SG11202008819VA - Power feeding mechanism, rotary base device and semiconductor processing equipment - Google Patents

Power feeding mechanism, rotary base device and semiconductor processing equipment

Info

Publication number
SG11202008819VA
SG11202008819VA SG11202008819VA SG11202008819VA SG11202008819VA SG 11202008819V A SG11202008819V A SG 11202008819VA SG 11202008819V A SG11202008819V A SG 11202008819VA SG 11202008819V A SG11202008819V A SG 11202008819VA SG 11202008819V A SG11202008819V A SG 11202008819VA
Authority
SG
Singapore
Prior art keywords
processing equipment
feeding mechanism
power feeding
semiconductor processing
base device
Prior art date
Application number
SG11202008819VA
Inventor
Jiansheng Liu
Liang Li
Xinxian Jiang
Peng Chen
Lihui Wen
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201810224905.5A external-priority patent/CN108461387B/en
Priority claimed from CN201820370506.5U external-priority patent/CN208014650U/en
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of SG11202008819VA publication Critical patent/SG11202008819VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
SG11202008819VA 2018-03-19 2018-11-28 Power feeding mechanism, rotary base device and semiconductor processing equipment SG11202008819VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810224905.5A CN108461387B (en) 2018-03-19 2018-03-19 Power feed-in mechanism, rotating base device and semiconductor processing equipment
CN201820370506.5U CN208014650U (en) 2018-03-19 2018-03-19 RF power fed-in mechanism, rotating basis device and semiconductor processing equipment
PCT/CN2018/117901 WO2019179159A1 (en) 2018-03-19 2018-11-28 Power feeding mechanism, rotating base apparatus, and semiconductor processing device

Publications (1)

Publication Number Publication Date
SG11202008819VA true SG11202008819VA (en) 2020-10-29

Family

ID=67988180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008819VA SG11202008819VA (en) 2018-03-19 2018-11-28 Power feeding mechanism, rotary base device and semiconductor processing equipment

Country Status (4)

Country Link
EP (1) EP3770947B1 (en)
KR (1) KR102437306B1 (en)
SG (1) SG11202008819VA (en)
WO (1) WO2019179159A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112323036A (en) * 2020-11-03 2021-02-05 北京北方华创微电子装备有限公司 Power feed-in mechanism, rotating base device and semiconductor processing equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4050044A4 (en) 2020-09-16 2023-06-21 LG Chem, Ltd. Compound, antimicrobial deodorant composition comprising same, and method for producing same

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JP3446091B2 (en) * 1995-09-26 2003-09-16 株式会社徳力本店 Current collector ring assembly
JP2003092343A (en) * 2001-09-17 2003-03-28 Dainippon Screen Mfg Co Ltd Substrate holding mechanism, substrate processing apparatus using the same and substrate processing method
JP2004273406A (en) * 2003-03-07 2004-09-30 Jukai:Kk Method of current collection without slippage
CN102469675A (en) * 2010-11-05 2012-05-23 北京北方微电子基地设备工艺研究中心有限责任公司 Power matching apparatus and semiconductor equipment
WO2013088598A1 (en) * 2011-12-15 2013-06-20 キヤノンアネルバ株式会社 Substrate holder device and vacuum processing device
US9809876B2 (en) * 2014-01-13 2017-11-07 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure
JP2015180768A (en) * 2014-03-06 2015-10-15 株式会社日立国際電気 Substrate treatment apparatus, semiconductor device manufacturing method, and recording medium
TWI530584B (en) * 2015-01-16 2016-04-21 財團法人工業技術研究院 Brushless rotray plasma electrode structure and film coating system
GB201505528D0 (en) * 2015-03-31 2015-05-13 Gencoa Ltd Rotational device-III
JP6449091B2 (en) * 2015-04-20 2019-01-09 東京エレクトロン株式会社 Slip ring, support mechanism and plasma processing apparatus
US10043636B2 (en) * 2015-12-10 2018-08-07 Lam Research Corporation Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal
JP6462620B2 (en) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
CN108461387B (en) * 2018-03-19 2020-06-19 北京北方华创微电子装备有限公司 Power feed-in mechanism, rotating base device and semiconductor processing equipment
CN208014650U (en) * 2018-03-19 2018-10-26 北京北方华创微电子装备有限公司 RF power fed-in mechanism, rotating basis device and semiconductor processing equipment
CN108448409A (en) * 2018-04-10 2018-08-24 周琼 A kind of power distribution cabinet with shock-absorbing function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112323036A (en) * 2020-11-03 2021-02-05 北京北方华创微电子装备有限公司 Power feed-in mechanism, rotating base device and semiconductor processing equipment

Also Published As

Publication number Publication date
EP3770947B1 (en) 2023-06-07
EP3770947A4 (en) 2021-12-22
KR102437306B1 (en) 2022-08-29
EP3770947A1 (en) 2021-01-27
KR20200119287A (en) 2020-10-19
WO2019179159A1 (en) 2019-09-26

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