CN106415249B - 在晶片检验期间确定定位于收集孔隙中的光学元件的配置 - Google Patents

在晶片检验期间确定定位于收集孔隙中的光学元件的配置 Download PDF

Info

Publication number
CN106415249B
CN106415249B CN201580029498.7A CN201580029498A CN106415249B CN 106415249 B CN106415249 B CN 106415249B CN 201580029498 A CN201580029498 A CN 201580029498A CN 106415249 B CN106415249 B CN 106415249B
Authority
CN
China
Prior art keywords
different
light
images
optical element
collection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580029498.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN106415249A (zh
Inventor
P·科尔钦
M·奥利莱
魏军伟
D·卡普
G·陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Priority to CN201810473396.XA priority Critical patent/CN108508028B/zh
Publication of CN106415249A publication Critical patent/CN106415249A/zh
Application granted granted Critical
Publication of CN106415249B publication Critical patent/CN106415249B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95623Inspecting patterns on the surface of objects using a spatial filtering method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/066Modifiable path; multiple paths in one sample
    • G01N2201/0668Multiple paths; optimisable path length

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN201580029498.7A 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置 Active CN106415249B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810473396.XA CN108508028B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462017264P 2014-06-26 2014-06-26
US62/017,264 2014-06-26
US201562111402P 2015-02-03 2015-02-03
US62/111,402 2015-02-03
US14/749,564 2015-06-24
US14/749,564 US9709510B2 (en) 2014-06-26 2015-06-24 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
PCT/US2015/038115 WO2015200856A1 (en) 2014-06-26 2015-06-26 Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201810473396.XA Division CN108508028B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

Publications (2)

Publication Number Publication Date
CN106415249A CN106415249A (zh) 2017-02-15
CN106415249B true CN106415249B (zh) 2018-06-12

Family

ID=54930191

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580029498.7A Active CN106415249B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置
CN201810473396.XA Active CN108508028B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810473396.XA Active CN108508028B (zh) 2014-06-26 2015-06-26 在晶片检验期间确定定位于收集孔隙中的光学元件的配置

Country Status (6)

Country Link
US (2) US9709510B2 (OSRAM)
JP (1) JP6652511B2 (OSRAM)
KR (1) KR102269512B1 (OSRAM)
CN (2) CN106415249B (OSRAM)
IL (1) IL248647B (OSRAM)
WO (1) WO2015200856A1 (OSRAM)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10062156B2 (en) 2016-02-25 2018-08-28 Kla-Tencor Corporation Method and system for detecting defects on a substrate
US11512943B2 (en) * 2016-11-23 2022-11-29 Nova Ltd Optical system and method for measuring parameters of patterned structures in micro-electronic devices
JP7115826B2 (ja) * 2017-07-18 2022-08-09 三星電子株式会社 撮像装置および撮像方法
US10429315B2 (en) * 2017-07-18 2019-10-01 Samsung Electronics Co., Ltd. Imaging apparatus and imaging method
CN109425618B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
CN109425619B (zh) * 2017-08-31 2021-12-28 深圳中科飞测科技股份有限公司 光学测量系统及方法
US10607119B2 (en) * 2017-09-06 2020-03-31 Kla-Tencor Corp. Unified neural network for defect detection and classification
CN212207144U (zh) * 2017-11-15 2020-12-22 康宁公司 用于检测玻璃片上的表面缺陷的设备
US11067389B2 (en) 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
NL2023884A (en) 2018-10-12 2020-05-07 Asml Netherlands Bv Detection system for an alignment sensor
US11815470B2 (en) 2019-01-17 2023-11-14 Applied Materials Israel, Ltd. Multi-perspective wafer analysis
US10902582B2 (en) * 2019-01-17 2021-01-26 Applied Materials Israel, Ltd. Computerized system and method for obtaining information about a region of an object
CN110006684A (zh) * 2019-03-13 2019-07-12 广州金域医学检验中心有限公司 数字病理切片的生成系统和方法
JP7236170B2 (ja) * 2019-03-29 2023-03-09 国立大学法人大阪大学 光検出装置、光検出方法、光検出装置の設計方法、試料分類方法、及び、不良検出方法
WO2020224882A1 (en) * 2019-05-06 2020-11-12 Asml Netherlands B.V. Dark field microscope
US10921261B2 (en) 2019-05-09 2021-02-16 Kla Corporation Strontium tetraborate as optical coating material
US11011366B2 (en) 2019-06-06 2021-05-18 Kla Corporation Broadband ultraviolet illumination sources
US11255797B2 (en) 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material
CN114616657A (zh) 2019-11-04 2022-06-10 东京毅力科创株式会社 用于校准多个晶圆检查系统(wis)模块的系统和方法
US11168978B2 (en) 2020-01-06 2021-11-09 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
WO2021183332A1 (en) 2020-03-10 2021-09-16 Tokyo Electron Limited Long wave infrared thermal sensor for integration into track system
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
US12488452B2 (en) 2021-06-16 2025-12-02 Tokyo Electron Limited Wafer bath imaging
US12072606B2 (en) 2021-07-30 2024-08-27 Kla Corporation Protective coating for nonlinear optical crystal
KR102695451B1 (ko) * 2021-12-03 2024-08-23 참엔지니어링(주) 하전입자를 이용한 시료 처리 장치
US11899338B2 (en) 2021-12-11 2024-02-13 Kla Corporation Deep ultraviolet laser using strontium tetraborate for frequency conversion
WO2024056296A1 (en) * 2022-09-13 2024-03-21 Asml Netherlands B.V. Metrology method and associated metrology device
EP4339703A1 (en) * 2022-09-13 2024-03-20 ASML Netherlands B.V. Metrology method and associated metrology device
US20250383294A1 (en) * 2024-06-18 2025-12-18 Kla Corporation Speckle noise reduction using pupil masks

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532542A (zh) * 2003-03-24 2004-09-29 光子动力学公司 大平面构图介质的高通量检测方法和装置
CN102636963A (zh) * 2011-02-11 2012-08-15 Asml荷兰有限公司 检查设备和方法、光刻设备和处理单元、器件制造方法
CN103201682A (zh) * 2010-11-12 2013-07-10 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
JP2014530389A (ja) * 2011-10-12 2014-11-17 ベンタナ メディカル システムズ, インコーポレイテッド 多焦点干渉計画像取得

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7957066B2 (en) * 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US20060012781A1 (en) 2004-07-14 2006-01-19 Negevtech Ltd. Programmable spatial filter for wafer inspection
WO2006091913A1 (en) * 2005-02-25 2006-08-31 Nanometrics Incorporated Apparatus and method for enhanced critical dimension scatterometry
JP4625716B2 (ja) * 2005-05-23 2011-02-02 株式会社日立ハイテクノロジーズ 欠陥検査装置及び欠陥検査方法
US7345825B2 (en) * 2005-06-30 2008-03-18 Kla-Tencor Technologies Corporation Beam delivery system for laser dark-field illumination in a catadioptric optical system
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
SG176552A1 (en) * 2009-06-19 2012-01-30 Kla Tencor Tech Corp Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
KR20110055787A (ko) 2009-11-20 2011-05-26 재단법인 서울테크노파크 레이저를 이용한 접합웨이퍼 검사장치
WO2012126684A1 (en) * 2011-03-24 2012-09-27 Asml Netherlands B.V. Substrate and patterning device for use in metrology, metrology method and device manufacturing method
US8614790B2 (en) * 2011-12-12 2013-12-24 Applied Materials Israel, Ltd. Optical system and method for inspection of patterned samples
EP2823288B1 (en) * 2012-03-07 2021-05-05 KLA-Tencor Corporation Wafer and reticle inspection systems and method for selecting illumination pupil configurations
KR101761735B1 (ko) * 2012-03-27 2017-07-26 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
KR101442792B1 (ko) 2012-08-31 2014-09-23 (주)유텍시스템 사파이어 웨이퍼의 검사 방법
US9075027B2 (en) * 2012-11-21 2015-07-07 Kla-Tencor Corporation Apparatus and methods for detecting defects in vertical memory
US9091650B2 (en) * 2012-11-27 2015-07-28 Kla-Tencor Corporation Apodization for pupil imaging scatterometry
US9726617B2 (en) * 2013-06-04 2017-08-08 Kla-Tencor Corporation Apparatus and methods for finding a best aperture and mode to enhance defect detection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1532542A (zh) * 2003-03-24 2004-09-29 光子动力学公司 大平面构图介质的高通量检测方法和装置
CN103201682A (zh) * 2010-11-12 2013-07-10 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
CN102636963A (zh) * 2011-02-11 2012-08-15 Asml荷兰有限公司 检查设备和方法、光刻设备和处理单元、器件制造方法
JP2014530389A (ja) * 2011-10-12 2014-11-17 ベンタナ メディカル システムズ, インコーポレイテッド 多焦点干渉計画像取得

Also Published As

Publication number Publication date
KR20170021830A (ko) 2017-02-28
WO2015200856A1 (en) 2015-12-30
US10215713B2 (en) 2019-02-26
US20150377797A1 (en) 2015-12-31
KR102269512B1 (ko) 2021-06-24
IL248647B (en) 2020-05-31
IL248647A0 (en) 2017-01-31
CN108508028B (zh) 2021-03-09
US20170292918A1 (en) 2017-10-12
JP6652511B2 (ja) 2020-02-26
US9709510B2 (en) 2017-07-18
CN106415249A (zh) 2017-02-15
JP2017527780A (ja) 2017-09-21
CN108508028A (zh) 2018-09-07

Similar Documents

Publication Publication Date Title
CN106415249B (zh) 在晶片检验期间确定定位于收集孔隙中的光学元件的配置
KR101460128B1 (ko) 패터닝된 샘플들을 검사하기 위한 광학적 시스템 및 방법
US10067072B2 (en) Methods and apparatus for speckle suppression in laser dark-field systems
JP6598914B2 (ja) ウェハおよびレチクル検査システムならびに照明瞳配置を選択するための方法
KR102198743B1 (ko) 동시 다중-각도 분광법
CN114341593A (zh) 使用云纹元件及旋转对称布置以成像叠加目标
US9194811B1 (en) Apparatus and methods for improving defect detection sensitivity
TW201506383A (zh) 用於尋找最佳孔徑及模式以加強缺陷偵測之裝置及方法
US20130148115A1 (en) Optical system and method for inspection of patterned samples
JP6847663B2 (ja) ウェハ検査のためのロジックの中のパターン抑制
US7940384B2 (en) Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen
JP7240829B2 (ja) パターン構造のx線測定
US20230205095A1 (en) Method and system for determining one or more dimensions of one or more structures on a sample surface
US20250053098A1 (en) Spatially-varying spectral metrology for local variation detection
KR20230056781A (ko) 다중 관점 웨이퍼 분석

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant