CN106449567A - 一种冷却器 - Google Patents
一种冷却器 Download PDFInfo
- Publication number
- CN106449567A CN106449567A CN201611057246.8A CN201611057246A CN106449567A CN 106449567 A CN106449567 A CN 106449567A CN 201611057246 A CN201611057246 A CN 201611057246A CN 106449567 A CN106449567 A CN 106449567A
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- CN
- China
- Prior art keywords
- layer
- alloy
- cooler
- hole
- cooler according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611057246.8A CN106449567B (zh) | 2016-11-26 | 2016-11-26 | 一种冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611057246.8A CN106449567B (zh) | 2016-11-26 | 2016-11-26 | 一种冷却器 |
Publications (2)
Publication Number | Publication Date |
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CN106449567A true CN106449567A (zh) | 2017-02-22 |
CN106449567B CN106449567B (zh) | 2018-11-23 |
Family
ID=58218480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611057246.8A Active CN106449567B (zh) | 2016-11-26 | 2016-11-26 | 一种冷却器 |
Country Status (1)
Country | Link |
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CN (1) | CN106449567B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02283053A (ja) * | 1989-03-03 | 1990-11-20 | Delco Electron Corp | 集積回路/ヒートシンク中間部材 |
US6045927A (en) * | 1996-05-22 | 2000-04-04 | Hitachi Metals, Ltd. | Composite material for electronic part and method of producing same |
WO2014026675A2 (de) * | 2012-08-17 | 2014-02-20 | Curamik Electronics Gmbh | Verfahren zur herstellung von hohlkörpern, insbesondere von kühlern, hohlkörper sowie kühler enthaltende elektrische oder elektronische baugruppen |
CN105189109A (zh) * | 2013-03-14 | 2015-12-23 | 三菱综合材料株式会社 | 接合体、功率模块用基板及自带散热器的功率模块用基板 |
-
2016
- 2016-11-26 CN CN201611057246.8A patent/CN106449567B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02283053A (ja) * | 1989-03-03 | 1990-11-20 | Delco Electron Corp | 集積回路/ヒートシンク中間部材 |
US6045927A (en) * | 1996-05-22 | 2000-04-04 | Hitachi Metals, Ltd. | Composite material for electronic part and method of producing same |
WO2014026675A2 (de) * | 2012-08-17 | 2014-02-20 | Curamik Electronics Gmbh | Verfahren zur herstellung von hohlkörpern, insbesondere von kühlern, hohlkörper sowie kühler enthaltende elektrische oder elektronische baugruppen |
CN105189109A (zh) * | 2013-03-14 | 2015-12-23 | 三菱综合材料株式会社 | 接合体、功率模块用基板及自带散热器的功率模块用基板 |
Also Published As
Publication number | Publication date |
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CN106449567B (zh) | 2018-11-23 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20180921 Address after: 226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu. Applicant after: Nantong Ji Zhi Intellectual Property Service Co., Ltd. Address before: 226300 window of science and technology, No. 266, New Century Avenue, Nantong hi tech Zone, Nantong, Jiangsu Applicant before: Nantong Voight Optoelectronics Technology Co., Ltd. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20181012 Address after: 226600 No. 8, Xiao Xing Road, Chengdong Town, Haian economic and Technological Development Zone, Nantong, Jiangsu Applicant after: Jiangsu Tubo Refrigeration Technology Co., Ltd. Address before: 226600 169 Li Fa FA Road, Chengdong Town, Haian City, Nantong, Jiangsu. Applicant before: Nantong Ji Zhi Intellectual Property Service Co., Ltd. |
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