CN106653563A - Guide groove guide-in structure of wafer edge processing apparatus - Google Patents
Guide groove guide-in structure of wafer edge processing apparatus Download PDFInfo
- Publication number
- CN106653563A CN106653563A CN201610867074.4A CN201610867074A CN106653563A CN 106653563 A CN106653563 A CN 106653563A CN 201610867074 A CN201610867074 A CN 201610867074A CN 106653563 A CN106653563 A CN 106653563A
- Authority
- CN
- China
- Prior art keywords
- guide
- guide groove
- wafer
- processing apparatus
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Abstract
The invention relates to a guide groove guide-in structure of a water edge processing apparatus. The structure comprises a guide groove plate arranged at the upper part of a cleaning sink. The guide groove plate is provided with a plurality of parallel guide grooves. Among the guide grooves, a plurality of guide-in grooves are arranged at intervals with the guide-in grooves in the adjacent guide grooves in staggered layout. According to the invention, the specialized device for cleaning and processing a wafer edge adopts a guide groove plate structure which enables a wafer to be guided into the cleaning sink conveniently and rapidly. The structure can be conveniently used and achieves high efficiency.
Description
Technical field
The present invention relates to the processing equipment in IC processing equipment field, more particularly to wafer.
Background technology
Using traditional cleaning equipment can advantageously cleaning wafer front and back pollution, but crystal round fringes
Especially the pollution of chamfered region is usually ignored or to remove difficulty larger.
The content of the invention
For the problems referred to above that prior art is present, applicant is studied and is designed, there is provided a kind of wafer edge
The guide groove guiding structure of reason device, is exclusively used in the cleaning treatment at wafer edge, its rational in infrastructure, easy to use, low cost.
In order to solve the above problems, the present invention adopts following scheme：
A kind of guide groove guiding structure of wafer edge processing apparatus, including the guide channel plate being installed on above service sink, institute
State guide channel plate and be provided with a plurality of parallel guide groove, multiple lead-in grooves, leading in adjacent guide groove are arranged at intervals with the guide groove
To enter be staggeredly arranged between groove.
As the further improvement of above-mentioned technical proposal：
Diameter of the width of the lead-in groove more than wafer.
The method have technical effect that：
The present invention is exclusively used in the cleaning treatment equipment at wafer edge, using guide channel plate structure, can easily and quickly by
Wafer is directed in service sink, its easy to use, efficiency high.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the layout drawing of rinse bath in the present invention.
In figure：1st, guide channel plate；2nd, guide groove；3rd, lead-in groove；4th, wafer.
Specific embodiment
The specific embodiment of the present invention is described further below in conjunction with the accompanying drawings.
As shown in Figure 1 and Figure 2, the guide groove guiding structure of the wafer edge processing apparatus of the present embodiment is clear including being installed on
Guide channel plate 1 above wash pool, guide channel plate 1 is provided with a plurality of parallel guide groove 2, and multiple lead-in grooves 3 are arranged at intervals with guide groove 2,
It is staggeredly arranged between lead-in groove 3 in adjacent guide groove 2.Wherein, diameter of the width of lead-in groove 3 slightly larger than wafer 4, it is ensured that
Wafer 4 can smoothly fall.When using, wafer 4 is inserted in guide groove 2 from one end of guide channel plate 1, wafer 4 is rolled
During to lead-in groove 3, during the service sink (not shown) of lower section is fallen to from lead-in groove 3.
Embodiment provided above is the better embodiment of the present invention, only for the convenient explanation present invention, not to this
It is bright to make any pro forma restriction, any those of ordinary skill in the art, if putting forward skill without departing from the present invention
In the range of art feature, using the Equivalent embodiments locally changed done by disclosed technology contents or modify, and
Without departing from the technical characteristic content of the present invention, still fall within the range of the technology of the present invention feature.
Claims (2)
1. a kind of guide groove guiding structure of wafer edge processing apparatus, it is characterised in that：Including being installed on above service sink
Guide channel plate (1), the guide channel plate (1) is provided with a plurality of parallel guide groove (2), and in the guide groove (2) multiple leading is arranged at intervals with
Enter groove (3), be staggeredly arranged between the lead-in groove (3) in adjacent guide groove (2).
2. the guide groove guiding structure of wafer edge processing apparatus according to claim 1, it is characterised in that：The importing
Diameter of the width of groove (3) more than wafer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867074.4A CN106653563A (en) | 2016-09-29 | 2016-09-29 | Guide groove guide-in structure of wafer edge processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867074.4A CN106653563A (en) | 2016-09-29 | 2016-09-29 | Guide groove guide-in structure of wafer edge processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106653563A true CN106653563A (en) | 2017-05-10 |
Family
ID=58854698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610867074.4A Withdrawn CN106653563A (en) | 2016-09-29 | 2016-09-29 | Guide groove guide-in structure of wafer edge processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106653563A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050153557A1 (en) * | 2004-01-12 | 2005-07-14 | Chan-Woo Cho | Apparatus and method for treating susbtrates |
-
2016
- 2016-09-29 CN CN201610867074.4A patent/CN106653563A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050153557A1 (en) * | 2004-01-12 | 2005-07-14 | Chan-Woo Cho | Apparatus and method for treating susbtrates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170510 |