CN106411283A - Quartz crystal oscillator and preparation method thereof - Google Patents
Quartz crystal oscillator and preparation method thereof Download PDFInfo
- Publication number
- CN106411283A CN106411283A CN201610906801.3A CN201610906801A CN106411283A CN 106411283 A CN106411283 A CN 106411283A CN 201610906801 A CN201610906801 A CN 201610906801A CN 106411283 A CN106411283 A CN 106411283A
- Authority
- CN
- China
- Prior art keywords
- attach area
- die
- quartz crystal
- integrated circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 65
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 239000013078 crystal Substances 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000012212 insulator Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 9
- 239000003792 electrolyte Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Abstract
The invention applies to the field of an oscillator and provides a quartz crystal oscillator and a preparation method thereof. The oscillator comprises a piezoelectric quartz crystal oscillator and a substrate. The substrate is an independent element. An integrated circuit is packaged in the substrate. The substrate comprises a metal lead frame. The integrated circuit is electrically connected with the metal lead frame. The piezoelectric quartz crystal oscillator is electrically connected with the metal lead frame. The substrate of the oscillator is the independent element, due to the structure, the substrate and the piezoelectric quartz crystal oscillator are relatively independent, and the substrate and the piezoelectric quartz crystal oscillator can be processed independently. The piezoelectric quartz crystal oscillator can be prevented from being polluted when the integrated circuit is processed, so the stability of the oscillator can be improved. Moreover, the piezoelectric quartz crystal oscillator is processed independently, so the piezoelectric quartz crystal oscillator is enabled to satisfy design and production performance demands, a production yield of a product is improved, the waste for raw materials is reduced, and the production cost is reduced.
Description
Technical field
The invention belongs to field of oscillators, more particularly, to a kind of quartz oscillator and preparation method thereof.
Background technology
At present, the structure of quartz oscillator is that integrated circuit and piezoelectric quartz crystal resonance piece are enclosed in the same face
In cavity.In process, the contaminated chance of piezoelectric quartz crystal resonance piece can be increased, directly affect the parameter of agitator
And stability.
In addition, piezoelectric quartz crystal resonance piece and integrated circuit are enclosed in the cavity of the same face then it represents that quartz crystal
Agitator it is impossible to test its function, can lead to potential defect ware to be worked into and just pinpoint the problems during back segment before completing to produce,
Product fraction defective is caused to raise.Meanwhile, because finished product cannot be done over again, bad products can only directly be thrown aside, and wastes product raw material, increases
Add production cost.
Content of the invention
The technical problem to be solved is for providing a kind of quartz oscillator and preparation method thereof it is intended to reduce
Pollution to resonator in production process, improves production yield, reduces production cost.
For solving above-mentioned technical problem, the present invention is achieved in that a kind of quartz oscillator, including piezoquartz
Crystal resonator, this agitator also includes substrate, and described piezoelectric quartz crystal resonator and substrate are independent component, described
It is enclosed with integrated circuit, described substrate includes die-attach area, described integrated circuit is electrically connected with described die-attach area in substrate
Connect, described piezoelectric quartz crystal resonator is electrically connected with described die-attach area.
Further, described substrate also includes insulator, and described die-attach area is fixed on the outer surface of described insulator,
Described integrated circuit is located between described die-attach area and described insulator.
Further, described die-attach area has some pins, and described some pins are all fitted in described insulator
Outer surface, its part pin is electrically connected with described piezoelectric quartz crystal resonator.
Further, described piezoelectric quartz crystal resonator passes through conducting resinl or stannum slurry is bonded in described die-attach area
On part pin.
Further, described integrated circuit is electrically connected with described die-attach area by some metal wires, described some gold
Belong to line connection corresponding with the lead end of described some pins.
Further, described insulator is to print the plastic material of machine-shaping by injection, embedding or three-dimensional.
Further, described integrated circuit passes through conducting resinl or stannum slurry is bonded in described die-attach area.
For solving above-mentioned technical problem, present invention also offers a kind of preparation method of quartz oscillator, including with
Lower step：
Described die-attach area is fixed by metal outer frame；
Described integrated circuit is bonded in described die-attach area by electrolyte；
With metal wire, described integrated circuit is connected with the pin of described die-attach area；
With the mode of filling, plastic material is filled into the correspondence position of described die-attach area, is formed and cover in described collection
Become the insulator on circuit；
Remove described metal outer frame, and adjust the Pin locations of described die-attach area, form complete substrate；
Piezoelectric quartz crystal resonator is bonded on the substrate by electrolyte, and guarantees both consistencies from top to bottom.
Further, the preparation method of above-mentioned quartz oscillator is further comprising the steps of：
After several described die-attach area are fixed by metal outer frame, described some die-attach area are arranged in
One-dimensional or two-dimensional matrix.
The present invention compared with prior art, has the beneficial effects that：A kind of quartz oscillator of the present invention and its preparation
Method, described agitator includes independent component substrate, due to described substrate in structure with described piezoelectric quartz crystal resonator
Relatively independent, therefore all can be separately machined.Because integrated circuit is wrapped in substrate, when therefore can remove working integrated circuit from
Pollution to piezoelectric quartz crystal resonator, makes the stability of agitator be improved.And, piezoelectric quartz crystal resonator
The separately machined performance requirement that can ensure that piezoelectric quartz crystal resonator meets design and produces, improves the production yield of product,
Reduce the waste to raw material, reduce production cost.
Brief description
Fig. 1 is a kind of quartz oscillator structural representation provided in an embodiment of the present invention.
Fig. 2 is the structural representation of substrate in Fig. 1.
Fig. 3 is the internal structure schematic diagram of Fig. 2.
Fig. 4 to Figure 12 is the schematic diagram preparing each process of quartz oscillator.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples, right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only in order to explain the present invention, and
It is not used in the restriction present invention.
As shown in Figure 1 to Figure 3, a kind of quartz oscillator 100 provided in an embodiment of the present invention, it includes piezoquartz
Crystal resonator 1 and substrate 2, described substrate 2 is independent component, is enclosed with integrated circuit 21, described substrate includes metal in it
Lead frame 22, described integrated circuit 21 is electrically connected with described die-attach area 22, described piezoelectric quartz crystal resonator 1 with described
Die-attach area 22 electrically connects.
Described substrate 2 also includes insulation board 23, and in embodiments of the present invention, described insulation board 23 is plastic material, can lead to
Cross injection, embedding or three-dimensional to print machine-shaping.Described die-attach area 22 is fixed on the outer surface of described insulation board 23, is used for
Electrically connect with described piezoelectric quartz crystal resonator 1, described integrated circuit 21 is located at described die-attach area 22 and described insulation
Between plate 23.
The concrete structure of described substrate 2 is as shown in figure 3, described die-attach area 22 has some pins 221, described some
Pin 221 is all fitted in the outer surface of described insulation board 23, and its part pin 221 is electric with described piezoelectric quartz crystal resonator 1
Connect.
Described piezoelectric quartz crystal resonator 1 passes through conducting resinl or stannum slurry 4 is bonded in the part of described die-attach area 22
On pin 221, described integrated circuit 21 passes through conducting resinl or stannum slurry 4 is bonded in described die-attach area 22.Described integrated electricity
Road 21 is electrically connected with described die-attach area 22 by some metal wires 3, described some metal wires 3 and described some pins 221
Lead end corresponding connect, in order to be drawn out to the incoming end of described integrated circuit 21 in described die-attach area 22.By inciting somebody to action
The part pin 221 of described die-attach area 22 is electrically connected with described piezoelectric quartz crystal resonator 1, realizes described piezoquartz
Electrical connection between crystal resonator 1 and described integrated circuit 21.
By adjusting the design of die-attach area 22, can be effectively by integrated circuit 21 and piezoelectric quartz crystal resonator
1 connects it is also possible to support the connection of different model integrated circuit 21.By changing the model of integrated circuit 21, substrate 2 can be made
Support the agitator 100 of difference in functionality.By adding components and parts, the quantity of element needed for agitator 100 periphery can be reduced, enter one
Step will apply miniaturization.
As shown in Fig. 4 to Figure 12, the preparation flow of described quartz oscillator 100 is as follows：
S11, fixation：Die-attach area 22 is fixed by metal outer frame 5, makes some pins of described die-attach area 22
221 cannot relative movement；
S12, array：Above-mentioned some die-attach area 22 fixing by metal outer frame 5 are arranged in one-dimensional or Two-Dimensional Moment
Battle array, in order to produce in batches, improve production efficiency；
S13, smear electrolyte：With the mode smeared, conducting resinl or stannum slurry 4 are applied in described die-attach area 22；
S14, bonding integrated circuit：Integrated circuit 21 is passed through conducting resinl or stannum slurry 4 is bonded in described die-attach area 22
On；
S15, connection metal wire：With metal wire 3 by some pins of described integrated circuit 21 and described die-attach area 22
221 are connected；
S16, covering insulator：With the mode of filling, colloid is filled into the correspondence position of described die-attach area 22, shape
Become and cover the insulator 1 on described integrated circuit 21, the semi-finished product of composition substrate 2；
S17, adjustment pin：Remove described metal shell 5, and adjust pin 221 position of described die-attach area 22, make
Described some pins 221 are fitted in the outer surface of above-mentioned insulator 1, form complete substrate 2；
S18, bonding piezoelectric quartz crystal resonator：Piezoelectric quartz crystal resonator 1 is passed through conducting resinl or stannum slurry 4 bonding
On described complete substrate 2, and consistency from top to bottom, form described quartz oscillator 100.
A kind of quartz oscillator 100 of the present invention, including independent component substrate 2, in structure, described substrate 2 with
Described piezoelectric quartz crystal resonator 1 is relatively independent, therefore can be separately machined.Can remove from because during working integrated circuit 21 to pressure
The pollution of electric quartz-crystal resonator 1, makes the stability of agitator 100 be improved.Meanwhile, piezoelectric quartz crystal resonator 1
Separately machined can ensure that piezoelectric quartz crystal resonator 1 meet design and produce performance requirement, improve product production good
Rate, reduces the waste to raw material, reduces production cost.
Load onto in group, due to the independent molding of substrate 2, be connected with described piezoelectric quartz crystal resonator 1 more afterwards, can remove from
When producing in the matrix form, the performance of piezoelectric quartz crystal resonator 1 body described in the stress rupture in bulk-breaking operation.
In performance, integrated circuit 21 is to be connected with die-attach area 22, and metallic conduction performance is good, can effectively with institute
State piezoelectric quartz crystal resonator 1 and connect into circuit.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (9)
1. a kind of quartz oscillator, including piezoelectric quartz crystal resonator it is characterised in that this agitator also includes base
Piece, described piezoelectric quartz crystal resonator and substrate are independent component, are enclosed with integrated circuit, described base in described substrate
Piece includes die-attach area, and described integrated circuit is electrically connected with described die-attach area, described piezoelectric quartz crystal resonator with
Described die-attach area electrical connection.
2. quartz oscillator as claimed in claim 1 is it is characterised in that described substrate also includes insulator, described gold
Belong to the outer surface in described insulator for the lead frame attachment, described integrated circuit be located at described die-attach area and described insulator it
Between.
3. quartz oscillator as claimed in claim 2 is it is characterised in that described die-attach area has some pins,
Described some pins are all fitted in the outer surface of described insulator, and its part pin is electrically connected with described piezoelectric quartz crystal resonator
Connect.
4. quartz oscillator as claimed in claim 3 is it is characterised in that described piezoelectric quartz crystal resonator passes through to lead
Electric glue or stannum slurry are bonded on the part pin of described die-attach area.
5. quartz oscillator as claimed in claim 3 it is characterised in that described integrated circuit pass through some metal wires with
Described die-attach area electrical connection, described some metal wires are corresponding with the lead end of described some pins to be connected.
6. quartz oscillator as claimed in claim 2 it is characterised in that described insulator be by injection, embedding or
Three-dimensional is printd the plastic material of machine-shaping.
7. the quartz oscillator as described in any one in claim 1 to 6 is it is characterised in that described integrated circuit leads to
Cross conducting resinl or stannum slurry is bonded in described die-attach area.
8. a kind of preparation method of the quartz oscillator as described in any one in claim 1 to 6 it is characterised in that
Comprise the following steps：
Described die-attach area is fixed by metal outer frame；
Described integrated circuit is bonded in described die-attach area by electrolyte；
With metal wire, described integrated circuit is connected with the pin of described die-attach area；
With the mode of filling, plastic material is filled into the correspondence position of described die-attach area, is formed and cover in described integrated electricity
Insulator on road；
Remove described metal outer frame, and adjust the Pin locations of described die-attach area, form complete substrate；
Piezoelectric quartz crystal resonator is bonded on the substrate by electrolyte, and guarantees both consistencies from top to bottom.
9. the preparation method of quartz oscillator as claimed in claim 8 is it is characterised in that further comprising the steps of：
After several described die-attach area are fixed by metal outer frame, described some die-attach area are arranged in one-dimensional
Or two-dimensional matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610906801.3A CN106411283A (en) | 2016-10-18 | 2016-10-18 | Quartz crystal oscillator and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610906801.3A CN106411283A (en) | 2016-10-18 | 2016-10-18 | Quartz crystal oscillator and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106411283A true CN106411283A (en) | 2017-02-15 |
Family
ID=58012012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610906801.3A Pending CN106411283A (en) | 2016-10-18 | 2016-10-18 | Quartz crystal oscillator and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106411283A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004032456A (en) * | 2002-06-27 | 2004-01-29 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator for surface mounting |
| CN104283524A (en) * | 2014-10-22 | 2015-01-14 | 应达利电子(深圳)有限公司 | Piezoelectric quartz-crystal resonator and manufacturing method thereof |
| CN105450196A (en) * | 2015-11-30 | 2016-03-30 | 应达利电子股份有限公司 | Thermistor piezoelectric quartz crystal resonator and manufacturing process thereof |
| CN106031032A (en) * | 2014-05-07 | 2016-10-12 | 株式会社村田制作所 | Crystal oscillation apparatus |
| CN206117603U (en) * | 2016-10-18 | 2017-04-19 | 应达利电子股份有限公司 | Crystal oscillator |
-
2016
- 2016-10-18 CN CN201610906801.3A patent/CN106411283A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004032456A (en) * | 2002-06-27 | 2004-01-29 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator for surface mounting |
| CN106031032A (en) * | 2014-05-07 | 2016-10-12 | 株式会社村田制作所 | Crystal oscillation apparatus |
| CN104283524A (en) * | 2014-10-22 | 2015-01-14 | 应达利电子(深圳)有限公司 | Piezoelectric quartz-crystal resonator and manufacturing method thereof |
| CN105450196A (en) * | 2015-11-30 | 2016-03-30 | 应达利电子股份有限公司 | Thermistor piezoelectric quartz crystal resonator and manufacturing process thereof |
| CN206117603U (en) * | 2016-10-18 | 2017-04-19 | 应达利电子股份有限公司 | Crystal oscillator |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
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| RJ01 | Rejection of invention patent application after publication |