CN106413262A - PCB substrate batch marking device - Google Patents
PCB substrate batch marking device Download PDFInfo
- Publication number
- CN106413262A CN106413262A CN201610986165.XA CN201610986165A CN106413262A CN 106413262 A CN106413262 A CN 106413262A CN 201610986165 A CN201610986165 A CN 201610986165A CN 106413262 A CN106413262 A CN 106413262A
- Authority
- CN
- China
- Prior art keywords
- platform
- pcb substrate
- plc
- frame
- pushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000002372 labelling Methods 0.000 claims description 36
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000003825 pressing Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The invention discloses a PCB substrate batch marking device, which comprises a rack, a pressing mechanism, a horizontal moving mechanism, a vertical moving mechanism, a marking cutting tool and a PLC controller, wherein a pushing platform is arranged on the rack; the pressing mechanism is arranged on the rack and located above the front-side edge of the pushing platform; the horizontal moving mechanism is arranged on the rack and located in front of the pushing platform; the vertical moving mechanism is arranged on the horizontal moving mechanism and located in front of the pushing platform; the marking cutting tool is arranged on the vertical moving mechanism and located at the front-side edge of the pushing platform; and the PLC controller is respectively connected with the pressing mechanism, the horizontal moving mechanism, the vertical moving mechanism and the marking cutting tool. A whole stack marking mode is adopted to mark the PCB substrates, the operation is simple and convenient, the marking efficiency is improved, the production cost is reduced, whole stack batch marking is realized, and production demands are met.
Description
Technical field
The present invention relates to PCB substrate production equipment technical field, more particularly, to a kind of PCB substrate batch labelling apparatus.
Background technology
At present in PCB substrate production technology, monolithic labelling or whole folded labelling are used to back flow plate, lamina rara externa, to PCB base
Plate uses monolithic labelling, is reached by not isolabeling lot number and can clearly distinguish between batch, is easy to production operation more
Accurately distinguish the product of same item number different batches so that every kind of product all has trackability.
In PCB production technology, it is not marked due in the PCB substrate PCB course of processing before lamination, or logical
Crossing monolithic labelling to make a distinction, production effect being substantially reduced, especially for the product not being marked, once quality occurs asking
Topic, so that quality cannot obtain management and control well the reason cannot trace back to real.
Existing PCB substrate is typically with the modes such as coding or laser and carries out monolithic labelling, the equipment of these labellings
Operation easier is larger, easily causes maloperation, and needs multiple devices to be processed simultaneously, increased production cost, same to markers
Note efficiency low it is difficult to meet current production needs.
For this reason, applicant carried out beneficial exploration and trial, have found result of the above problems, will be detailed below being situated between
The technical scheme continuing produces under this background.
Content of the invention
The technical problem to be solved：There is provided for the deficiencies in the prior art a kind of simple to operate, prevent by mistake
Operation, reduction production cost, the PCB substrate batch labelling apparatus improving labeling effciency, can achieve whole folded batch marking operation.
Technical problem solved by the invention can employ the following technical solutions to realize：
A kind of PCB substrate batch labelling apparatus, including：
One frame, described frame is constituted a push platform；
One is arranged in described frame and is located at the hold-down mechanism of the described top of forward edge pushing platform；
One is arranged in described frame and is located at the horizontal mobile mechanism in the described front pushing platform；
One is arranged on described horizontal mobile mechanism and is located at the vertical shift mechanism in the described front pushing platform；
One is arranged in described vertical shift mechanism and is located at the labelling cutting edge at the forward edge of described push platform
Tool；And
One PLC, described PLC respectively with described hold-down mechanism, horizontal mobile mechanism, vertical shift mechanism
And labelling cutting tool connects.
In a preferred embodiment of the invention, described push platform offers some ventholes, in described machine
One gas supply mechanism being connected with described PLC is additionally provided with frame, the gas outlet of described gas supply mechanism is pushed away with described respectively
The venthole sending platform connects, for gas produced by described gas supply mechanism is delivered to the described surface pushing platform.
In a preferred embodiment of the invention, the described side pushing on platform is provided with one to prolong along pushing direction
The spacing shelves side stretched.
In a preferred embodiment of the invention, it is provided with a limiting block at the forward edge of described push platform
Block.
In a preferred embodiment of the invention, described hold-down mechanism includes a compression cylinder and a strip plate, institute
State compression cylinder to be arranged in described frame, and be located at the top of the described forward edge pushing platform, and control with described PLC
Device connects, and the outfan of described compression cylinder is extended straight down and is connected with described strip plate, for controlling described bar shaped
Pressing plate vertically moves up and down.
The operation principle of the PCB substrate batch labelling apparatus of the present invention is as follows：
Whole folded PCB substrate is placed on push platform, and whole folded PCB substrate is pushed to forward labelling station, that is, whole folded
The leading edge of PCB substrate with push platform forward edge concordant, PLC control hold-down mechanism by push put in place whole fold
The front side portion of PCB substrate compresses it is ensured that whole folded PCB substrate will not shift, and then PLC controls labelling cutting tool
Rotate, control horizontal mobile mechanism and vertical shift mechanism to carry out action simultaneously, labelling cutting tool in horizontal mobile mechanism and
Under the drive of vertical shift mechanism, whole folded labelling is carried out to the cephalolateral margin of whole folded PCB substrate.
Due to employing technical scheme as above, the beneficial effects of the present invention is：The present invention adopts the side of whole folded labelling
Formula is marked to PCB substrate, simple and quick, improves labeling effciency, reduces production cost, realizes whole folded batch mark
Note, meets Production requirement.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the side view of the PCB substrate batch labelling apparatus of the present invention.
Fig. 2 is the top view of the PCB substrate batch labelling apparatus of the present invention.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention realizes are easy to understand, tie below
Conjunction is specifically illustrating, and the present invention is expanded on further.
Referring to Fig. 1 and Fig. 2, what in figure was given is a kind of PCB substrate batch labelling apparatus, including frame 100, hold-down mechanism
200th, horizontal mobile mechanism 300, vertical shift mechanism 400, labelling cutting tool 500 and PLC 600.
Constituting in frame 100 has a push platform 110, pushes and offers some ventholes 111, in frame on platform 110
Be provided with a gas supply mechanism (not shown) being connected with PLC 600 on 100, the gas outlet of gas supply mechanism respectively with
The venthole 111 pushing platform 110 connects, for gas produced by gas supply mechanism is delivered to the surface pushing platform 110,
And gas produced by gas supply mechanism to be placed on the buoyancy that the whole folded PCB substrate pushing on platform 110 produces be slightly lower than whole
The gravity of folded PCB substrate.So when whole folded PCB substrate is placed on push platform 110 and pushes forward whole folded PCB substrate
When, the abrasion to the PCB substrate being located at bottom in whole folded PCB substrate can be avoided.
Hold-down mechanism 200 is arranged in frame 100 and is located at the top of the forward edge pushing platform 110.Specifically, press
Tight mechanism 200 includes a compression cylinder 210 and a strip plate 220, and compression cylinder 210 is arranged in frame 100, and is located at and pushes away
Send the top of the forward edge of platform 110, and be connected with PLC 600, the outfan of compression cylinder 210 prolongs straight down
Stretch and be connected with strip plate 220, for controlling strip plate 220 vertically to move up and down, when whole folded PCB substrate is flat along pushing
During the pushed station to labelling of platform 110, PLC 600 controls compression cylinder 210 action, and compression cylinder 210 drives bar shaped pressure
Plate 220 moves straight down, and the front side portion compression by whole folded PCB substrate, prevents whole folded PCB substrate from occurring in labelling partially
Move.
Horizontal mobile mechanism 300 is arranged in frame 100, and is located at the front pushing platform 110, and and PLC
600 connections, under the control of PLC 600, can produce horizontal displacement action, this mechanism is existing mechanism, and here is no longer
Repeat.
Vertical shift mechanism 400 is arranged on horizontal mobile mechanism 300, and is located at the front pushing platform 110, and with
PLC 600 connects, and under the control of PLC 600, can produce vertical displacement action, and this mechanism is existing machine
Structure, will not be described here.
Labelling cutting tool 500 is arranged on labelling cutting tool 500, and is located at the forward edge pushing platform 110,
And be connected with PLC 600.
For the ease of the push positioning of whole folded PCB substrate, the side on pushing platform 110 is provided with one along push direction
The spacing shelves side 112 extending, when whole folded PCB substrate is when pushing platform 110 and pushing, the edge of whole folded PCB substrate againsts spacing
Shelves side 112 is pushed, and so ensures the regularity in the process of push for the whole folded PCB substrate.
For the ease of the push positioning of whole folded PCB substrate, at the forward edge pushing platform 110, it is provided with a limiting block
Block (not shown), when whole folded PCB substrate pushes forward along push platform 110, positive stop is to whole folded PCB substrate
Leading edge is positioned it is ensured that the labelling accuracy of whole folded PCB substrate.
Ultimate principle and principal character and the advantages of the present invention of the present invention have been shown and described above.The technology of the industry
, it should be appreciated that the present invention is not restricted to the described embodiments, the simply explanation described in above-described embodiment and description is originally for personnel
The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these changes
Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and its
Equivalent thereof.
Claims (5)
1. a kind of PCB substrate batch labelling apparatus are it is characterised in that include：
One frame, described frame is constituted a push platform；
One is arranged in described frame and is located at the hold-down mechanism of the described top of forward edge pushing platform；
One is arranged in described frame and is located at the horizontal mobile mechanism in the described front pushing platform；
One is arranged on described horizontal mobile mechanism and is located at the vertical shift mechanism in the described front pushing platform；
One is arranged in described vertical shift mechanism and is located at the labelling cutting tool at the forward edge of described push platform；With
And
One PLC, described PLC respectively with described hold-down mechanism, horizontal mobile mechanism, vertical shift mechanism and
Labelling cutting tool connects.
2. PCB substrate batch labelling apparatus as claimed in claim 1 are it is characterised in that offer on described push platform
Some ventholes, are additionally provided with a gas supply mechanism being connected with described PLC in described frame, described gas supply mechanism
Gas outlet is connected with the described venthole pushing platform respectively, described for being delivered to gas produced by described gas supply mechanism
Push the surface of platform.
3. PCB substrate batch labelling apparatus as claimed in claim 1 it is characterised in that described push platform on side
It is provided with one along the spacing shelves side pushing direction extension.
4. PCB substrate batch labelling apparatus as claimed in claim 1 it is characterised in that described push platform front side edge
It is provided with a positive stop at edge.
5. the PCB substrate batch labelling apparatus as any one of Claims 1-4 are it is characterised in that described hold-down mechanism
Including a compression cylinder and a strip plate, described compression cylinder is arranged in described frame, and is located at described push platform
The top of forward edge, and being connected with described PLC, the outfan of described compression cylinder extend straight down and with described
Strip plate connects, for controlling described strip plate vertically to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610986165.XA CN106413262A (en) | 2016-11-09 | 2016-11-09 | PCB substrate batch marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610986165.XA CN106413262A (en) | 2016-11-09 | 2016-11-09 | PCB substrate batch marking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413262A true CN106413262A (en) | 2017-02-15 |
Family
ID=59229827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610986165.XA Pending CN106413262A (en) | 2016-11-09 | 2016-11-09 | PCB substrate batch marking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106413262A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309974A (en) * | 2017-07-29 | 2017-11-03 | 深圳市乐维机械有限公司 | A kind of whole folded labelling apparatus of sheet material sawing sheet |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224250A (en) * | 1990-07-13 | 1993-07-06 | Murata Manufacturing Co., Ltd. | Apparatus for manufacturing ceramic capacitors |
| CN201109246Y (en) * | 2007-10-12 | 2008-09-03 | 深圳市大族激光科技股份有限公司 | Automatic laser marking gear |
| CN101399171A (en) * | 2007-09-25 | 2009-04-01 | 大日本网屏制造株式会社 | Method of forming alignment mark |
| CN202059689U (en) * | 2011-03-15 | 2011-11-30 | 安徽威远电路板有限公司 | Post-treatment apparatus for circuit board hot air leveling treatment |
| CN102456536A (en) * | 2010-10-19 | 2012-05-16 | 格兰达技术（深圳）有限公司 | High-accuracy position system for bar of marking machine |
| CN104015498A (en) * | 2014-05-28 | 2014-09-03 | 阿博建材（昆山）有限公司 | Marking device with automatic clamping and positioning function |
| CN203956959U (en) * | 2014-07-02 | 2014-11-26 | 广东万昌印刷包装有限公司 | A kind of special-shaped trade mark cutting means |
| CN104820346A (en) * | 2015-04-24 | 2015-08-05 | 深圳市大川光电设备有限公司 | Flat workpiece alignment method |
| CN104890372A (en) * | 2015-05-29 | 2015-09-09 | 歌尔声学股份有限公司 | Scrapped PCB marking device and marking method thereof |
| CN105195902A (en) * | 2015-10-15 | 2015-12-30 | 浙江欧威科技有限公司 | PCB dry film circuit digitized film cutting machine |
| CN204997397U (en) * | 2015-09-30 | 2016-01-27 | 安徽应流机电股份有限公司 | Circuit board is clamping processingequipment in batches |
| CN205272869U (en) * | 2016-01-14 | 2016-06-01 | 济南新天科技有限公司 | Vulcanize laser marking machine of signing |
| CN205341989U (en) * | 2016-01-22 | 2016-06-29 | 东莞市南兴家具装备制造股份有限公司 | Duplex head double -clamp machining center that drills |
| CN206196146U (en) * | 2016-11-09 | 2017-05-24 | 上海展华电子有限公司 | PCB base plate is mark device in batches |
-
2016
- 2016-11-09 CN CN201610986165.XA patent/CN106413262A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224250A (en) * | 1990-07-13 | 1993-07-06 | Murata Manufacturing Co., Ltd. | Apparatus for manufacturing ceramic capacitors |
| CN101399171A (en) * | 2007-09-25 | 2009-04-01 | 大日本网屏制造株式会社 | Method of forming alignment mark |
| CN201109246Y (en) * | 2007-10-12 | 2008-09-03 | 深圳市大族激光科技股份有限公司 | Automatic laser marking gear |
| CN102456536A (en) * | 2010-10-19 | 2012-05-16 | 格兰达技术（深圳）有限公司 | High-accuracy position system for bar of marking machine |
| CN202059689U (en) * | 2011-03-15 | 2011-11-30 | 安徽威远电路板有限公司 | Post-treatment apparatus for circuit board hot air leveling treatment |
| CN104015498A (en) * | 2014-05-28 | 2014-09-03 | 阿博建材（昆山）有限公司 | Marking device with automatic clamping and positioning function |
| CN203956959U (en) * | 2014-07-02 | 2014-11-26 | 广东万昌印刷包装有限公司 | A kind of special-shaped trade mark cutting means |
| CN104820346A (en) * | 2015-04-24 | 2015-08-05 | 深圳市大川光电设备有限公司 | Flat workpiece alignment method |
| CN104890372A (en) * | 2015-05-29 | 2015-09-09 | 歌尔声学股份有限公司 | Scrapped PCB marking device and marking method thereof |
| CN204997397U (en) * | 2015-09-30 | 2016-01-27 | 安徽应流机电股份有限公司 | Circuit board is clamping processingequipment in batches |
| CN105195902A (en) * | 2015-10-15 | 2015-12-30 | 浙江欧威科技有限公司 | PCB dry film circuit digitized film cutting machine |
| CN205272869U (en) * | 2016-01-14 | 2016-06-01 | 济南新天科技有限公司 | Vulcanize laser marking machine of signing |
| CN205341989U (en) * | 2016-01-22 | 2016-06-29 | 东莞市南兴家具装备制造股份有限公司 | Duplex head double -clamp machining center that drills |
| CN206196146U (en) * | 2016-11-09 | 2017-05-24 | 上海展华电子有限公司 | PCB base plate is mark device in batches |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309974A (en) * | 2017-07-29 | 2017-11-03 | 深圳市乐维机械有限公司 | A kind of whole folded labelling apparatus of sheet material sawing sheet |
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Legal Events
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |