CN106531288A - Dry mica tape and preparation method thereof - Google Patents

Dry mica tape and preparation method thereof Download PDF

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Publication number
CN106531288A
CN106531288A CN201610945613.1A CN201610945613A CN106531288A CN 106531288 A CN106531288 A CN 106531288A CN 201610945613 A CN201610945613 A CN 201610945613A CN 106531288 A CN106531288 A CN 106531288A
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Prior art keywords
mica
inorganic filler
preparation
oxidant layer
mica tape
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CN201610945613.1A
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CN106531288B (en
Inventor
李忠良
田宗芳
曾亮
李鸿岩
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Zhuzhou Times Electric Insulation Co Ltd
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Zhuzhou Times New Material Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/06—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H01B19/04—Treating the surfaces, e.g. applying coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Insulating Bodies (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses dry mica tape, which is composed of a first adhesive layer, mica paper, a second adhesive layer and a fiber cloth layer stacked sequentially from top to bottom, wherein the first adhesive layer contains an inorganic filler, and the mass of the inorganic filler occupies 0.5% to 3% of the total mass of the first adhesive layer; and the second adhesive layer contains an inorganic filler, and the mass of the inorganic filler occupies 0.5% to 3% of the total mass of the second adhesive layer. Rubber powder is adopted to carry out hot pressing composite on the mica paper and the fiber cloth, a surface processing preparation process is then carried out, multiple channels can be formed in the adhesive layer, the VPI impregnating varnish permeability is improved, the solvent use during the production process can be reduced, and the cost and the environment pollution are reduced; and the dry mica tape obtained through preparation is good in flexibility, good in lapping process, and high in permeability, epoxy anhydride-type and epoxy polyester-type VPI insulated processing processes are facilitated, and the dry mica tape and the preparation method are applicable to a main insulation material with a voltage class of 10 to 27 kV and a single edge insulation thickness of 2 to 7 mm in a large high-voltage motor, a power generator and a million-kilowatt-class generator set.

Description

A kind of low resin mica tape and preparation method thereof
Technical field
The invention belongs to insulating materials technical field, more particularly to a kind of low resin mica tape and preparation method thereof.
Background technology
With being continuously increased for generating set electric pressure and single-machine capacity, for the requirement of electrical machine insulation is improved constantly, Its insulation thickness is continuously increased, and current maximum gauge reaches 7mm, in order to the major insulation material for ensureing high thickness can be by VPI resins Quickly it is impregnated with, it is desirable to which low resin mica tape has higher gas permeability and impregnability.Substantial amounts of description of test, the performance of insulation system Be mixed with impregnating resin by mica tape after it is common embody, and adhesive is then the weight for affecting mica tape process based prediction model Want component.
At present, low resin mica tape mainly uses the adhesive that modified epoxy type resin is prepared as adhesive, modified epoxy Wellability that can be to mica tape with epoxy systems impregnating resin is impacted, and can also reduce the electric property of epoxy resin itself Superiority, the overall performance and electric property of the insulation system for affecting thickness higher.Cause that motor feels hot is big, ageing-resistant performance Difference, it is difficult to be applied to the higher insulation system of high-voltage motor thickness.Also there is low resin mica tape in technique for applying performance soft Property it is poor, wrapped when fly powder, the problems such as layering is serious, air permeability is less.
The content of the invention
The technical problem to be solved be overcome the shortcomings of background above technology in mention and defect, there is provided one Kind of highly-breathable and impregnability, suitable for the low resin mica tape and preparation method thereof of VPI techniques.
To solve above-mentioned technical problem, technical scheme proposed by the present invention is：
A kind of low resin mica tape, the low resin mica tape is by the first gluing oxidant layer, mica paper, the second gluing oxidant layer and scrim cloth group Into, and be from top to bottom sequentially overlapped, the first gluing oxidant layer contains inorganic filler, and its quality accounts for the first gluing oxidant layer gross mass 0.5%～3%.The second gluing oxidant layer contains inorganic filler, and its quality accounts for the 0.5%～3% of the second gluing oxidant layer gross mass.
Above-mentioned technical proposal is based primarily upon following principle：The first gluing oxidant layer is close to the one side of mica paper, addition Inorganic filler is avoided that glue is distributed into planar on mica paper surface, is conducive to the formation of gas-permeable channels.In second gluing oxidant layer Add nanometer inorganic filler particle, both can to macromolecular chain produce blocking effect, slow down electrostrictive polymer poplar bundles starting and Development, improves insulation layer resistivity, so as to improving, extending insulating barrier pressure-resistant time and improve insulating barrier breakdown voltage；Again can be with Reduce the accumulation of insulating barrier Space-charge, reduce space charge activity, improve insulating barrier shelf depreciation ability.
Above-mentioned low resin mica tape, it is preferred that the mica paper is made up of mica sheet, aramid fiber and inorganic filler, institute Mica sheet is stated for calcining white clouds master slice or mix white clouds master slice, wherein, the quality of aramid fiber account for mica paper quality 5%～ 10%, the quality of inorganic filler accounts for the 0.5%～2% of mica paper quality；The thickness of the mica paper is 0.05～0.1mm.
It is based primarily upon following principle：Using aramid fiber and Inorganic Fillers Filled mica paper, with aramid fiber as skeleton, both The intensity of mica paper is improve, the gas permeability of mica tape is improved again, the excellent heat-resistant aging of insulation system, hot machine is given Tool intensity and insulating properties；The one side that adds of inorganic filler increased the micro channel of mica paper, improves porosity, strengthens Capillarity, improves permeability, on the other hand, improves insulating properties.
Above-mentioned low resin mica tape, it is preferred that the scrim cloth is glass fabric, and thickness is 0.025～0.06mm.
Above-mentioned low resin mica tape, it is preferred that the inorganic filler is silica and/or boron nitride, the first adhesive The inorganic filler of layer and the second gluing oxidant layer addition is nano sized inorganic fillers, and filling inorganic filler in mica paper is micron order Inorganic filler.
Above-mentioned low resin mica tape, it is preferred that the second gluing oxidant layer mainly with compound bisphenol A type epoxy resin be Matrix, the second gluing oxidant layer gross mass account for the 3%～5% of mica tape gross mass.Used as a total inventive concept, the present invention is also carried For a kind of preparation method of above-mentioned low resin mica tape, comprise the following steps：
（1）Prepare rubber powder；
（2）Mica paper is unreeled；
（3）The one side of the mica paper by duster after unreeling uniformly spreads rubber powder；
（4）The first drying tunnel of feeding of the mica paper after rubber powder will be spread to be bakeed；
（5）Fiber cloth is unreeled and step is drawn to（4）On mica paper afterwards, fiber cloth and mica paper are passed through into one together then Carry out hot pressing to be combined to pressure roller；
（6）The semi-finished product that hot pressing is obtained after compound are surface-treated；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel to be bakeed；
（8）Product after baking is carried out winding, cut, finished product is obtained.
Technique prepared by low resin mica tape, is based primarily upon following principle：Using rubber powder hot pressing combined mica paper and fiber cloth, Then the preparation technology being surface-treated, not only so that being formed in gluing oxidant layer compared with multichannel, improves the infiltration of VPI impregnating varnishes Property, and the use of solvent in production process, reduces cost and environmental pollution can be reduced.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（1）The preparation process of middle rubber powder is：To promote Enter agent, inorganic filler uniformly to mix with epoxy resin, then rubber powder will be obtained after mixed solution Freezing smashing, its softening point is 80 DEG C～90 DEG C.In general the low epoxy bonds of softening point are poor, and the high epoxy bonds of softening point are good, softening point and bonding Property need to reach an optimal meeting point and could be adapted to prepare the mica tape of the present invention.
The preparation method of above-mentioned low resin mica tape, it is preferred that the epoxy resin is the bisphenol type epoxy tree of compounding Fat.Epoxy resin-base in the gluing oxidant layer of ground floor can be single bisphenol A type epoxy resin, and effect is that combined mica piece is prevented Only mica tape dry linting.Epoxy resin-base in the gluing oxidant layer of the second layer is compounding bisphenol A type epoxy resin, its softening point and viscous Connecing property has the advantage of controllability for single epoxy, can reach suitable softening point and cementability to realize dry method Photoresist coating process.
The accelerator is that zinc Isoocatanoate or zinc naphthenate press 1 with end hydroxy butadiene:1 quality mixes than proportioning Solution, its quality for adhesive gross mass 4%～8%.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（6）Middle surface treatment is by the another of mica paper Simultaneously by rubber roller, one layer of epoxy adhesive for containing inorganic filler and epoxy resin is coated；Epoxy is coated on mica paper surface The mode of adhesive advantageously reduces the glue content of mica tape, and the glue content of low resin mica tape of the present invention is 3%～5%；Through After two drying tunnels are bakeed, the epoxy adhesive of coating forms the first gluing oxidant layer in low resin mica tape, is close to mica paper, can be with Ensure that mica sheet is mutually combined closely, prevent mica tape from occurring dry linting in wrapped application process, flying the problem of powder and layering.
The preparation method of above-mentioned low resin mica tape, it is preferred that the epoxy resin is bisphenol A type epoxy resin or compounding Bisphenol A type epoxy resin；The solid content of coating epoxy adhesive epoxy resin is 2%～10%.
According to resin in the adhesive of the principle of similar compatibility, combined mica paper and fiber cloth and the adhesive of surface treatment Bisphenol A epoxide resin is adopted, so has fabulous with the VPI resins of the VPI resins or epoxy polyester systems of epoxy anhydride system Compatibility and impregnability, can with the impregnating resin rapid osmotic of epoxy systems complete wetting, formed after solidification one it is whole Body, lifts the globality and electric property of insulation system, is conducive to giving full play to the advantage of VPI techniques.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（5）In two pressure rollers temperature be 100 DEG C ～110 DEG C, pressure is 0.1～0.2MPa therebetween.
The preparation method of above-mentioned low resin mica tape, it is preferred that the step（4）In the first drying tunnel temperature be 120 DEG C ～130 DEG C, the baking time is 2～5min；The step（7）In the second drying tunnel temperature be 110 DEG C～125 DEG C, bakee the time For 2～5min.
Compared with prior art, it is an advantage of the current invention that：
（1）The low resin mica tape finished product of the present invention has high gas permeability and impregnability, poly- beneficial to epoxy anhydride type and epoxy Ester type VPI insulating treatment process, can significantly shorten the VPI process times of coil, improve insulation compactness and bar extension paint amount, Air gap is reduced, so as to the electric property and operational reliability of lifting motor；Suitable for Large-scale High-Pressure motor, generator and million Multikilowatt generating set, electric pressure be 10～27kV, the major insulation material of monolateral 2～7mm of insulation thickness.
（2）Dry linting, adhesive content be not few, flexibility is good, around-packing technology is good for the low resin mica tape finished product of the present invention, is suitable for In machine bag and artificial wrapped.
（3）The low resin mica tape simple production process of the present invention, can effectively reduces cost and reduction environmental pollution.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are the present invention Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can be with basis These accompanying drawings obtain other accompanying drawings.
Fig. 1 is the structural representation of mica tape.
Fig. 2 is mica tape production technological process.
Marginal data：
1st, the first gluing oxidant layer；2nd, mica paper；3rd, the second gluing oxidant layer；4th, scrim cloth；5th, mica paper unreeling structure；6th, dusting Machine；7th, the first drying tunnel；8th, fiber cloth unreeling structure；9th, pressure roller；10th, surface coating mechanism；11st, the second drying tunnel；12nd, winder Structure.
Specific embodiment
For the ease of understanding the present invention, more complete is done to invention herein below in conjunction with Figure of description and preferred embodiment Face, meticulously describe, but protection scope of the present invention is not limited to specific examples below.
Unless otherwise defined, all technical terms used hereinafter are generally understood that implication phase with those skilled in the art Together.Technical term used herein is intended merely to the purpose for describing specific embodiment, is not intended to limit the present invention's Protection domain.
Unless otherwise specified, the various raw material used in the present invention, reagent, instrument and equipment etc. can pass through city Field is commercially available or can be prepared by existing method.
Embodiment：
A kind of low resin mica tape of the present invention as shown in Figure 1, the mica tape are gluing by the first gluing oxidant layer 1, mica paper 2, second Oxidant layer 3 and scrim cloth 4 are constituted, and are from top to bottom sequentially overlapped, and the first gluing oxidant layer contains inorganic filler for nanometer two Silica, its quality account for the 2% of the first gluing oxidant layer gross mass.The second gluing oxidant layer contains inorganic filler for nano-silica SiClx, its quality account for the 2% of the second gluing oxidant layer gross mass.
Mica paper in the present embodiment is constituted by mica sheet, aramid fiber and inorganic filler is calcined, wherein, aramid fiber Quality accounts for the 6.25% of mica paper quality, and the quality of inorganic filler accounts for the 1% of mica paper quality, and mica paper thickness is 0.05mm.This In embodiment, the gross mass of the second of mica tape the gluing oxidant layer accounts for the 4.5% of mica tape gross mass, and fiber cloth is glass fabric, Its thickness is 0.032mm.
The preparation method of above-mentioned low resin mica tape, comprises the steps of, as shown in Fig. 2：
（1）Prepare rubber powder：By the mixed solution freezing after the nano silicon and accelerator dispersed epoxy resin to compounding Crush, make adhesive powder；Accelerator used is that zinc Isoocatanoate quality presses 1 with end hydroxy butadiene:1 quality compares proportioning The solution of mixing, its quality for adhesive gross mass 8%；Epoxy resin used is that E12 epoxy resin and E24 epoxy resin are pressed According to 2:The compounding epoxy resin that 1 quality mixes than proportioning；
（2）Mica paper is unreeled with certain speed by mica paper unreeling structure 5, is placed on conveyer belt；
（3）Rubber powder is uniformly spread by the one side of mica paper of the duster 6 after unreeling；
（4）The first drying tunnel 7 of feeding of the mica paper after rubber powder will be spread to be bakeed, drying tunnel temperature is 120 DEG C, and the time is 2min；
（5）Fiber cloth is unreeled with certain speed by fiber cloth unreeling structure 8 and is placed on conveyer belt, and be drawn to step （4）On mica paper afterwards, it is 100 DEG C～110 DEG C that fiber cloth and mica paper are passed through a pair of temperature together then, and pressure is The pressure roller 9 of 0.1Mpa carries out hot pressing and is combined；
（6）The semi-finished product that hot pressing is obtained after compound are surface-treated by surface coating mechanism 10, one layer of coating contains nanometer The adhesive solvent of silica and E23 epoxy resin, wherein, nano silicon quality accounts for the 2% of epoxy adhesive quality, E23 epoxy resin solid content is 2%；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel 11 to be bakeed, temperature is 110 DEG C～125 DEG C, and the time is 2min；
（8）Product after baking is wound by appropriate disk footpath or weight by rolling-up mechanism 12, and finished product is obtained after cutting.
Low resin mica tape finished product obtained in the present embodiment has highly-breathable and impregnability, suitable for VPI techniques, and the cloud Dry linting, flexibility be not good for master tape finished product, around-packing technology is good.

Claims (10)

1. a kind of low resin mica tape, the low resin mica tape is by the first gluing oxidant layer, mica paper, the second gluing oxidant layer and scrim cloth Composition, and be from top to bottom sequentially overlapped, it is characterised in that the first gluing oxidant layer contains inorganic filler, and its quality accounts for first The 0.5%～3% of gluing oxidant layer gross mass；The second gluing oxidant layer contains inorganic filler, and it is total that its quality accounts for the second gluing oxidant layer The 0.5%～3% of quality.
2. low resin mica tape according to claim 1, it is characterised in that the mica paper by mica sheet, aramid fiber and Inorganic filler is constituted, and the mica sheet is calcining white clouds master slice or mix white clouds master slice, wherein, the quality of aramid fiber accounts for mica The 5%～10% of paper quality, the quality of inorganic filler account for the 0.5%～2% of mica paper quality.
3. low resin mica tape according to claim 1 and 2, it is characterised in that the inorganic filler be silica and/or The inorganic filler of boron nitride, the first gluing oxidant layer and the second gluing oxidant layer addition is nano sized inorganic fillers, is filled in mica paper It is micro inorganic fillers with inorganic filler.
4. low resin mica tape according to claim 1 and 2, it is characterised in that the second gluing oxidant layer is mainly compounding Bisphenol A type epoxy resin based on, the second gluing oxidant layer gross mass accounts for the 3%～5% of mica tape gross mass.
5. a kind of preparation method of the low resin mica tape as described in any one of claim 1-4, it is characterised in that comprising following step Suddenly：
（1）Prepare rubber powder；
（2）Mica paper is unreeled；
（3）The one side of the mica paper by duster after unreeling uniformly spreads rubber powder；
（4）The first drying tunnel of feeding of the mica paper after rubber powder will be spread to be bakeed；
（5）Fiber cloth is unreeled and step is drawn to（4）On mica paper afterwards, fiber cloth and mica paper are passed through into one together then Carry out hot pressing to be combined to pressure roller；
（6）The semi-finished product that hot pressing is obtained after compound are surface-treated；
（7）Semi-finished product after surface treatment are sent into the second drying tunnel to be bakeed；
（8）Product after baking is carried out winding, cut, finished product is obtained.
6. preparation method according to claim 5, it is characterised in that the step（1）The preparation process of middle rubber powder is：Will Accelerator, inorganic filler are uniformly mixed with epoxy resin, then rubber powder, its softening point will be obtained after mixed solution Freezing smashing For 80 DEG C～90 DEG C.
7. preparation method according to claim 6, it is characterised in that the epoxy resin is the bisphenol type epoxy of compounding Resin.
8. the preparation method according to claim 5,6 or 7, it is characterised in that the step（6）Middle surface treatment is by cloud The another side of female paper coats one layer of epoxy adhesive for containing inorganic filler and epoxy resin by rubber roller；The epoxy resin For bisphenol A type epoxy resin or the bisphenol A type epoxy resin of compounding, the solid content of epoxy resin is 2%～10%.
9. the preparation method according to claim 5,6 or 7, it is characterised in that the step（5）In two pressure rollers temperature For 100 DEG C～110 DEG C, pressure is 0.1～0.2MPa therebetween.
10. the preparation method according to claim 5,6 or 7, it is characterised in that the step（4）In the first drying tunnel temperature Spend for 120 DEG C～130 DEG C, the baking time is 2～5min；The step（7）In the second drying tunnel temperature be 110 DEG C～125 DEG C, The baking time is 2～5min.
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CN107134329A (en) * 2017-04-26 2017-09-05 晶锋集团（天长）高分子材料有限公司 A kind of preparation method of insulation mica tape
CN108864973A (en) * 2018-06-15 2018-11-23 苏州巨峰电气绝缘系统股份有限公司 A kind of film low resin mica tape of heat-resistant fireproof
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CN111560793A (en) * 2020-05-06 2020-08-21 平江县盛盈云母工业有限公司 Little-glue mica paper reinforced by fibers
CN112677619A (en) * 2020-12-29 2021-04-20 丹阳市沃德立电工材料有限公司 Integration mica tape production facility
CN112746522A (en) * 2020-03-25 2021-05-04 株洲时代新材料科技股份有限公司 High-dielectric-property composite aramid paper
CN114496349A (en) * 2022-02-09 2022-05-13 浙江荣泰电工器材股份有限公司 Ultra-long high-temperature-resistant mica tape and preparation method thereof
CN116313229A (en) * 2023-03-20 2023-06-23 哈尔滨电机厂有限责任公司 High-heat-conductivity multi-glue epoxy glass fiber powder mica tape and manufacturing method thereof

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CN107134329A (en) * 2017-04-26 2017-09-05 晶锋集团（天长）高分子材料有限公司 A kind of preparation method of insulation mica tape
CN108864973A (en) * 2018-06-15 2018-11-23 苏州巨峰电气绝缘系统股份有限公司 A kind of film low resin mica tape of heat-resistant fireproof
CN108864973B (en) * 2018-06-15 2023-06-23 苏州巨峰电气绝缘系统股份有限公司 High-temperature-resistant flame-retardant thin film less-adhesive mica tape
CN112746522A (en) * 2020-03-25 2021-05-04 株洲时代新材料科技股份有限公司 High-dielectric-property composite aramid paper
CN111560793A (en) * 2020-05-06 2020-08-21 平江县盛盈云母工业有限公司 Little-glue mica paper reinforced by fibers
CN111284035A (en) * 2020-05-07 2020-06-16 苏州银禧新能源复合材料有限公司 Forming process method of thermal runaway prevention composite material battery box upper cover and product
CN111284035B (en) * 2020-05-07 2020-07-28 苏州银禧新能源复合材料有限公司 Forming process method of thermal runaway prevention composite material battery box upper cover and product
CN112677619A (en) * 2020-12-29 2021-04-20 丹阳市沃德立电工材料有限公司 Integration mica tape production facility
CN114496349A (en) * 2022-02-09 2022-05-13 浙江荣泰电工器材股份有限公司 Ultra-long high-temperature-resistant mica tape and preparation method thereof
CN114496349B (en) * 2022-02-09 2023-09-26 浙江荣泰电工器材股份有限公司 Ultra-long high-temperature-resistant mica tape and preparation method thereof
CN116313229A (en) * 2023-03-20 2023-06-23 哈尔滨电机厂有限责任公司 High-heat-conductivity multi-glue epoxy glass fiber powder mica tape and manufacturing method thereof

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