CN106476402A - Buffer plate of running machine preparation method - Google Patents
Buffer plate of running machine preparation method Download PDFInfo
- Publication number
- CN106476402A CN106476402A CN201510526402.XA CN201510526402A CN106476402A CN 106476402 A CN106476402 A CN 106476402A CN 201510526402 A CN201510526402 A CN 201510526402A CN 106476402 A CN106476402 A CN 106476402A
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- CN
- China
- Prior art keywords
- running machine
- buffer plate
- molds
- predetermined
- machine preparation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
The present invention discloses a kind of buffer plate of running machine preparation method, including gluing, dry in the shade, preset, matched moulds and heating and mould pressing molding, the step such as cooling and die sinking molding, required buffer plate of running machine can simply be produced, and can be according to different designs such as the salient point of the mold of set of molds and lower mould, the settings of flat or concave arc, only change the buffer plate of running machine that different moulds can produce different structure, to reduce manufacturing cost.
Description
Technical field
The present invention relates to the association area of treadmill, particularly relate to a kind of manufacture method of the buffer plate of running machine for treadmill.
Background technology
General treadmill is using a buffer board as the support below treadmill belt, but, when running because of running legpower to buffer board force greatly, such as do not have buffer spring then quite unfavorable to runner, therefore, below buffer board, reload buffer device again in addition to cushion pad, and one layer of foaming layer is sticked on described buffer board, and one layer of nonwoven fabric layer is sticked on described foaming layer again, so that running tape loop can smooth rotate, have the effect of buffering concurrently simultaneously.
Existing buffer plate of running machine refers to Taiwan patent of invention the I406686th, it discloses a kind of buffer plate of running machine, it is made up of the bamboo band of suitable thickness and width, bamboo band is divided into warp bamboo band and parallel bamboo band by it, makes the lapping braiding that intersects of at least one warp bamboo band and at least one parallel bamboo band form a braiding bamboo slab rubber；Described bamboo slab rubber can be stacked with to desired thickness, to constitute a braiding bamboo glue lamination, to lift intensity and to possess snubber elastomeric；Also can by aforementioned warp bamboo band and rearward with and the direct lapping of parallel bamboo band rearward, to constitute a stacking bamboo slab rubber.
In addition, the buffer board bamboo chip structure of current treadmill, its production method is first the bamboo stem rip cutting of bamboo to be become a quarter, then the bamboo chip axially cutting into flat board strip in this quarter.
Afterwards, each bamboo chip to form buffer board again in the way of weaving.
Because the bamboo chip area that existing production method is produced is less, and waste too many bamboo wood, produce waste material too much, lead to increase many costs, and weave more verbose with Production Time；And, because buffer board is formed by bamboo chip braiding, the gap between each bamboo chip is larger, and the effect of buffering is poor.
Content of the invention
For solving the above problems, it is an object of the invention to provide a kind of buffer plate of running machine preparation method, required buffer plate of running machine can simply be produced, and can be according to different designs such as the salient point of the mold of set of molds and lower mould, the settings of flat or concave arc, only change the buffer plate of running machine that different moulds can produce different structure, to reduce manufacturing cost.
For reaching above-mentioned purpose, the present invention provides a kind of buffer plate of running machine preparation method, and its step includes：
Step SA1：Multiple making materials are put into and soaks in a glue pond or the one predetermined gluing time of coating；
Step SA2：After this predetermined gluing time arrives, each making material is picked up or puts and dry in the shade；
Step SA3：Each making material of upper complete glue is laid out according to a lamination order and forms a plate body, and put in a set of molds of a hydraulic press；
Step SA4：This set of molds of this hydraulic press carries out matched moulds and heating and mould pressing molding to this plate body, is heated to a preset heating temperature, and continues a predetermined burn close time；
Step SA5：When this predetermined burn close time reaches, stop this plate body is heated, afterwards, then this plate body is cooled down, be cooled to a predetermined chilling temperature, and cooling continues a predetermined cool time；And
Step SA6：After this predetermined cool time reaches, this set of molds is molded.
In certain embodiments, this predetermined gluing time is 10-30 minute.
In certain embodiments, plate body is dried before putting into this glue pond or coating in advance.
In certain embodiments, this plate body can be stacked by following material to be constituted, and its lamination order is resistance to slide plate, thin web (cloth), wood chip, wood chip, five layers of long curtain and short curtain bamboo chip, wood chip, wood chip, thin web (cloth) and resistance to slide plate；Wherein, the processing technology of shown bamboo chip, is to carry out axially cutting open by individual bamboo stem, and is rolled into tabular, formed, wood chip includes chipboard or solid wood board after lapping；
In certain embodiments, this preset heating temperature is 100 DEG C -180 DEG C, and predetermined burn close time is 5-30 minute.
In certain embodiments, this predetermined chilling temperature is 0 DEG C -40 DEG C, and this predetermined cool time is 10-60 minute.
In certain embodiments, this set of molds has a fluid circuit, and this fluid circuit is connected with a Cold-hot water valve, and this Cold-hot water valve can control a hot fluid or a cold flow body to enter this fluid circuit respectively, and this set of molds is heated or cooled.
In certain embodiments, this set of molds has a fluid circuit, this fluid circuit is connected with a Cold-hot water valve, this Cold-hot water valve is connected with an electric heater (accompanying drawing omission), this Cold-hot water valve can be connected with an electric heater, with control cryogenic fluid through electric heater enter this fluid circuit heating, to heat to this set of molds, and block electric heater make cold flow body cool down set of molds.
In certain embodiments, this set of molds has a mold and once mould, and this mold is located at the top of this lower mould and can be mutually shifted ground interval setting, and this mold and this lower mould are the flat setting being parallel to each other or the depression being parallel to each other is arranged.
In certain embodiments, a surface of this lower mould faced by this mold is laid with multiple salient points.
In certain embodiments, an opposed facing surface is laid with multiple salient points to this mold with this lower mould.
Brief description
Fig. 1：In buffer plate of running machine preparation method of the present invention, plate body is seated in the decomposing schematic representation of a hydraulic press.
Fig. 2：The schematic appearance of Fig. 1.
Fig. 3：Fig. 1 uses schematic diagram when matched moulds for the set of molds of a first embodiment.
Fig. 4：The cross-sectional schematic of Fig. 2.
Fig. 5：The cross-sectional schematic of Fig. 3.
Fig. 6：Buffer plate of running machine preparation method of the present invention uses the schematic diagram of the buffer plate of running machine manufactured by set of molds of first embodiment.
Fig. 7：In buffer plate of running machine preparation method of the present invention, plate body is seated in the schematic appearance of a hydraulic press.
Fig. 8：Fig. 7 uses the decomposing schematic representation of the set of molds of a second embodiment.
Fig. 9：Buffer plate of running machine preparation method of the present invention uses the schematic diagram of the buffer plate of running machine manufactured by set of molds of second embodiment.
Figure 10：In buffer plate of running machine preparation method of the present invention, plate body is seated in the decomposing schematic representation of a hydraulic press of the set of molds with a 3rd embodiment.
Figure 11：Buffer plate of running machine preparation method of the present invention uses the schematic diagram of the buffer plate of running machine manufactured by set of molds of 3rd embodiment.
Figure 12：In buffer plate of running machine preparation method of the present invention, plate body is seated in the decomposing schematic representation of a hydraulic press of the set of molds with a fourth embodiment.
Figure 13：Buffer plate of running machine preparation method of the present invention uses the schematic diagram of the buffer plate of running machine manufactured by set of molds of fourth embodiment.
Figure 14：The flow chart of buffer plate of running machine preparation method of the present invention.
Description of reference numerals
1 plate body
2 buffer plate of running machines
100 hydraulic presses
200 set of molds
210 molds
220 times moulds
230 drivers
240 Cold-hot water valves
300 salient points
The manufacture method that the step SA1-SA6 present invention provides.
Specific embodiment
Please also refer to shown in Fig. 1 to Figure 14, the buffer plate of running machine preparation method that the present invention provides, its step includes：
Step SA1（Gluing）：Multiple making materials are put into and soaks in a glue pond or the one predetermined gluing time of coating, preferably, the described predetermined gluing time can be 10-30 minute, but be not limited thereto；
Step SA2（Dry in the shade）：After this predetermined gluing time arrives, described making material is picked up and dries in the shade；
Step SA3（Preset）：Each making material of upper complete glue is laid out according to a lamination order and forms a plate body 1, and put in a set of molds 200 of a hydraulic press 100, wherein, plate body 1 can be by following material（I.e. described making material）It is stacked composition, its lamination order is resistance to slide plate, thin web (cloth), wood chip, wood chip, five layers of long curtain and short curtain bamboo chip, wood chip, wood chip, thin web (cloth) and resistance to slide plate；Wherein, the processing technology of bamboo chip, is to carry out axially cutting open by multiple bamboo stem, and is rolled into tabular, formed, wood chip includes chipboard or solid wood board after lapping；
Step SA4（Matched moulds and heating and mould pressing molding）：The set of molds 200 of hydraulic press 100 carries out matched moulds and heating and mould pressing molding to plate body 1, it is heated to a preset heating temperature, and continue a predetermined burn close time, preferably, described preset heating temperature is 100 DEG C -180 DEG C, and described predetermined burn close time is 10-20 minute, wherein, this hydraulic press 100 can arrange this set of molds 200 multiple simultaneously, to carry out matched moulds and heating and mould pressing molding simultaneously；
Step SA5（Cooling）：When described predetermined burn close time reaches, stop plate body 1 is heated, afterwards, then plate body 1 is cooled down, be cooled to a predetermined chilling temperature, and cooling continues a predetermined cool time；And
Step SA6（Die sinking molding）：After described predetermined cool time reaches, set of molds 200 can be molded, to mold a buffer plate of running machine 2.
Preferably, the plate body 1 of above-mentioned steps SA1 can be dried in advance in the glue pond described in putting into or before being coated.
In above-mentioned steps SA5, described predetermined chilling temperature may be set to 0 DEG C -40 DEG C, and this predetermined cool time is preferably 10-60 minute, but is not limited thereto.
Set of molds 200 can have a mold 210 and once mould 220, and mold 210 can be located at the top of lower mould 220 and can pass through driver 230（Can be driven by modes such as oil pressure or air pressure, but be not limited thereto）It is mutually shifted ground interval setting, mold 210 and lower mould 220 are the flat setting being parallel to each other（As shown in Fig. 1 to Fig. 5）, buffer plate of running machine 2 that it is formed can be as shown in fig. 6, or the depression setting that is parallel to each other（As shown in figure 12）, its buffer plate of running machine 2 can be as shown in figure 13；Meanwhile, faced by mold 210, a surface of lower mould 220 is laid with multiple salient points 300（As shown in Figure 8）, its buffer plate of running machine 2 can as shown in figure 9, or mold 210 an opposed facing surface is laid with multiple salient points 300 with lower mould 220（As shown in Figure 10）, its buffer plate of running machine 2 can be as shown in figure 11.
Set of molds 200 can have a fluid circuit, this fluid circuit can be located in mold 210 and in lower mould 220, fluid circuit can be connected with a Cold-hot water valve 240, and Cold-hot water valve 240 can control a hot fluid or a cold flow body enters fluid circuit, and set of molds 200 is heated or cooled.
Foregoing mould group 200 has a fluid circuit, this fluid circuit can be located in mold 210 and in lower mould 220, fluid circuit can be connected with a Cold-hot water valve 240, this Cold-hot water valve 240 can be connected to control a cold flow body to enter fluid circuit heating with an electric heater, and blocking electric heater (in fluid circuit, omit draw) after then with one cold flow body enter fluid circuit, set of molds 200 is cooled down.
By above-mentioned manufacture method, required buffer plate of running machine can simply be produced, and can be according to different designs such as the salient point 300 of the mold 210 of set of molds 200 and lower mould 220, the settings of flat or concave arc, only change the buffer plate of running machine 2 that different moulds can produce different structure, as shown in Fig. 6, Fig. 9, Figure 11 and Figure 13, to reduce manufacturing cost.
On the basis of foregoing embodiments, other embodiments of the invention can be designed further, without prejudice to technical scheme, protection scope of the present invention is by being defined of limiting in claims for these embodiments.Although the present invention is illustrated with related preferred embodiment, this is not intended to limit the present invention.It should be noted that those skilled in the art can construct a lot of other similar embodiment according to the thought of the present invention, these belong to protection scope of the present invention.
Claims (10)
1. a kind of buffer plate of running machine preparation method it is characterised in that：Its step includes：
Step SA1：Multiple making materials are put into and soaks in a glue pond or the one predetermined gluing time of coating；
Step SA2：After this predetermined gluing time arrives, each making material is dried in the shade；
Step SA3：Each making material of upper complete glue is laid out according to a lamination order and forms a plate body, and put in a set of molds of a hydraulic press；
Step SA4：This set of molds of this hydraulic press carries out matched moulds and heating and mould pressing molding to this plate body, is heated to a preset heating temperature, and continues a predetermined burn close time；
Step SA5：When this predetermined burn close time reaches, stop this plate body is heated, afterwards, then this plate body is cooled down, be cooled to a predetermined chilling temperature, and cooling continues a predetermined cool time；And
Step SA6：After this predetermined cool time reaches, this set of molds is molded, to shape a buffer plate of running machine.
2. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This predetermined gluing time is 10-30 minute.
3. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This plate body is dried before putting into this glue pond or coating in advance.
4. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This plate body can be stacked by following material to be constituted, its lamination order is resistance to slide plate, thin web, wood chip, wood chip, five layers of long curtain and short curtain bamboo chip, wood chip, wood chip, thin web and resistance to slide plate, wherein, multiple bamboo stem are carried out axially cutting open by bamboo chip, and it is rolled into tabular, formed after lapping, wood chip includes chipboard or solid wood board.
5. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This preset heating temperature is 100 DEG C -180 DEG C, and predetermined burn close time is 5-30 minute.
6. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This predetermined chilling temperature is 0 DEG C -40 DEG C, and this predetermined cool time is 10-60 minute.
7. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This set of molds has a fluid circuit, and this fluid circuit is connected with a Cold-hot water valve, and this Cold-hot water valve can control a hot fluid or a cold flow body to enter this fluid circuit respectively, and this set of molds is heated or cooled.
8. buffer plate of running machine preparation method as claimed in claim 7 it is characterised in that：This set of molds has a fluid circuit, this fluid circuit is connected with a Cold-hot water valve, and this Cold-hot water valve can be connected with an electric heater, enters the heating of this fluid circuit to control cryogenic fluid through electric heater, this set of molds being heated, and blocks electric heater makes cold flow body cool down set of molds.
9. buffer plate of running machine preparation method as claimed in claim 1 it is characterised in that：This set of molds has a mold and once mould, and this mold is located at the top of this lower mould and can be mutually shifted ground interval setting, and this mold and this lower mould are the flat setting being parallel to each other or the depression being parallel to each other is arranged.
10. buffer plate of running machine preparation method as claimed in claim 9 it is characterised in that：This mold is laid with multiple salient points in the face of a surface of this lower mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510526402.XA CN106476402A (en) | 2015-08-25 | 2015-08-25 | Buffer plate of running machine preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510526402.XA CN106476402A (en) | 2015-08-25 | 2015-08-25 | Buffer plate of running machine preparation method |
Publications (1)
| Publication Number | Publication Date |
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| CN106476402A true CN106476402A (en) | 2017-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510526402.XA Pending CN106476402A (en) | 2015-08-25 | 2015-08-25 | Buffer plate of running machine preparation method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244457A (en) * | 1998-08-10 | 2000-02-16 | 浙江省德清县莫干山竹胶板厂 | Manufacture of faced bamboo board |
| JP2000094623A (en) * | 1998-09-25 | 2000-04-04 | Matsushita Electric Works Ltd | Manufacture of laminate |
| CN2796898Y (en) * | 2005-06-07 | 2006-07-19 | 梅州市广厦冷暖设备有限公司 | Hot press shaped heating and cooling mould device |
| CN102049121A (en) * | 2009-10-30 | 2011-05-11 | 张煌东 | Buffer plate of running machine |
| CN204411576U (en) * | 2015-01-06 | 2015-06-24 | 张仲甫 | The buffer board structure of treadmill |
-
2015
- 2015-08-25 CN CN201510526402.XA patent/CN106476402A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244457A (en) * | 1998-08-10 | 2000-02-16 | 浙江省德清县莫干山竹胶板厂 | Manufacture of faced bamboo board |
| JP2000094623A (en) * | 1998-09-25 | 2000-04-04 | Matsushita Electric Works Ltd | Manufacture of laminate |
| CN2796898Y (en) * | 2005-06-07 | 2006-07-19 | 梅州市广厦冷暖设备有限公司 | Hot press shaped heating and cooling mould device |
| CN102049121A (en) * | 2009-10-30 | 2011-05-11 | 张煌东 | Buffer plate of running machine |
| CN204411576U (en) * | 2015-01-06 | 2015-06-24 | 张仲甫 | The buffer board structure of treadmill |
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Application publication date: 20170308 |
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