CN106366964A - 易脱离高脱除率发泡胶带 - Google Patents
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Abstract
本发明公开了一种易脱离高脱除率发泡胶带,包括自上而下设置的胶带基层、胶膜层和隔离层,所述的胶膜层包括20%‑70%质量份数的高分子聚合物类胶水和30%‑80%质量份数的遇热可膨胀的微胶囊,所述的高分子聚合物类胶水包括50%‑100%质量份数的多糖类聚合物和0%‑50%质量份数的多官能团烯烃聚合物。本发明的发泡胶带,利用壳聚糖等多糖类聚合物,作为胶膜层的基料,其粘性大粘附能力强,而且随温度升高粘性衰减迅速且不挂胶,能满足后续焊接处理。在每块单独的方形模切块上设置切口,改变了胶带基层和胶膜层的应力,使其更容易发生卷曲,而且提高卷曲的规律性,提升卷曲度,提高胶带脱除率,有效提高自动化生产设备的适应性。
Description
技术领域
本发明涉及胶带技术领域,特别是涉及一种易脱离高脱除率发泡胶带。
背景技术
发泡胶带是一种由特殊粘合胶制成,在常温下有较好的粘合力,加热到合适的温度后胶面膨胀粘性就会消失,用在电子零部件的临时固定、保护,避免产品在加工工程中的划伤和损害,剥离时不残胶,不会对粘附体造成伤害。以及用于锂电池、精巧易碎的晶片加工及其他电子产品保护及固定。
但是,现有的发泡胶带在加热解黏后发生的卷曲不确定,一般需要手工去除,尤其是当发泡胶带上涂覆有材料时,虽然加热解黏特性仍保持,但是其发生弯曲的概率减少,更不利于自动化去除。
发明内容
本发明的目的是针对现有技术中存在的技术缺陷,而提供一种易脱离高脱除率发泡胶带。
为实现本发明的目的所采用的技术方案是:
一种易脱离高脱除率发泡胶带,包括自上而下设置的胶带基层、胶膜层和隔离层,所述的胶膜层包括20%-70%质量份数的高分子聚合物类胶水和30%-80%质量份数的遇热可膨胀的微胶囊,所述的高分子聚合物类胶水包括50%-100%质量份数的多糖类聚合物和0%-50%质量份数的多官能团烯烃聚合物。
所述的多糖类聚合物为壳聚糖、乳糖、麦芽糖和纤维素的一种或几种,所述的多官能团烯烃聚合物为丙烯酸、聚丙烯酸酯、聚丙烯酰胺或聚丙烯腈的一种或几种。
所述的胶带基层和胶膜层上下对应并构成矩形模切块且间隔地贴覆在隔离层,矩形模切块上设置有多个切穿所述的胶带基层和胶膜层的切口。
所述的胶带基层为PET层。
所述的切口为多个横向间隔排列的直线痕。
所述的直线痕的长度为模切区长度对应边长度的70%-90%。
所述的直线痕长短依次交错间隔设置。
所述的切口包括围合呈方形的四个直线痕,相邻直线痕间保持间隔。
所述的发泡胶带厚度在40mm-65mm,所述的胶带基层的厚度在10mm-30mm。
所述的PET层经过表面接枝处理以提高表面亲水性。
与现有技术相比,本发明的有益效果是:
本发明的发泡胶带,利用壳聚糖等多糖类聚合物,作为胶膜层的基料,其粘性大粘附能力强,而且随温度升高粘性衰减迅速且不挂胶,能满足后续焊接处理。在每块单独的方形模切块上设置切口,改变了胶带基层和胶膜层的应力,使其更容易发生卷曲,而且提高卷曲的规律性,提升卷曲度,提高胶带脱除率,有效提高自动化生产设备的适应性。
附图说明
图1所示为本发明的易脱离高脱除率发泡胶带的结构示意图;
图2所示为发泡胶带的截面结构示意图;
图3所示为另一种切口结构示意图。
具体实施方式
以下结合附图和具体实施例对本发明作进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
如图1-3所示,本发明的易脱离高脱除率发泡胶带包括自上而下设置的胶带基层1、胶膜层2和隔离层3,其中,所述的胶膜层包括20%-70%质量份数的高分子聚合物类胶水和30%-80%质量份数的微胶囊,所述的高分子聚合物类胶水包括50%-100%质量份数的多糖类聚合物和0%-50%质量份数的多官能团烯烃聚合物。
具体地说,所述的多糖类聚合物为壳聚糖、乳糖、麦芽糖和纤维素的一种或几种,所述的多官能团烯烃聚合物为丙烯酸、聚丙烯腈、聚丙烯酰胺或聚丙烯酸酯的一种或几种。
即,所述的胶膜层可直接由多糖类聚合物,如壳聚糖与微胶囊按比例混合构成,具体制备时,利用弱酸如醋酸将多糖类聚合物溶解后与微胶囊匀浆后烘干即可制得。
利用壳聚糖等多糖类聚合物,作为胶膜层的基料,其粘性大粘附能力强,而且随温度升高粘性衰减迅速且不挂胶,能满足后续焊接处理。
上述实施例中,增大了微胶囊的含量,胶膜层均表现了良好的粘附性,同时因为高分子聚合物类胶水,如壳聚糖,具有升温粘结性降低的特性,两者互相配合,首先发泡胶带易因微胶囊膨胀发生卷曲,同时壳聚糖等的粘性降低可提高脱除率,避免表面有粘附,发泡胶带遇热后脱除率由95%,增加到99%。提高了生产效率,增加了产品良品率。
本发明的发泡胶带可用于贴覆在箔片上,然后连续涂覆浆料,当发泡胶带卷曲脱离时即在集流体上留下相对干净的极片焊接空白区。当本发明的发泡胶带用于水性浆料涂覆时,由于发泡胶带表面疏水,水性负极浆料会滑到浆料边缘堆积,导致极片涂覆局部厚度不均匀,碾压后由于应力不均破坏极片。
为改善这一问题,需要增加发泡胶带的亲水性,将发泡胶带进行等离子体表面接枝处理,接枝亲水性官能团如羟基、羧基、羰基等。接枝后的发泡胶带表面亲水性显著提高,可以使浆料均匀覆盖在发泡发泡胶带表面。
具体操作步骤如下:
将发泡胶带置于等离子设备中,调整等离子设备的放电功率为12W,调节丙烯酸气体的流量,使放电真空度为30Pa,放电时间为1分钟,以500mL/min的速度通入丙烯酸气体,进行等离子体放电反应,放电后继续以上述相同的速度通入反应气体进行后续化学聚合,调整真空度为80Pa,聚合时间为0.5小时。在热压定型的PET膜表面进行接枝反应得到含有丙烯酸长链官能团的PET膜。
其中,所述的发泡胶带厚度在40-65mm,所述的胶带基层的厚度在10-30mm。所述的胶带基层和胶膜层上下对应并构成矩形模切块且间隔地贴覆在隔离层,矩形模切块上设置有多个切穿所述的胶带基层和胶膜层的切口。利用模切的矩形模切区,限定了单块大小,便于需要高精度地方的黏贴,同时在每块单独的矩形模切区上设置切口,改变了胶带基层和胶膜层的应力,使其更容易发生卷曲,而且提高卷曲的规律性,提升卷曲度,有效提高自动化生产设备的适应性。
优选地,所述的切口为多个横向间隔排列的的直线痕4,具体设计上,可采用多种形式,如所述的直线痕的长度为模切区长度对应边长度的70%-90%,或者所述的直线痕长短依次交错设置。或者所述的直线痕两两为一组,两组间的间距大于一组内两直线痕的间距。
当然,所述的切口也可采用斜向布局,即与方形区的侧边不平行或垂直的设置,同样能起到上述效果。
作为另外一种实施方式,所述的切口包括围合呈方形的四个直线痕5,相邻直线痕间保持间隔。采用四角处保留间隔的方形的切口设计,使得胶膜层向中心卷曲,减少附着点,控制残余的粘结力,使其便于脱离。
以上所述仅是本发明的优选实施方式,应当指出的是,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种易脱离高脱除率发泡胶带,其特征在于,包括自上而下设置的胶带基层、胶膜层和隔离层,所述的胶膜层包括20%-70%质量份数的高分子聚合物类胶水和30%-80%质量份数的遇热可膨胀的微胶囊,所述的高分子聚合物类胶水包括50%-100%质量份数的多糖类聚合物和0%-50%质量份数的多官能团烯烃聚合物。
2.如权利要求1所述的易脱离高脱除率发泡胶带,其特征在于,所述的多糖类聚合物为壳聚糖、乳糖、麦芽糖和纤维素的一种或几种,所述的多官能团烯烃聚合物为丙烯酸、聚丙烯酸酯、聚丙烯酰胺或聚丙烯腈的一种或几种。
3.如权利要求1所述的易脱离高脱除率发泡胶带,其特征在于,所述的胶带基层和胶膜层上下对应并构成矩形模切块且间隔地贴覆在隔离层,矩形模切块上设置有多个切穿所述的胶带基层和胶膜层的切口。
4.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的胶带基层为PET层。
5.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的切口为多个横向间隔排列的直线痕。
6.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的直线痕的长度为模切区长度对应边长度的70%-90%。
7.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的直线痕长短依次交错间隔设置。
8.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的切口包括围合呈方形的四个直线痕,相邻直线痕间保持间隔。
9.如权利要求3所述的易脱离高脱除率发泡胶带,其特征在于,所述的发泡胶带厚度在40mm-65mm,所述的胶带基层的厚度在10mm-30mm。
10.如权利要求4所述的易脱离高脱除率发泡胶带,其特征在于,所述的PET层经过表面接枝处理以提高表面亲水性。
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Cited By (2)
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CN109825206A (zh) * | 2019-01-28 | 2019-05-31 | 东莞市澳中电子材料有限公司 | 一种易脱离高脱除率发泡胶带 |
CN113899390A (zh) * | 2021-12-10 | 2022-01-07 | 浙江大学 | 一种非对称的强粘易撕传感器及制备方法 |
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CN113899390A (zh) * | 2021-12-10 | 2022-01-07 | 浙江大学 | 一种非对称的强粘易撕传感器及制备方法 |
CN113899390B (zh) * | 2021-12-10 | 2022-03-29 | 浙江大学 | 一种非对称的强粘易撕传感器及制备方法 |
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