CN105761855B - A kind of ultra-thin mica tape of high heat conduction and preparation method thereof - Google Patents
A kind of ultra-thin mica tape of high heat conduction and preparation method thereof Download PDFInfo
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- CN105761855B CN105761855B CN201610060634.5A CN201610060634A CN105761855B CN 105761855 B CN105761855 B CN 105761855B CN 201610060634 A CN201610060634 A CN 201610060634A CN 105761855 B CN105761855 B CN 105761855B
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- mica tape
- woven fabrics
- aramid fiber
- aluminium oxide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/66—Joining insulating bodies together, e.g. by bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/02—Drying; Impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulating Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of production method with the ultra-thin mica tape of high heat conduction, comprise the following steps：1), the modification of nano aluminium oxide；2) poly- aramid fiber non-woven fabrics dipping；3) it is compound；4), bakee；5), cooling cutting.The present invention has carried out surface modification to nanometer inorganic filler, overcome the various processing problems that Nano filling is brought, obtained poly- aramid fiber non-woven fabrics single-side reinforced low resin mica tape, Wrapping technical is good, resin is easier to be impregnated with during vacuum pressure impregnation, it is more conducive to realize that motor air-gap-free insulate, ensures the thermal-electrical aging life-span of motor, while reduce motor cost.
Description
Technical field
The invention belongs to the ultra-thin mica of the few glue of single-side reinforced of low resin mica tape manufacturing technology field, more particularly to high heat conduction
Band and preparation method thereof.
Background technology
Mica tape is the most key insulating materials that motor is particularly large-scale, irreplaceable in high-voltage motor, but mica
Mechanical strength it is too low, it is impossible to meet the requirement during motor manufacturing and in motor actual motion to mechanical strength, it is necessary to make
Strengthened with supporting material.At present, it is used in national standard, professional standard, the company standard of each mica tape manufacturing enterprise
Supporting material be all electrician with alkali-free glass fiber cloth, insulating paper, plastic sheeting.
From the VPI technologies birth fifties in last century, major Motor Corporation of the world and insulating materials manufacturing company are just
Never the research to low resin mica tape is stopped.The company with low resin mica tape production capacity is more in the world at present, compares
Name includes Switzerland Von-Roll-ISOLA, Switzerland Micafil, Belgian COGEBI, German Krempel, Brazilian DMI etc., day
Sheet, South Korea etc. are also owned by numerous companies for possessing low resin mica tape production capacity.
Low resin mica tape has multiple species, and wherein high heat conduction low resin mica tape just grows up recently, such few adhesive tape
In addition to using epoxy resin or polyester resin as adhesive, three oxidations two of high-termal conductivity are also added in adhesive
The inorganic particles such as aluminium, boron nitride, the insulating barrier thermal conductivity to be formed is improved, the temperature rise of motor can be reduced, reduce motor volume,
But limited to complete machine temperature rise and thermolysis because cost is higher, application of the high heat conduction low resin mica tape on motor at present is also
It is not quite varied.
External Vonroll companies just have developed high heat conduction low resin mica tape in the nineties in last century, applied to ABB and east
The generator of sesame, the temperature rise of stator coil can be significantly reduced.Nevertheless, it is not widely used yet at present, mainly
The thermal conductivity of existing high heat conduction low resin mica tape is not still very high, only from original 0.3W/ (mK) liftings to 0.5W/ (m
K)；Second, although the temperature rise of stator coil can be reduced, the heat-sinking capability contribution to complete machine is limited；Third, the limit of Costco Wholesale
System.The country did some researchs to high heat conduction resin-rich mica tape, but also failed to obtain batch application, and high heat conduction low resin mica tape
It is even more then that few people set foot in.But as a developing direction in future, some basic research works still can be done in this respect
Make, such as during mica paper is manufactured paper with pulp add heat conducting fiber or particle, using high-heat-conductivity glue stick, even exploitation high heat conduction reinforcement
Material and the matched use of impregnating resin with high-termal conductivity, to improve the thermal conductivity of whole major insulation system comprehensively, this
Wherein there is the underlying issue for much needing to solve.
The content of the invention
Due to needing higher heat conduction requirement in high-power generator, therefore begin one's study high heat conduction already both at home and abroad
Filler is added in ordinary mica tape, most commonly adds nano aluminium oxide, but because its alkalescence is larger so that gel
Time shortens, and influences the Storage period of mica tape；In addition the process of mica tape can also be caused by adding solid packing in mica tape
It is middle the problems such as sedimentation, layering occur.For these problems present in prior art, the present invention has carried out spy to nano aluminium oxide
Different surface is modified, and is improved in processing technology so that mica tape had both met good heat conductivility, will not reduce
Service life, there is preferable processing characteristics again.
The technical scheme is that be accomplished by the following way：
A kind of production method of the ultra-thin low resin mica tape of high heat conduction, comprises the following steps：1), the modification of nano aluminium oxide；
2) poly- aramid fiber non-woven fabrics dipping；3) it is compound；4), bakee；5), cooling cutting；It is characterized in that：
1) modification of nano aluminium oxide：Organic acid and cationic surfactant, butyl titanate is according to 1：1-2：0.1-
0.5 mass ratio mixing, is immersed in 1-10h in mixed liquor by nano aluminium oxide, is dried after being washed with deionized, you can obtain
Modified nano-alumina；
2), poly- aramid fiber non-woven fabrics dipping；By the thick poly- aramid fiber non-woven fabrics uncoilings of 0.025~0.060mm, cross and fill
There is the glue groove of dipping adhesive, described dipping adhesive includes main glue, organic solvent, modifying agent, modified nano-alumina, institute
It is epoxy type adhesive or polyester epoxy type adhesive to state main glue, and organic solvent is dimethyl carbonate or polyethylene glycol, modifying agent
It is barium mahogany sulfonate or has sodium sulfonate；Wherein main glue, organic solvent, modifying agent, the mass ratio of modified nano-alumina is 1：
0.05-0.2：0.01-0.05：0.01-0.1, preferably 1：0.1-0.2：0.02-0.04：0.03-0.05；
3) it is compound：By mica paper uncoiling and it is compounded on the poly- aramid fiber non-woven fabrics for having applied adhesive, with roller by two
Person presses together to form mica tape germ band；
4), bakee：By above-mentioned mica tape germ band by oven-baked, the temperature of baking oven by room temperature be gradually increased to 40 DEG C~
80 DEG C, bakee 3~8min；
5), cooling cutting：Go out after bakeing and 2~3min is cooled down in air at room temperature, by manufactured mica tape embryo material after cooling
Wound；By mica tape embryo material device on cutting machine, carry out cutting by the width of customer requirement and become band and wind, produce
To product
Organic acid described in step 1) is acetic acid or ethanedioic acid；The cationic surfactant is imidazolines or triazine
Class surfactant；Organic acid and cationic surfactant, the mass ratio of butyl titanate are preferably 1：1：0.3 mass ratio
Mixing.
Main glue described in step 2) is epoxy type adhesive or polyester epoxy type adhesive, organic solvent are dimethyl carbonate
Or polyethylene glycol, modifying agent are barium mahogany sulfonate or have sodium sulfonate；
Obtained poly- aramid fiber non-woven fabrics single-side reinforced low resin mica tape, Wrapping technical is good, during vacuum pressure impregnation
Resin is easier to be impregnated with, and is more conducive to realize that motor air-gap-free insulate, ensures the thermal-electrical aging life-span of motor, while reduce motor
Cost.
Product properties of the present invention all reach and exceed the relevant requirement of " GB/T5019-2009 ", and are higher than
Electrician is with the performance of alkali-free glass fiber cloth reinforcement one side low resin mica tape.
Embodiment
The technical scheme of invention is described in detail with reference to specific embodiment.
Embodiment 1
The ultra-thin low resin mica tape of high heat conduction, is produced according to following steps：1), the modification of nano aluminium oxide；2) poly- aramid fiber is fine
Tie up non-woven fabrics dipping；3) it is compound；4), bakee；5), cooling cutting；
1) modification of nano aluminium oxide：Acetic acid and imidazoline type cationic surfactant, butyl titanate is according to 1：2：
0.5 mass ratio mixing, is immersed in 10h in mixed liquor by nano aluminium oxide, is dried after being washed with deionized, you can changed
Property nano aluminium oxide；
2), poly- aramid fiber non-woven fabrics dipping；The thick poly- aramid fiber non-woven fabrics uncoilings of 0.025mm are crossed equipped with dipping
The glue groove of adhesive, described dipping adhesive include main glue, organic solvent, modifying agent, modified nano-alumina, the main glue
For epoxy type adhesive, organic solvent is dimethyl carbonate, and modifying agent is barium mahogany sulfonate；Wherein main glue, organic solvent are modified
Agent, the mass ratio 1 of modified nano-alumina：0.1：0.05：0.04；
3) it is compound：By mica paper uncoiling and it is compounded on the poly- aramid fiber non-woven fabrics for having applied adhesive, with roller by two
Person presses together to form mica tape germ band；
4), bakee：By above-mentioned mica tape germ band by oven-baked, the temperature of baking oven by room temperature be gradually increased to 40 DEG C~
80 DEG C, bakee 3~8min；
5), cooling cutting：Go out after bakeing and 2~3min is cooled down in air at room temperature, by manufactured mica tape embryo material after cooling
Wound；By mica tape embryo material device on cutting machine, carry out cutting by the width of customer requirement and become band and wind, produce
Product.
Embodiment 2
The ultra-thin low resin mica tape of high heat conduction, is produced according to following steps：1), the modification of nano aluminium oxide；2) poly- aramid fiber is fine
Tie up non-woven fabrics dipping；3) it is compound；4), bakee；5), cooling cutting；
1) modification of nano aluminium oxide：Ethanedioic acid and triazines cationic surfactant, butyl titanate is according to 1：2：
0.1 mass ratio mixing, is immersed in 10h in mixed liquor by nano aluminium oxide, is dried after being washed with deionized, you can changed
Property nano aluminium oxide；
2), poly- aramid fiber non-woven fabrics dipping；The thick poly- aramid fiber non-woven fabrics uncoilings of 0.050mm are crossed equipped with dipping
The glue groove of adhesive, described dipping adhesive include main glue, organic solvent, modifying agent, modified nano-alumina, the main glue
For polyester epoxy type adhesive, organic solvent is polyethylene glycol, and modifying agent is barium mahogany sulfonate；Wherein main glue, organic solvent, changes
Property agent, the mass ratio 1 of modified nano-alumina：0.2：0.04：0.05；
3) it is compound：By mica paper uncoiling and it is compounded on the poly- aramid fiber non-woven fabrics for having applied adhesive, with roller by two
Person presses together to form mica tape germ band；
4), bakee：By above-mentioned mica tape germ band by oven-baked, the temperature of baking oven by room temperature be gradually increased to 40 DEG C~
80 DEG C, bakee 3~8min；
5), cooling cutting：Go out after bakeing and 2~3min is cooled down in air at room temperature, by manufactured mica tape embryo material after cooling
Wound；By mica tape embryo material device on cutting machine, carry out cutting by the width of customer requirement and become band and wind, produce
Product.
The present invention can be summarized with others without prejudice to the concrete form of the spirit or essential characteristics of the present invention.The present invention's
All embodiments can only all be considered the description of the invention rather than limitation, and every technique according to the invention content is made
Any trickle amendment or equivalent substitution gone out, is belonged within technical scheme.
Claims (3)
1. a kind of production method of the ultra-thin mica tape of high heat conduction, it is characterised in that comprise the following steps：1) nano aluminium oxide changes
Property；2) poly- aramid fiber non-woven fabrics dipping；3) it is compound；4) bakee；5) cooling cutting；
1) modification of nano aluminium oxide：Organic acid and cationic surfactant, butyl titanate is according to 1：1-2：0.1-0.5's
Mass ratio is mixed, and nano aluminium oxide is immersed in into 1-10h in mixed liquor, is dried after being washed with deionized, you can be modified
Nano aluminium oxide；
2) poly- aramid fiber non-woven fabrics dipping：The thick poly- aramid fiber non-woven fabrics uncoilings of 0.025~0.060mm are crossed equipped with leaching
The glue groove of stain adhesive, described dipping adhesive include main glue, organic solvent, modifying agent, modified nano-alumina, wherein main
Glue, organic solvent, modifying agent, the mass ratio of modified nano-alumina is 1：0.05-0.2：0.01-0.05：0.01-0.1；
3) it is compound：By mica paper uncoiling and it is compounded on the poly- aramid fiber non-woven fabrics for having applied adhesive, is pressed the two with roller
It is combined to form mica tape germ band；
4) bakee：Above-mentioned mica tape germ band is gradually increased to 40 DEG C~80 DEG C by oven-baked, the temperature of baking oven by room temperature,
Bakee 3~8min；
5) cooling cutting：Go out after bakeing and 2~3min is cooled down in air at room temperature, received manufactured mica tape embryo material after cooling
Volume；By mica tape embryo material device on cutting machine, carry out cutting by the width of customer requirement and become band and wind, that is, produced
Product；
Wherein, organic acid described in step 1) is acetic acid or ethanedioic acid；The cationic surfactant is imidazolines or three
Piperazine class surfactant；Main glue described in step 2) is epoxy type adhesive or polyester epoxy type adhesive, organic solvent are carbon
Dimethyl phthalate or polyethylene glycol, modifying agent are barium mahogany sulfonates.
2. the method as described in claim 1, it is characterised in that the organic acid and cationic surfactant, butyl titanate
Mass ratio be 1：1：0.3.
3. the method as described in claim 1, it is characterised in that：Main glue, organic solvent, modifying agent, modification in the step 2)
The mass ratio of nano aluminium oxide is 1：0.1-0.2：0.02-0.04：0.03-0.05.
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| CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
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| CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
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| CN105761855B true CN105761855B (en) | 2017-12-08 |
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| CN109454970B (en) * | 2018-11-08 | 2020-11-03 | 哈尔滨电机厂有限责任公司 | Manufacturing method of high-thermal-conductivity multi-glue epoxy glass fiber powder mica tape |
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| DE102010032949A1 (en) * | 2010-07-30 | 2012-02-02 | Siemens Aktiengesellschaft | Insulating systems with improved partial discharge resistance |
| CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
| CN102693791B (en) * | 2012-05-29 | 2013-06-05 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
| CN102800445B (en) * | 2012-08-05 | 2016-07-20 | 哈尔滨理工大学 | The preparation method of high heat conduction high strength multi-powder adhesion mica tape |
| CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
| JP2014167053A (en) * | 2013-02-28 | 2014-09-11 | 3M Innovative Properties Co | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using prepreg, and semiconductor device using multilayer printed wiring board |
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Effective date of registration: 20171116 Address after: 401320 Chongqing city Banan District Yudong textile village three Applicant after: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. Address before: 266000 Shandong province Qingdao City, Inner Mongolia Road No. 30 Building No. 5 Applicant before: Hao Fu |
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Effective date of registration: 20180119 Address after: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee after: Li Qingdi Address before: 401320 Chongqing city Banan District Yudong textile village three Patentee before: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. |
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Effective date of registration: 20200521 Address after: 437400 Xianning City, Hubei Province Tongcheng Yuli juanyong Road No. 226 Building 1 Patentee after: PAMICA ELECTRIC MATERIAL (HUBEI) Co.,Ltd. Address before: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee before: Li Qingdi |
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