CN105761855A - High-thermal conductivity ultrathin mica tape and preparation method thereof - Google Patents
High-thermal conductivity ultrathin mica tape and preparation method thereof Download PDFInfo
- Publication number
- CN105761855A CN105761855A CN201610060634.5A CN201610060634A CN105761855A CN 105761855 A CN105761855 A CN 105761855A CN 201610060634 A CN201610060634 A CN 201610060634A CN 105761855 A CN105761855 A CN 105761855A
- Authority
- CN
- China
- Prior art keywords
- mica tape
- aramid fiber
- nano
- fiber non
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010445 mica Substances 0.000 title claims abstract description 50
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 19
- 229920006231 aramid fiber Polymers 0.000 claims description 17
- 238000007598 dipping method Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 14
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 8
- 239000003093 cationic surfactant Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 8
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 8
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- 241000158728 Meliaceae Species 0.000 claims description 5
- 229910052788 barium Inorganic materials 0.000 claims description 5
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical group [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical group COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- KBIWNQVZKHSHTI-UHFFFAOYSA-N 4-n,4-n-dimethylbenzene-1,4-diamine;oxalic acid Chemical compound OC(=O)C(O)=O.CN(C)C1=CC=C(N)C=C1 KBIWNQVZKHSHTI-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Natural products OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 150000003918 triazines Chemical class 0.000 claims description 3
- 150000002462 imidazolines Chemical group 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000011347 resin Substances 0.000 abstract description 19
- 238000012545 processing Methods 0.000 abstract description 5
- 239000000835 fiber Substances 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000012986 modification Methods 0.000 abstract description 3
- 230000004048 modification Effects 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 229920003235 aromatic polyamide Polymers 0.000 abstract 2
- 238000005485 electric heating Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004836 Glue Stick Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/66—Joining insulating bodies together, e.g. by bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
- H01B19/02—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulating Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610060634.5A CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105761855A true CN105761855A (en) | 2016-07-13 |
CN105761855B CN105761855B (en) | 2017-12-08 |
Family
ID=56342673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610060634.5A Active CN105761855B (en) | 2016-01-29 | 2016-01-29 | A kind of ultra-thin mica tape of high heat conduction and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105761855B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109454970A (en) * | 2018-11-08 | 2019-03-12 | 哈尔滨电机厂有限责任公司 | A kind of manufacturing method of the more glue epoxy fibreglass mica paper tapes of high thermal conductivity |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012013543A2 (en) * | 2010-07-30 | 2012-02-02 | Siemens Aktiengesellschaft | Insulation system having improved partial discharge strength |
CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
CN102800445A (en) * | 2012-08-05 | 2012-11-28 | 哈尔滨理工大学 | Preparation method of high heat conduction high strength multi-powder adhesion mica tape |
CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
CN105027689A (en) * | 2013-02-28 | 2015-11-04 | 3M创新有限公司 | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board |
-
2016
- 2016-01-29 CN CN201610060634.5A patent/CN105761855B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012013543A2 (en) * | 2010-07-30 | 2012-02-02 | Siemens Aktiengesellschaft | Insulation system having improved partial discharge strength |
CN104409187A (en) * | 2011-12-12 | 2015-03-11 | 江苏冰城电材股份有限公司 | Mica tape manufacturing method suitable for energy conservation, emission reduction and reduction of environmental pollution |
CN102693791A (en) * | 2012-05-29 | 2012-09-26 | 苏州巨峰电气绝缘系统股份有限公司 | High-heat conducting high-air permeability less-glue mica tape and preparing method thereof |
CN102800445A (en) * | 2012-08-05 | 2012-11-28 | 哈尔滨理工大学 | Preparation method of high heat conduction high strength multi-powder adhesion mica tape |
CN102820110A (en) * | 2012-09-03 | 2012-12-12 | 中国船舶重工集团公司第七一二研究所 | Glass cloth reinforcing high-thermal conductivity mica tape and preparation method thereof |
CN105027689A (en) * | 2013-02-28 | 2015-11-04 | 3M创新有限公司 | High thermal conductivity prepreg, printed wiring board and multilayer printed wiring board using the prepreg, and semiconductor device using the multilayer printed wiring board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109454970A (en) * | 2018-11-08 | 2019-03-12 | 哈尔滨电机厂有限责任公司 | A kind of manufacturing method of the more glue epoxy fibreglass mica paper tapes of high thermal conductivity |
Also Published As
Publication number | Publication date |
---|---|
CN105761855B (en) | 2017-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171116 Address after: 401320 Chongqing city Banan District Yudong textile village three Applicant after: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. Address before: 266000 Shandong province Qingdao City, Inner Mongolia Road No. 30 Building No. 5 Applicant before: Hao Fu |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180119 Address after: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee after: Li Qingdi Address before: 401320 Chongqing city Banan District Yudong textile village three Patentee before: Chongqing Yue Yue Machinery Manufacturing Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200521 Address after: 437400 Xianning City, Hubei Province Tongcheng Yuli juanyong Road No. 226 Building 1 Patentee after: PAMICA ELECTRIC MATERIAL (HUBEI) Co.,Ltd. Address before: 401344 Chongqing city Banan District of the town of Huai village Solitaire force Zi Wan Group No. 1043 Patentee before: Li Qingdi |
|
TR01 | Transfer of patent right |