CN106410315B - A kind of bidirectional flow battery thermal management system and battery thermal conditioning method - Google Patents

A kind of bidirectional flow battery thermal management system and battery thermal conditioning method Download PDF

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Publication number
CN106410315B
CN106410315B CN201610481193.6A CN201610481193A CN106410315B CN 106410315 B CN106410315 B CN 106410315B CN 201610481193 A CN201610481193 A CN 201610481193A CN 106410315 B CN106410315 B CN 106410315B
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heating
semiconductor chip
air duct
cooling semiconductor
radiating fin
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CN106410315A (en
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王长宏
杨光
李云海
谭健康
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Guangdong University of Technology
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Guangdong University of Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/61Types of temperature control
    • H01M10/613Cooling or keeping cold
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/62Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625Vehicles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/655Solid structures for heat exchange or heat conduction
    • H01M10/6551Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/656Means for temperature control structurally associated with the cells characterised by the type of heat-exchange fluid
    • H01M10/6561Gases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/657Means for temperature control structurally associated with the cells by electric or electromagnetic means
    • H01M10/6572Peltier elements or thermoelectric devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Secondary Cells (AREA)

Abstract

The invention discloses a kind of bidirectional flow battery thermal management system and battery thermal conditioning methods.Bidirectional flow battery thermal management system includes: protection shell, air duct, radiating fin group, processor module, radiator fan and the heating and cooling semiconductor chip of battery pack;Protection shell upper and lower surface is provided with metal mesh and air duct, is separated to form double air ducts with partition among air duct, is mounted on the heating and cooling semiconductor chip on the inside of double air ducts;The huyashi-chuuka (cold chinese-style noodles) of heating and cooling semiconductor chip and hot face two sides are respectively and fixedly provided with the radiating fin group;The air inlet in air duct is equipped with radiator fan;Processor module is according to the battery temperature detected, the working condition of real-time control heating and cooling semiconductor chip and radiator fan.The uniform temperature between each single battery is met through the invention, solves the problems, such as that use reliability that battery pack in the prior art is generated by heat dissipation problem and stability are poor.

Description

A kind of bidirectional flow battery thermal management system and battery thermal conditioning method
Technical field
The present invention relates to battery thermal management technical fields, more particularly to a kind of two-way galvanic battery heat based on air dielectric Management system and battery thermal conditioning method.
Background technique
As energy crisis and problem of environmental pollution are on the rise, electric car comes into being.It is most heavy in electric car The part wanted first is that battery pack, and battery pack is composed of a large amount of single battery, according to the heat production mechanism of battery, Battery pack can generate a large amount of heat during high current charge-discharge.In order to keep the heat production of internal battery pack system thermal environment With the balance of heat dissipation, battery thermal management system is usually used in electric car.If the heat dissipation link of battery thermal management system It breaking down or inefficient, the heat that will lead to battery pack generation tens cannot be effectively dissipated in external environment, So that thermal accumlation causes the excessively high temperature difference between battery of battery pack temperature to increase, when battery work in inside battery Make environment temperature it is excessively high when, easily cause the issue of ASIC thermal failure of battery.When battery operating temperature is too low, the charge and discharge of battery pack Efficiency also declines therewith, and there are security risks.
Some use the cooling heat management system of relatively simple air dielectric for the design of existing battery thermal management system, To guarantee the balance of the heat production of internal battery pack system and heat dissipation.However when battery pack works under severe working environment, this Kind of mode difficulty makes battery work within the scope of optimal working environment, it cannot be guaranteed that between battery temperature uniform temperature, influence system Service life.Therefore, existing technology not can guarantee the use reliability and stability of battery pack.
Summary of the invention
It is directed to the above problem, the present invention provides a kind of bidirectional flow battery thermal management system and battery thermal conditioning method, uses The use reliability and stability generated with solving the problems, such as battery pack in the prior art because of heat dissipation problem is poor.
In order to solve the above technical problems, according to the first aspect of the invention, providing a kind of bidirectional flow battery thermal management System, which is characterized in that the system includes: protection shell, air duct, radiating fin group, the processor module, radiation air of battery pack Fan and heating and cooling semiconductor chip;
Wherein, the protection shell upper and lower surface is provided with metal mesh and the air duct, and the air duct includes the first wind Road and the second air duct, first air duct of the metal mesh of the protection housing upper surface and the protection housing lower surface Relatively, the metal mesh of the protection housing lower surface is opposite with protection second air duct of housing upper surface;
It is separated among first air duct and second air duct with partition, and first air duct and second wind Baffle is mounted between road;
The heating and cooling semiconductor chip is mounted on the inside of first air duct and second air duct;
The huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip and hot face two sides are respectively and fixedly provided with the radiating fin group;
The radiator fan is mounted on the air inlet in the air duct, and is set in the heating and cooling semiconductor chip Side, the outside of the radiating fin group;
The processor module is connect with the heating and cooling semiconductor chip and the radiator fan, the processor module The temperature signal for the battery pack that will test is converted to control instruction, controls the heating and cooling semiconductor chip and the radiation air The working condition of fan.
Preferably, the radiating fin group is combined closely by heat-conductive bonding agent and the heating and cooling semiconductor chip.
Preferably, the processor module includes: temperature collecting module, and the temperature collecting module is set to the battery The outside of the single battery of group.
Preferably, the temperature collecting module includes: thermocouple temperature sensor and signal processing module, the thermocouple The temp probe of sensor is tightly attached on the single battery wall of the battery pack.
Preferably, which is characterized in that the protection shell is metal shell.
Preferably, which is characterized in that the metal mesh of the protection shell upper and lower surface and air duct are symmetrical about line of symmetry, respectively Account for the 1/2 of the protection shell upper and lower surface, wherein the line of symmetry is two short side midpoint of metal shell upper surface or lower surface Line.
Preferably, which is characterized in that the heating and cooling semiconductor chip is TEC1-12706.
Preferably, the baffle and the radiating fin group are aluminum metal material, and the radiating fin group Groove is provided at left and right sides of each radiating fin.
Preferably, which is characterized in that the heat-conductive bonding agent includes heat-conducting silicone grease.
According to the second aspect of the invention, a kind of battery thermal conditioning method is provided, first aspect is suitable for the invention The bidirectional flow battery management system of offer, this method comprises:
The bidirectional flow battery management system reads battery by the temperature collecting module in the processor module Group real-time working environment temperature, and the work that the battery pack operating ambient temperature and the preset battery pack are adapted to The peak and minimum for making environment temperature are compared;
When the battery pack real-time working environment temperature is higher than the highest for the operating ambient temperature that the battery pack is adapted to When value, the input current that the temperature collecting module controls the heating and cooling semiconductor chip is DC Forward Current, and is controlled Make the radiator fan work;The cooling capacity that the heating and cooling semiconductor chip generates the huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip Conduction to the radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air is carried out by the radiating fin group It is cooled into cooling wind, the cooling wind is the heat dissipation in the hot face of the heating and cooling semiconductor chip by the metal mesh Fins set radiates;
When the battery pack real-time working environment temperature is minimum lower than the operating ambient temperature that the battery pack is adapted to When value, the input current that the temperature collecting module controls the heating and cooling semiconductor chip is reverse dc, and is controlled Make the radiator fan work;The heat that the heating and cooling semiconductor chip generates the hot face of the heating and cooling semiconductor chip It passes to the radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air is carried out by the radiating fin group It is thermally formed heating wind, the heat dissipation of huyashi-chuuka (cold chinese-style noodles) of the heating wind by the metal mesh for the heating and cooling semiconductor chip Fins set is heated.
Compared to the prior art, bidirectional flow battery thermal management system is guarantor by battery pack in the inventive solutions What protective case body, air duct, radiating fin group, processor module, radiator fan and heating and cooling semiconductor chip were constituted, and in this hair Double air ducts and heating and cooling semiconductor chip are used in bright, its heat can be carried out according to battery pack real-time working environment temperature It adjusts, meets the uniform temperature between single battery, and then solve the use reliability and stability of battery pack in the prior art Poor problem.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram inside the bidirectional flow battery thermal management system that the embodiment of the present invention one provides;
Fig. 2 is the structural profile illustration in the middle part of the bidirectional flow battery thermal management system that the embodiment of the present invention one provides;
Fig. 3 is the structural schematic diagram outside the bidirectional flow battery thermal management system that the embodiment of the present invention one provides;
Fig. 4 is the structural representation of the radiating fin group for the bidirectional flow battery thermal management system that the embodiment of the present invention one provides Figure;
Fig. 5 is a kind of method flow schematic diagram of adjusting method that radiates provided by Embodiment 2 of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Term " first " and " second " in description and claims of this specification and above-mentioned attached drawing etc. are for area Not different objects, rather than for describing specific sequence.Furthermore term " includes " and " having " and their any deformations, It is intended to cover and non-exclusive includes.Such as it contains the process, method of a series of steps or units, system, product or sets It is standby not to be set in listed step or unit, but may include the step of not listing or unit.While term " on ", The orientation or positional relationship of the instructions such as "lower", "left", "right", "top", "bottom", "inner", "outside" is orientation based on the figure Or positional relationship, it is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning It must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as limitation of the invention.
Embodiment one
It is respectively in the bidirectional flow battery thermal management system that provides of the embodiment of the present invention one referring to Fig. 1, Fig. 2, Fig. 3 and Fig. 4 Portion, middle part, the structural schematic diagram of outside and radiating fin group structural schematic diagram, the bidirectional flow battery thermal management system packet It includes: protection shell 2, air duct 3, radiating fin group 4, processor module, radiator fan 5 and the semiconductor refrigerating heating of battery pack 1 Piece 9;
Wherein, 2 upper and lower surface of protection shell is provided with metal mesh 6 and the air duct 3, and the air duct 3 includes the One air duct and the second air duct, the metal mesh 6 of protection 2 upper surface of shell are described with protection 2 lower surface of shell First air duct is opposite, the metal mesh 6 of protection 2 lower surface of shell and described the second of protection 2 upper surface of shell Air duct is opposite;
It is separated among first air duct and second air duct with partition 7, and first air duct and described second Baffle 8 is mounted between air duct;
The heating and cooling semiconductor chip 9 is mounted on the inside of first air duct and second air duct;
The huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip 9 and hot face two sides are respectively and fixedly provided with the radiating fin group 4;
The radiator fan 5 is mounted on the air inlet in the air duct 3, and is set to the heating and cooling semiconductor chip 9 insides, the outside of the radiating fin group 4;
The processor module is connect with the heating and cooling semiconductor chip 9 and the radiator fan 5, the processor die The temperature signal for the battery pack that block will test is converted to control instruction, control the heating and cooling semiconductor chip 9 and it is described dissipate The working condition of Hot-air fan 5.
Specifically, referring to Fig. 3, the protection shell 2 being set to outside battery pack 1, using metal shell, and the guarantor The metal mesh of protective case body upper and lower surface and air duct are symmetrical about line of symmetry, respectively account for the 1/2 of the protection shell upper and lower surface, In, the line of symmetry is the line at two short side midpoint of metal shell upper surface or lower surface.
The double air ducts being made of first air duct and second air duct are separately mounted to referring to baffle 8 described in Fig. 1 In battery pack 1 battery cell wall and protection shell 2 between and each battery cell among, and every two baffle 8 is in Vertical interlaced structure.And the preferred aluminum metal material of the baffle 8 can also use other metal materials, doubling of the present invention The material of flow is not particularly limited.Meanwhile radiator fan 5 works at the same time at double tunnel inlets, is formed two-way wandering Hot heating structure.
The radiating fin group 4 is combined closely by heat-conductive bonding agent with the heating and cooling semiconductor chip 9.Wherein, institute The preferred metal aluminium material of radiating fin group 4 is stated, other materials can also be used, and referring to fig. 4 in the radiating fin group Two sides of each radiating fin or so are provided with the groove 10 of proper alignment, effectively increase each radiating fin using this structure The area that piece is contacted with air, and then accelerate the rate of heat dissipation or heating;The wherein preferred heat-conducting silicone grease of the heat-conductive bonding agent, Same or other heat-conductive bonding agents, the present invention is without limitation.
Specifically, the processor module includes: temperature collecting module, the temperature collecting module is set to the battery The outside of the single battery of group;And the temperature collecting module uses thermocouple temperature sensor and signal processing module, institute The temp probe for stating thermocouple sensor is tightly attached on the single battery wall of the battery pack;The signal described in the present embodiment one The preferred MAX6675 integrated circuit of processing module, using this model signal processing module can by the differential input of high impedance, Guarantee the high-precision of detection input, while it guarantees temperature collecting module with thermocouple temperature sensor burn out detection It works normally.But the present invention is preferred MAX6675 integrated circuit to signal processing module, can also equally use its other party The signal processing module of formula, as long as can guarantee the function of realizing in the present invention program, without limitation to its concrete model.
Referring to fig. 2, it when the DC current that the heating and cooling semiconductor chip 9 inputs is forward current, is led by two and half When the galvanic couple of body material composition, wherein one side heat absorption another side heat release;When changing current direction, huyashi-chuuka (cold chinese-style noodles) and hot face are exchanged, and And all heating and cooling semiconductor chips 9 huyashi-chuuka (cold chinese-style noodles) and hot face be consistent transformation;Wherein the heating and cooling semiconductor chip is excellent TEC1-12706 is selected, the heating and cooling semiconductor chip of other models can also be chosen accordingly.
In technical solution disclosed according to embodiments of the present invention one, it can be deduced that adopted in bidirectional flow battery thermal management system It is worked at the same time with the radiator fan at double tunnel inlets, and then forms two-way flow heat dissipation heating structure, accelerate dissipating for battery Heat and heating efficiency, meet the uniform temperature between each single battery;The structure for using radiating fin group simultaneously, can heat and partly lead The heat dissipation or heating of body heating and cooling chip non-working surface, extend the service life of heating and cooling semiconductor chip;And in double wind It joined baffle in road, improve cooling or heating speed.So bidirectional flow battery thermal disclosed in the embodiment of the present invention one Reason system solves the problems, such as that the use reliability that battery pack in the prior art is generated by heat dissipation problem and stability are poor.
Embodiment two
It is a kind of method flow schematic diagram of adjusting method that radiates provided by Embodiment 2 of the present invention referring to Fig. 5.The battery Thermal conditioning method is suitable for the invention the bidirectional flow battery management system of the offer of embodiment one, this method comprises:
S21, the bidirectional flow battery management system are read by the temperature collecting module in the processor module Battery pack real-time working environment temperature;
After executing the step S21, and by the battery pack operating ambient temperature and the preset battery pack institute The peak and minimum of the operating ambient temperature of adaptation are compared, i.e. step S22 and S25 in Fig. 5;
S22, judge whether the battery pack operating ambient temperature is higher than the work that the preset battery pack is adapted to Make the peak of environment temperature, if so, executing S23;
The input current that S23, temperature collecting module control the heating and cooling semiconductor chip is DC Forward Current, and S24 is executed after controlling the radiator fan work;
S24, the heating and cooling semiconductor chip by the cooling capacity that the huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip generates conduct to The radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air carry out cooling shape by the radiating fin group At cooling wind, the cooling wind is the radiating fin group in the hot face of the heating and cooling semiconductor chip by the metal mesh It radiates;
Correspondingly, also to execute step S25 after step S21;
S25, judge whether the battery pack operating ambient temperature is lower than the work that the preset battery pack is adapted to Make the minimum of environment temperature, if so, executing S26;
The input current that S26, the temperature collecting module control the heating and cooling semiconductor chip is reversed direct current Stream, and S27 is executed after controlling the radiator fan work;
S27, the heating and cooling semiconductor chip by the heat that the hot face of the heating and cooling semiconductor chip generates pass to The radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air are heated by the radiating fin group Form heating wind, the radiating fin of huyashi-chuuka (cold chinese-style noodles) of the heating wind by the metal mesh for the heating and cooling semiconductor chip Group is heated.
It should be understood that step S22 and step in a kind of heat dissipation adjusting method provided in the embodiment of the present invention two S25 be it is existing side by side, i.e., respectively and in advance after temperature collecting module reads the environment temperature of battery pack real-time working The peak and minimum for the operating ambient temperature that the battery pack of setting is adapted to are compared, and determine how other dresses of control It sets or the work of component.
In the technical solution disclosed in the embodiment of the present invention two, mainly there is provided a kind of heat dissipation adjusting methods, by adopting The environment temperature of set battery group real-time working, and the operating ambient temperature adapted to respectively with the preset battery pack Peak and minimum are compared, by heating and cooling semiconductor chip, radiator fan, radiating fin group co-operation, have Effect improves the utilization rate of cooling capacity and heat, i.e., no matter battery pack real-time working environment temperature it is excessively high or too low, can protect Demonstrate,prove the adjusting of its heat, thus solve use reliability that battery pack in the prior art is generated by heat dissipation problem and stability compared with The problem of difference.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (10)

1. a kind of bidirectional flow battery thermal management system, which is characterized in that the system includes: the protection shell of battery pack, air duct, dissipates Hot fins set, processor module, radiator fan and heating and cooling semiconductor chip;
Wherein, the protection shell upper and lower surface is provided with metal mesh and the air duct, the air duct include the first air duct and Second air duct, first air duct phase of the metal mesh of the protection housing upper surface and the protection housing lower surface Right, the metal mesh of the protection housing lower surface is opposite with protection second air duct of housing upper surface;
Separated among first air duct and second air duct with partition, and first air duct and second air duct it Between be mounted on baffle;
The heating and cooling semiconductor chip is mounted on the inside of first air duct and second air duct;
The huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip and hot face two sides are respectively and fixedly provided with the radiating fin group;
The radiator fan is mounted on the air inlet in the air duct, and is set on the inside of the heating and cooling semiconductor chip, The outside of the radiating fin group;
The processor module is connect with the heating and cooling semiconductor chip and the radiator fan, and the processor module will be examined The temperature signal of the battery pack measured is converted to control instruction, controls the heating and cooling semiconductor chip and the radiator fan Working condition.
2. system according to claim 1, which is characterized in that the radiating fin group passes through heat-conductive bonding agent and described half Conductor heating and cooling chip is combined closely.
3. system according to claim 1, which is characterized in that the processor module includes: temperature collecting module, described Temperature collecting module is set to the outside of the single battery of the battery pack.
4. system according to claim 3, which is characterized in that the temperature collecting module includes: electric thermo-couple temperature sensing Device and signal processing module, the temp probe of the thermocouple sensor are tightly attached on the single battery wall of the battery pack.
5. system according to claim 1, which is characterized in that the protection shell is metal shell.
6. system according to claim 1, which is characterized in that the metal mesh of the protection shell upper and lower surface and air duct are closed It is symmetrical in line of symmetry, respectively account for it is described protection shell upper and lower surface 1/2, wherein the line of symmetry be metal shell upper surface or The line at two short side midpoint of lower surface.
7. system according to claim 1, which is characterized in that the heating and cooling semiconductor chip is TEC1-12706.
8. system according to claim 1, which is characterized in that the baffle and the radiating fin group are aluminum metal Material, and groove is provided at left and right sides of each radiating fin of the radiating fin group.
9. system according to claim 2, which is characterized in that the heat-conductive bonding agent includes heat-conducting silicone grease.
10. a kind of battery thermal conditioning method, which is characterized in that suitable for bidirectional flow described in any one of claim 1-9 Battery management system, this method comprises:
The bidirectional flow battery management system reads the real-time work of battery pack by the temperature collecting module in the processor module Make environment temperature, and the working environment temperature that the battery pack operating ambient temperature and the preset battery pack are adapted to The peak and minimum of degree are compared;
When the battery pack real-time working environment temperature is higher than the peak for the operating ambient temperature that the battery pack is adapted to, The input current that the temperature collecting module controls the heating and cooling semiconductor chip is DC Forward Current, and described in control Radiator fan work;The heating and cooling semiconductor chip by the cooling capacity that the huyashi-chuuka (cold chinese-style noodles) of the heating and cooling semiconductor chip generates conduct to The radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air carry out cooling shape by the radiating fin group At cooling wind, the cooling wind is the radiating fin group in the hot face of the heating and cooling semiconductor chip by the metal mesh It radiates;
When minimum of the battery pack real-time working environment temperature lower than the operating ambient temperature that the battery pack is adapted to, The input current that the temperature collecting module controls the heating and cooling semiconductor chip is reverse dc, and described in control Radiator fan work;The heating and cooling semiconductor chip by the heat that the hot face of the heating and cooling semiconductor chip generates conduct to The radiating fin group being mounted at the tunnel inlet, the radiator fan outlet air carry out heating shape by the radiating fin group At heating wind, the radiating fin group of huyashi-chuuka (cold chinese-style noodles) of the heating wind by the metal mesh for the heating and cooling semiconductor chip It is heated.
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