CN106363269A - Tool and method for brazing of microstrip circuit - Google Patents
Tool and method for brazing of microstrip circuit Download PDFInfo
- Publication number
- CN106363269A CN106363269A CN201610900681.6A CN201610900681A CN106363269A CN 106363269 A CN106363269 A CN 106363269A CN 201610900681 A CN201610900681 A CN 201610900681A CN 106363269 A CN106363269 A CN 106363269A
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- China
- Prior art keywords
- substrate
- soldering
- circuit
- carrier board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a tool for brazing of a microstrip circuit. The tool comprises a first base plate, a second base plate and a magnetic switch device, wherein the first base plate and the second base plate are parallel and are made of electromagnetic materials. A microstrip circuit board is arranged between the first base plate and the second base plate in a pressure welding manner. The magnetic switch device is placed on the side face, away from the microstrip circuit board, of the first base plate or the second base plate and used for attracting or separating the first base plate and the second base plate. Magnetic force between the magnetic switch device and the upper-lower base plates is utilized for replacing pressure between a screw and a metal plate tool in a traditional tool for conducting fixing, screw holes do not need to be designed in the metal plate tool or a circuit base plate or a carrier plate, and screws do not need to be used the metal plate tool or the circuit base plate or the carrier plate. The situation that tools need to be independently designed for different microstrip circuits is avoided. Dismounting and mounting operation is easier, and the operation efficiency can be effectively improved.
Description
Technical field
The present invention relates to microstrip circuit welding field, especially a kind of frock for microstrip circuit soldering and method.
Background technology
Microstrip circuit is typically made up of microstrip circuit substrate and carrier board two parts, and the two passes through in joint face solder application
Carry out soldering to realize connecting.The brazing tooling of current microstrip circuit substrate generally requires and is set for special microstrip circuit
Meter, the upper and lower of microstrip circuit substrate and carrier board respectively with two pieces need position reserve screw hole plater
Dress and screw are fixed, so that when microstrip circuit being placed in reflow soldering after solder application and carrying out soldering, by two nugget genus
The screw of plate frock and fixed metal plate frock is to providing necessary pressure between microstrip circuit substrate and carrier board so that solder
Can smoothly flow after soldering fusing, it is to avoid in microstrip circuit substrate and load after soldering under the pressure condition that there is no need
Between body plate solder cannot smooth outflow, between microstrip circuit substrate and carrier board formed cavity so that the saturating rate of pricker reduce.
But, the frock of this traditional form needs at the beginning of microstrip circuit design just in microstrip circuit substrate and carrier board
And plater loads onto the position of reserved screw hole；Even the microstrip circuit of formed objects, due to microstrip circuit figure not
With screw needs the position conceded different, thus screw hole correspondence position is different, is required to individually designed frock；And operated
In journey, brazing tooling needs to be screwed with microstrip circuit, and complex operation takes more, inefficiency.
Content of the invention
The technical problem to be solved be provide a kind of simple to operate, versatility is high, high being used for of welding efficiency
The frock of microstrip circuit soldering.
The technical scheme is that a kind of frock for microstrip circuit soldering, including
First substrate and second substrate and magnetic switch device；Described first substrate and described second substrate are all using ferrimagnet system
Become, described micro belt board is crimped between described first substrate and described second substrate, and described magnetic switch device is placed on
On the described first substrate or described second substrate side away from described micro belt board, for by described first substrate with described
Second substrate absorption or separation.
The invention has the beneficial effects as follows: spiral shell in traditional frock is replaced using the magnetic force between Magnetic gauge stand and upper and lower laminar substrate
Pressure between nail and metallic plate frock is fixed, and needs in metallic plate frock, microstrip circuit at the beginning of decreasing structure design
Necessity of screw hole is designed in substrate, carrier board；Microstrip circuit for formed objects can adopt same set of frock, it is to avoid
Need the necessity for the different individually designed frocks of microstrip circuit；Save the fixation during frock mounts and dismounts and dismounting
, it is only necessary to magnet in spin magnetization gauge stand, Magnetic gauge stand is more much bigger than the area of screw by contrast for the process of screw,
Requirement much less in frock, installs fixing and dismantles also more simple, can effectively improve operating efficiency.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described magnetic switch device includes Magnetic gauge stand, Magnet and switching knob, and described Magnetic gauge stand is placed on
On the side away from described micro belt board for the described second substrate, the side of described Magnetic gauge stand is connected with switching knob,
The first groove is offered, described Magnet is fixedly mounted in described first groove, and described Magnet is with institute inside described switching knob
State switching knob to rotate.
Beneficial effect using above-mentioned further scheme is；On the switching knob of Magnetic gauge stand, a Magnet is installed, and
Band moving magnet is rotated, and first substrate can be controlled to separate and absorption with second substrate, simple and convenient, is conducive to fast welding
Connect, the frock step before solving the problems, such as and structure are excessively loaded down with trivial details.
Further, described Magnet is bar magnet, when described Magnet rotate to vertical with described second substrate when, described the
One substrate is separated with described second substrate；When described Magnet rotate to parallel with described second substrate when, described first substrate
Fit with the absorption of described second substrate.
Beneficial effect using above-mentioned further scheme is: when Magnet is parallel to each other with second substrate, by Magnet
Magnetic induction line is controlled with second substrate to first substrate, makes the two magnetic force each other larger, micro belt board is compressed,
It is easy to micro belt board is welded.
Further, described Magnetic gauge stand also includes block, and described block is made using nonferromugnetic material, described magnetic table
The middle part seating against closely described second substrate one end offers the second groove perpendicular to described second substrate, and described block is entrenched in
In described second groove.
Beneficial effect using above-mentioned further scheme is: embeds unification in the second groove vertical with second substrate non-
The block that ferrimagnet is made is so that when Magnet is vertical with first substrate, the magnetic induction line that Magnet sends is only a small amount of
Through first substrate, and then first substrate is separated with second substrate.
Further, described micro belt board includes carrier board and circuit substrate, described carrier board and described circuit substrate
Length and width all same, described carrier board arranges near described first substrate, described circuit substrate is near described second substrate
Arrangement, described carrier board crimps arrangement and the welding of the solder side of described carrier board and described circuit substrate with described circuit substrate
Face is bonded to each other.
Further, described first substrate and the length of described second substrate are all higher than described carrier board and described circuit substrate
Length, the width of described first substrate and described second substrate is more than the width of described carrier board and described circuit substrate.
Beneficial effect using above-mentioned further scheme is: first substrate is designed as relatively with the length and width of second substrate
Big size, can be applied to multiple micro belt boards with a set of frock, need not prepare multiple frocks, cost-effective, improve work
Make efficiency.
A kind of method for microstrip circuit soldering, comprises the following steps:
Step 1, described first substrate, micro belt board, second substrate are sequentially overlapped placement from the bottom to top, then will be described
Magnetic switch device is placed on described second substrate；
Step 2, adjusts described magnetic switch device, after so that described first substrate is fitted with the absorption of described second substrate, right
Described micro belt board carries out soldering；
Step 3, after the completion of soldering, adjusts described magnetic switch device, by described Magnetic gauge stand and described second substrate according to
Secondary take off, the more described micro belt board after soldering is taken out.
Further, in described step 1, described micro belt board includes carrier board and circuit substrate, more described carrier board with
Coat solder on the solder side of described circuit substrate, the superposition of described carrier board is placed on described first substrate, by described electricity
Base board superposition is placed on described carrier board and will be mutual with the solder side of described circuit substrate for the solder side of described carrier board
Laminating.
Further, in described step 2, rotate described switching knob, make described Magnet parallel with described second substrate, in institute
State after the absorption of carrier board and described circuit substrate fits, described frock is put in soldering oven, the solder side to described carrier board
Carry out soldering with the solder side of described circuit substrate.
Further, in described step 3, after the completion of described carrier board and described circuit substrate soldering, by described frock from
Take out in described soldering oven, rotating described switching knob makes described Magnet vertical with described first substrate, in described first substrate
After separating with described second substrate, described magnetic switch device is taken off successively with described second substrate, then will be welded
Described carrier board is taken out with described circuit substrate.
Beneficial effects of the present invention are identical with a kind of above-mentioned beneficial effect of the frock for microstrip circuit soldering, and here is not
Repeat again.
Brief description
Fig. 1 is overall structure figure of the present invention.
In accompanying drawing, the list of parts representated by each label is as follows:
1st, first substrate；2nd, second substrate；3rd, magnetic switch device；31st, Magnetic gauge stand；311st, block；32nd, switch rotation
Button；33rd, Magnet；4th, micro belt board；41st, carrier board；42nd, circuit substrate.
Specific embodiment
Below in conjunction with accompanying drawing, the principle of the present invention and feature are described, example is served only for explaining the present invention, and
Non- for limiting the scope of the present invention.
As shown in figure 1, a kind of frock for microstrip circuit soldering of the present embodiment, including first substrate 1, second substrate
2 and magnetic switch device 3；, all using ferrimagnet, micro belt board 4 is plugged on the first base for first substrate 1 and second substrate 2
Between plate 1 and second substrate 2, magnetic switch device 3 is placed on the side away from micro belt board 4 for the second substrate 2, for inciting somebody to action
First substrate 1 is adsorbed with second substrate 2 or separates.
As shown in figure 1, the magnetic switch device 3 of the present embodiment includes Magnetic gauge stand 31, switching knob 32 and Magnet 33, magnetic
Property gauge stand 31 is placed on the side away from micro belt board 4 for the second substrate 2, and the side of Magnetic gauge stand 31 is connected with switch
Knob 32, offers the first groove inside switching knob 32, Magnet 33 is fixedly mounted in the first groove, and Magnet 33 is with switch rotation
Button 32 rotates；Magnetic gauge stand 31 also includes block 311, and block 311 is made using nonferromugnetic material, and block 311 fixedly mounts
Magnetic gauge stand 31 is near the middle part of second substrate 2 one end.The Magnet 32 of the present embodiment is bar magnet, and its one end is n pole,
One end is s pole, and magnetic induction line sends by n pole and return to s pole, is subject to through its with the magnetic induction line of second substrate 2 more of first substrate 1
Magnetic force is bigger；Magnetic force is bigger, and first substrate 1 is fitted tighter with second substrate 2, and magnetic force is less, first substrate 1 and second substrate 2
It is separated from each other.Therefore, when Magnet 33 rotate to vertical with second substrate 2 when, Magnet 33 is near one end of second substrate 2 and non-ferric
The block 311 that magnetic material is made contacts, less with the magnetic induction line quantity of second substrate 2 through first substrate 1, first substrate with
Second substrate is less by magnetic force, and first substrate 1 is separated with second substrate 2；When Magnet 33 rotates to parallel with second substrate 2
When, more with the magnetic induction line quantity of second substrate 2 through first substrate 1, the magnetic force that first substrate 1 is subject to second substrate 2 is relatively
Greatly, first substrate 1 is fitted with second substrate 2 absorption.
In the present embodiment, micro belt board 4 includes carrier board 41 and circuit substrate 42, carrier board 41 and circuit substrate 42
Length and width all same, carrier board 41 arranges near first substrate 1, circuit substrate 42 is arranged near second substrate 2, carrier board
41 crimp with circuit substrate 42 arrangement and carrier board 41 solder side bonded to each other with the solder side of circuit substrate 42；First substrate
1 is all higher than the length of carrier board 41 and circuit substrate 42 with the length of second substrate 2, the width of first substrate 1 and second substrate 2
Width more than carrier board 41 and circuit substrate 42.
As shown in figure 1, a kind of method for microstrip circuit soldering of the present embodiment, comprise the following steps:
Step 1, first substrate 1, micro belt board 4, second substrate 2 are sequentially overlapped placement from the bottom to top, then by magnetic
Switching device 3 is placed on second substrate 2；
Step 2, adjusts magnetic switch device 3, after so that first substrate 1 and second substrate 2 is separated, to micro belt board 4
Carry out soldering；
Step 3, after the completion of soldering, adjusts magnetic switch device 3, after so that first substrate 1 and second substrate 2 is mutually adsorbed,
Micro belt board 4 after soldering is taken out.
In step 1, micro belt board 4 includes carrier board 41 and circuit substrate 42, and carrier board 41 superposition is placed on first
On substrate 1, circuit substrate 42 is superimposed the weldering being placed on carrier board 41 and by the solder side of carrier board 41 and circuit substrate 42
Junction is bonded to each other.
In step 2, rotary switch knob 32, make Magnet 33 parallel with second substrate 2, in carrier board 41 and circuit substrate 42
After laminating, soldering is carried out to the solder side of carrier board 41 and the solder side of circuit substrate 42.
In step 3, after the completion of by carrier board 41 and circuit substrate 42 soldering, adjust magnetic switch device 3, magnetic is opened
Close device 3 to take off successively with second substrate 2, then the micro belt board 4 after welding is taken out.
In the present embodiment, micro belt board 4 includes carrier board 41 and circuit substrate 42.
In step 1, after the solder side of carrier board 41 and circuit substrate 42 coats solder, carrier board 41 is superimposed placement
On first substrate 1, circuit substrate 42 superposition is placed on carrier board 41 and by the solder side of carrier board 41 and circuit substrate
42 solder side is bonded to each other.
In step 2, rotary switch knob 32, make Magnet 33 parallel with first substrate 1, in carrier board 41 and circuit substrate 42
After absorption laminating, whole frock is put in soldering oven, the solder side of carrier board 41 is carried out with the solder side of circuit substrate 42
Soldering.
In step 3, after the completion of carrier board 41 with circuit substrate 42 soldering, whole frock is taken out from soldering oven, rotation
Turning switching knob 32 makes Magnet 33 vertical with second substrate 2, takes off successively with second substrate 2 in first substrate 1, then will be welded
Carrier board 41 take out with circuit substrate 42.
Be only used for describing purpose with term " first ", " second ", and it is not intended that instruction or hint relative importance or
Person implies the quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or hidden
Include at least one this feature containing ground.
Upper described be only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and former
Within then, any modification, equivalent substitution and improvement made etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of frock for microstrip circuit soldering is it is characterised in that include first substrate (1) and the second base being arranged in parallel
Plate (2) and magnetic switch device (3)；Described first substrate (1) and described second substrate (2) are all made using ferrimagnet,
Described micro belt board (4) is crimped between described first substrate (1) and described second substrate (2), described magnetic switch device
(3) it is placed on described first substrate (1) or described second substrate (2) side away from described micro belt board (4), for inciting somebody to action
Described first substrate (1) is adsorbed with described second substrate (2) or is separated.
2. according to claim 1 a kind of frock for microstrip circuit soldering it is characterised in that described magnetic switch device
(3) Magnetic gauge stand (31), switching knob (32) and Magnet (33) are included；Described Magnetic gauge stand (31) is placed on described second substrate
(2), on the side away from described micro belt board (4), the side of described Magnetic gauge stand (31) is connected with switching knob
(32), offer the first groove inside described switching knob (32), described Magnet (33) is fixedly mounted in described first groove,
Described Magnet (33) rotates with described switching knob (32).
3. according to claim 2 a kind of frock for microstrip circuit soldering it is characterised in that described Magnet (33) be bar
Shape Magnet, when described Magnet (33) rotate to vertical with described second substrate (1) when, described first substrate (1) and described second
Substrate (2) is separated；When described Magnet (33) rotate to parallel with described second substrate (1) when；Described first substrate (1) and institute
State second substrate (2) absorption laminating.
4. according to Claims 2 or 3 a kind of frock for microstrip circuit soldering it is characterised in that described Magnetic gauge stand
(31) also include block (311), described block is made using nonferromugnetic material, described Magnetic gauge stand (31) close described second
The middle part of substrate (2) one end offers the second groove perpendicular to described second substrate (2), and described block (311) is entrenched in institute
State in the second groove.
5. according to claim 1 a kind of frock for microstrip circuit soldering it is characterised in that described micro belt board
(4) carrier board (41) and circuit substrate (42), the length of described carrier board (41) and described circuit substrate (42) and width are included
All same, near described first substrate (1) arrangement, described circuit substrate (42) is near described second substrate for described carrier board (41)
(2) arrange, described carrier board (41) crimps arrangement and the solder side of described carrier board (41) and institute with described circuit substrate (42)
The solder side stating circuit substrate (42) is bonded to each other.
6. according to claim 4 a kind of frock for microstrip circuit soldering it is characterised in that described first substrate (1)
It is all higher than the length of described carrier board (41) and described circuit substrate (42) with the length of described second substrate (2), described first
The width of substrate (1) and described second substrate (2) is more than the width of described carrier board (41) and described circuit substrate (42).
7. a kind of method that using the frock as described in claim 1 to 6, microstrip circuit is carried out with soldering is it is characterised in that wrap
Include following steps:
Step 1, described first substrate (1), described micro belt board (4), described second substrate (2) are sequentially overlapped from the bottom to top
Place, more described magnetic switch device (3) is placed on described second substrate (2)；
Step 2, adjusts described magnetic switch device (3), so that described first substrate (1) is fitted with described second substrate (2) absorption
Afterwards, soldering is carried out to described micro belt board (4)；
Step 3, after the completion of soldering, adjusts described magnetic switch device (3), by described magnetic switch device (3) and described second
Substrate (2) takes off successively, the more described micro belt board (4) after soldering is taken out.
8. a kind of method for microstrip circuit soldering is it is characterised in that in described step 1, described according to claim 7
Micro belt board (4) includes carrier board (41) and circuit substrate (42), in described carrier board (41) and described circuit substrate (42)
Solder side coat solder after, by described carrier board (41) superposition be placed on described first substrate (1), by described circuit substrate
(42) to be placed on described carrier board (41) upper and by the solder side of described carrier board (41) and described circuit substrate (42) for superposition
Solder side is bonded to each other.
9. according to claim 8 a kind of method for microstrip circuit soldering it is characterised in that in described step 2, rotation
Described switching knob (32), makes described Magnet (33) parallel with described second substrate (2), in described carrier board (41) and described electricity
After base board (42) absorption laminating, described frock is put in soldering oven, solder side and the described electricity to described carrier board (41)
The solder side of base board (42) carries out soldering.
10. according to claim 7 a kind of method for microstrip circuit soldering it is characterised in that in described step 3,
After the completion of described carrier board (41) and the soldering of described circuit substrate (42), described frock is taken out from described soldering oven, rotation
Described switching knob (32) makes described Magnet (33) vertical with described second substrate (2), in described first substrate (1) and described the
After two substrates (2) are separated, described magnetic switch device (3) is taken off successively with described second substrate (2), then will be welded
Described carrier board (41) is taken out with described circuit substrate (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610900681.6A CN106363269B (en) | 2016-10-17 | 2016-10-17 | A kind of tooling and method for microstrip circuit soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610900681.6A CN106363269B (en) | 2016-10-17 | 2016-10-17 | A kind of tooling and method for microstrip circuit soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106363269A true CN106363269A (en) | 2017-02-01 |
| CN106363269B CN106363269B (en) | 2019-09-27 |
Family
ID=57896402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610900681.6A Active CN106363269B (en) | 2016-10-17 | 2016-10-17 | A kind of tooling and method for microstrip circuit soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106363269B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2991347A (en) * | 1959-12-14 | 1961-07-04 | Hoffman Electronics Corp | Magnetic jig for alloying |
| CN2178322Y (en) * | 1993-07-13 | 1994-09-28 | 高国良 | Working lamp with magnetic base |
| CN2243115Y (en) * | 1995-08-07 | 1996-12-18 | 王金源 | Magnetic seat |
| JP2004230871A (en) * | 2003-02-03 | 2004-08-19 | Nippon Dempa Kogyo Co Ltd | Solder printing method onto print substrate |
| CN202587621U (en) * | 2012-04-25 | 2012-12-05 | 苏州友佳电子有限公司 | Flexible printed circuit board (FPC) mounting jig |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN203504890U (en) * | 2013-09-03 | 2014-03-26 | 潘宇强 | Magnetic printing jig of FPC circuit board |
| CN205082071U (en) * | 2015-11-12 | 2016-03-09 | 珠海市华亚机械科技有限公司 | FPC crosses stove anchor clamps |
-
2016
- 2016-10-17 CN CN201610900681.6A patent/CN106363269B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2991347A (en) * | 1959-12-14 | 1961-07-04 | Hoffman Electronics Corp | Magnetic jig for alloying |
| CN2178322Y (en) * | 1993-07-13 | 1994-09-28 | 高国良 | Working lamp with magnetic base |
| CN2243115Y (en) * | 1995-08-07 | 1996-12-18 | 王金源 | Magnetic seat |
| JP2004230871A (en) * | 2003-02-03 | 2004-08-19 | Nippon Dempa Kogyo Co Ltd | Solder printing method onto print substrate |
| CN202587621U (en) * | 2012-04-25 | 2012-12-05 | 苏州友佳电子有限公司 | Flexible printed circuit board (FPC) mounting jig |
| CN102858095A (en) * | 2012-08-27 | 2013-01-02 | 歌尔声学股份有限公司 | Supporting jig of flexible circuit board |
| CN203504890U (en) * | 2013-09-03 | 2014-03-26 | 潘宇强 | Magnetic printing jig of FPC circuit board |
| CN205082071U (en) * | 2015-11-12 | 2016-03-09 | 珠海市华亚机械科技有限公司 | FPC crosses stove anchor clamps |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106363269B (en) | 2019-09-27 |
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