CN106469696B - 功率半导体的封装和冷却装置 - Google Patents
功率半导体的封装和冷却装置 Download PDFInfo
- Publication number
- CN106469696B CN106469696B CN201610154538.7A CN201610154538A CN106469696B CN 106469696 B CN106469696 B CN 106469696B CN 201610154538 A CN201610154538 A CN 201610154538A CN 106469696 B CN106469696 B CN 106469696B
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- Prior art keywords
- semiconductor
- power semiconductor
- plank
- coolant
- fin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/830,684 | 2015-08-19 | ||
US14/830,684 US9443786B1 (en) | 2015-08-19 | 2015-08-19 | Packaging and cooling method and apparatus for power semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106469696A CN106469696A (zh) | 2017-03-01 |
CN106469696B true CN106469696B (zh) | 2018-09-25 |
Family
ID=56881346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610154538.7A Active CN106469696B (zh) | 2015-08-19 | 2016-03-17 | 功率半导体的封装和冷却装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9443786B1 (zh) |
CN (1) | CN106469696B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10892208B2 (en) * | 2017-10-19 | 2021-01-12 | Beijing E. Motor Advance Co. Ltd. | Heat dissipation apparatus and method for power semiconductor devices |
WO2020060482A1 (en) * | 2018-09-17 | 2020-03-26 | Agency For Science, Technology And Research | Liquid cooling module and method of forming the same |
CN109755196A (zh) * | 2018-12-29 | 2019-05-14 | 上海大郡动力控制技术有限公司 | 新能源汽车电机控制器中分立式igbt冷却布置结构 |
FR3094173B1 (fr) * | 2019-03-19 | 2021-04-23 | Bull Sas | Module d’interconnexion dissipant pour carte d'extension a facteur de forme m.2 |
US11647611B2 (en) * | 2019-04-05 | 2023-05-09 | Dana Tm4 Inc. | Thermal interface for plurality of discrete electronic devices |
EP4050295A1 (en) * | 2021-02-26 | 2022-08-31 | Ovh | Water block having hollow fins |
US11520391B1 (en) * | 2021-05-14 | 2022-12-06 | AA Power Inc. | Power supply for a mining machine |
WO2023168199A2 (en) * | 2022-03-01 | 2023-09-07 | Essentium Ipco, Llc | Heated nozzle assembly for a three-dimensional printer head including fins in shank barrel and nozzle tip |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101103659A (zh) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | 带有用于功率器件的微槽道冷却的散热器 |
CN102779799A (zh) * | 2011-05-13 | 2012-11-14 | Abb公司 | 液体冷却元件 |
CN102956586A (zh) * | 2011-08-22 | 2013-03-06 | 通用电气公司 | 用于igbt模块的高性能液体冷却散热器 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6606251B1 (en) * | 2002-02-07 | 2003-08-12 | Cooligy Inc. | Power conditioning module |
US7274106B2 (en) * | 2003-09-24 | 2007-09-25 | Intel Corporation | Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
US7355277B2 (en) * | 2003-12-31 | 2008-04-08 | Intel Corporation | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
US7327570B2 (en) * | 2004-12-22 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Fluid cooled integrated circuit module |
US7317615B2 (en) * | 2005-05-23 | 2008-01-08 | Intel Corporation | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment |
JP5137379B2 (ja) * | 2005-11-14 | 2013-02-06 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 衝突冷却器 |
US7536870B2 (en) * | 2006-03-30 | 2009-05-26 | International Business Machines Corporation | High power microjet cooler |
WO2008075409A1 (ja) * | 2006-12-19 | 2008-06-26 | Kabushiki Kaisha Toyota Jidoshokki | パワーモジュール用ベース、パワーモジュール用ベースの製造方法及びパ ワーモジュール |
US7762314B2 (en) * | 2007-04-24 | 2010-07-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
US7884468B2 (en) * | 2007-07-30 | 2011-02-08 | GM Global Technology Operations LLC | Cooling systems for power semiconductor devices |
JP2009087928A (ja) * | 2007-09-13 | 2009-04-23 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
EP2704191B1 (en) * | 2011-04-26 | 2019-03-13 | Fuji Electric Co., Ltd. | Cooler for semiconductor module |
KR101474616B1 (ko) * | 2012-11-02 | 2014-12-18 | 삼성전기주식회사 | 전력반도체장치의 방열시스템 |
-
2015
- 2015-08-19 US US14/830,684 patent/US9443786B1/en active Active
-
2016
- 2016-03-17 CN CN201610154538.7A patent/CN106469696B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101103659A (zh) * | 2004-11-24 | 2008-01-09 | 通用电气公司 | 带有用于功率器件的微槽道冷却的散热器 |
CN102779799A (zh) * | 2011-05-13 | 2012-11-14 | Abb公司 | 液体冷却元件 |
CN102956586A (zh) * | 2011-08-22 | 2013-03-06 | 通用电气公司 | 用于igbt模块的高性能液体冷却散热器 |
Also Published As
Publication number | Publication date |
---|---|
US9443786B1 (en) | 2016-09-13 |
CN106469696A (zh) | 2017-03-01 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181102 Address after: Taiwan, China Patentee after: Rui Hearst Co Address before: American California Patentee before: ACP power |
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TR01 | Transfer of patent right |
Effective date of registration: 20200115 Address after: 12 Xinghai 1st st, economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing billion pioneer Automotive Technology Co., Ltd. Address before: Taiwan China Patentee before: Rui Hearst Co |
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