CN106409747A - Intelligent power module and manufacture method thereof - Google Patents
Intelligent power module and manufacture method thereof Download PDFInfo
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- CN106409747A CN106409747A CN201611014960.9A CN201611014960A CN106409747A CN 106409747 A CN106409747 A CN 106409747A CN 201611014960 A CN201611014960 A CN 201611014960A CN 106409747 A CN106409747 A CN 106409747A
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- wiring
- spm
- sealing resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/85005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate being a temporary or sacrificial substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Abstract
The invention discloses an intelligent power module and a manufacture method thereof. The intelligent power module comprises a circuit wire, circuit components and sealing resin; at least one end portion of the circuit wire is provided with a pad electrically connected with an external circuit; the circuit components are arranged in the upper surface of the circuit wire, and electrically connected with the circuit wire via metal wires respectively; and the sealing resin is arranged on the circuit wire. According to the intelligent power module, the end portion of the circuit wire is provided with the pad, so that the reliability of the intelligent power module is improved, the service life of the intelligent power module is prolonged, and the using cost is reduced. In addition, the structure and processing technology of the intelligent power module are simplified, the processing cost of the intelligent power module is reduced, and the total cost of the intelligent power module is further reduced.
Description
Technical field
The present invention relates to technical field of electronic devices, especially relate to a kind of SPM and its manufacture method.
Background technology
SPM, that is, IPM (Intelligent Power Module) is a kind of by power electronics and integrated electricity
The power drive class product that road technique combines.SPM is integrated in one device for power switching and high-voltage driving circuit
Rise, and interior be provided with overvoltage, overcurrent and the failure detector circuit such as overheated.On the one hand SPM receives MCU (Micro
Controller Unit micro-control unit) control signal, drive subsequent conditioning circuit work, on the other hand the state of system examined
Survey signal and send MCU back to.Compared with traditional discrete scheme, SPM is won with advantages such as its high integration, high reliability
Increasing market, is particularly suitable for the converter of motor and various inverter, be frequency control, metallurgical machinery,
Electric propulsion, servo-drive, a kind of desired power level electronic device of frequency-conversion domestic electric appliances.
In correlation technique, SPM is provided with the pin for electrically connecting with external circuit, but intelligent power
Module typically can be used in severe operating mode, and such as on the off-premises station of convertible frequency air-conditioner, SPM is generally hot and humid
In the state of work, pin exposed easily produces the phenomenons such as condensation in wet environment, causes short circuit between pin, can make when serious
There is explosion accident in SPM, be applied to environment structure infringement, cause heavy economic lossess.
Content of the invention
It is contemplated that at least solving one of technical problem present in prior art.For this reason, one object of the present invention
It is to propose a kind of SPM, the reliability height of this SPM and low cost.
Further object is that proposing a kind of manufacture method of SPM.
According to the SPM of the present invention, including：Wiring, at least one end of described wiring is provided with
For the pad electrically connecting with external circuit；Multiple components, multiple described components are located at the upper of described wiring
On surface, multiple described components are electrically connected with described wiring by metal wire respectively；Sealing resin, described sealing tree
Fat is located on described wiring.
According to the SPM of the present invention, by arranging pad in the end of wiring, and by pad with outward
The electrical connection of portion circuit, eliminates the pin stretching out on SPM in correlation technique, it is to avoid because producing on pin
The short circuit that condensation causes, improves the reliability of SPM, extends the service life of SPM, reduces
Use cost.Additionally, also simplify structure and the processing technique of SPM, reduce being processed into of SPM
This, thus create a further reduction the holistic cost of SPM.
In addition, can also have the technical characteristic of following adnexa according to the SPM of the present invention：
According to some embodiments of the present invention, described sealing resin covers the upper surface of described wiring and described circuit
Wiring side top, the bottom of described side of described wiring and the lower surface of described wiring exposed described
Outside sealing resin.
Specifically, described sealing resin is completely covered the described component on described wiring upper surface and described gold
Belong to line.
Alternatively, the exposed height outside described sealing resin in the described side of described wiring is h, and described h meets：
0.3 ounce≤h≤0.8 ounce.
According to some embodiments of the present invention, described wiring is processed using copper coin, and the thickness of described copper coin is
T, described t meets：T >=5 ounce.
Further, the outer surface of described wiring is provided with anti oxidation layer.Alternatively, described metal wire is a diameter of
D, described d meets：15μm≤d≤400μm.
Alternatively, described metal wire is aluminum steel, gold thread or copper cash.
The manufacture method of the SPM according to the present invention, comprises the following steps：
S1：Make wiring；
S2：Make base, and groove is dug out on described base according to the shape of described wiring, described wiring
Bottom be adapted for placement in described groove；
S3：Described wiring is placed in described groove, then component is attached on described wiring；
S4：Binding metal wire, realizes the electrical connection between described component and described wiring；
S5：Described wiring is encapsulated using sealing resin；
S6：Described wiring is taken out from described base, obtains SPM.
The manufacture method of the SPM according to the present invention, by repeatable using base wiring is carried out
Positioning, significantly reduces the manufacture difficulty of SPM, improves fine ratio of product, reduce the one-tenth of SPM
This, be conducive to popularization and the application of SPM.
According to some embodiments of the present invention, described step S1 specifically includes following steps：
S11：Copper coin is carried out with punching press or etching forms described wiring；
S12：Anti-oxidant treatment is carried out to the outer surface of described wiring.
Specifically, described step S3 specifically includes following steps：
S31：After described wiring is placed in described groove, in the to be installed described circuit elements of described wiring
The position application tin cream of part；
S32：Described component is placed on described tin cream；
S33：Make tin cream solidify by Reflow Soldering described component is fixed on described wiring；
S34：Clean described wiring, to remove the foreign body remaining on described wiring.
Further, after described wiring being taken out from described base, also comprise the steps：Described electricity will be encapsulated
The excessive glue being formed in the wiring process of road removes.
Alternatively, the depth of described groove is H, and described H meets：0.3 ounce≤H≤0.8 ounce.
Alternatively, described base is stainless steel part.
The additional aspect of the present invention and advantage will be set forth in part in the description, and partly will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description
The above-mentioned and/or additional aspect of the present invention and advantage will become from reference to the description to embodiment for the accompanying drawings below
Substantially and easy to understand, wherein：
Fig. 1 is the top view of SPM according to embodiments of the present invention；
Fig. 2 is the cut-away view of the line A-A along along Fig. 1；
Fig. 3 is the top view of SPM according to embodiments of the present invention, wherein, eliminates on SPM
The sealing resin on surface；
Fig. 4 is the upward view of SPM according to embodiments of the present invention；
Fig. 5 is the top view of the wiring of SPM according to embodiments of the present invention；
Fig. 6 is the cut-away view of the line B-B along along Fig. 5；
Fig. 7 is the top view of the base in the manufacture method of SPM according to embodiments of the present invention；
Fig. 8 is by the vertical view of base in the manufacture method of SPM according to embodiments of the present invention and carrier cooperation
Figure；
Fig. 9 is the cut-away view of the line C-C along along Fig. 8；
Figure 10 is the structural representation after SPM according to embodiments of the present invention binds metal wire；
Figure 11 is the side view after SPM according to embodiments of the present invention binds metal wire；
Figure 12 is the schematic diagram of the potting resin of SPM according to embodiments of the present invention；
Figure 13 is the upward view after the potting resin of SPM according to embodiments of the present invention；
Figure 14 is the flow chart of the manufacture method of SPM according to embodiments of the present invention.
Reference：
SPM 100,
Wiring 1, pad 11,
Component 2, sealing resin 3, metal wire 4,
Base 5, groove 51,
Carrier 6, fixed strip 61, excessive glue 7,
Upper mould 81, lower mould 82, cast gate 83, air vent 84.
Specific embodiment
Embodiments of the invention are described below in detail, the example of described embodiment is shown in the drawings, wherein from start to finish
The element that same or similar label represents same or similar element or has same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention it is to be understood that term " length ", " width ", " thickness ", " on ", D score,
The orientation of instruction such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " or position relationship are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or dark
Show the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that right
The restriction of the present invention.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint are relative
Importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be bright
Show or implicitly include one or more this feature.In describing the invention, unless otherwise stated, the containing of " multiple "
Justice is two or more.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or is integrally connected；Can
To be to be mechanically connected or electrical connection；Can be to be joined directly together it is also possible to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Below with reference to Fig. 1-Figure 14, SPM 100 according to embodiments of the present invention is described.
As shown in Figure 1-Figure 3, SPM 100 according to embodiments of the present invention, including：Wiring 1, Duo Ge electricity
Circuit component 2 and sealing resin 3.
Specifically, reference picture 3- Fig. 6, at least one end (for example, the front end in Fig. 3) of wiring 1 be provided with for
The pad 11 electrically connecting with external circuit.
Here, it should be noted that " at least one " described in the application refers to one or more.
Wherein, with reference to Fig. 5 and combine Fig. 6, pad 11 can be formed as square structure, and the longitudinal cross-section area of pad 11 is excellent
Choosing is more than the longitudinal cross-section area of wiring 1 end.Thus, it is possible to increase the contact area of pad 11 and external circuit, carry
The reliability that high SPM 100 is connected with external circuit.
Alternatively, pad 11 and wiring 1 are integrally formed.Process is simple, easy to process and processing cost is low.
Multiple components 2 are located on the upper surface of wiring 1, and multiple components 2 pass through metal wire 4 and electricity respectively
Road wiring 1 electrical connection.Wherein, component 2 can be the active component such as transistor or diode, can also be electric capacity or resistance
Deng passive element.Component 2 may be mounted on the upper surface of wiring 1.Specifically, component 2 can pass through stannum
Cream is fixed on wiring 1.Component 2 is connected electrically in electricity by metal wire 4 by the face-up installation of component 2
In road wiring 1.
As shown in Fig. 2, Figure 10 and Figure 11, one end of metal wire 4 is connected with the upper surface of component 2, metal wire 4 another
One end is connected with component 2.It is understood that metal wire 4 can be also used between component 2 and component 2, electricity
Electrical connection between road wiring 1 and wiring 1.
Sealing resin 3 is located on wiring 1.Sealing resin 3 is used for encapsulated circuit and connects up 1, connects up 1 He with protection circuit
Component 2 on wiring 1, improves the reliability of SPM 100.Specifically, sealing resin 3 can be by passing
Pass mould mode to mould using thermosetting resin, it is possible to use injection mould mode is moulded using thermoplastic resin.
SPM 100 according to embodiments of the present invention, by arranging pad 11 in the end of wiring 1, and
Electrically connected with external circuit by pad 11, the pin stretching out is eliminated on SPM 100 in correlation technique, keeps away
Exempt from, because producing, on pin, the short circuit that condensation causes, to improve the reliability of SPM 100, extend intelligent power mould
The service life of block 100, reduces use cost.Additionally, also simplify structure and the processing technique of SPM 100,
Reduce the processing cost of SPM 100, thus create a further reduction the holistic cost of SPM 100.
According to some embodiments of the present invention, sealing resin 3 covers the upper surface of wiring 1 and the side of wiring 1
The top in face, the lower surface of the bottom of the side of wiring 1 and wiring 1 exposed outside sealing resin 3.Wherein, reference
Fig. 1 simultaneously combines Fig. 2 and Fig. 4, and sealing resin 3 can be completely covered component 2 and metal wire on the upper surface of wiring 1
4, and cover most of height, the fraction height of the side lower of wiring 1 and the wiring 1 of wiring 1 side
Lower surface exposed outside sealing resin 3.
Thus, it is possible to effectively improve the heat dispersion of SPM 100, it is to avoid SPM 100 interior
Portion produces heat localization, and so that the gap between wiring 1 is completely exposed out, so that dampness is difficult to be attached to
On wiring 1, and then efficiently avoid the ion within SPM 100 under hot and humid environment, such as chlorine from
Son, bromide ion etc. occur to migrate the corrosion that circuit is caused in the presence of steam, it is to avoid the circuit of wiring 1 and circuit elements
The circuit of part 2 is short-circuited, and further increasing the reliability of SPM 100, extends SPM 100
Service life, reduce the use cost of SPM 100.
Alternatively, the exposed height outside sealing resin 3 in the side of wiring 1 is h, and h meets：0.3 ounce≤h≤
0.8 ounce.For example, the exposed height h outside sealing resin 3 in the side of wiring 1 can meet further：H=0.3 big belly
Department, h=0.4 ounce, h=0.5 ounce, h=0.6 ounce or h=0.8 ounce etc..Thus, SPM 100 is follow-up
Be easy to tin cream during being welded and fixed climbs stannum so that exposed wiring 1 outside sealing resin 3 can be by solders such as tin creams
Fully wrapped around, consequently facilitating by the assembling of SPM 100, improve efficiency of assembling and the dress of SPM 100
The reliability joined.
According to some embodiments of the present invention, wiring 1 is processed using copper coin, and the thickness of copper coin is t, and t meets：
T >=5 ounce.For example, the thickness t of copper coin can meet further：T=5 ounce, t=6 ounce, t=7 ounce etc..Thus, may be used
With the contact area of increasing circuit wiring 1 and sealing resin 3, it is easy to SPM 100 is fixed.
Specifically, 64mm × 30mm, the copper coin not less than 5 ounces for the thickness can be less than from cross-sectional area, using punching press
Mould stamps out the shape of wiring 1 on copper coin, forms wiring 1；High-speed steel can also be used to be used as by gong knife
Material, the rotating speed of controlled motor is 5000 revs/min, makes gong knife and plane at right angles descend knife to form the shape of wiring 1；Also
Etch tool can be passed through, the shape of wiring 1 is etched by chemical reaction on copper coin.
Further, the outer surface of wiring 1 is provided with anti oxidation layer.Alternatively, anti oxidation layer can be layer gold.Example
As layer gold can be formed in the outer surface of wiring 1, to improve wiring 1 by way of electrogilding or chemical turmeric
Non-oxidizability so that SPM 100 goes for resisting the higher occasion of oxidation requirements, thus improve intelligence
The performance of power model 100 expands the range of SPM 100.
Alternatively, a diameter of d of metal wire 4, d meet：15μm≤d≤400μm.Metal wire 4 can for aluminum steel, gold thread or
Copper cash etc..
Wherein, the concrete diameter of metal wire 4 can be according to the size of binding point, required cocurrent flow ability, components and parts
The suitable diameter of selecting factors such as machinability and material metal wire 4.For example, according to through-current capability needs, select suitably straight
The aluminum steel in footpath as binding line, for the integrated circuit controlling for signal it is also contemplated that gold thread is used as binding line.
Specifically, in component 2, the power of power component is larger, and caloric value is big, for the connection of power component, to work(
Can being bound using many a diameter of 350 μm -400 μm of metal wire 4 (such as aluminum steel etc.) parallel connections of rate element, first to non-power
Part can be bound using single a diameter of 38 μm of -200 μm of metal wires 4 (such as aluminum steel etc.).Thus, it is possible to further carry
The reliability of high SPM 100.
One specific embodiment of SPM 100 according to embodiments of the present invention is described below.
As shown in Figure 1-Figure 3, SPM 100 according to embodiments of the present invention, including：Wiring 1, Duo Ge electricity
Circuit component 2 and sealing resin 3.
Wiring 1 is stamped to form using the copper coin that thickness is not less than 5 ounces.The end of wiring 1 be provided with for
The pad 11 of external circuit electrical connection, the longitudinal cross-section area of pad 11 is preferably greater than the longitudinal cross-section face of wiring 1 end
Long-pending.Pad 11 is integrally formed with wiring 1.Multiple components 2 are electrically connected with wiring 1 by metal wire 4 respectively.Close
Envelope resin 3 is completely covered component 2 and metal wire 4 on the upper surface of wiring 1, and covers wiring 1 side
Most of height, the fraction height of the side lower of wiring 1 and the lower surface of wiring 1 exposed in sealing resin 3
Outward.The exposed height outside sealing resin 3 in side of wiring 1 is 0.5 ounce.
SPM 100 according to embodiments of the present invention, is electrically connected with external circuit by pad 11, improves intelligence
The reliability of energy power model 100, extends the service life of SPM 100, reduces use cost.Meanwhile, also
Simplify structure and the processing technique of SPM 100, reduce the processing cost of SPM 100, thus entering
Reduce to one step the holistic cost of SPM 100.Additionally, passing through the bottom of the side of wiring 1 and circuit
The lower surface of wiring 1 is exposed to improve the heat dispersion of SPM 100, thus further carrying outside sealing resin 3
The high reliability of SPM 100.
The manufacture method of SPM 100 according to embodiments of the present invention, as shown in figure 14, comprises the following steps：
S1：Make wiring 1；
S2：Make base 5, and groove 51, the bottom of wiring 1 are dug out on base 5 according to the shape of wiring 1
It is adapted for placement in groove 51；
S3：Wiring 1 is placed in groove 51, then component 2 is attached on wiring 1；
S4：Binding metal wire 4, realizes the electrical connection between component 2 and wiring 1；
S5：Connect up 1 using sealing resin 3 encapsulated circuit；
S6：Wiring 1 is taken out from base 5, obtains SPM 100.
Wherein, the bottom of the side of wiring 1 is stretched in groove 51, and the top of the side of wiring 1 is exposed at groove
Outside 51.The width of the groove 51 on base 5 can be slightly larger than the width of corresponding wiring 1, in order to by circuit cloth
The bottom of line 1 is placed in groove 51.
Thus, wiring 1 can be positioned by base 5, be easy to for sealing resin 3 to be encapsulated in wiring 1
Above so that the bottom of side stretched in groove 51 of wiring 1 and lower surface are exposed at outside sealing resin 3, reduce in electricity
Positioning difficulty during potting resin 3 in road wiring 1.Meanwhile, with respect to traditional intelligence being fully sealed by sealing resin 3
Power model 100, reduces sealing resin 3 variable thickness in the upper and lower surface of wiring 1 during injecting glue and causes to parameter
The difficulty controlling, thus significantly reducing the manufacture difficulty of SPM 100, and improves fine ratio of product, Jin Erjin
Reduce to one step the cost of SPM 100.Additionally, after sealing resin 3 is encapsulated on wiring 1, need to be the bottom of by
Seat 5 taking-up, base 5 can reuse, and eliminates the metal basal board in SPM 100 in correlation technique, thus, more
Create a further reduction the cost of SPM 100.
The manufacture method of SPM 100 according to embodiments of the present invention, by being placed on and can weigh wiring 1
In groove 51 on the multiple base 5 utilizing, by base 5, wiring 1 is positioned, significantly reduce intelligent power mould
The manufacture difficulty of block 100, improves fine ratio of product, reduces the cost of SPM 100, is conducive to SPM
100 popularization and application.
According to some embodiments of the present invention, above-mentioned steps S1 specifically include following steps：
S11：Copper coin is carried out with punching press or etching forms wiring 1；
S12：Anti-oxidant treatment is carried out to the outer surface of wiring 1.
Specifically, 64mm × 30mm, the copper coin not less than 5 ounces for the thickness can be less than from cross-sectional area, using punching press
Mould stamps out the shape of wiring 1 on copper coin, forms wiring 1；Etch tool can also be passed through, anti-by chemistry
The shape of wiring 1 should be etched on copper coin.It is, of course, understood that can also be made using high-speed steel by gong knife
For material, the rotating speed of controlled motor is 5000 revs/min, makes gong knife and aluminium plane at right angles descend knife formation wiring 1
Shape.Then, anti-oxidant treatment is carried out to the outer surface of wiring 1.
For example, it is possible to by way of electrogilding or chemical turmeric, form layer gold in the outer surface of wiring 1, to carry
The non-oxidizability of high wiring 1 so that SPM 100 goes for resisting the higher occasion of oxidation requirements, from
And expand the range of SPM 100.
It is, of course, understood that when SPM 100 uses in the not high occasion of antagonism oxidation requirements, can
To save above-mentioned steps S12, with the processing technique of simplified intelligent power model 100, reduce processing cost.
According to some embodiments of the present invention, above-mentioned steps S3 specifically include following steps：
S31：After wiring 1 is placed in groove 51, apply in the position of the component to be installed 2 of wiring 1
Dress tin cream；
S32：Component 2 is placed on tin cream；
S33：Make tin cream solidify by Reflow Soldering component 2 is fixed on wiring 1；
S34：Cleaning circuit wiring 1, to remove the foreign body remaining on wiring 1.
For example, it is possible to the wiring made 1 is placed in the corresponding groove 51 of base 5 (as Fig. 7 institute
Show), and pass through stencil printer, the position using the component to be installed 2 to wiring 1 for the steel mesh carries out tin cream application,
Wherein, the thickness of steel mesh can be 0.13mm.Then pass through the equipment such as SMT machine or DA machine, carry out the installation of component 2.Tool
Body ground, component 2 can be directly placed at the position of application tin cream of wiring 1, then put the bottom of base 5
It is placed in carrier 6 top so that at least one edge of base 5 is contacted with carrier 6 and is fixed (as shown in Figure 8 and Figure 9), then lead to
Crossing Reflow Soldering makes tin cream solidify to be fixed on component 2 on wiring 1.Thus, by carrier 6, base 5 can be carried out
Positioning, prevents base 5 mobile, consequently facilitating component 2 is fixed on wiring 1 by Reflow Soldering.
With reference to Fig. 8 and combine Fig. 9, carrier 6 can be formed as rectangle, and at least one edge of carrier 6 is provided with fixed strip
61, base 5 can push to carrier 6 from the lateral edges not having fixed strip 61 of carrier 6.At least one edge of base 5
Contact with carrier 6.Alternatively, carrier 6 can be made by materials such as compound stones.Structural strength height and low cost.
For example, in the example of fig. 8, three edges of carrier 6 are provided with fixed strip 61, and base 5 can not having from carrier 6
The lateral edges having fixed strip 61 push on carrier 6.
Here, it should be noted that " SMT " in the application is the abbreviation of Surface Mount Technology, in
Literary composition can be translated as " surface installation technique " or " surface mounting technology ", and SMT machine refers to microtome." DA " is Die Attach
Abbreviation, Chinese can be translated as " die bonding ", and DA machine refers to die bonding machine.
Specifically, during cleaning circuit wiring 1, the wiring 1 being fixed on base 5 can be put in cleaning machine and carry out
Cleaning, the foreign bodies such as the aluminum steel remaining when the scaling powders such as the Colophonium remaining during Reflow Soldering and punching press are cleaned.Specifically, permissible
According to component 2 in the arrangement density of wiring 1, select the cleaning side of spray or ultrasonic or spray and combination of ultrasound
Formula is carried out.During cleaning, mechanical arm Holding seat 5 can be passed through, base 5 is placed in rinse bath and is carried out.
Further, after wiring 1 being taken out from base 5, also comprise the steps：Encapsulated circuit is connected up 1 mistake
The excessive glue 7 being formed in journey removes.
With reference first to Figure 12, the detailed process to wiring 1 potting resin 3 once is described.
During potting resin 3, can first in oxygen-free environment, wiring 1 be toasted, baking time should not be little
In 2 hours, baking temperature can select 125 DEG C about.
With reference to Figure 12, encapsulating mould includes mould 81 and lower mould 82, limits die cavity between upper mould 81 and lower mould 82.Die cavity
There is cast gate 83 and air vent 84.First the base 5 placing wiring 1 is placed in die cavity, and make base 5 with
Mould 82 contacts, to position to wiring 1.During matched moulds, inject sealing resin 3, injection process in cast gate 83 is to die cavity
In, the gas of mold cavity can be externally discharged by air vent 84.
Using sealing resin 3 encapsulated circuit wiring 1 during, wiring 1 side expose groove 51 part,
Component 2 on the upper surface of wiring 1, wiring 1 upper surface and metal wire 4 are covered by sealing resin 3.Due to pressure
The effect of power, part resin can enter in the groove 51 of base 5, forms excessive glue 7, as shown in figure 13 on wiring 1.Excessive glue
7 thickness is very thin, typically not over 0.1mm, it is possible to use the mode such as air knife removes, it is possible to use chemical method is gone
Remove.Thus, it is possible to avoiding the input and output that excessive glue 7 affects wiring 1 to connect and radiating, improve SPM 100
Heat dispersion.
After removing excessive glue 7, SPM 100 can be put in test equipment, carry out the electric parameters testing of routine.
Specifically, engaged test can be carried out by thimble and test point.If engaged test is not passed through, need thimble is trimmed
Process, after engaged test is passed through, then carry out electrical characteristics test, include the surveys such as the pressure, quiescent dissipation of insulation, delay time
Examination project, test passes person is finished product.
Alternatively, the depth of groove 51 is H, and H meets：0.3 ounce≤H≤0.8 ounce.For example, the depth H of groove 51 can
To meet further：H=0.3 ounce, H=0.4 ounce, H=0.5 ounce, H=0.6 ounce or H=0.8 ounce etc..Thus,
The bottom that wiring 1 can be made is stretched in groove 51, is not covered by sealing resin 3, and is easy to SPM 100 rear
Continuous be welded and fixed during be easy to tin cream climb stannum so that exposed wiring 1 outside sealing resin 3 can be welded by tin cream etc.
Material is fully wrapped around, consequently facilitating by the assembling of SPM 100, improve SPM 100 efficiency of assembling and
The reliability of assembling.
Alternatively, base 5 is stainless steel part.For example, base 5 can be processed by the high-temperature-resistant steel of smooth surface.
Thus, it is possible to improve structural strength and the resistance to elevated temperatures of base 5, extend the service life of base 5, and stainless low cost
Honest and clean, material cost can be reduced.
Describe one of manufacture method of SPM 100 according to embodiments of the present invention referring to Fig. 5-Figure 14
Specific embodiment.
It is not less than 5 ounces of copper coin from thickness, the shape of wiring 1 is stamped out using diel on copper coin,
Form wiring 1；
By way of electrogilding or chemical turmeric, form layer gold in the outer surface of wiring 1；
Base 5 is made by the high-temperature-resistant steel of smooth surface, and is dug out on base 5 according to the shape of wiring 1
Depth is 0.5 ounce of groove 51；
After wiring 1 is placed in groove 51, in the position application stannum of the component to be installed 2 of wiring 1
Cream；
Component 2 is placed on tin cream；
Base 5 is placed on carrier 6, so that at least one edge of base 5 is contacted with carrier 6, then pass through Reflow Soldering
Tin cream is made to solidify to be fixed on component 2 on wiring 1；
Cleaning circuit wiring 1, to remove the foreign body remaining on wiring 1.
Binding metal wire 4, realizes the electrical connection between component 2 and wiring 1；
Connect up 1 using sealing resin 3 encapsulated circuit；
Wiring 1 is taken out from base 5, the excessive glue 7 being formed on wiring 1 is removed；
SPM 100 is tested.
The manufacture method of SPM 100 according to embodiments of the present invention, using reusable base 5 to electricity
Road wiring 1 is positioned, and reduces the difficulty positioning during potting resin 3, significantly reduces SPM 100
Manufacture difficulty, improves fine ratio of product, reduces the cost of SPM 100, is conducive to the general of SPM 100
And and application.
In the description of this specification, reference term " embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features, the knot describing with reference to this embodiment or example
Structure, material or feature are contained at least one embodiment or the example of the present invention.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or spy
Point can combine in any one or more embodiments or example in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
Multiple changes, modification, replacement and modification can be carried out to these embodiments in the case of the principle of the disengaging present invention and objective, this
The scope of invention is limited by claim and its equivalent.
Claims (14)
1. a kind of SPM is it is characterised in that include：
Wiring, at least one end of described wiring is provided with the pad for electrically connecting with external circuit；
Multiple components, multiple described components are located on the upper surface of described wiring, multiple described components
Electrically connected with described wiring by metal wire respectively；
Sealing resin, described sealing resin is located on described wiring.
2. SPM according to claim 1 is it is characterised in that described sealing resin covers described wiring
Upper surface and described wiring side top, the bottom of described side of described wiring and described wiring
Lower surface exposed outside described sealing resin.
3. SPM according to claim 2 is it is characterised in that described sealing resin is completely covered described circuit
Described component on wiring upper surface and described metal wire.
4. SPM according to claim 2 it is characterised in that the described side of described wiring exposed
Height outside described sealing resin is h, and described h meets：0.3 ounce≤h≤0.8 ounce.
5. SPM according to claim 1 is it is characterised in that described wiring is using copper coin processing
Become, the thickness of described copper coin is t, and described t meets：T >=5 ounce.
6. the SPM according to claim 1 is it is characterised in that the outer surface of described wiring is provided with
Anti oxidation layer.
7. the SPM according to claim 1 is it is characterised in that a diameter of d of described metal wire, described d
Meet：15μm≤d≤400μm.
8. the SPM according to any one of claim 1-7 it is characterised in that described metal wire be aluminum steel,
Gold thread or copper cash.
9. a kind of manufacture method of the SPM according to any one of claim 1-8 is it is characterised in that include
Following steps：
S1：Make wiring；
S2：Make base, and groove is dug out on described base according to the shape of described wiring, under described wiring
Portion is adapted for placement in described groove；
S3：Described wiring is placed in described groove, then component is attached on described wiring；
S4：Binding metal wire, realizes the electrical connection between described component and described wiring；
S5：Described wiring is encapsulated using sealing resin；
S6：Described wiring is taken out from described base, obtains SPM.
10. the manufacture method of SPM according to claim 9 is it is characterised in that described step S1 is specifically wrapped
Include following steps：
S11：Copper coin is carried out with punching press or etching forms described wiring；
S12：Anti-oxidant treatment is carried out to the upper surface of described wiring.
The manufacture method of 11. SPMs according to claim 9 is it is characterised in that described step S3 is specifically wrapped
Include following steps：
S31：After described wiring is placed in described groove, in the to be installed described component of described wiring
Position application tin cream；
S32：Described component is placed on described tin cream；
S33：Make tin cream solidify by Reflow Soldering described component is fixed on described wiring；
S34：Clean described wiring, to remove the foreign body remaining on described wiring.
The manufacture method of 12. SPMs according to claim 9 it is characterised in that by described wiring from
After taking out in described base, also comprise the steps：
The excessive glue being formed during described wiring being encapsulated removes.
The manufacture method of 13. SPMs according to claim 9 is it is characterised in that the depth of described groove is
H, described H meets：0.3 ounce≤H≤0.8 ounce.
The manufacture method of 14. SPMs according to claim 9 is it is characterised in that described base is rustless steel
Part.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611014960.9A CN106409747A (en) | 2016-11-15 | 2016-11-15 | Intelligent power module and manufacture method thereof |
| PCT/CN2017/086430 WO2018040638A1 (en) | 2016-08-31 | 2017-05-27 | Intelligent power module and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611014960.9A CN106409747A (en) | 2016-11-15 | 2016-11-15 | Intelligent power module and manufacture method thereof |
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| CN201611014960.9A Pending CN106409747A (en) | 2016-08-31 | 2016-11-15 | Intelligent power module and manufacture method thereof |
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| CN106783836A (en) * | 2017-03-27 | 2017-05-31 | 广东美的制冷设备有限公司 | SPM, the preparation method of SPM and power electronic equipment |
| WO2018018849A1 (en) * | 2016-07-29 | 2018-02-01 | 广东美的制冷设备有限公司 | Intelligent power module and method for manufacturing same |
| WO2018040638A1 (en) * | 2016-08-31 | 2018-03-08 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method therefor |
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