CN106463325B - 用于旋转式目标的末端块以及小于大气压的压力下的收集器和转子之间的电连接 - Google Patents
用于旋转式目标的末端块以及小于大气压的压力下的收集器和转子之间的电连接 Download PDFInfo
- Publication number
- CN106463325B CN106463325B CN201480077077.7A CN201480077077A CN106463325B CN 106463325 B CN106463325 B CN 106463325B CN 201480077077 A CN201480077077 A CN 201480077077A CN 106463325 B CN106463325 B CN 106463325B
- Authority
- CN
- China
- Prior art keywords
- sputtering
- end block
- rotor
- conductive
- cooled region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004544 sputter deposition Methods 0.000 claims abstract description 76
- 238000005477 sputtering target Methods 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- -1 Wherein Chemical compound 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Substances [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Motor Or Generator Current Collectors (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/153,658 | 2014-01-13 | ||
| US14/153,658 US9809876B2 (en) | 2014-01-13 | 2014-01-13 | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure |
| PCT/US2014/072784 WO2015105711A1 (en) | 2014-01-13 | 2014-12-30 | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106463325A CN106463325A (zh) | 2017-02-22 |
| CN106463325B true CN106463325B (zh) | 2019-02-26 |
Family
ID=52355266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480077077.7A Expired - Fee Related CN106463325B (zh) | 2014-01-13 | 2014-12-30 | 用于旋转式目标的末端块以及小于大气压的压力下的收集器和转子之间的电连接 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US9809876B2 (ru) |
| EP (1) | EP3095126B8 (ru) |
| JP (1) | JP2017503080A (ru) |
| KR (1) | KR20160108424A (ru) |
| CN (1) | CN106463325B (ru) |
| BR (1) | BR112016016151A2 (ru) |
| ES (1) | ES2660576T3 (ru) |
| PL (1) | PL3095126T3 (ru) |
| RU (1) | RU2667143C2 (ru) |
| WO (1) | WO2015105711A1 (ru) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
| CN108277468B (zh) * | 2018-02-26 | 2019-11-12 | 沈阳中北真空技术有限公司 | 一种带真空机械臂的磁控溅射光学镀膜设备及镀膜方法 |
| SG11202008819VA (en) * | 2018-03-19 | 2020-10-29 | Beijing Naura Microelectronics Equipment Co Ltd | Power feeding mechanism, rotary base device and semiconductor processing equipment |
| CN113445013B (zh) * | 2021-06-28 | 2022-06-03 | 哈尔滨工业大学 | 旋翼轴承内圈内壁高功率磁控溅射薄膜沉积装置及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5620577A (en) * | 1993-12-30 | 1997-04-15 | Viratec Thin Films, Inc. | Spring-loaded mount for a rotatable sputtering cathode |
| US5725746A (en) * | 1990-08-10 | 1998-03-10 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
| CN101473405A (zh) * | 2006-06-19 | 2009-07-01 | 贝卡尔特先进涂层公司 | 用于溅射装置端块的插件 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5096562A (en) | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
| US5427665A (en) | 1990-07-11 | 1995-06-27 | Leybold Aktiengesellschaft | Process and apparatus for reactive coating of a substrate |
| US20020189939A1 (en) * | 2001-06-14 | 2002-12-19 | German John R. | Alternating current rotatable sputter cathode |
| US6736948B2 (en) | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
| DE10213049A1 (de) | 2002-03-22 | 2003-10-02 | Dieter Wurczinger | Drehbare Rohrkatode |
| US7014741B2 (en) | 2003-02-21 | 2006-03-21 | Von Ardenne Anlagentechnik Gmbh | Cylindrical magnetron with self cleaning target |
| US7513141B2 (en) | 2003-09-09 | 2009-04-07 | Applied Films Corporation | Method for differentially pumping endblock seal cavity |
| US20050224343A1 (en) * | 2004-04-08 | 2005-10-13 | Richard Newcomb | Power coupling for high-power sputtering |
| ES2320366T3 (es) | 2004-10-18 | 2009-05-21 | Bekaert Advanced Coatings | Bloque terminal plano para portar un material de pulverizacion ionica de manera giratoria. |
| WO2006042808A1 (en) | 2004-10-18 | 2006-04-27 | Bekaert Advanced Coatings | An end-block for a rotatable target sputtering apparatus |
| US20060096855A1 (en) * | 2004-11-05 | 2006-05-11 | Richard Newcomb | Cathode arrangement for atomizing a rotatable target pipe |
| EP1783814A1 (fr) * | 2005-11-07 | 2007-05-09 | ARCELOR France | Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique |
| DE502005006841D1 (de) | 2005-12-22 | 2009-04-23 | Applied Materials Gmbh & Co Kg | Zerstäubungsvorrichtung mit einer Rohrkathode und Verfahren zum Betreiben dieser Zerstäubungsvorrichtung |
| US8535490B2 (en) | 2007-06-08 | 2013-09-17 | General Plasma, Inc. | Rotatable magnetron sputtering with axially movable target electrode tube |
| DE102008033902B4 (de) | 2008-07-18 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Endblock für eine Magnetronanordnung mit einem rotierenden Target und Vakuumbeschichtungsanlage |
| DE102008058528B4 (de) | 2008-11-21 | 2011-03-03 | Von Ardenne Anlagentechnik Gmbh | Endblock für eine Magnetronanordnung mit einem rotierenden Target |
| US20120097526A1 (en) | 2009-04-03 | 2012-04-26 | Madocks John E | Rotary magnetron |
| US10586689B2 (en) * | 2009-07-31 | 2020-03-10 | Guardian Europe S.A.R.L. | Sputtering apparatus including cathode with rotatable targets, and related methods |
| EP2371992B1 (en) | 2010-04-01 | 2013-06-05 | Applied Materials, Inc. | End-block and sputtering installation |
-
2014
- 2014-01-13 US US14/153,658 patent/US9809876B2/en active Active
- 2014-12-30 PL PL14827991T patent/PL3095126T3/pl unknown
- 2014-12-30 BR BR112016016151A patent/BR112016016151A2/pt active Search and Examination
- 2014-12-30 RU RU2016133224A patent/RU2667143C2/ru active
- 2014-12-30 KR KR1020167021583A patent/KR20160108424A/ko active IP Right Grant
- 2014-12-30 EP EP14827991.2A patent/EP3095126B8/en not_active Not-in-force
- 2014-12-30 JP JP2016546486A patent/JP2017503080A/ja not_active Ceased
- 2014-12-30 CN CN201480077077.7A patent/CN106463325B/zh not_active Expired - Fee Related
- 2014-12-30 ES ES14827991.2T patent/ES2660576T3/es active Active
- 2014-12-30 WO PCT/US2014/072784 patent/WO2015105711A1/en active Application Filing
-
2017
- 2017-10-18 US US15/786,809 patent/US20180037984A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5725746A (en) * | 1990-08-10 | 1998-03-10 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
| US5620577A (en) * | 1993-12-30 | 1997-04-15 | Viratec Thin Films, Inc. | Spring-loaded mount for a rotatable sputtering cathode |
| CN101473405A (zh) * | 2006-06-19 | 2009-07-01 | 贝卡尔特先进涂层公司 | 用于溅射装置端块的插件 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9809876B2 (en) | 2017-11-07 |
| EP3095126B8 (en) | 2018-02-14 |
| RU2016133224A3 (ru) | 2018-06-25 |
| PL3095126T3 (pl) | 2018-06-29 |
| KR20160108424A (ko) | 2016-09-19 |
| US20150197847A1 (en) | 2015-07-16 |
| RU2016133224A (ru) | 2018-02-20 |
| RU2667143C2 (ru) | 2018-09-17 |
| CN106463325A (zh) | 2017-02-22 |
| EP3095126B1 (en) | 2017-12-13 |
| BR112016016151A2 (pt) | 2017-08-08 |
| US20180037984A1 (en) | 2018-02-08 |
| EP3095126A1 (en) | 2016-11-23 |
| ES2660576T3 (es) | 2018-03-23 |
| WO2015105711A1 (en) | 2015-07-16 |
| JP2017503080A (ja) | 2017-01-26 |
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 Termination date: 20211230 |