CN106449970A - 一种低功耗磁性存储单元 - Google Patents
一种低功耗磁性存储单元 Download PDFInfo
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- CN106449970A CN106449970A CN201610955485.9A CN201610955485A CN106449970A CN 106449970 A CN106449970 A CN 106449970A CN 201610955485 A CN201610955485 A CN 201610955485A CN 106449970 A CN106449970 A CN 106449970A
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 47
- 238000003860 storage Methods 0.000 title abstract description 8
- 230000015654 memory Effects 0.000 claims abstract description 48
- 229910001385 heavy metal Inorganic materials 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000005290 antiferromagnetic effect Effects 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 19
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 8
- 229910003321 CoFe Inorganic materials 0.000 claims description 8
- 229910019236 CoFeB Inorganic materials 0.000 claims description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 229910052707 ruthenium Inorganic materials 0.000 claims description 8
- 229910052715 tantalum Inorganic materials 0.000 claims description 8
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
- 229910000863 Ferronickel Inorganic materials 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- 229910019041 PtMn Inorganic materials 0.000 claims description 4
- SHMWNGFNWYELHA-UHFFFAOYSA-N iridium manganese Chemical compound [Mn].[Ir] SHMWNGFNWYELHA-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- IGOJMROYPFZEOR-UHFFFAOYSA-N manganese platinum Chemical compound [Mn].[Pt] IGOJMROYPFZEOR-UHFFFAOYSA-N 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000002679 ablation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000005294 ferromagnetic effect Effects 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201610955485.9A CN106449970B (zh) | 2016-11-03 | 2016-11-03 | 一种低功耗磁性存储单元 |
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CN201610955485.9A CN106449970B (zh) | 2016-11-03 | 2016-11-03 | 一种低功耗磁性存储单元 |
Publications (2)
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CN106449970A true CN106449970A (zh) | 2017-02-22 |
CN106449970B CN106449970B (zh) | 2019-03-15 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107611255A (zh) * | 2017-09-11 | 2018-01-19 | 北京航空航天大学 | 一种高密度磁性存储器件 |
CN108573725A (zh) * | 2017-03-10 | 2018-09-25 | 东芝存储器株式会社 | 磁存储装置 |
CN108886061A (zh) * | 2017-02-27 | 2018-11-23 | Tdk株式会社 | 自旋流磁化旋转元件、磁阻效应元件及磁存储器 |
CN109417100A (zh) * | 2017-03-29 | 2019-03-01 | Tdk株式会社 | 自旋流磁化反转元件、磁阻效应元件及磁存储器 |
CN109637569A (zh) * | 2018-11-23 | 2019-04-16 | 北京航空航天大学 | 一种磁性存储单元及其数据写入方法 |
CN112186097A (zh) * | 2019-07-01 | 2021-01-05 | 上海磁宇信息科技有限公司 | 一种优化磁性随机存储器写性能的结构及其制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230089984A1 (en) * | 2021-09-20 | 2023-03-23 | International Business Machines Corporation | Stacked spin-orbit torque magnetoresistive random access memory |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100135072A1 (en) * | 2008-12-02 | 2010-06-03 | Seagate Technology Llc | Spin-Torque Bit Cell With Unpinned Reference Layer and Unidirectional Write Current |
CN103794715A (zh) * | 2014-02-28 | 2014-05-14 | 北京航空航天大学 | 一种基于电压控制的磁存储器 |
US20140252439A1 (en) * | 2013-03-08 | 2014-09-11 | T3Memory, Inc. | Mram having spin hall effect writing and method of making the same |
CN104795489A (zh) * | 2015-04-20 | 2015-07-22 | 北京航空航天大学 | 一种新型的四端磁存储器件 |
US20150302911A1 (en) * | 2012-11-27 | 2015-10-22 | Crocus Technology Sa | Magnetic random access memory (mram) cell with low power consumption |
CN105161613A (zh) * | 2015-08-18 | 2015-12-16 | 北京航空航天大学 | 一种基于双势垒结构的磁存储器件 |
-
2016
- 2016-11-03 CN CN201610955485.9A patent/CN106449970B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100135072A1 (en) * | 2008-12-02 | 2010-06-03 | Seagate Technology Llc | Spin-Torque Bit Cell With Unpinned Reference Layer and Unidirectional Write Current |
US20150302911A1 (en) * | 2012-11-27 | 2015-10-22 | Crocus Technology Sa | Magnetic random access memory (mram) cell with low power consumption |
US20140252439A1 (en) * | 2013-03-08 | 2014-09-11 | T3Memory, Inc. | Mram having spin hall effect writing and method of making the same |
CN103794715A (zh) * | 2014-02-28 | 2014-05-14 | 北京航空航天大学 | 一种基于电压控制的磁存储器 |
CN104795489A (zh) * | 2015-04-20 | 2015-07-22 | 北京航空航天大学 | 一种新型的四端磁存储器件 |
CN105161613A (zh) * | 2015-08-18 | 2015-12-16 | 北京航空航天大学 | 一种基于双势垒结构的磁存储器件 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108886061A (zh) * | 2017-02-27 | 2018-11-23 | Tdk株式会社 | 自旋流磁化旋转元件、磁阻效应元件及磁存储器 |
CN108573725A (zh) * | 2017-03-10 | 2018-09-25 | 东芝存储器株式会社 | 磁存储装置 |
CN108573725B (zh) * | 2017-03-10 | 2022-05-10 | 铠侠股份有限公司 | 磁存储装置 |
CN109417100A (zh) * | 2017-03-29 | 2019-03-01 | Tdk株式会社 | 自旋流磁化反转元件、磁阻效应元件及磁存储器 |
CN107611255A (zh) * | 2017-09-11 | 2018-01-19 | 北京航空航天大学 | 一种高密度磁性存储器件 |
CN107611255B (zh) * | 2017-09-11 | 2019-09-10 | 北京航空航天大学 | 一种高密度磁性存储器件 |
CN109637569A (zh) * | 2018-11-23 | 2019-04-16 | 北京航空航天大学 | 一种磁性存储单元及其数据写入方法 |
CN112186097A (zh) * | 2019-07-01 | 2021-01-05 | 上海磁宇信息科技有限公司 | 一种优化磁性随机存储器写性能的结构及其制备方法 |
CN112186097B (zh) * | 2019-07-01 | 2023-10-27 | 上海磁宇信息科技有限公司 | 一种优化磁性随机存储器写性能的结构及其制备方法 |
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CN106449970B (zh) | 2019-03-15 |
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Effective date of registration: 20210303 Address after: 100191 rooms 504a and 504b, 5th floor, 23 Zhichun Road, Haidian District, Beijing Patentee after: Zhizhen storage (Beijing) Technology Co.,Ltd. Address before: 100191 No. 37, Haidian District, Beijing, Xueyuan Road Patentee before: BEIHANG University |
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Effective date of registration: 20231226 Address after: Room 1605, Building 1, No. 117 Yingshan Red Road, Huangdao District, Qingdao City, Shandong Province, 266400 Patentee after: Qingdao Haicun Microelectronics Co.,Ltd. Address before: 100191 rooms 504a and 504b, 5th floor, 23 Zhichun Road, Haidian District, Beijing Patentee before: Zhizhen storage (Beijing) Technology Co.,Ltd. |