JP2011191514A - Apparatus for edge cut machining on substrate of liquid crystal display panel prior to uv curing - Google Patents

Apparatus for edge cut machining on substrate of liquid crystal display panel prior to uv curing Download PDF

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JP2011191514A
JP2011191514A JP2010057494A JP2010057494A JP2011191514A JP 2011191514 A JP2011191514 A JP 2011191514A JP 2010057494 A JP2010057494 A JP 2010057494A JP 2010057494 A JP2010057494 A JP 2010057494A JP 2011191514 A JP2011191514 A JP 2011191514A
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substrate
edge
carry
path
cutter
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JP5550107B2 (en
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Hiroji Murasawa
Akira Shirai
浩次 村澤
明 白井
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Shiraitekku:Kk
株式会社シライテック
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    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133351Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/04Transporting of hot hollow or semi-hollow glass products
    • C03B35/06Feeding of hot hollow glass products into annealing or heating kilns
    • C03B35/12Feeding of hot hollow glass products into annealing or heating kilns by picking-up and depositing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • C03B35/202Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames by supporting frames

Abstract

<P>PROBLEM TO BE SOLVED: To cut an edge of a substrate of a liquid crystal display (LCD) panel prior to UV curing, without adding an excess stress on a liquid crystal substrate before a polymer alignment processing. <P>SOLUTION: A carry-in path A, tables B arranged in parallel to one another and having a group of small holes 1 for ejecting air for floatation and suction for holding, and a carry-out path C are arranged in series. A substrate X is transferred from the carry-in path to the tables by use of a drawing pawl 21, a substrate on the tables is transferred to the carry-out path by use of an ejecting pawl 22, the lower face at an edge of a CF plate that constitutes the substrate is scribed with a cutter, and the substrate is split at the scribed portion by a twist-splitting device H. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、LCDパネルUV硬化前基板のエッジをカットする加工装置に関する。   The present invention relates to a processing apparatus for cutting an edge of a substrate before LCD panel UV curing.
ガラス基板のエッジをカットする従来技術としては、既に知られている(特許文献1参照)。   It is already known as a prior art for cutting the edge of a glass substrate (see Patent Document 1).
特開2010−26267号公報JP 2010-26267 A
ところで、特許文献1の加工方式によると、ガラス基板にカッタにより切断線を入れ、この切断線の部分に分断手段の応力を加えて分断する。   By the way, according to the processing method of Patent Document 1, a cutting line is put into a glass substrate by a cutter, and the cutting line is divided by applying stress of a cutting means.
このような方式をLCDパネルUV硬化前基板のエッジカットに採用すると、ポリマー配向処理前の液晶基板に余分なストレスをかけて、エッジカットの処理ができず、不良品が発生する。すなわち、LCDパネルUV硬化前基板のエッジカット加工をすることができない。   When such a method is employed for edge cutting of the substrate before curing the LCD panel UV, excessive stress is applied to the liquid crystal substrate before polymer alignment treatment, and the edge cutting cannot be performed, resulting in defective products. That is, it is not possible to perform edge cutting of the substrate before LCD panel UV curing.
そこで、この発明は、エッジカットの加工に際しポリマー配向処理前の液晶基板に余分なストレスをかけることなく加工できるようにしたことにある。   Therefore, the present invention is to enable processing without applying extra stress to the liquid crystal substrate before the polymer alignment treatment in processing of edge cutting.
上記の課題を解決するために、この発明は、LCDパネルUV硬化前の基板を供給する搬入路と、この搬入路の前方に搬入方向に沿って多数並列すると共に、荷受けする上記基板の浮上エアの噴出及び上記基板の保持吸引の小孔群を有する並列テーブルと、この並列両側のテーブルをセンタのテーブルに対し接近、離反スライドさせるように設けたスライド手段と、上記テーブルの前方に設けたエッジカットずみの基板を搬出するように設けた搬出路と、上記基板の走行路両側で走行手段により前後方向に走行する台車と、この台車に昇降手段により待機位置から上昇し、かつ前後方向移動手段により上記搬入路上の上記基板の前縁両端をクランプするように設けた引き込み爪及びテーブル上浮上基板の後縁両端をクランプするように設けた払い出し爪と、上記テーブル上の基板をアライメントするように設けたアライメント手段と、上記基板のアライメントマークを読み取るように設けたカメラと、上記センタのテーブル間で両端が前後方向にアームと、このアームの両端に上記基板の前後縁をクランプするように設けたアライメント爪と、上記アームを待機位置からクランプ位置に上昇させる昇降手段と、上記カメラによるアライメントマークの読み取りにともないアライメント制御を行なうように上記アームを旋回揺動させる旋回揺動手段とで構成したアライメント装置と、上記テーブル上の吸引保持基板の両側で走行手段により前後方向に走行するように設けたカッタ台車と、このカッタ台車に昇降手段により上昇させて上記基板を構成するCF板の下面辺縁に当接するように設けたカッタと、上記テーブル上の吸引保持基板の両側に移動手段により前記基板の辺縁に接近、離反するように設けたサイド台車と、このサイド台車に搭載した上記基板のTFT板上面の辺縁部に昇降手段の作用により当接する押えバー材と、基板のCF板下面のスクライブ線外側の辺縁部に昇降手段の作用により当接する折割バー材とで構成した捻り折割装置とからなる構成を採用する。   In order to solve the above-described problems, the present invention provides a carry-in path for supplying a substrate before curing the LCD panel UV, and a large number of parallel airflow along the carry-in direction in front of the carry-in path and the floating air of the board that receives the load. A parallel table having a group of small holes for ejecting the substrate and holding and sucking the substrate, slide means provided to slide the tables on both sides of the parallel toward and away from the center table, and an edge provided in front of the table An unloading path provided to unload the cut substrate, a cart that travels in the front-rear direction by the traveling means on both sides of the travel path of the substrate, and a moving means that moves up and down from the standby position by the lifting means to the cart Provided to clamp both ends of the leading edge of the substrate on the carry-in path and clamp both ends of the trailing edge of the floating substrate on the table. A projecting claw, an alignment means provided to align the substrate on the table, a camera provided to read the alignment mark on the substrate, an arm in the front-rear direction between the center table, Alignment claws provided to clamp the front and rear edges of the substrate at both ends of the arm, lifting and lowering means for raising the arm from the standby position to the clamping position, and alignment control as the alignment mark is read by the camera An alignment device comprising a swing swinging means for swinging and swinging the arm, a cutter carriage provided so as to travel in the front-rear direction by the travel means on both sides of the suction holding substrate on the table, and ascending and descending to the cutter carriage It is raised by the means and comes into contact with the lower edge of the CF plate constituting the substrate. A side carriage provided on both sides of the suction holding substrate on the table so as to approach and separate from the edge of the substrate by moving means, and an upper surface of the TFT plate of the substrate mounted on the side carriage. A torsional folding device composed of a presser bar material that comes into contact with the edge portion by the action of the elevating means and a folding bar material that makes contact with the edge portion outside the scribe line on the lower surface of the CF plate of the substrate by the action of the elevating means The structure which consists of is adopted.
また、前記カッタの近傍位置に、カッタによるスクライブラインを読み取るカメラを搭載した構成を採用する。   Further, a configuration is adopted in which a camera that reads a scribe line by the cutter is mounted in the vicinity of the cutter.
さらに、前記カッタのスクライブ方行後側に、スクライブにより発生するカレットを吸引する吸引ボックスを設けた構成を採用する。   Furthermore, the structure which provided the suction box which attracts | sucks the cullet which generate | occur | produces by scribing is employ | adopted on the scribe direction side of the said cutter.
以上のように、この発明のLCDパネルUV硬化前基板のエッジカット加工装置によれば、搬入路上の基板の前縁両端部を引き込み爪によりクランプし、テーブル上の加工ずみ浮上基板の後縁両端部を払い出し爪によりクランプして、搬入路からテーブル上に、テーブル上から搬出路に搬送するため、ポリマー配向処理前の液晶基板にストレスをかけることなく搬送すると共に、テーブル上に基板の下面を吸引保持して、保持状況下にカッタによりスクライブし、その後に基板のTFT板上面に押えバー材を当接し、基板のCF板下面に折割バー材を当接して、押えバー材と折割バー材との折割装置による捻りによりCF板の辺縁のエッジを折割加工するので、上述と同様にポリマー配向処理前にストレスをかけることなくエッジ加工を行なうことができる。   As described above, according to the edge cut processing apparatus for the LCD panel UV curing substrate of the present invention, both ends of the front edge of the substrate on the carry-in path are clamped by the pulling claws, and both ends of the trailing edge of the processed floating substrate on the table are obtained. The part is clamped by a discharge claw and transported from the carry-in path to the table and from the table to the carry-out path, so that the liquid crystal substrate before the polymer alignment treatment is transported without stress, and the lower surface of the substrate is placed on the table. Suction and hold, scribe with the cutter under the holding condition, and then contact the presser bar material to the upper surface of the TFT plate of the substrate, and contact the folding bar material to the lower surface of the CF plate of the substrate, Since the edge of the edge of the CF plate is split by twisting with a bar material splitting device, the edge processing is performed without applying stress before the polymer orientation treatment as described above. It is possible.
そして、カメラによりアライメントマークを読み取ってアライメント装置により基板のアライメントを行なうため、エッジ加工の不良品の発生もないと共に、スライド手段により両サイドのテーブルをスライドさせて、基板の縦長、横長にも対応できる。   And since the alignment mark is read by the camera and the substrate is aligned by the alignment device, there is no occurrence of defective edge processing, and the table on both sides is slid by the sliding means to support the portrait and landscape orientation of the substrate. it can.
また、カメラによりスクライブラインを読み取るので、スクライブラインの不良加工もなくすることができる。   Further, since the scribe line is read by the camera, it is possible to eliminate defective processing of the scribe line.
さらに、スクライブの際に発生したカレットをカッタと共に走行する吸引ボックスにより吸引して、基板面のカレットを除去することもできる。   Furthermore, the cullet generated during scribing can be sucked by a suction box that travels with the cutter, and the cullet on the substrate surface can be removed.
図1は、この発明の第1の実施形態を示す平面図である。FIG. 1 is a plan view showing a first embodiment of the present invention. 図2は、同上の爪の部分を示す拡大側面図である。FIG. 2 is an enlarged side view showing the nail portion. 図3は、同上の縦断拡大正面図である。FIG. 3 is a longitudinally enlarged front view of the above. 図4は、爪のアライメントローラを示す拡大側面図である。FIG. 4 is an enlarged side view showing a claw alignment roller. 図5は、アライメント装置を示す拡大側面図である。FIG. 5 is an enlarged side view showing the alignment apparatus. 図6は、割折の部分を示す拡大側面図である。FIG. 6 is an enlarged side view showing a split portion. 図7は、同上の拡大正面図である。FIG. 7 is an enlarged front view of the above. 図8は、アライメントローラ及び折割装置の部分の拡大側面図である。FIG. 8 is an enlarged side view of portions of the alignment roller and the folding device. 図9は、スクライブカッタを示す縦断拡大正面図である。FIG. 9 is a longitudinally enlarged front view showing the scribe cutter. 図10は、折割装置の要部を示す縦断拡大正面図である。FIG. 10 is a longitudinally enlarged front view showing a main part of the folding device. 図11は、カレットの吸引を示す縦断拡大正面図である。FIG. 11 is a longitudinally enlarged front view showing suction of cullet. 図12は、爪の作用を示す側面図である。FIG. 12 is a side view showing the action of the nail. 図13は、折割の作用を示す縦断拡大正面図である。FIG. 13 is a longitudinally enlarged front view showing the action of folding. 図14は、基板の縦断拡大正面図である。FIG. 14 is a longitudinally enlarged front view of the substrate.
以下、この発明の実施形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.
第1の実施形態を図1から図10に示すもので、Aは、LCDパネルUV硬化前の基板Xを供給する搬入路、Bは搬入路Aの前方に搬入方向に沿って多数並列すると共に、荷受けする基板Xの浮上エアの噴出及び基板Xの保持吸引用の小孔1群を有する並列テーブル、Cは並列テーブルB上の基板X(エッジ加工ずみの)を前方に搬出して荷受けする搬出路である。   The first embodiment is shown in FIG. 1 to FIG. 10, wherein A is a carry-in path for supplying the substrate X before curing the LCD panel UV, and B is arranged in parallel along the carry-in direction in front of the carry-in path A. A parallel table having a group of small holes for ejecting the floating air of the substrate X to be loaded and holding and sucking the substrate X, C carries the substrate X (edge processed) on the parallel table B forward and receives it. It is a carry-out route.
上記の搬入路A及び搬出路Cは、図示の場合ローラコンベヤを使用したが、限定されない。   In the illustrated case, the carry-in path A and the carry-out path C use roller conveyors, but are not limited thereto.
上記の並列テーブルBは、図示の場合中空の横長なボックス2を並設し、このボックス2の頂壁に無数の小孔1を設けて形成する。   In the illustrated case, the parallel table B is formed by arranging hollow horizontally long boxes 2 in parallel and providing innumerable small holes 1 on the top wall of the boxes 2.
そして、各ボックス2内を連通するように接続したパイプやホース(図示省略)にポンプの運転によりエアを供給して、小孔1から噴出するエアにより基板Xを浮上させ、ポンプの運転によりボックス2内を吸引することで、テーブルBのボックス2上面に基板Xを吸引保持させるようになっている。   Then, air is supplied to the pipes and hoses (not shown) connected so as to communicate with each box 2 by the operation of the pump, the substrate X is levitated by the air ejected from the small holes 1, and the boxes are operated by the operation of the pump. The substrate X is sucked and held on the upper surface of the box 2 of the table B by sucking the inside of the table B.
上記両側のテーブルBは、センタ側のテーブルBに対しスライド手段Dにより接近、離反スライドするようになっている。   The table B on both sides is slid toward and away from the table B on the center side by the slide means D.
上記のスライド手段Dとしては、例えば図7に示すように、ベース3上のレール4に台車5のスライダ6をスライド自在に係合して、台車5上の脚材7を介し支持してある水平フレーム15にテーブルBを搭載し、ベース3に据え付けたモーター8の運転により可逆駆動する雄ネジ9を台車5に支持させた雌ネジ10にねじ込んで構成し、モーター8の可逆運転により台車5と共にサイドのテーブルBをスライドさせて、縦長な基板X、横長な基板Xはもとより、基板Xの両側縁間の幅が変動しても対応できるようになっている。   As the slide means D, for example, as shown in FIG. 7, the slider 6 of the carriage 5 is slidably engaged with the rail 4 on the base 3 and supported via the legs 7 on the carriage 5. A table B is mounted on the horizontal frame 15, and a male screw 9 that is reversibly driven by the operation of the motor 8 installed on the base 3 is screwed into a female screw 10 supported by the carriage 5. At the same time, the side table B is slid to cope with fluctuations in the width between both side edges of the substrate X as well as the vertically long substrate X and the horizontally long substrate X.
上記の基板Xは、図14に示すように、上下で対向する上側TFT板11、下側CF板12と、このTFT板11及びCF板12の各辺縁部の内側に介在した二条一組のシール材13と、このシール材13の内側でTFT板11とCF板12との間に封入したUV14とからなる。   As shown in FIG. 14, the substrate X includes an upper TFT plate 11 and a lower CF plate 12 that face each other in the vertical direction, and a set of two strips interposed inside each edge portion of the TFT plate 11 and the CF plate 12. And a UV 14 sealed between the TFT plate 11 and the CF plate 12 inside the seal material 13.
また、基板Xの走行路の両側に走行手段Eにより前後方向に走行する台車16が設けてある。   In addition, a carriage 16 that travels in the front-rear direction by travel means E is provided on both sides of the travel path of the substrate X.
上記の台車16は、水平フレーム15に設けてある水平なレール17に台車16に設けてあるスライダ18をスライド自在に係合して、台車16がスライドするようにしてある。   The carriage 16 is configured such that the carriage 16 slides by slidably engaging a slider 18 provided on the carriage 16 with a horizontal rail 17 provided on the horizontal frame 15.
そして、水平フレーム15と台車16との間に走行手段Eとしてのリニアモーターの一次側稼動子と二次側固定子が設けてあるが、限定されず、その他の構成により台車16を往復走行させてもよい。   A primary side operating element and a secondary side stator of the linear motor as the traveling means E are provided between the horizontal frame 15 and the carriage 16, but the invention is not limited, and the carriage 16 is reciprocated by other configurations. May be.
さらに、台車16には、シリンダなどによる昇降手段19により待機位置から基板Xの位置まで上昇し、かつシリンダなどによる前後方向移動手段20により搬入路A上の基板Xの前縁両端をクランプする引き込み爪21及びテーブルB上の基板Xの後縁両端をクランプする払い出し爪22が設けてある。   Further, the carriage 16 is lifted from the standby position to the position of the substrate X by a lifting / lowering means 19 such as a cylinder, and is retracted to clamp both ends of the front edge of the substrate X on the loading path A by a longitudinal movement means 20 such as a cylinder. Dispensing pawls 22 for clamping the pawl 21 and both ends of the rear edge of the substrate X on the table B are provided.
上記の台車16は、前後に二基並べて、移動手段20により接近、離反方向に或る程度スライドし、離反方向のスライドにともないクランプ用引き込み爪21が搬入路A上の基板Xの前縁に嵌り込み、クランプ用払い出し爪22がテーブルB上の基板Xの後縁に嵌り込み、引き込み爪21及び払い出し爪22をシリンダ23の作用により閉じて基板Xをクランプする。   Two carriages 16 are arranged side by side and are moved to a certain extent in the approaching and separating directions by the moving means 20, and the pulling claws 21 for clamping are moved to the front edge of the substrate X on the carry-in path A along with the sliding in the separating direction. The clamping and paying claw 22 is fitted to the rear edge of the substrate X on the table B, and the drawing claw 21 and the discharging claw 22 are closed by the action of the cylinder 23 to clamp the substrate X.
すると、走行手段Eを前進方向に運転することで、搬入路A上の基板XをテーブルB上に(このとき、小孔1群からのエアの噴出によりテーブルBのボックス2に対し基板Xを浮上させてUV14にストレスをかけないようになっている)基板Xを引き込み、テーブルB上の基板Xを(このとき上述と同様に基板Xを浮上させて、UV14にストレスをかけないようにしてある)搬出路Cに払い出す。   Then, by driving the traveling means E in the forward direction, the substrate X on the carry-in path A is placed on the table B (at this time, the substrate X is placed on the box 2 of the table B by the ejection of air from the small holes 1 group. The substrate X is lifted so that the UV 14 is not stressed, and the substrate X on the table B is lifted (the substrate X is lifted in the same manner as described above so that the UV 14 is not stressed). Yes) pays out to carry-out path C.
上記のように構成すると、図12(イ)に示すように待機位置にある引き込み爪21及び払い出し爪22を昇降手段19により図12(ロ)に示すように上昇させ、次いで移動手段20の伸長作用により台車16を若干前進走行させる。   When configured as described above, as shown in FIG. 12 (a), the retracting claw 21 and the payout claw 22 at the standby position are raised as shown in FIG. The carriage 16 is caused to travel slightly forward by the action.
すると、図12(ハ)に示すようにテーブルB上の基板Xの後縁を払い出し爪22によりチャッキングする。   Then, as shown in FIG. 12C, the trailing edge of the substrate X on the table B is chucked by the discharge claw 22.
次に移動手段20の伸長作用により台車16を後進させて、図12(ニ)に示すように搬入路A上の基板Xの前縁を引き込み爪21によりチャッキングする。   Next, the carriage 16 is moved backward by the extending action of the moving means 20, and the front edge of the substrate X on the carry-in path A is chucked by the retracting claw 21 as shown in FIG.
そして、走行手段Eにより台車16、16を前進走行させると、搬入路A上の基板Xを引き込み、テーブルB上の基板Xを払い出す。   Then, when the carriages 16 are moved forward by the traveling means E, the substrate X on the carry-in path A is pulled in and the substrate X on the table B is paid out.
なお、図2及び図4に示すように、引き込み爪21及び追い出し爪22の各上下の爪間に移動手段20の伸長作用により引き込み爪21、追い出し爪22がスライドした際、基板Xの辺縁に当接するローラ25が設けてあるので、基板Xがアライメントされる。   2 and 4, when the pulling claw 21 and the kicking claw 22 slide between the upper and lower claws of the pulling claw 21 and the kicking claw 22 by the extension action of the moving means 20, the edge of the substrate X Since the roller 25 which contacts is provided, the substrate X is aligned.
そして、テーブルB上に払い出した基板Xは、待機位置から降下し、次いで基板Xの両側縁に押し当てるアライメント用ローラ26によってアライメントされる。   Then, the substrate X delivered onto the table B is lowered from the standby position, and then aligned by the alignment rollers 26 that press against both side edges of the substrate X.
また、図5に示すように、中間のテーブルBに配置した両端が前後方向に向くアライメント装置Fとしてアーム85の中間を旋回支軸86により支持させて、この支軸86を可逆モーター99により旋回できるようにすると共に、アーム85の搬入路A側末端には、シリンダやサーボモーターなどの昇降手段87により昇降するベース88に基板Xの後縁をシリンダ89によって開閉する爪90によりクランプし、アーム85の搬出路C側先端には、シリンダやサーボモーターなどの進退手段91により前後方向に移動し、かつ昇降手段87と同様の昇降手段92により昇降するベース93に基板Xの前縁クランプ用にシリンダ94により開閉する爪95が設けてある。   Further, as shown in FIG. 5, the middle of the arm 85 is supported by a turning support shaft 86 as an alignment device F arranged on the intermediate table B so that both ends thereof are directed in the front-rear direction, and the support shaft 86 is turned by a reversible motor 99. In addition, the arm 85 is clamped at the end of the loading path A side of the arm 85 by a claw 90 that opens and closes the rear edge of the substrate X by a cylinder 89 on a base 88 that is lifted and lowered by a lifting means 87 such as a cylinder or a servomotor. The front end of the unloading path C on the side of 85 is moved in the front-rear direction by an advancing / retreating means 91 such as a cylinder or a servo motor, and is moved up and down by an elevating means 92 similar to the elevating means 87 for clamping the leading edge of the substrate X A claw 95 that is opened and closed by a cylinder 94 is provided.
すると、テーブルB上に払い出す基板XのアライメントマークをカメラPにより読み取って、数値制御によりモーター99を可逆運転することで、基板Xをアライメントする。   Then, the alignment mark of the board | substrate X paid out on the table B is read with the camera P, and the board | substrate X is aligned by carrying out the reversible operation of the motor 99 by numerical control.
上記爪95側を前後方向に移動することで、基板Xの前後方向の長さに変動があっても対応することができ、爪90、95間に設けてあるアライメントローラ98を基板Xの前縁、後縁に当接させて正確なアライメンを行なうことができる。   By moving the claw 95 side in the front-rear direction, it is possible to cope with variations in the length of the substrate X in the front-rear direction, and the alignment roller 98 provided between the claws 90, 95 is moved in front of the substrate X. Accurate alignment can be performed by contacting the edge and the rear edge.
勿論、アーム85の旋回揺動は、モーター99方式に限定されない。   Of course, the swing swing of the arm 85 is not limited to the motor 99 system.
さらに、テーブルBの両側には、走行手段Eにより前後方向に往復走行するカッタ台車36が設けてあり、このカッタ台車36にシリンダやサーボモーターなどの昇降手段37により昇降する昇降体38を設けて、この昇降体38の上端には、基板Xを構成するCF板12の辺縁部下面をスクライブするカッタ39が設けてある。   Further, on both sides of the table B, a cutter carriage 36 that reciprocates in the front-rear direction by a traveling means E is provided, and a lifting body 38 that is lifted and lowered by a lifting means 37 such as a cylinder or a servomotor is provided on the cutter carriage 36. A cutter 39 for scribing the lower surface of the edge of the CF plate 12 constituting the substrate X is provided at the upper end of the elevating body 38.
勿論、カッタ39には、シリンダ40により、昇降体38に上向きの加圧力を作用させるようにしてある。   Needless to say, upward force is applied to the lift 38 by the cylinder 40 in the cutter 39.
上記のカッタ台車36は、台車16と同様に水平フレーム15に設けてあるレール17にカッタ台車36に設けてあるスライダ18をスライド自在に係合して走行させ、走行手段Eは、台車16と同様に水平フレーム15とカッタ台車36とに一次側稼動子と二次側固定子とからなるリニアモーターを設けた。   Similarly to the carriage 16, the cutter carriage 36 is slidably engaged with the rails 17 provided on the horizontal frame 15, and the slider 18 provided on the cutter carriage 36 is slidable. Similarly, the horizontal frame 15 and the cutter carriage 36 are provided with linear motors composed of primary side operating elements and secondary side stators.
また、図6、7に示すように、両側の台車5上に柱材44を起立させて、この柱材44の上端水平なベース45の上面レール46を設けて、このレール46に移動台47の下面に設けてあるスライダ48をスライド自在に係合すると共に、ベース45に据え付けてあるモーター49によりドライブする雄ネジ50を移動台47の下面に支持してある雌ネジ51にねじ込んで、移動台47のスライド手段Gを構成する。   Further, as shown in FIGS. 6 and 7, a pillar material 44 is erected on the carriages 5 on both sides, and an upper surface rail 46 of a base 45 horizontal to the upper end of the pillar material 44 is provided. The slider 48 provided on the lower surface of the slider 45 is slidably engaged, and the male screw 50 driven by the motor 49 installed on the base 45 is screwed into the female screw 51 supported on the lower surface of the moving table 47 for movement. The slide means G of the base 47 is configured.
そして、各前後で対向する両移動台47の対向間に捻り折割装置Hが設けてある。   In addition, a twist-and-break device H is provided between the two movable tables 47 facing each other in the front-rear direction.
上記の捻り折割装置Hは、両移動台47の対向側面に支軸52を介し上下間の中央を揺動自在に支持した揺動体53と、移動台47の上面ベース54に可動的に据え付けて揺動体53の上端に可動的に連続した伸縮のためのサーボモーターやシリンダの伸縮手段55と、各揺動体53の前後対向面の上部及び下部にそれぞれ設けたサーボモーターやシリンダによる上部昇降体56及び下部昇降体57と、前後で対向する上部昇降体56、56に両端を支持させた上側横材58と、この上側横材58の下面に取付けてあるブラケット59に取付けたサーボモーターやシリンダのスライド作用体60の作用によりテーブルBの側縁に接近、離反スライドするスライダ61と、このスライダ61の内端に支持させた押えバー42と、前後で対向する下部昇降体57、57に両端を支持させた下側横材62と、この下側横材62の上面に支持させた折割受けバー63とで構成されている。   The torsional splitting device H is movably installed on a swinging body 53 that supports the center between the upper and lower sides via a support shaft 52 so as to be swingable on opposite side surfaces of both the moving bases 47 and an upper surface base 54 of the moving base 47. Servo motors and cylinder expansion / contraction means 55 that are movably continuously extended on the upper end of the rocking body 53, and upper lifting / lowering bodies by servo motors and cylinders respectively provided on the upper and lower sides of the front and rear facing surfaces of the rocking bodies 53. 56 and lower elevating body 57, upper cross member 58 supported at both ends by upper and lower elevating bodies 56 and 56 opposed in the front-rear direction, and a servo motor or cylinder attached to a bracket 59 attached to the lower surface of this upper cross member 58 The slider 61 that slides toward and away from the side edge of the table B by the action of the slide action body 60 and the presser bar 42 supported on the inner end of the slider 61 face each other in the front-rear direction. The lower cross member 62 in section lifting body 57, 57 was supported at both ends, and a bend-receiving bar 63 is supported on the upper surface of the lower horizontal member 62.
なお、折割受けバー63の上面(CF板12の下面と接触する面)は、揺動体53の上端側が伸縮手段55の作用により外側方に向け揺動して捻り折割する関係上、図8に示すように外側方(テーブルBの反対方向に)に傾斜させて、CF板12のスクライブラインでの捻り折割の方がスムーズに作用するようにしてある。   Note that the upper surface of the folding receiving bar 63 (the surface that contacts the lower surface of the CF plate 12) is twisted and bent due to the upper end of the swinging body 53 swinging outward by the action of the expansion / contraction means 55. As shown in FIG. 8, it is inclined outward (in the direction opposite to the table B) so that twisting and breaking along the scribe line of the CF plate 12 acts more smoothly.
なお、各アライメントローラ26は、上側横材58に支持させたサーボモーターやシリンダなどの上下方向の伸縮作用体64の下面に取付けて、押え位置と退避位置とに昇降するようになっている。   Each alignment roller 26 is attached to the lower surface of a vertically extending and contracting acting body 64 such as a servo motor or a cylinder supported by the upper cross member 58 so as to move up and down between a pressing position and a retracted position.
なお、図8、図13に示すようにスライダ61に刷子70を設けておくと、受けバー63の上面のカレットを清掃すると共に、受けバー63上の折割端材Yを受け箱Z内に排出することができる。   8 and 13, when the brush 70 is provided on the slider 61, the cullet on the upper surface of the receiving bar 63 is cleaned and the split end material Y on the receiving bar 63 is placed in the receiving box Z. Can be discharged.
次に、エッジカットを図13に基づいて説明する。   Next, edge cutting will be described with reference to FIG.
図13(イ)に示すように、基板XのCF板12のエッジ下面に向け下部昇降体57を作用させて受けバー63を上昇させ、上部昇降体56を作用させてTFT板11のエッジ上面に向け押えバー42を降下させる。   As shown in FIG. 13A, the lower lifting body 57 is acted on the lower surface of the edge of the CF plate 12 of the substrate X to raise the receiving bar 63 and the upper lifting body 56 is acted on to raise the upper surface of the edge of the TFT plate 11. The presser bar 42 is moved downward.
次に、伸縮手段55を作用させて揺動体53を揺動させながら、受けバー63を図13(ロ)に示すように傾動させると、CF板12の下面に設けてあるカッタ39により設けてあるスクライブラインSが折割される。   Next, when the receiving bar 63 is tilted as shown in FIG. 13B while swinging the swinging body 53 by operating the expansion / contraction means 55, the cutter 39 provided on the lower surface of the CF plate 12 is provided. A scribe line S is broken.
このとき、基板Xを構成するUV14にストレスをかけることなく折割される。   At this time, the UV 14 constituting the substrate X is folded without applying stress.
そして、図13(ハ)に示すように上部昇降体56の作用により押えバー42を上昇させ、下部昇降体57の作用により受けバー63を降下させる。   Then, as shown in FIG. 13C, the presser bar 42 is raised by the action of the upper elevating body 56, and the receiving bar 63 is lowered by the action of the lower elevating body 57.
その後にスライダ61を前進走行させて、刷子70によりカレットを清掃しながら、受けバー63上の折割端材Yを排出する。   Thereafter, the slider 61 is moved forward, and the folded end material Y on the receiving bar 63 is discharged while the cullet is cleaned by the brush 70.
次に、第2の実施形態を図2、7、11に基づいて説明する。   Next, a second embodiment will be described based on FIGS.
カッタ台車36のカッタ39によるスクライブ走行方向の後側に基板Xの辺縁上下に被さり(嵌装して)、かつCF板12の下面側に吸引口81を有する吸引ボックス82を設けておく。   A suction box 82 having a suction port 81 on the lower surface side of the CF plate 12 is provided on the lower side of the CF plate 12 on the rear side of the cutter carriage 36 in the scribing direction of the cutter 39.
吸引ボックス82の排気口83には、吸引ホース(図示省略)を接続しておく。   A suction hose (not shown) is connected to the exhaust port 83 of the suction box 82.
すると、カッタ39によりスクライブした際のカレットは、吸引ボックス82に吸引することができる。   Then, the cullet when scribed by the cutter 39 can be sucked into the suction box 82.
X 基板
A 搬入路
B テーブル
C 搬出路
D スライド手段
E 走行手段
F アライメント装置
G スライド手段
H 捻り折割装置
1 小孔
2 ボックス
3 ベース
4 レール
5 台車
6 スライダ
7 脚材
8 モーター
9 雄ネジ
10 雌ネジ
11 TFT板
12 CF板
13 シール材
14 UV
15 水平フレーム
16 台車
17 レール
18 スライダ
19 昇降手段
20 移動手段
21 引き込み爪
22 払い出し爪
23 シリンダ
25 ローラ
26 ローラ
36 カッタ台車
37 昇降手段
38 昇降体
39 カッタ
40 シリンダ
42 押えバー
44 柱材
45 ベース
46 レール
47 移動台
48 スライダ
49 モーター
50 雄ネジ
51 雌ネジ
52 支軸
53 揺動体
54 ベース
55 伸縮手段
56 上部昇降体
57 下部昇降体
58 上側横材
59 ブラケット
60 スライド作用体
61 スライダ
62 下側横材
63 受けバー
64 伸縮作用体
70 刷子
81 吸引口
82 吸引ボックス
85 アーム
86 支軸
87 昇降手段
88 ベース
89 シリンダ
90 爪
91 進退手段
92 昇降手段
93 ベース
94 シリンダ
95 爪
98 ローラ
99 モーター
X board A carry-in path B table C carry-out path D slide means E travel means F alignment device G slide means H twist breaker 1 small hole 2 box 3 base 4 rail 5 carriage 6 slider 7 leg material 8 motor 9 male screw 10 female Screw 11 TFT plate 12 CF plate 13 Sealing material 14 UV
DESCRIPTION OF SYMBOLS 15 Horizontal frame 16 Bogie 17 Rail 18 Slider 19 Lifting means 20 Moving means 21 Retraction claw 22 Discharging claw 23 Cylinder 25 Roller 26 Roller 36 Cutter bogie 37 Lifting means 38 Lifting body 39 Cutter 40 Cylinder 42 Presser bar 44 Base material 45 Base 46 Rail 47 Moving base 48 Slider 49 Motor 50 Male screw 51 Female screw 52 Support shaft 53 Oscillating body 54 Base 55 Extending / contracting means 56 Upper lifting / lowering body 57 Lower lifting / lowering body 58 Upper lateral member 59 Bracket 60 Slide acting body 61 Slider 62 Lower lateral member 63 Receiving bar 64 Telescopic action body 70 Brush 81 Suction port 82 Suction box 85 Arm 86 Support shaft 87 Lifting means 88 Base 89 Cylinder 90 Claw 91 Advancement / retraction means 92 Lifting means 93 Base 94 Cylinder 95 Claw 98 Low 99 motor

Claims (3)

  1. LCDパネルUV硬化前の基板を供給する搬入路と、この搬入路の前方に搬入方向に沿って多数並列すると共に、荷受けする上記基板の浮上エアの噴出及び上記基板の保持吸引の小孔群を有する並列テーブルと、この並列両側のテーブルをセンタのテーブルに対し接近、離反スライドさせるように設けたスライド手段と、上記テーブルの前方に設けたエッジカットずみの基板を搬出するように設けた搬出路と、上記基板の走行路両側で走行手段により前後方向に走行する台車と、この台車に昇降手段により待機位置から上昇し、かつ前後方向移動手段により上記搬入路上の上記基板の前縁両端をクランプするように設けた引き込み爪及びテーブル上浮上基板の後縁両端をクランプするように設けた払い出し爪と、上記テーブル上の基板をアライメントするように設けたアライメント手段と、上記基板のアライメントマークを読み取るように設けたカメラと、上記センタのテーブル間で両端が前後方向にアームと、このアームの両端に上記基板の前後縁をクランプするように設けたアライメント爪と、上記アームを待機位置からクランプ位置に上昇させる昇降手段と、上記カメラによるアライメントマークの読み取りにともないアライメント制御を行なうように上記アームを旋回揺動させる旋回揺動手段とで構成したアライメント装置と、上記テーブル上の吸引保持基板の両側で走行手段により前後方向に走行するように設けたカッタ台車と、このカッタ台車に昇降手段により上昇させて上記基板を構成するCF板の下面辺縁に当接するように設けたカッタと、上記テーブル上の吸引保持基板の両側に移動手段により前記基板の辺縁に接近、離反するように設けたサイド台車と、このサイド台車に搭載した上記基板のTFT板上面の辺縁部に昇降手段の作用により当接する押えバー材と、基板のCF板下面のスクライブ線外側の辺縁部に昇降手段の作用により当接する折割バー材とで構成した捻り折割装置とからなるLCDパネルUV硬化前基板のエッジカット加工装置。   A carry-in path for supplying a substrate before UV curing of the LCD panel, and a plurality of small holes for discharging the floating air of the substrate to be received and holding and sucking the substrate are arranged in parallel along the carry-in direction in front of the carry-in path. A parallel table, slide means provided to slide the tables on both sides of the parallel toward and away from the center table, and a carry-out path provided to carry out an edge-cut substrate provided in front of the table. A carriage that travels in the front-rear direction by the traveling means on both sides of the travel path of the board, and is lifted from the standby position by the lifting means to the carriage, and clamps both ends of the front edge of the substrate on the carry-in path by the longitudinal movement means The pull-in claw and the discharge claw provided to clamp both ends of the trailing edge of the table floating substrate and the substrate on the table are Alignment means provided to calibrate, a camera provided to read the alignment mark on the substrate, an arm in the front-rear direction between the center table, and the front and rear edges of the substrate clamped to both ends of the arm An alignment claw provided so as to lift, an elevating means for raising the arm from a standby position to a clamp position, and a swing swinging means for swinging and swinging the arm so as to perform alignment control as the alignment mark is read by the camera An alignment apparatus comprising: a cutter carriage provided on both sides of the suction holding substrate on the table so as to run in the front-rear direction by a running means; and a CF which is lifted by the lifting means on the cutter carriage to constitute the substrate. Cutter provided to contact the lower edge of the plate and suction on the table A side carriage provided on both sides of the holding substrate so as to approach and separate from the edge of the substrate by the moving means, and an edge portion of the upper surface of the TFT plate of the substrate mounted on the side carriage is brought into contact by the action of the raising and lowering means. Edge cutting of a substrate before UV curing of an LCD panel comprising a press bar material and a twisting and folding device composed of a folding bar material that abuts on the outer edge of the scribe line on the lower surface of the CF plate of the substrate by the action of an elevating means Processing equipment.
  2. 前記カッタの近傍位置に、カッタによるスクライブラインを読み取るカメラを搭載したことを特徴とする請求項1に記載のLCDパネルUV硬化前基板のエッジカット加工装置。   The apparatus for edge-cutting the substrate before LCD panel UV curing according to claim 1, wherein a camera that reads a scribe line by the cutter is mounted at a position near the cutter.
  3. 前記カッタのスクライブ方行後側に、スクライブにより発生するカレットを吸引する吸引ボックスを設けたことを特徴とする請求項1に記載のLCDパネルUV硬化前基板のエッジカット加工装置。   2. The edge cut processing apparatus for an LCD panel UV-cured substrate according to claim 1, wherein a suction box for sucking a cullet generated by the scribe is provided on the rear side of the cutter in the scribe direction.
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CN201010550661.3A CN102190435B (en) 2010-03-15 2010-11-19 Substrate trimming processing device of liquid crystal display panel
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