IL248647B - Configuring for an optical element placed in a collection port when testing a slice - Google Patents
Configuring for an optical element placed in a collection port when testing a sliceInfo
- Publication number
- IL248647B IL248647B IL248647A IL24864716A IL248647B IL 248647 B IL248647 B IL 248647B IL 248647 A IL248647 A IL 248647A IL 24864716 A IL24864716 A IL 24864716A IL 248647 B IL248647 B IL 248647B
- Authority
- IL
- Israel
- Prior art keywords
- determining
- configuration
- optical element
- element positioned
- wafer inspection
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/066—Modifiable path; multiple paths in one sample
- G01N2201/0668—Multiple paths; optimisable path length
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462017264P | 2014-06-26 | 2014-06-26 | |
| US201562111402P | 2015-02-03 | 2015-02-03 | |
| US14/749,564 US9709510B2 (en) | 2014-06-26 | 2015-06-24 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
| PCT/US2015/038115 WO2015200856A1 (en) | 2014-06-26 | 2015-06-26 | Determining a configuration for an optical element positioned in a collection aperture during wafer inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL248647A0 IL248647A0 (en) | 2017-01-31 |
| IL248647B true IL248647B (en) | 2020-05-31 |
Family
ID=54930191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL248647A IL248647B (en) | 2014-06-26 | 2016-10-31 | Configuring for an optical element placed in a collection port when testing a slice |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9709510B2 (OSRAM) |
| JP (1) | JP6652511B2 (OSRAM) |
| KR (1) | KR102269512B1 (OSRAM) |
| CN (2) | CN106415249B (OSRAM) |
| IL (1) | IL248647B (OSRAM) |
| WO (1) | WO2015200856A1 (OSRAM) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10062156B2 (en) | 2016-02-25 | 2018-08-28 | Kla-Tencor Corporation | Method and system for detecting defects on a substrate |
| WO2018096526A1 (en) * | 2016-11-23 | 2018-05-31 | Nova Measuring Instruments Ltd. | Optical system and method for measuring parameters of patterned structures in microelectronic devices |
| US10429315B2 (en) * | 2017-07-18 | 2019-10-01 | Samsung Electronics Co., Ltd. | Imaging apparatus and imaging method |
| JP7115826B2 (ja) * | 2017-07-18 | 2022-08-09 | 三星電子株式会社 | 撮像装置および撮像方法 |
| CN109425618B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| CN109425619B (zh) * | 2017-08-31 | 2021-12-28 | 深圳中科飞测科技股份有限公司 | 光学测量系统及方法 |
| US10607119B2 (en) * | 2017-09-06 | 2020-03-31 | Kla-Tencor Corp. | Unified neural network for defect detection and classification |
| JP7208233B2 (ja) * | 2017-11-15 | 2023-01-18 | コーニング インコーポレイテッド | ガラスシートの表面欠陥の検出方法および装置 |
| US11067389B2 (en) | 2018-03-13 | 2021-07-20 | Kla Corporation | Overlay metrology system and method |
| WO2020074250A1 (en) | 2018-10-12 | 2020-04-16 | Asml Netherlands B.V. | Detection system for an alignment sensor |
| US11815470B2 (en) | 2019-01-17 | 2023-11-14 | Applied Materials Israel, Ltd. | Multi-perspective wafer analysis |
| US10902582B2 (en) * | 2019-01-17 | 2021-01-26 | Applied Materials Israel, Ltd. | Computerized system and method for obtaining information about a region of an object |
| CN110006684A (zh) * | 2019-03-13 | 2019-07-12 | 广州金域医学检验中心有限公司 | 数字病理切片的生成系统和方法 |
| WO2020203592A1 (ja) * | 2019-03-29 | 2020-10-08 | 国立大学法人大阪大学 | 光検出装置、光検出方法、光検出装置の設計方法、試料分類方法、及び、不良検出方法 |
| JP7261903B2 (ja) * | 2019-05-06 | 2023-04-20 | エーエスエムエル ネザーランズ ビー．ブイ． | 暗視野顕微鏡 |
| US10921261B2 (en) | 2019-05-09 | 2021-02-16 | Kla Corporation | Strontium tetraborate as optical coating material |
| US11011366B2 (en) | 2019-06-06 | 2021-05-18 | Kla Corporation | Broadband ultraviolet illumination sources |
| US11255797B2 (en) | 2019-07-09 | 2022-02-22 | Kla Corporation | Strontium tetraborate as optical glass material |
| KR20220091544A (ko) | 2019-11-04 | 2022-06-30 | 도쿄엘렉트론가부시키가이샤 | 복수의 웨이퍼 검사 시스템(wis) 모듈을 교정하는 시스템 및 방법 |
| US11168978B2 (en) | 2020-01-06 | 2021-11-09 | Tokyo Electron Limited | Hardware improvements and methods for the analysis of a spinning reflective substrates |
| CN115315794A (zh) | 2020-03-10 | 2022-11-08 | 东京毅力科创株式会社 | 用于集成到跟踪系统的长波红外热传感器 |
| US11738363B2 (en) | 2021-06-07 | 2023-08-29 | Tokyo Electron Limited | Bath systems and methods thereof |
| US12488452B2 (en) | 2021-06-16 | 2025-12-02 | Tokyo Electron Limited | Wafer bath imaging |
| US12072606B2 (en) | 2021-07-30 | 2024-08-27 | Kla Corporation | Protective coating for nonlinear optical crystal |
| KR102695451B1 (ko) * | 2021-12-03 | 2024-08-23 | 참엔지니어링(주) | 하전입자를 이용한 시료 처리 장치 |
| US11899338B2 (en) | 2021-12-11 | 2024-02-13 | Kla Corporation | Deep ultraviolet laser using strontium tetraborate for frequency conversion |
| IL317785A (en) * | 2022-09-13 | 2025-02-01 | Asml Netherlands Bv | The metrology method and the associated metrology instrument |
| EP4339703A1 (en) * | 2022-09-13 | 2024-03-20 | ASML Netherlands B.V. | Metrology method and associated metrology device |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7957066B2 (en) * | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
| US7041998B2 (en) | 2003-03-24 | 2006-05-09 | Photon Dynamics, Inc. | Method and apparatus for high-throughput inspection of large flat patterned media using dynamically programmable optical spatial filtering |
| US20060012781A1 (en) | 2004-07-14 | 2006-01-19 | Negevtech Ltd. | Programmable spatial filter for wafer inspection |
| DE602006015785D1 (de) * | 2005-02-25 | 2010-09-09 | Nanometrics Inc | L-dimension-scatterometrie |
| JP4625716B2 (ja) * | 2005-05-23 | 2011-02-02 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置及び欠陥検査方法 |
| US7345825B2 (en) * | 2005-06-30 | 2008-03-18 | Kla-Tencor Technologies Corporation | Beam delivery system for laser dark-field illumination in a catadioptric optical system |
| US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
| US8711346B2 (en) * | 2009-06-19 | 2014-04-29 | Kla-Tencor Corporation | Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks |
| KR20110055787A (ko) | 2009-11-20 | 2011-05-26 | 재단법인 서울테크노파크 | 레이저를 이용한 접합웨이퍼 검사장치 |
| CN103201682B (zh) * | 2010-11-12 | 2015-06-17 | Asml荷兰有限公司 | 量测方法和设备、光刻系统和器件制造方法 |
| IL217843A (en) | 2011-02-11 | 2016-11-30 | Asml Netherlands Bv | A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device |
| NL2008317A (en) * | 2011-03-24 | 2012-09-25 | Asml Netherlands Bv | Substrate and patterning device for use in metrology, metrology method and device manufacturing method. |
| WO2013053822A1 (en) * | 2011-10-12 | 2013-04-18 | Ventana Medical Systems, Inc. | Polyfocal interferometric image acquisition |
| US8614790B2 (en) * | 2011-12-12 | 2013-12-24 | Applied Materials Israel, Ltd. | Optical system and method for inspection of patterned samples |
| JP6345125B2 (ja) * | 2012-03-07 | 2018-06-20 | ケーエルエー−テンカー コーポレイション | ウェハおよびレチクル検査システムならびに照明瞳配置を選択するための方法 |
| KR101761735B1 (ko) * | 2012-03-27 | 2017-07-26 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
| KR101442792B1 (ko) | 2012-08-31 | 2014-09-23 | (주)유텍시스템 | 사파이어 웨이퍼의 검사 방법 |
| US9075027B2 (en) * | 2012-11-21 | 2015-07-07 | Kla-Tencor Corporation | Apparatus and methods for detecting defects in vertical memory |
| US9091650B2 (en) * | 2012-11-27 | 2015-07-28 | Kla-Tencor Corporation | Apodization for pupil imaging scatterometry |
| US9726617B2 (en) * | 2013-06-04 | 2017-08-08 | Kla-Tencor Corporation | Apparatus and methods for finding a best aperture and mode to enhance defect detection |
-
2015
- 2015-06-24 US US14/749,564 patent/US9709510B2/en active Active
- 2015-06-26 WO PCT/US2015/038115 patent/WO2015200856A1/en not_active Ceased
- 2015-06-26 CN CN201580029498.7A patent/CN106415249B/zh active Active
- 2015-06-26 KR KR1020177000065A patent/KR102269512B1/ko active Active
- 2015-06-26 CN CN201810473396.XA patent/CN108508028B/zh active Active
- 2015-06-26 JP JP2016575210A patent/JP6652511B2/ja active Active
-
2016
- 2016-10-31 IL IL248647A patent/IL248647B/en active IP Right Grant
-
2017
- 2017-06-18 US US15/626,123 patent/US10215713B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017527780A (ja) | 2017-09-21 |
| KR102269512B1 (ko) | 2021-06-24 |
| CN106415249A (zh) | 2017-02-15 |
| US20150377797A1 (en) | 2015-12-31 |
| CN108508028A (zh) | 2018-09-07 |
| US10215713B2 (en) | 2019-02-26 |
| US9709510B2 (en) | 2017-07-18 |
| IL248647A0 (en) | 2017-01-31 |
| CN108508028B (zh) | 2021-03-09 |
| CN106415249B (zh) | 2018-06-12 |
| KR20170021830A (ko) | 2017-02-28 |
| WO2015200856A1 (en) | 2015-12-30 |
| US20170292918A1 (en) | 2017-10-12 |
| JP6652511B2 (ja) | 2020-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |