CN109454970B - Manufacturing method of high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape - Google Patents
Manufacturing method of high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape Download PDFInfo
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- CN109454970B CN109454970B CN201811323368.6A CN201811323368A CN109454970B CN 109454970 B CN109454970 B CN 109454970B CN 201811323368 A CN201811323368 A CN 201811323368A CN 109454970 B CN109454970 B CN 109454970B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
- B32B2315/085—Glass fiber cloth or fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
Abstract
The invention relates to a method for manufacturing a high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape. The high-heat-conductivity multi-glue epoxy glass fiber powder mica tape is formed by compounding one or two layers of high-heat-conductivity glass fiber cloth reinforcing materials (1), one layer of bonding material layer (2) and one layer of mica paper layer (3), and comprises the following steps: 1) compounding a high-thermal-conductivity bonding material by using a high-thermal-conductivity filler and an adhesive, then compounding the high-thermal-conductivity bonding material with glass fiber cloth, and heating and drying the high-thermal-conductivity bonding material to prepare high-thermal-conductivity glass fiber cloth (1) as shown in figure 1 and figure 2; 2) high heat-conducting glass fiber cloth is dipped in glue (2), and mica paper (3) is compounded with the high heat-conducting glass fiber cloth. As shown in fig. 3 and 4, if the single-layer high thermal conductivity glass cloth (1) is dipped in the glue (2) and then compounded with the mica paper (3), an isolation layer (4) needs to be coated on the surface of the other mica paper; 3) baking; 4) cooling to form a coil, and cutting to prepare the mica tape. The insulating and heat-conducting performance of a wire rod manufactured by the high-heat-conducting mica tape is not less than 0.35W/(m.k).
Description
Technical Field
The invention relates to a method for manufacturing a high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape.
Background
The large and medium-sized generator is a power source for national economic development, the heat resistance level of the insulating material is continuously improved along with the continuous increase of the capacity of the generator, the insulation of the A level (90 ℃) is developed from the 50-60 years to the insulation of the B level (130 ℃) in the 70-80 years, the insulation of the F level (155 ℃) is developed at the end of the 80 years, the structural change of the insulating material is realized when the heat resistance level is improved every time, but the heat conductivity of the insulating material is not improved all the time. After the heat-conducting property of the main insulation of the stator winding is improved, the capacity of a unit can be further improved on the basis of keeping the volume, the rated voltage and the temperature rise of the motor unchanged, and the economic and technical indexes of the whole machine are improved, so that the main insulation material of the generator has new development requirements, and the heat-conducting property of the main insulation material of the stator winding is urgently required to be improved. In addition, the running time of the generator sets of many power plants at home and abroad will or has reached the service life, the volume, the rated voltage and the main insulation thickness of the stator are kept unchanged when the generator sets are updated and modified, the capacity of the generator sets can be improved by High Thermal Conductivity (HTC) insulation, the modification cost of the generator sets is reduced, the economic benefit of the generator sets is improved, and therefore the HTC insulation has wide market prospect in the aspect of capacity increase modification of the old generator sets.
The research progress of foreign high-thermal-conductivity VPI insulating materials is remarkable, and the VPI insulating materials are already applied to a prototype of a large-scale air-cooled or hydrogen-cooled generator. As the domestic is mainly made of the multi-rubber molded insulator, the domestic research on the high-heat-conductivity multi-rubber main insulating material is started at the end of the 20 th century, and although the research history is short, colleges, enterprises and scientific research units related to the direction are more. The insulation structure of the main insulation of the domestic motor stator bar is formed by compounding epoxy tung maleic anhydride adhesive, mica paper and glass fiber cloth, wherein the thermal conductivity coefficients of the adhesive, the mica and the glass fiber cloth are respectively 0.17W/(m.k) -0.22W/(m.k), 0.3W/(m.k) -0.6W/(m.k), 0.8W/(m.k) -1.2W/(m.k), and the thermal conductivity coefficient of the adhesive is the lowest, so most researchers mainly concentrate on improving the thermal conductivity of the insulation adhesive. In 1997, the research of Guilin institute of Electrical and electronic sciences, application units, insulation material factories and cooperation units started to jointly conduct research, and the key point of the research is to firstly manufacture a high-thermal-conductivity adhesive, and then compound mica paper and glass fiber cloth together by using the high-thermal-conductivity adhesive to manufacture a high-thermal-conductivity multi-glue powder mica tape. In the production process of the three-in-one common rich-rubber mica tape to the four-in-one high-heat-conductivity rich-rubber mica tape, the addition of the high-heat-conductivity filler brings a series of problems to the development and production of the mica tape and the insulating hot-pressing curing molding process, wherein the fundamental problem (the content of mica in the mica tape is reduced)
The method can not be solved all the time, and can not be applied after more than 20 years of development.
In view of that some enterprises in the south of China have developed a low-glue VPI (vacuum pressure impregnation) high-thermal-conductivity insulating material, but the low-glue VPI is not suitable for a multi-glue molding insulation system in China, the development of the high-thermal-conductivity multi-glue insulating material has been slow.
Disclosure of Invention
The invention aims to improve the heat conduction performance of a motor stator bar while ensuring the stable main insulation electrical performance of the motor stator bar, and provides a manufacturing method of a high-heat-conduction multi-glue epoxy glass fiber powder mica tape. The technical scheme of the invention is as follows:
1. the high-thermal-conductivity multi-glue epoxy glass fiber mica tape is formed by compounding a high-thermal-conductivity glass fiber cloth layer (1), a bonding material layer (2) and a mica paper layer (3);
1) the glass fiber cloth in the high heat-conducting glass fiber cloth layer (1) is electrical alkali-free glass fiber cloth, and the thickness of the glass fiber cloth is 0.025 mu m-0.05 mu m;
2) the mica paper layer (3) is made of calcined high-voltage muscovite paper, and the mica weight is 100g/m 2-200 g/m 2;
3) carrying out surface activation treatment on the high-thermal-conductivity filler: the mass percentages of the high heat conduction filler, the surfactant and the solvent are 100%: 0.5% -1.0%: 100 percent of surfactant and solvent are prepared into solution, then high thermal conductivity filler is added, the mixture is stirred for 10 to 30min, and the mixed solution is dried at 120 ℃ to obtain the surface activated high thermal conductivity filler;
4) after surface activation treatment, the high-thermal-conductivity filler is compounded with an adhesive to prepare a high-thermal-conductivity bonding material, and then the high-thermal-conductivity glass fiber cloth is compounded with the high-thermal-conductivity bonding material to prepare the high-thermal-conductivity glass fiber cloth; then coating adhesive material on the high-heat-conductivity glass fiber cloth, and compounding the adhesive material with mica paper to form the high-heat-conductivity multi-glue epoxy glass fiber powder mica tape.
2. The high heat conduction filler in the high heat conduction bonding material is composed of the following materials: BN, AlN, Si3N4、Al2O3、MgO、ZnO、SrTiO3、TiO2、SiO2、C、BeO。
3. The high-heat-conductivity filler in the high-heat-conductivity bonding material is composed of any two materials: BN, AlN, Si3N4、Al2O3、MgO、ZnO、SrTiO3、TiO2、SiO2、C、BeO。
4. The grain diameter of the high heat conduction filler in the high heat conduction bonding material is 0.1-10 mu m, and the grains consist of grains with single grain diameter.
5. The grain diameter of the high heat conduction filler in the high heat conduction bonding material is 0.1-10 μm, and the grains can be composed of grains with various grain diameters.
6. The high-thermal-conductivity filler surface active agent is one of the following materials: silane coupling agent and titanate coupling agent.
7. The surface-activated high-thermal-conductivity filler and the bonding material are 30-200% by mass: 100 percent of the raw materials are mixed and stirred for 30min to 60min to obtain the high heat conduction adhesive material.
8. The adhesive in the high-thermal-conductivity bonding material is composed of the following high polymer materials: epoxy resin, phenolic resin, unsaturated polyester resin, polyurethane, polyimide.
9. The adhesive in the high-thermal-conductivity bonding material is composed of the following rubber materials: ethylene propylene rubber, silicon rubber and styrene butadiene rubber.
10. The thickness of the high-thermal-conductivity glass fiber cloth manufactured by compounding the high-thermal-conductivity bonding material and the glass fiber cloth is 0.025-0.05 mu m, wherein the bonding material (2) between the high-thermal-conductivity bonding material and the glass fiber is one of the following materials: epoxy tung oil anhydride resin, epoxy tung maleic anhydride resin and epoxy phenolic resin.
11. When the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape comprises two layers of the alkali-free glass fiber cloth, the mica paper layer is positioned between the two layers of the alkali-free glass fiber cloth.
12. When the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape contains a layer of the alkali-free glass fiber cloth, the high-thermal-conductivity glass fiber cloth is bonded to one side of the mica paper, and an isolation layer (4) needs to be coated on the surface of the other side of the mica paper.
13. When the high-thermal-conductivity glass fiber cloth single-side reinforced mica paper is used, the isolating layer (4) comprises the following raw material components in percentage by mass: 100 parts of hydrogen-containing silicone resin, 0.5-0.9 part of P22 platinum complex catalyst and 235-1920 parts of solvent; the hydrogen content of the hydrogen-containing silicone resin is 0.03-1.6 percent by mass; dissolving hydrogen-containing silicone resin in a solvent, uniformly mixing, adding a P22 platinum complex catalyst, and uniformly stirring to obtain the separant.
14. The main insulation thermal conductivity of the stator bar made of the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape is not less than 0.35W/(m.k).
Technical effects
The invention seriously summarizes the problems existing in the research of the high-heat-conductivity insulating material at home and finds a solution. According to the previous research direction, the adhesive is added with the high-thermal-conductivity filler and then is bonded with the mica paper and the glass fiber cloth, the amount of the adhesive in the mica tape is obviously less, the adhesive is suitable for developing the low-adhesive high-thermal-conductivity insulation, and the method is adopted to manufacture the high-thermal-conductivity VPI mica tape abroad. The domestic research also has fundamental problems that the mica tape is thickened after the high-heat-conduction additive is added, and the thickness of the mica paper is not changed, so that the insulation breakdown strength and the electric aging resistance are reduced due to the reduction of the mica content (the mica is a material playing a main electric property in an insulation material); other problems (such as poor binding manufacturability) in the past belong to manufacturability problems, and the technical progress can be solved by researching the technology. Therefore, the invention changes the research direction of domestic high-heat-conductivity insulating materials, the heat-conducting filler is firstly compounded with the glass fiber cloth, so that the thickness of the compound glass fiber cloth is almost unchanged, then the glass fiber cloth and the mica paper are compounded into the mica tape, so that the thickness of the mica tape is almost unchanged, the content of mica in the high-heat-conductivity mica tape is ensured to be unchanged, and the heat-conducting filler is mutually connected on the glass fiber cloth to form a heat-conducting channel, so that the heat-conducting property of the mica tape can be improved. The production process of the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape is not substantially different from the production process of the common epoxy multi-glue powder mica tape, for example: preparing an adhesive, gluing high-thermal-conductivity glass fiber cloth, compounding mica paper, drying, rolling and slitting.
The high-thermal-conductivity insulating material developed by the invention enables the power generation manufacturing industry of China to go ahead of the world, improves the innovation capability of the power generation manufacturing industry and the insulating material manufacturing industry of China, lays a foundation for mastering the key core technology of high-thermal-conductivity insulating manufacturing of China, and strives to gradually catch up with the work in the aspect and exceed the foreign pace. Compared with the prior art, the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape manufactured by the invention has good binding process performance, such as softness, conformability and no delamination of the mica tape. The stator bar prepared by the high-heat-conductivity multi-glue epoxy glass fiber powder mica tape has various technical indexes reaching the advanced foreign level:
(1) the insulating and heat conducting performance of the wire rod is not less than 0.35W/(m.k); (2) dielectric loss value tan0.2U of wire rodN(UNRated voltage of the coil bar is less than 1.0 percent, and tan0.6UN-tan0.2UNLess than 0.5 percent; (3) thermal state dielectric loss (0.6U)N155 ℃) is less than 5.0 percent; (4) breakdown voltage of stator coil is more than 5.5UN(ii) a (5) Stator coil 2UNElectric old manThe chemical life is more than 1000h and 3UNThe electrical aging life is more than 10 h.
The invention can be popularized to the main insulation structure of the thermal power, hydroelectric power or nuclear power stator bar with higher voltage-withstanding level of 24kV or above, has wide application prospect, and lays a reliable technical foundation for manufacturing VPI stator coils of million units of water power, million thermal power and million nuclear power.
Drawings
FIG. 1: schematic structural diagram of glass fiber cloth
FIG. 2: schematic structural diagram of high-thermal-conductivity glass fiber cloth
FIG. 3: high-heat-conductivity multi-glue epoxy glass fiber powder mica tape structure schematic diagram of two layers of high-heat-conductivity glass fiber cloth
FIG. 4: high-heat-conductivity multi-glue epoxy glass fiber powder mica tape structure schematic diagram of one layer of high-heat-conductivity glass fiber cloth
Detailed Description
The high-thermal-conductivity multi-glue epoxy glass fiber mica tape prepared by the embodiment is formed by compounding a high-thermal-conductivity glass fiber cloth layer 1, a bonding material layer 2 and a mica paper layer 3, as shown in fig. 3 and 4: the glass fiber cloth in the high heat-conducting glass fiber cloth layer 1 is electrical alkali-free glass fiber cloth, and the thickness of the glass fiber cloth is 0.025-0.05 μm; the mica paper layer 3 is made of calcined high-voltage muscovite paper with a mica weight of 100g/m2～200g/m2To (c) to (d); carrying out surface activation treatment on the high-thermal-conductivity filler: the mass percentages of the high heat conduction filler, the surfactant and the solvent are 100%: 0.5% -1.0%: 100 percent of surfactant and solvent are prepared into solution, then high thermal conductivity filler is added, the mixture is stirred for 10 to 30min, and the mixed solution is dried at 120 ℃ to obtain the surface activated high thermal conductivity filler; after surface activation treatment, the high-thermal-conductivity filler is compounded with an adhesive to prepare a high-thermal-conductivity bonding material, and then the high-thermal-conductivity glass fiber cloth is compounded with the high-thermal-conductivity bonding material to prepare the high-thermal-conductivity glass fiber cloth; then coating adhesive material on the high-heat-conductivity glass fiber cloth, and compounding the adhesive material with mica paper to form the high-heat-conductivity multi-glue epoxy glass fiber powder mica tape.
The high heat conduction filler in the high heat conduction bonding material is composed of the following materials: BN, AlN, Si3N4、Al2O3、MgO、ZnO、SrTiO3、TiO2、SiO2、C、BeO。
The high-heat-conductivity filler in the high-heat-conductivity bonding material is composed of any two materials: BN, AlN, Si3N4、Al2O3、MgO、ZnO、SrTiO3、TiO2、SiO2、C、BeO。
The grain diameter of the high heat conduction filler in the high heat conduction bonding material is 0.1-10 mu m, and the grains consist of grains with single grain diameter.
The grain diameter of the high heat conduction filler in the high heat conduction bonding material is 0.1-10 μm, and the grains can be composed of grains with various grain diameters.
The high-thermal-conductivity filler surface active agent is one of the following materials: silane coupling agent and titanate coupling agent.
The surface-activated high-thermal-conductivity filler and the bonding material are 30-200% by mass: 100 percent of the raw materials are mixed and stirred for 30min to 60min to obtain the high heat conduction adhesive material.
The adhesive in the high-thermal-conductivity bonding material is composed of the following high polymer materials: epoxy resin, phenolic resin, unsaturated polyester resin, polyurethane, polyimide.
The adhesive in the high-thermal-conductivity bonding material is composed of the following rubber materials: ethylene propylene rubber, silicon rubber and styrene butadiene rubber.
The high-thermal-conductivity bonding material and the glass fiber cloth are shown in figure 1, the high-thermal-conductivity glass fiber cloth manufactured after compounding is shown in figure 2, the thickness of the high-thermal-conductivity glass fiber cloth is 0.025-0.05 μm, and the bonding material 2 between the high-thermal-conductivity bonding material and the glass fiber is one of the following materials: epoxy tung oil anhydride resin, epoxy tung maleic anhydride resin and epoxy phenolic resin.
When the high-thermal-conductivity multi-glue epoxy glass fiber mica tape contains two layers of the alkali-free glass fiber cloth, the mica paper layer is positioned between the two layers of the alkali-free glass fiber cloth, as shown in fig. 3.
When the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape contains a layer of the alkali-free glass fiber cloth, as shown in fig. 4, the high-thermal-conductivity glass fiber cloth is bonded to one side of the mica paper, and the surface of the other side of the mica paper needs to be coated with the isolation layer 4.
When the high-thermal-conductivity glass fiber cloth single-side reinforced mica paper is used, the isolating layer 4 comprises the following raw material components in percentage by mass: 100 parts of hydrogen-containing silicone resin, 0.5-0.9 part of P22 platinum complex catalyst and 235-1920 parts of solvent; the hydrogen content of the hydrogen-containing silicone resin is 0.03-1.6 percent by mass; dissolving hydrogen-containing silicone resin in a solvent, uniformly mixing, adding a P22 platinum complex catalyst, and uniformly stirring to obtain the separant.
The main insulation thermal conductivity of the stator bar made of the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape is not less than 0.35W/(m.k).
The high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape prepared by the implementation method is soft, conformable and non-layered in a wrapping process test. Standard aluminum winding displacement bar (rated voltage U of bar) with unilateral insulation thickness of 3.5mm is manufactured by adopting hot-pressing processN15kV), its main insulation thermal conductivity is not less than 0.35W/(m · k), normal state dielectric loss value is 0.2UNThe lower tan is less than 1 percent, and the breakdown voltage of a winding bar reaches 5.5UN. Standard aluminum bus bar resistance to electrical aging test, 3.0UNThe service life under voltage is more than 10h and 2.0UNThe service life under voltage is more than 1000 h.
Claims (4)
1. A high heat conduction many glues epoxy glass silk powder mica tape, characterized by: the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape is formed by compounding a high-thermal-conductivity glass fiber cloth layer (1), a bonding material layer (2) and a mica paper layer (3); wherein the content of the first and second substances,
the glass fiber cloth in the high-heat-conductivity glass fiber cloth layer (1) is electrical alkali-free glass fiber cloth;
the mica paper layer (3) is made of calcined high-voltage muscovite paper, and the mica weight is 100g/m2～200g/m2To (c) to (d);
the bonding material of the bonding material layer (2) is any one of epoxy tung oil anhydride resin, epoxy tung maleic anhydride resin and epoxy phenolic resin;
the manufacturing method of the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape comprises the following steps:
(1) carrying out surface activation treatment on the high-thermal-conductivity filler: preparing a surface active agent and a solvent into a solution, then adding a high thermal conductivity filler, stirring for 10-30 min, and drying the mixed solution at 120 ℃ to obtain the surface activated high thermal conductivity filler; wherein the high heat-conducting filler is composed of BN, AlN and Si3N4、Al2O3、MgO、ZnO、SrTiO3、TiO2、SiO2One or two of C and BeO;
(2) the high-thermal-conductivity filler is compounded with an adhesive to prepare a high-thermal-conductivity bonding material after surface activation treatment, and then the high-thermal-conductivity bonding material is compounded with electrical alkali-free glass fiber cloth to prepare high-thermal-conductivity glass fiber cloth, wherein the high-thermal-conductivity filler is mutually connected on the electrical alkali-free glass fiber cloth to form a thermal-conductive channel, and the thickness of the high-thermal-conductivity glass fiber cloth is basically unchanged compared with the electrical alkali-free glass fiber cloth; then coating adhesive material on the high-thermal-conductivity glass cloth, and compounding the adhesive material with mica paper to form the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape, wherein the thickness of the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape is basically unchanged compared with the sum of the thicknesses of the electric alkali-free glass cloth and the mica paper.
2. The high thermal conductivity multi-glue epoxy glass fiber powder mica tape according to claim 1, which is characterized in that: the particle size of the high heat conduction filler is 0.1-10 mu m, and the particles consist of particles with single particle size or multiple particle sizes.
3. The high thermal conductivity multi-glue epoxy glass fiber powder mica tape according to claim 1, which is characterized in that: the high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape comprises two high-thermal-conductivity glass fiber cloth layers, and the mica paper layer is located between the two high-thermal-conductivity glass fiber cloth layers.
4. The high thermal conductivity multi-glue epoxy glass fiber powder mica tape according to claim 1, which is characterized in that: the heat conductivity of the main insulation of the stator bar made of the high-heat-conductivity multi-glue epoxy glass fiber powder mica tape is not less than 0.35W/(m.k).
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| CN113066603A (en) * | 2021-03-26 | 2021-07-02 | 哈尔滨大电机研究所 | High-temperature-resistant high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape and manufacturing method thereof |
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| US4704322A (en) * | 1986-09-22 | 1987-11-03 | Essex Group, Inc. | Resin rich mica tape |
| CN102153975B (en) * | 2011-02-01 | 2013-03-27 | 升信新材（北京）科技有限公司 | Adhesive, preparation method thereof, mica tape containing same and laminated board containing same |
| CN102398395B (en) * | 2011-07-18 | 2014-07-16 | 四川东材科技集团股份有限公司 | One-side glass cloth reinforced rich gelatine powder mica tape, manufacturing method thereof and purpose thereof |
| CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
| CN103198908B (en) * | 2013-04-01 | 2015-08-05 | 株洲时代电气绝缘有限责任公司 | A kind of preparation method of high heat conduction epoxy low resin mica tape |
| CN103400665B (en) * | 2013-08-05 | 2016-09-28 | 桂林理工大学 | A kind of nanometer strengthens the many adhesive-contented mica tapes of high heat conduction and application thereof |
| CN105632660B (en) * | 2014-10-30 | 2017-08-11 | 株洲时代新材料科技股份有限公司 | High heat conduction low resin mica tape and preparation method thereof |
| CN105761855B (en) * | 2016-01-29 | 2017-12-08 | 重庆市木越机械制造有限公司 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
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