CN106410315A - Two-way flow battery heat management system and battery heat adjustment method - Google Patents
Two-way flow battery heat management system and battery heat adjustment method Download PDFInfo
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- CN106410315A CN106410315A CN201610481193.6A CN201610481193A CN106410315A CN 106410315 A CN106410315 A CN 106410315A CN 201610481193 A CN201610481193 A CN 201610481193A CN 106410315 A CN106410315 A CN 106410315A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/656—Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
- H01M10/6561—Gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/657—Means for temperature control structurally associated with the cells by electric or electromagnetic means
- H01M10/6572—Peltier elements or thermoelectric devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Secondary Cells (AREA)
Abstract
The invention discloses a two-way flow battery heat management system and a battery heat adjustment method. The two-way flow battery heat management system comprises a protection shell of a battery pack, air ducts, cooling fin groups, a processor module, cooling fans and semiconductor refrigerating and heating plates, wherein metal meshes and the air ducts are arranged on the upper surface and the lower surface of the protection shell; the air ducts are partitioned by a partition plate to form double air ducts; the semiconductor refrigerating and heating plates are arranged at the inner sides of the double air ducts; the cooling fin groups are fixed on a cold surface and a hot surface of each semiconductor refrigerating and heating plate; the cooling fans are arranged at air inlets of the air ducts; and the processor module controls the working states of the semiconductor refrigerating and heating plates and the cooling fans in real time according to the detected battery temperature. Through the two-way flow battery heat management system and the battery heat adjustment method, the temperature uniformity among single batteries is met and the problems of relatively poor use reliability and stability of the battery pack due to a cooling problem in the prior art are solved.
Description
Technical field
The present invention relates to battery thermal management technical field, more particularly to a kind of bidirectional flow battery thermal management system based on air dielectric and battery thermal conditioning method.
Background technology
It is on the rise with energy crisis and problem of environmental pollution, electric automobile arises at the historic moment.In electric automobile, one of most important part is set of cells, and set of cells is combined by substantial amounts of cell, and according to the heat production mechanism of battery, set of cells can produce substantial amounts of heat during high current charge-discharge.In order to keep the heat production of internal battery pack system thermal environment and the balance of radiating, electric automobile usually adopts battery thermal management system.If the radiating link of battery thermal management system breaks down or inefficient, the heat that may result in set of cells generation can not tens effectively dissipate in external environment, so that thermal accumlation is in inside battery, the too high temperature difference and battery between of battery pack temperature is caused to increase, when cell operating conditions temperature is too high, easily cause the issue of ASIC thermal failure of battery.When battery operating temperature is too low, the efficiency for charge-discharge of set of cells also declines therewith, there is potential safety hazard.
The design of existing battery thermal management system some employ relatively simple air dielectric cooling heat management system, to ensure the balance of internal battery pack system heat production and radiating.But when set of cells works under severe working environment, this mode difficulty makes battery in optimal working environment operated within range it is impossible to ensure the uniform temperature of temperature between battery, the service life of impact system.Therefore, existing technology cannot ensure dependability and the stability of set of cells.
Content of the invention
It is directed to the problems referred to above, the present invention providesA kind of bidirectional flow battery thermal management system and battery thermal conditioning method, in order to solve the problems, such as dependability and the less stable that set of cells in prior art produces because of heat dissipation problem.
For solving above-mentioned technical problem, according to the first aspect of the invention, there is provided a kind of bidirectional flow battery thermal management system is it is characterised in that this system includes：The protective housing of set of cells, air channel, radiating fin group, processor module, radiator fan and heating and cooling semiconductor chip；
Wherein, described protective housing upper and lower surface is provided with wire netting and described air channel; described air channel includes the first air channel and the second air channel; the described wire netting of described protective housing upper surface is relative with described first air channel of described protective housing lower surface, and the described wire netting of described protective housing lower surface is relative with described second air channel of described protective housing upper surface；
Separated with dividing plate in the middle of described first air channel and described second air channel, and be mounted on baffle between described first air channel and described second air channel；
It is mounted on described heating and cooling semiconductor chip inside described first air channel and described second air channel；
The huyashi-chuuka (cold chinese-style noodles) of described heating and cooling semiconductor chip and hot face both sides are respectively and fixedly provided with described radiating fin group；
Described radiator fan is arranged on the air inlet in described air channel, and is arranged inside described heating and cooling semiconductor chip, the outside of described radiating fin group；
Described processor module is connected with described heating and cooling semiconductor chip and described radiator fan, and the temperature signal of the set of cells detecting is converted to control instruction by described processor module, controls the working condition of described heating and cooling semiconductor chip and described radiator fan.
Preferably, described radiating fin group is combined closely with described heating and cooling semiconductor chip by heat-conductive bonding agent.
Preferably, described processor module includes：Temperature collect module, described temperature collect module is arranged at the outside of the cell of described set of cells.
Preferably, described temperature collect module includes：Thermocouple temperature sensor and signal processing module, the temperature probe of described thermocouple sensor is close on the cell wall of described set of cells.
Preferably it is characterised in that described protective housing is metal shell.
Preferably it is characterised in that the wire netting of described protective housing upper and lower surface and air channel are symmetrical with regard to line of symmetry, respectively account for the 1/2 of described protective housing upper and lower surface, wherein, described line of symmetry is the line at metal shell upper surface or lower surface two minor face midpoint.
Preferably it is characterised in that described heating and cooling semiconductor chip is TEC1-12706.
Preferably, described baffle and described radiating fin group are aluminum metal material, and each radiating fin left and right sides of described radiating fin group is provided with groove.
Preferably it is characterised in that described heat-conductive bonding agent includes heat-conducting silicone grease.
According to the second aspect of the invention, there is provided it is adaptable to the bidirectional flow battery management system that provides of a first aspect of the present invention, the method includes a kind of battery thermal conditioning method：
Described bidirectional flow battery management system reads set of cells real time operation ambient temperature by the described temperature collect module in described processor module, and the peak of operating ambient temperature that described set of cells operating ambient temperature is adapted to described set of cells set in advance and minimum are compared；
When the peak of the operating ambient temperature that described set of cells real time operation ambient temperature is adapted to higher than described set of cells, described temperature collect module controls the input current of described heating and cooling semiconductor chip to be DC Forward Current, and controls described radiator fan work；Described heating and cooling semiconductor chip conducts the cold that the huyashi-chuuka (cold chinese-style noodles) of described heating and cooling semiconductor chip produces to the radiating fin group being arranged at described tunnel inlet, described radiator fan air-out carries out being cooled into cooling down wind through described radiating fin group, and the described radiating fin group in the hot face that described cooling wind is described heating and cooling semiconductor chip through described wire netting is radiated；
When the minimum of the operating ambient temperature that described set of cells real time operation ambient temperature is adapted to less than described set of cells, described temperature collect module controls the input current of described heating and cooling semiconductor chip to be reverse dc, and controls described radiator fan work；Described heating and cooling semiconductor chip passes to the heat that the hot face of described heating and cooling semiconductor chip produces to the radiating fin group being arranged at described tunnel inlet, described radiator fan air-out carries out being thermally formed heating wind through described radiating fin group, and the described radiating fin group of the huyashi-chuuka (cold chinese-style noodles) that described heating wind is described heating and cooling semiconductor chip through described wire netting is heated.
Compared to prior art; bidirectional flow battery thermal management system is to be made up of the protective housing of set of cells, air channel, radiating fin group, processor module, radiator fan and heating and cooling semiconductor chip in the inventive solutions; and employ double air channels and heating and cooling semiconductor chip in the present invention; according to set of cells real time operation ambient temperature, its heat can be adjusted; meet the uniform temperature between cell, and then solve the problems, such as the dependability of set of cells and less stable in prior art.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below by required use in embodiment or description of the prior artAccompanying drawingBe briefly described it should be apparent that, below describe inAccompanying drawingIt is only embodiments of the invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to offerAccompanying drawingObtain otherAccompanying drawing.
Figure 1The structural representation within bidirectional flow battery thermal management system providing for the embodiment of the present invention oneFigure；
Figure 2The structural profile in the middle part of bidirectional flow battery thermal management system providing for the embodiment of the present invention one is illustratedFigure；
Figure 3The structural representation outside bidirectional flow battery thermal management system providing for the embodiment of the present invention oneFigure；
Figure 4The structural representation of the radiating fin group of the bidirectional flow battery thermal management system providing for the embodiment of the present invention oneFigure；
Figure 5A kind of method flow of the radiating control method providing for the embodiment of the present invention two is illustratedFigure.
Specific embodiment
Below in conjunction with the embodiment of the present inventionAccompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under the premise of not making creative work, broadly fall into the scope of protection of the invention.
The description of the present invention andClaimBook and above-mentionedIn accompanying drawingTerm " first " and " second " etc. be for distinguishing different objects, rather than be used for describing specific order.In addition term " comprising " and " having " and their any deformation, meaningFigureIt is to cover non-exclusive comprising.For example contain series of steps or process, method, system, product or the equipment of unit are not set in the step listed or unit, but may include the step do not listed or unit.Simultaneously term " on ", D score, "left", "right", " top ", " bottom ", " interior ", the orientation of instruction such as " outward " or position relationship be based onAccompanying drawing instituteThe orientation showing or position relationship, are for only for ease of the description present invention and simplify description, rather than instruction or the hint device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that the restriction of the present invention.
Embodiment one
Respectively referring toFigure 1、Figure 2、Figure 3WithFigure 4Inside the bidirectional flow battery thermal management system providing for the embodiment of the present invention one, middle part, outside structural representationFigure, and the structural representation of radiating fin groupFigure, this bidirectional flow battery thermal management system includes：The protective housing 2 of set of cells 1, air channel 3, radiating fin group 4, processor module, radiator fan 5 and heating and cooling semiconductor chip 9；
Wherein, described protective housing 2 upper and lower surface is provided with wire netting 6 and described air channel 3; described air channel 3 includes the first air channel and the second air channel; the described wire netting 6 of described protective housing 2 upper surface is relative with described first air channel of described protective housing 2 lower surface, and the described wire netting 6 of described protective housing 2 lower surface is relative with described second air channel of described protective housing 2 upper surface；
Separated with dividing plate 7 in the middle of described first air channel and described second air channel, and be mounted on baffle 8 between described first air channel and described second air channel；
It is mounted on described heating and cooling semiconductor chip 9 inside described first air channel and described second air channel；
The huyashi-chuuka (cold chinese-style noodles) of described heating and cooling semiconductor chip 9 and hot face both sides are respectively and fixedly provided with described radiating fin group 4；
Described radiator fan 5 is arranged on the air inlet in described air channel 3, and is arranged inside described heating and cooling semiconductor chip 9, the outside of described radiating fin group 4；
Described processor module is connected with described heating and cooling semiconductor chip 9 and described radiator fan 5, the temperature signal of the set of cells detecting is converted to control instruction by described processor module, controls the working condition of described heating and cooling semiconductor chip 9 and described radiator fan 5.
Specifically, referring toFigure 3The described protective housing 2 being arranged at outside set of cells 1; using metal shell; and the wire netting of described protective housing upper and lower surface and air channel are symmetrical with regard to line of symmetry; respectively account for the 1/2 of described protective housing upper and lower surface; wherein, described line of symmetry is the line at metal shell upper surface or lower surface two minor face midpoint.
Referring toFigure 1Described baffle 8 is separately mounted between battery cell wall and the protective housing 2 of the set of cells 1 in the double air channels being made up of described first air channel and described second air channel, and in the middle of each battery cell, and the perpendicular cross structure of each two baffle 8.And the preferred aluminum metal material of described baffle 8, it would however also be possible to employ other metal materials, the present invention is not particularly limited to the material of baffle.Meanwhile, at described pair of tunnel inlet, radiator fan 5 all works simultaneously, forms two-way flow heat dissipation heating arrangement.
Described radiating fin group 4 is combined closely with described heating and cooling semiconductor chip 9 by heat-conductive bonding agent.Wherein, the preferred metal aluminium material of described radiating fin group 4, it would however also be possible to employ other materials, and referring toFigure 4About each radiating fin in described radiating fin group, two sides are provided with the groove 10 of proper alignment, effectively increase the area of each radiating fin and air contact using this structure, and then accelerate radiating or the speed of heating；The preferred heat-conducting silicone grease of wherein said heat-conductive bonding agent, equally can also not limit for other heat-conductive bonding agents, the present invention.
Specifically, described processor module includes：Temperature collect module, described temperature collect module is arranged at the outside of the cell of described set of cells；And described temperature collect module adopts thermocouple temperature sensor and signal processing module, the temperature probe of described thermocouple sensor is close on the cell wall of described set of cells；Signal processing module preferred MAX6675 integrated circuit described in the present embodiment one, signal processing module using this model can pass through the differential input of high impedance, to ensure to detect the high accuracy of input, it has thermocouple temperature sensor burn out detection it is ensured that the normal work of temperature collect module simultaneously.But the present invention is preferred MAX6675 integrated circuit to signal processing module, equally can also adopting the signal processing module of other modes, as long as can guarantee that the function of realizing in the present invention program, its concrete model not being limited.
Referring toFigure 2, when the DC current of described heating and cooling semiconductor chip 9 input is forward current, during the galvanic couple being formed by two kinds of semi-conducting materials, wherein one side heat absorption another side heat release；When changing the sense of current, huyashi-chuuka (cold chinese-style noodles) and hot face exchange, and the huyashi-chuuka (cold chinese-style noodles) of all heating and cooling semiconductor chips 9 and hot face are all consistent conversion；The preferred TEC1-12706 of wherein said heating and cooling semiconductor chip, can also choose the heating and cooling semiconductor chip of other models accordingly.
In technical scheme disclosed according to embodiments of the present invention, can show that the radiator fan employing in bidirectional flow battery thermal management system at double tunnel inlet works simultaneously, and then form two-way flow heat dissipation heating arrangement, accelerate radiating and the efficiency of heating surface of battery, meet the uniform temperature between each cell；Adopt the structure of radiating fin group simultaneously, radiating or the heating of heating and cooling semiconductor chip non-working surface can be heated, extend the service life of heating and cooling semiconductor chip；And add baffle in double air channels, improve cooling or firing rate.So bidirectional flow battery thermal management system disclosed in the embodiment of the present invention one solves the problems, such as dependability and the less stable that set of cells in prior art produces because of heat dissipation problem.
Embodiment two
Referring toFigure 5A kind of method flow of the radiating control method providing for the embodiment of the present invention two is illustratedFigure.It is adaptable to the bidirectional flow battery management system that provides of embodiments of the invention one, the method includes this battery thermal conditioning method：
S21, described bidirectional flow battery management system read set of cells real time operation ambient temperature by the described temperature collect module in described processor module；
After execution of step S21, and the peak of operating ambient temperature that described set of cells operating ambient temperature is adapted to described set of cells set in advance and minimum are compared, that is,Figure 5Middle step S22 and S25；
S22, judge the peak of the operating ambient temperature whether described set of cells operating ambient temperature is adapted to higher than described set of cells set in advance, if it is, execution S23；
S23, temperature collect module control the input current of described heating and cooling semiconductor chip to be DC Forward Current, and control execution S24 after described radiator fan work；
S24, described heating and cooling semiconductor chip conduct the cold that the huyashi-chuuka (cold chinese-style noodles) of described heating and cooling semiconductor chip produces to the radiating fin group being arranged at described tunnel inlet, described radiator fan air-out carries out being cooled into cooling down wind through described radiating fin group, and the described radiating fin group in the hot face that described cooling wind is described heating and cooling semiconductor chip through described wire netting is radiated；
Accordingly, also want execution step S25 after step S21；
S25, judge the minimum of the operating ambient temperature whether described set of cells operating ambient temperature is adapted to less than described set of cells set in advance, if it is, execution S26；
S26, described temperature collect module control the input current of described heating and cooling semiconductor chip to be reverse dc, and control execution S27 after described radiator fan work；
S27, described heating and cooling semiconductor chip pass to the heat that the hot face of described heating and cooling semiconductor chip produces to the radiating fin group being arranged at described tunnel inlet, described radiator fan air-out carries out being thermally formed heating wind through described radiating fin group, and the described radiating fin group of the huyashi-chuuka (cold chinese-style noodles) that described heating wind is described heating and cooling semiconductor chip through described wire netting is heated.
May be appreciated, step S22 in a kind of radiating control method providing in the embodiment of the present invention two and step S25 are presence arranged side by side, i.e. after temperature collect module reads the ambient temperature of set of cells real time operation, the peak of operating ambient temperature to be adapted to described set of cells set in advance respectively and minimum are compared, and determine how the work controlling other devices or part.
In technical scheme disclosed in the embodiment of the present invention two, mainly there is provided a kind of radiating control method, by gathering the ambient temperature of set of cells real time operation, and the peak of operating ambient temperature being adapted to described set of cells set in advance and minimum are compared respectively, by heating and cooling semiconductor chip, radiator fan, the cooperation of radiating fin group, effectively increase the utilization rate of cold and heat, i.e. no matter the ambient temperature of set of cells real time operation is too high or too low, all can guarantee that the regulation of its heat, thus solving the problems, such as dependability and the less stable that set of cells in prior art produces because of heat dissipation problem.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.Multiple modifications to these embodiments will be apparent from for those skilled in the art, and generic principles defined herein can be realized without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to the wide scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. a kind of bidirectional flow battery thermal management system is it is characterised in that this system includes：The guarantor of set of cells
Protective case body, air channel, radiating fin group, processor module, radiator fan and heating and cooling semiconductor chip；
Wherein, described protective housing upper and lower surface is provided with wire netting and described air channel, described air channel bag
Include the first air channel and the second air channel, the described wire netting of described protective housing upper surface and described protective housing
Described first air channel of lower surface relatively, the described wire netting of described protective housing lower surface and described protection
Described second air channel of housing upper surface is relatively；
Separated with dividing plate in the middle of described first air channel and described second air channel, and described first air channel and institute
State and be mounted on baffle between the second air channel；
It is mounted on described heating and cooling semiconductor chip inside described first air channel and described second air channel；
The huyashi-chuuka (cold chinese-style noodles) of described heating and cooling semiconductor chip and hot face both sides are respectively and fixedly provided with described radiating fin group；
Described radiator fan is arranged on the air inlet in described air channel, and is arranged at described semiconductor refrigerating
Heat inside piece, the outside of described radiating fin group；
Described processor module is connected with described heating and cooling semiconductor chip and described radiator fan, described place
The temperature signal of the set of cells detecting is converted to control instruction by reason device module, controls described quasiconductor system
The cold working condition heating piece and described radiator fan.
2. system according to claim 1 is it is characterised in that described radiating fin group passes through heat conduction
Binding agent is combined closely with described heating and cooling semiconductor chip.
3. system according to claim 1 is it is characterised in that described processor module includes：Temperature
Degree acquisition module, described temperature collect module is arranged at the outside of the cell of described set of cells.
4. system according to claim 3 is it is characterised in that described temperature collect module includes：
Thermocouple temperature sensor and signal processing module, the temperature probe of described thermocouple sensor is close to institute
State on the cell wall of set of cells.
5. system according to claim 1 is it is characterised in that described protective housing is metal shell.
6. system according to claim 1 is it is characterised in that described protective housing upper and lower surface
Wire netting and air channel are symmetrical with regard to line of symmetry, respectively account for the 1/2 of described protective housing upper and lower surface, wherein, institute
State the line that line of symmetry is metal shell upper surface or lower surface two minor face midpoint.
7. system according to claim 1 is it is characterised in that described heating and cooling semiconductor chip is
TEC1-12706.
8. system according to claim 1 is it is characterised in that described baffle and described radiating fin
Piece group is aluminum metal material, and each radiating fin left and right sides of described radiating fin group is respectively provided with
Fluted.
9. system according to claim 2 is it is characterised in that described heat-conductive bonding agent includes heat conduction
Silicone grease.
10. a kind of battery thermal conditioning method it is characterised in that be applied to claim 1-9 any one
Described bidirectional flow battery management system, the method includes：
The described temperature collect module that described bidirectional flow battery management system passes through in described processor module is read
Take set of cells real time operation ambient temperature, and by described set of cells operating ambient temperature and institute set in advance
State the peak of the operating ambient temperature that set of cells is adapted to and minimum is compared；
The operating ambient temperature being adapted to higher than described set of cells when described set of cells real time operation ambient temperature
Peak when, described temperature collect module controls the input current of described heating and cooling semiconductor chip to be
DC Forward Current, and control described radiator fan work；Described heating and cooling semiconductor chip is by described half
The cold that the huyashi-chuuka (cold chinese-style noodles) of conductor heating and cooling chip produces conducts to the radiating fin being arranged at described tunnel inlet
Group, described radiator fan air-out carries out being cooled into cooling down wind, described cooling through described radiating fin group
The described radiating fin group in the hot face that wind is described heating and cooling semiconductor chip through described wire netting is dissipated
Heat；
The operating ambient temperature being adapted to less than described set of cells when described set of cells real time operation ambient temperature
Minimum when, described temperature collect module controls the input current of described heating and cooling semiconductor chip to be
Reverse dc, and control described radiator fan work；Described heating and cooling semiconductor chip is by described half
The heat that the hot face of conductor heating and cooling chip produces conducts to the radiating fin being arranged at described tunnel inlet
Group, described radiator fan air-out carries out being thermally formed heating wind, described heating through described radiating fin group
The described radiating fin group of the huyashi-chuuka (cold chinese-style noodles) that wind is described heating and cooling semiconductor chip through described wire netting carries out adding
Heat.
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| CN107946681A (en) * | 2017-12-13 | 2018-04-20 | 深圳市海梁科技有限公司 | A kind of battery register and method for regulating temperature, temperature adjustment battery |
| CN108039278A (en) * | 2017-12-08 | 2018-05-15 | 安徽广宇电子材料有限公司 | A kind of radiator for capacitor case |
| CN108574126A (en) * | 2017-03-10 | 2018-09-25 | 何戴勇 | Power battery is quickly cooled down system |
| CN111755770A (en) * | 2019-03-29 | 2020-10-09 | 中光电智能机器人股份有限公司 | Battery device and carrier |
| CN111998504A (en) * | 2020-09-04 | 2020-11-27 | 赖慧芳 | New forms of energy temperature regulation system |
| US20220109167A1 (en) * | 2019-02-22 | 2022-04-07 | Delectrik Systems Private Limited | Integrated flow battery stack and heat exchanger |
| CN115036527A (en) * | 2022-06-13 | 2022-09-09 | 上海卓微氢科技有限公司 | Heating and cooling system of fuel cell and control method |
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