CN106449475A - Import structure for wafers - Google Patents
Import structure for wafers Download PDFInfo
- Publication number
- CN106449475A CN106449475A CN201610867072.5A CN201610867072A CN106449475A CN 106449475 A CN106449475 A CN 106449475A CN 201610867072 A CN201610867072 A CN 201610867072A CN 106449475 A CN106449475 A CN 106449475A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- baffle plate
- rinse bath
- wafers
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to an import structure for wafers. The import structure comprises a plurality of cleaning tanks arranged in a cleaning cavity, wherein the cleaning tanks are arranged in rows; the cleaning tanks in the adjacent rows are arranged in a staggered manner; baffle plates are arranged at two sides of each cleaning tank; and each baffle plate comprises an inclined baffle plate at the outer side of the corresponding cleaning tank and a straight baffle plate located between the cleaning tanks in the adjacent rows. The import structure is dedicated to cleaning treatment of the edges of the wafers; due to the staggered structure of the cleaning tanks, the whole structure is compact; and due to the arrangement of the baffle plates, placement of the wafers is facilitated.
Description
Technical field
The present invention relates to IC processing equipment field, particularly to the processing equipment of wafer.
Background technology
Using traditional cleaning equipment can advantageously cleaning wafer front and back pollution, but crystal round fringes
The pollution of especially chamfered region is usually ignored or to remove difficulty larger.
Content of the invention
The problems referred to above existing for prior art, applicant is studied and is designed, and provides a kind of importing of wafer
Structure, be exclusively used in wafer edge cleaning treatment when wafer importing, it is rational in infrastructure, easy to use, low cost.
In order to solve the above problems, the present invention adopts following scheme：
A kind of guiding structure of wafer, including the multiple rinse baths being arranged in cleaning chamber, described rinse bath in a row sets
Put, be staggeredly arranged between the rinse bath of adjacent row, the both sides of rinse bath are provided with baffle plate, described baffle plate is included outside rinse bath
Slanting baffle and be located at adjacent row rinse bath between straight baffle plate.
The method have technical effect that：
The present invention is exclusively used in the cleaning treatment at wafer edge, the staggered arrangement of rinse bath, and total is compact, baffle plate
Setting, facilitates the placement of wafer.
Brief description
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the sectional view of the A-A of Fig. 1.
In figure：1st, slanting baffle；2nd, clean chamber；3rd, straight baffle plate；4th, rinse bath.
Specific embodiment
Below in conjunction with the accompanying drawings the specific embodiment of the present invention is described further.
As shown in Figure 1 and Figure 2, the guiding structure of the wafer of the present embodiment is multiple clear in cleaning chamber 2 including being arranged at
Washing trough 4, rinse bath 4 sets in a row, is staggeredly arranged between the rinse bath 4 of adjacent row, and the both sides of rinse bath 4 are provided with baffle plate, baffle plate
Including the slanting baffle 1 positioned at rinse bath 4 outside and the straight baffle plate 3 between adjacent row rinse bath 4.During use, by wafer
Put in rinse bath 4 along between slanting baffle 1 and straight baffle plate 3.
Embodiment provided above is the better embodiment of the present invention, is only used for the convenient explanation present invention, not to this
Bright make any pro forma restriction, any those of ordinary skill in the art, if without departing from the carried skill of the present invention
In the range of art feature, using the Equivalent embodiments locally changed done by disclosed technology contents or modify, and
Without departing from the technical characteristic content of the present invention, all still fall within the range of the technology of the present invention feature.
Claims (1)
1. a kind of guiding structure of wafer it is characterised in that：Including the multiple rinse baths (4) being arranged in cleaning chamber (2), institute
State rinse bath (4) to set in a row, be staggeredly arranged between the rinse bath (4) of adjacent row, the both sides of rinse bath (4) are provided with baffle plate, institute
State baffle plate to include positioned at the slanting baffle (1) outside rinse bath (4) and be located at the straight baffle plate (3) between adjacent row rinse bath (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867072.5A CN106449475A (en) | 2016-09-29 | 2016-09-29 | Import structure for wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867072.5A CN106449475A (en) | 2016-09-29 | 2016-09-29 | Import structure for wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449475A true CN106449475A (en) | 2017-02-22 |
Family
ID=58171326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610867072.5A Withdrawn CN106449475A (en) | 2016-09-29 | 2016-09-29 | Import structure for wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449475A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195537A (en) * | 2017-06-30 | 2017-09-22 | 天津中环领先材料技术有限公司 | A kind of cleaning method of monocrystalline silicon buffing sheet |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841670A (en) * | 2005-03-31 | 2006-10-04 | 弘塑科技股份有限公司 | Wafer cleaning and drying apparatus |
| CN105977187A (en) * | 2016-05-27 | 2016-09-28 | 湖南新中合光电科技股份有限公司 | Wet-method-based cleaning apparatus for optical waveguide wafer production and cleaning method thereof |
-
2016
- 2016-09-29 CN CN201610867072.5A patent/CN106449475A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1841670A (en) * | 2005-03-31 | 2006-10-04 | 弘塑科技股份有限公司 | Wafer cleaning and drying apparatus |
| CN105977187A (en) * | 2016-05-27 | 2016-09-28 | 湖南新中合光电科技股份有限公司 | Wet-method-based cleaning apparatus for optical waveguide wafer production and cleaning method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195537A (en) * | 2017-06-30 | 2017-09-22 | 天津中环领先材料技术有限公司 | A kind of cleaning method of monocrystalline silicon buffing sheet |
| CN107195537B (en) * | 2017-06-30 | 2019-12-17 | 天津中环领先材料技术有限公司 | cleaning method of monocrystalline silicon polished wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170222 |