing filling effect and fitting effect more preferable, effectively solves few glue mica
With extremely unstable, there is the problems such as winged powder, layering, in addition, heat-conducting layer 6 can resist extraneous strong puncture, has to coil extremely strong
Protective effect；By setting Kapton as the reinforcing material bed of material, the insulation performance and temperature tolerance of mica tape can be improved.
Working principle: firstly, heat-conducting layer 6 is arranged to vertical bar 3 and transverse bar 4 overlapped structure, in 6 upper and lower end face of heat-conducting layer
Adhesive layer 7 is set, secondly, modified organic silicon adhesive phase 2 is placed on the pressing bonding of 6 upper surface of heat-conducting layer, it is organic in modification
Face glue has been lacked in the painting of 2 upper end-face edge of silicone coupling oxidant layer, and mica paper 1 is placed on 2 upper surface of modified organic silicon adhesive phase, by squeezing
Pressure, fits closely mica paper 1 with the reinforcing material bed of material 5.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of organosilicon little-glue single-face Kapton mica paper tape, including mica paper (1), it is characterised in that: described
It is connected with each other between mica paper (1) and the reinforcing material bed of material (5) by adhesive layer (7), the adhesive layer (7) is located at heat-conducting layer (6)
Upper and lower end face, the heat-conducting layer (6) are formed by overlapping by vertical bar (3) and transverse bar (4), and heat-conducting layer (6) upper end is fitted with modification
Silicone adhesive layer (2).
2. a kind of organosilicon little-glue single-face Kapton mica paper tape according to claim 1, it is characterised in that: institute
Heat-conducting layer (6) is stated with a thickness of 0.01~0.05mm.
3. a kind of organosilicon little-glue single-face Kapton mica paper tape according to claim 1, it is characterised in that: institute
Modified organic silicon adhesive phase (2) top surface edge stated is coated with a small amount of face glue.
4. a kind of organosilicon little-glue single-face Kapton mica paper tape according to claim 1, it is characterised in that: institute
It states vertical bar (3) and transverse bar (4) alternates superposition.
5. a kind of organosilicon little-glue single-face Kapton mica paper tape according to claim 1, it is characterised in that: institute
Mica paper (1) lower end is stated equipped with modified organic silicon adhesive phase (2).
6. a kind of organosilicon little-glue single-face Kapton mica paper tape according to claim 1, it is characterised in that: institute
The reinforcing material bed of material (5) stated is the very high Kapton of single side tensile strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820913966.8U CN208385103U (en) | 2018-06-13 | 2018-06-13 | A kind of organosilicon little-glue single-face Kapton mica paper tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820913966.8U CN208385103U (en) | 2018-06-13 | 2018-06-13 | A kind of organosilicon little-glue single-face Kapton mica paper tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208385103U true CN208385103U (en) | 2019-01-15 |
Family
ID=64967292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820913966.8U Expired - Fee Related CN208385103U (en) | 2018-06-13 | 2018-06-13 | A kind of organosilicon little-glue single-face Kapton mica paper tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208385103U (en) |
-
2018
- 2018-06-13 CN CN201820913966.8U patent/CN208385103U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 |
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| CF01 | Termination of patent right due to non-payment of annual fee |