CN106463384B - 修改基板厚度轮廓 - Google Patents

修改基板厚度轮廓 Download PDF

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Publication number
CN106463384B
CN106463384B CN201580032583.9A CN201580032583A CN106463384B CN 106463384 B CN106463384 B CN 106463384B CN 201580032583 A CN201580032583 A CN 201580032583A CN 106463384 B CN106463384 B CN 106463384B
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China
Prior art keywords
substrate
polishing pad
polishing
pressure
pad
Prior art date
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CN201580032583.9A
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English (en)
Chinese (zh)
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CN106463384A (zh
Inventor
J·古鲁萨米
H·C·陈
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Priority claimed from US14/334,948 external-priority patent/US9662762B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN106463384A publication Critical patent/CN106463384A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN201580032583.9A 2014-07-18 2015-07-10 修改基板厚度轮廓 Active CN106463384B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462026269P 2014-07-18 2014-07-18
US62/026,269 2014-07-18
US14/334,948 US9662762B2 (en) 2014-07-18 2014-07-18 Modifying substrate thickness profiles
US14/334,948 2014-07-18
PCT/US2015/040064 WO2016010865A1 (en) 2014-07-18 2015-07-10 Modifying substrate thickness profiles

Publications (2)

Publication Number Publication Date
CN106463384A CN106463384A (zh) 2017-02-22
CN106463384B true CN106463384B (zh) 2020-03-17

Family

ID=55078939

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580032583.9A Active CN106463384B (zh) 2014-07-18 2015-07-10 修改基板厚度轮廓

Country Status (5)

Country Link
JP (1) JP6778176B2 (enExample)
KR (1) KR102376928B1 (enExample)
CN (1) CN106463384B (enExample)
TW (1) TWI691379B (enExample)
WO (1) WO2016010865A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109155249B (zh) * 2016-03-25 2023-06-23 应用材料公司 局部区域研磨系统以及用于研磨系统的研磨垫组件
TWI733915B (zh) * 2016-10-10 2021-07-21 美商應用材料股份有限公司 控制基板的處理的方法，及其研磨系統和電腦程式產品
SG10202111787PA (en) * 2016-10-18 2021-11-29 Ebara Corp Local polisher, method of a local polisher and program
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
TWI771668B (zh) 2019-04-18 2022-07-21 美商應用材料股份有限公司 Cmp期間基於溫度的原位邊緣不對稱校正
US11282755B2 (en) * 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
TWI797501B (zh) 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
CN111975469A (zh) * 2020-08-28 2020-11-24 上海华力微电子有限公司 化学机械研磨的方法及研磨系统
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
US20240326195A1 (en) * 2023-03-30 2024-10-03 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-Blade Trimming and Dressing Tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246346A (ja) * 2001-02-14 2002-08-30 Hiroshima Nippon Denki Kk 化学機械研磨装置
CN102884612A (zh) * 2011-01-03 2013-01-16 应用材料公司 压力控制的抛光压板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06333891A (ja) * 1993-05-24 1994-12-02 Sony Corp 基板研磨装置および基板保持台
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5558563A (en) * 1995-02-23 1996-09-24 International Business Machines Corporation Method and apparatus for uniform polishing of a substrate
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad
US20020164926A1 (en) * 2001-05-07 2002-11-07 Simon Mark G. Retainer ring and method for polishing a workpiece
US6863771B2 (en) * 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US6913518B2 (en) * 2003-05-06 2005-07-05 Applied Materials, Inc. Profile control platen
TWI275451B (en) * 2005-01-11 2007-03-11 Asia Ic Mic Process Inc Measurement of thickness profile and elastic modulus profile of polishing pad
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
US8858300B2 (en) * 2010-02-09 2014-10-14 International Business Machines Corporation Applying different pressures through sub-pad to fixed abrasive CMP pad
JP6282437B2 (ja) * 2012-10-18 2018-02-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨パッドコンディショナ用ダンパ
US20140141694A1 (en) * 2012-11-21 2014-05-22 Applied Materials, Inc. In-Sequence Spectrographic Sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246346A (ja) * 2001-02-14 2002-08-30 Hiroshima Nippon Denki Kk 化学機械研磨装置
CN102884612A (zh) * 2011-01-03 2013-01-16 应用材料公司 压力控制的抛光压板

Also Published As

Publication number Publication date
CN106463384A (zh) 2017-02-22
TW201611946A (en) 2016-04-01
KR102376928B1 (ko) 2022-03-18
TWI691379B (zh) 2020-04-21
JP6778176B2 (ja) 2020-10-28
WO2016010865A1 (en) 2016-01-21
JP2017527107A (ja) 2017-09-14
KR20170034404A (ko) 2017-03-28

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