CN106358412B - Convertor device and convertor device manufacturing method - Google Patents
Convertor device and convertor device manufacturing method Download PDFInfo
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- CN106358412B CN106358412B CN201610529221.7A CN201610529221A CN106358412B CN 106358412 B CN106358412 B CN 106358412B CN 201610529221 A CN201610529221 A CN 201610529221A CN 106358412 B CN106358412 B CN 106358412B
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- framework
- installation base
- base plate
- convertor device
- opening portion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Miniaturization is simultaneously realized in a kind of convertor device and convertor device manufacturing method, gap packing material being reliably filled between the electric component of installation base plate.Have installation base plate (2), accommodate the framework (3) of installation base plate, to cover the cover (4) that the form of framework opening portion (33) is installed on framework, filler (5) is filled in framework to be constituted by the form that the electric component (22) of the installation base plate of framework is contained in covering, framework has bottom plate (31) and in each peripheral part of bottom plate (31) erects 4 side plates of setting to be formed and rib (34) are set to side plate inner face and constituted, installation base plate is contained in framework with mounting surface (21a) state that opposite and mounting surface is connected to rib with bottom plate for installing electric component, filler is filled between bottom plate (31) and mounting surface (21a), cover is connected to the installation base plate back side with the protrusion (43) set on inner face and the state that installation base plate is pressed to bottom plate side is installed on framework.
Description
Technical field
The present invention relates to the covers for the opening portion for having installation base plate, accommodating the framework of installation base plate and covering framework simultaneously
And in the form of the electric component for covering installation base plate by filler be filled into the intracorporal converter of frame (converter) device,
And manufacture the convertor device manufacturing method of the convertor device.
Background technique
As this kind of device, as we all know there are following resin packed electronic-circuit devices disclosed in patent document 1 (with
Down also referred to as " electronic-circuit device ").The electronic-circuit device passes through the wiring base that has shell (case), be equipped with component
Plate, the opening portion for covering shell cover shape frame constitute.In addition, being housed inside shell in the electronic-circuit device with covering
Potting resin is filled in shell by the form of the component of intracorporal wiring substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication 03-6879 bulletin (page 3~4, the 1st~3 figure)
However, there is following problem for existing electronic-circuit device.That is, in existing electronic-circuit device
In, so that wiring substrate is contained in the bottom side of shell simultaneously by the state (towards the state of the opening portion side of shell) that component is upward
The potting resin with mobility is flowed into simultaneously coating member from thereon.In the case, potting resin is because of its major function
To make hot heat transfer caused by component and via shell to radiating except shell, it is advantageous to exhaustive be filled in component that
The gap between gap and component and shell between this gap, component and substrate.However, only being flowed on component
When potting resin, so that potting resin is filled in above-mentioned each gap and be difficult.Therefore, with regard to existing electronics electricity
For the device of road, there is a problem of effectively playing heat sinking function of potting resin etc..In addition, being used for this kind of electronics
The shell of the resin of circuit device is generally formed by injection molding, still, in injection molding, in order to ensure taking off for molded part
Mould, it is necessary to which shell is configured to horizontal area with the shape to broaden from bottom side towards opening portion side.Therefore, it is inciting somebody to action
Wiring substrate is contained in the existing electronic-circuit device of housing bottom side, and the horizontal area of the opening portion side on shell is greater than
The area of wiring substrate.Therefore, in existing electronic-circuit device, because being open compared to the intracorporal wiring substrate of shell
There are more wasted spaces in the region of portion side, so correspondingly miniaturization becomes difficult.
Summary of the invention
The present invention is the invention completed in view of above-mentioned technical problem, its main purpose is, providing one kind can
Packing material is filled in the gap between the electric component in installation base plate by ground and can be realized the converter of miniaturization
Device.
In order to achieve the above object, convertor device according to the present invention, which is characterized in that be to have to install in substrate
Have electric component installation base plate, a face have opening portion and accommodate the installation base plate framework and with covering described in
The form of opening portion is installed in the cover of the framework, and by cover the installation base plate for being housed inside the framework
The form filler of the electric component be filled in the framework convertor device constituted, the framework passes through a pair
Above rib is arranged at inner face relative to each other to constitute, and the installation base plate is to be equipped with the base of the electric component
The state that the mounting surface of the plate mounting surface opposite and described with the bottom plate is connected to the rib is housed inside the framework, described
Filler is filled between the bottom plate and the mounting surface of the installation base plate, and the cover, which passes through to have, to be arranged at
The protrusion of the inner face of shape roughly the same with the opening portion of the framework is connected to constitute with the protrusion
The state that the installation base plate is pressed to the bottom plate side is simultaneously installed in institute by the back side of the substrate in the installation base plate
State framework.
In addition, convertor device according to the present invention, the framework is formed the length for having opening portion in a face
Cube shape.
In addition, convertor device according to the present invention, the framework is formed have the vertical of opening portion in a face
Cube shape.
In addition, convertor device according to the present invention, the framework is formed the circle that portion at one end has opening portion
Barrel shape.
In addition, convertor device according to the present invention, the framework is by having the institute being formed on the side plate
The holding section of the edge part of opening portion side is stated to constitute, the cover is blocked in the state of being installed in the framework by having
It is constituted together in the engaged part of the holding section.
In addition, convertor device according to the present invention, the framework should under the overlooking state for overlooking the bottom plate
The center of bottom plate is formed the shape of point symmetry as symmetric points.
In addition, convertor device manufacturing method according to the present invention, which is characterized in that be the change for manufacturing convertor device
Exchanger unit manufacturing method, the convertor device, which has, is equipped with the installation base plate of electric component, in a mask in substrate
There is opening portion and accommodates the framework of the installation base plate and be installed in the lid of the framework in the form of covering the opening portion
Portion, and filler is filled in the form of the electric component to cover the installation base plate for being housed inside the framework
In being constituted in the framework, the filler of the state with mobility is injected into it is arranged at by more than one pair of rib
Inner face relative to each other come in the framework that constitutes, be equipped with the electric component the substrate mounting surface with it is described
The installation base plate is contained in the framework by the opposite posture of bottom plate, in the form of covering the opening portion will with it is described
When the cover that the inner face of the roughly the same shape in the opening portion of framework is provided with protrusion is installed on the framework,
The installation base plate is pressed to the bottom plate by the back side for the substrate for being connected to the protrusion in the installation base plate
Side is until the mounting surface is connected to the rib, later, the filler is made to solidify and manufacture the convertor device.
In convertor device according to the present invention, mounting surface is opposite with the bottom plate of framework and is connected to mounting surface
Installation base plate is contained in framework by the state for being formed on the rib of the side plate of framework, and filler is filled in bottom plate and installation base plate
Mounting surface between, be arranged at the protrusion of cover be connected to installation base plate substrate the back side and installation base plate is pushed
Cover is installed on framework by the state to bottom plate side.Therefore, in the convertor device, to bottom plate side caused by protrusion
Installation base plate pushing, the gap being filled in filler with not omitting between each electric component or each electricity
Gap between gas component and mounting surface.Therefore, according to the convertor device, the heat dissipation function of filler can effectively be played
Energy.In addition, according to the convertor device, because will be installed with the mounting surface state that opposite and mounting surface is connected to rib with bottom plate
Substrate is contained in framework, so the substrate of installation base plate can be made to be located at the opening portion side of framework.Therefore, it is filled according to the converter
It sets, framework is formed and the area by the substrate of the horizontal area Matching installation substrate of opening portion side, so as to make bottom plate
The horizontal area of side is less than the area of substrate, and as a result, it is possible to minimize to framework.
In addition, convertor device involved according to the present invention, by the way that framework to be formed as to have opening portion in a face
Rectangular shape, so as to the configuration space of convertor device be rectangular shape when, by useless gap
It is suppressed to less state and convertor device is configured at the configuration space.
In addition, convertor device involved according to the present invention, by the way that framework to be formed as to have opening portion in a face
Cubic shaped, so as to the configuration space of convertor device be cubic shaped when, by useless gap
It is suppressed to less state and convertor device is configured at the configuration space.
In addition, convertor device involved according to the present invention, by the way that framework to be formed as to have opening an end
The cylindrical shape in portion, so as to which when the configuration space of convertor device is columned, useless gap is inhibited
Convertor device is configured at the configuration space for less state.
In addition, convertor device involved according to the present invention, framework is constituted by having holding section and is had and is being pacified
The engaged part of holding section is sticked under dress state to constitute cover, to only press cover energy towards the opening portion of framework
Engage holding section with engaged part and be reliably prevented cover to fall off from framework, and is able to maintain that base will be installed
Plate is pressed to the state of the bottom plate side of framework.In addition, because holding section engages with engaged part, without by fixed structure
Part etc. comes fixed frame and the such operation of cover, because by the peace of the filling of filler, the receiving of installation base plate and cover
It fills the framework finished and the heat treatment (curing process) of (set) in heating device and progress relative to filler is for example set,
So can be improved manufacture efficiency.
In addition, convertor device involved according to the present invention, by using the center of bottom plate as symmetric points and by framework
Be formed as the shape of point symmetry, thus it is different from the framework for the shape for not being formed point symmetry, it is contained in by installation base plate
When framework, it is not necessary that it carries out the left and right towards Matching installation substrate of the left and right of framework towards such operation,
So correspondingly can be improved manufacture efficiency.
In addition, convertor device manufacturing method involved according to the present invention, by the filler of the state with mobility
It is injected into framework, installation base plate is contained in framework with the posture that mounting surface is opposite with the bottom plate of framework, is pacified by cover
When loaded on framework, the back side for the substrate for being connected to the protrusion of cover in installation base plate, until mounting surface abuts to frame
Installation base plate is pressed to bottom plate side until the rib of body, later, by solidifying filler so as to as produced by protrusion
Pushing from the installation base plate to bottom plate side without omit so that filler is filled in each electric component between
Gap between gap or each electric component and mounting surface.Therefore, according to the convertor device manufacturing method, energy can be manufactured
The convertor device of enough heat sinking functions for effectively playing filler.
Detailed description of the invention
Fig. 1 is the perspective view of convertor device 1.
Fig. 2 is the perspective view of the convertor device 1 for the state for unloading cover-dropping part 4.
Fig. 3 is the perspective view of installation base plate 2.
Fig. 4 is the perspective view of framework 3.
Fig. 5 is the top view for the framework 3 seen from 33 side of opening portion.
Fig. 6 is the perspective view of cover 4.
Fig. 7 is the 1st explanatory diagram for illustrating the manufacturing method of convertor device 1.
Fig. 8 is the 2nd explanatory diagram for illustrating the manufacturing method of convertor device 1.
Fig. 9 is the 3rd explanatory diagram for illustrating the manufacturing method of convertor device 1.
Figure 10 is the 4th explanatory diagram for illustrating the manufacturing method of convertor device 1.
Figure 11 is the 5th explanatory diagram for illustrating the manufacturing method of convertor device 1.
Specific embodiment
Hereinafter, (being also only known as " manufacture below to convertor device and convertor device manufacturing method referring to attached drawing
Method ") embodiment be illustrated.
Firstly, just the structure work of convertor device 1 represented by Fig. 1 as an example of convertor device is said as follows
It is bright.Convertor device 1 is, for example, a kind of input AC electric current and exports the AC-DC converter of DC current, such as Fig. 1 and Fig. 2
It is shown, it is constituted by having installation base plate 2, framework 3 and cover 4.In addition, in the convertor device 1, such as Figure 10 institute
Show, filler 5 is filled in framework 3.
Installation base plate 2 as shown in Figure 3 by have substrate 21 and be installed in the various electric components 22 of substrate 21 come
It constitutes.Substrate 21 is formed to overlook substantially rectangular (such as generally rectangular) as shown in the figure.Each electronic component 22 is constituted
Carry out the processing circuit of AC-DC conversion process.In addition, transformer or electricity on the installation base plate 2, in each electric component 22
The large electrics such as container component 22 is installed in the mounting surface 21a of substrate 21 (with the lower surface in figure).In addition, in substrate 21
Back side 21b (being the face of the opposite side of mounting surface 21a, with the upper surface in figure) is equipped with 2 input terminals of input AC electric current
Son (primary side terminal) 23a and 2 output terminals (secondary side terminal) 23b for exporting DC current.In addition, installation base plate 2
Mounting surface 21a as shown in Figure 10 is opposite (that is, the large electrics such as transformer or capacitor component 22 becomes with the bottom plate 31 of framework 3
It is housed inside framework 3 downward) and with the state that substrate 21 is located at 33 side of opening portion of framework 3.
Such as Fig. 4 of framework 3 is straightened and is set with substantially rectangular bottom plate 31 and in each peripheral part of bottom plate 31 shown in 5
The 4 side plate 32a~32d (hereinafter, when indiscriminative also referred to as " side plate 32 ") set, and be formed in a mask
There is the approximately cuboid box-shaped of opening portion 33 (face is opened).In the case, framework 3 is because by infusing resin
Type is moulded into be formed, so release property when in order to ensure molding, is formed horizontal area and opens with from 31 side of bottom plate direction
The shape that 33 side of oral area broadens gradually.
Here, in the convertor device 1, as previously discussed, with mounting surface 21a and the bottom plate 31 of framework 3 it is opposite and
Installation base plate 2 is contained in framework 3 (referring to Fig.1 0) by the state that substrate 21 is located at 33 side of opening portion of framework 3.Therefore, in the change
In exchanger unit 1, because frame can be formed the area of the substrate 21 of the horizontal area Matching installation substrate 2 of 33 side of opening portion
Body 3, so the horizontal area of 31 side of bottom plate can be made less than the area of substrate 21.Therefore, in the convertor device 1, with
The state that substrate 21 is located at 31 side of bottom plate compares the structure that installation base plate 2 is contained in framework 3, framework 3 can be minimized.
In other words, in the case where making 3 same size of framework, installation base plate 2 is held with the state for being located at 31 side of bottom plate with substrate 21
The structure for being contained in framework 3 compares, and can increase the horizontal area of substrate 21.
In addition, as shown in figure 5, the inner face of 2 the side plates 32a, 32c relative to each other in each side plate 32, sets respectively
It is equipped with rib 34 (can also refer to Fig. 4).The rib 34 has peace when installation base plate 2 is contained in framework 3 as shown in Figure 10
The edge part for filling the mounting surface 21a on the substrate 21 of substrate 2 is abutted and supports the function of installation base plate 2.In addition, rib 34 is such as
It is slightly larger than with the length until the upper end of bottom plate 31 to rib 34 (part for being connected to substrate 21) from installation base with shown in figure
The maximum height (in the figure until the length of lower end) for the electric component 22 that the mounting surface 21a of substrate 21 in plate 2 rises
Form is formed.
In addition, the opening portion 33 on 2 side plates 32b, 32d relative to each other such as Fig. 4, shown in 5, in each side plate 32
The edge part of side is respectively formed with the claw 35 to fasten with the connecting hole 44 of cover 4 (engaged part being equivalent to, referring to Fig. 6)
(holding section).
In addition, framework 3 is as shown in Figure 5 under the overlooking state for overlooking bottom plate 31 using the center 31a of bottom plate 31 as symmetrical
Put and be formed the shape of point symmetry.That is, the forming position of each rib 34 or the forming position of each claw 35 are with by bottom plate
The form that 31 center 31a becomes point symmetry as symmetric points is prescribed.
Cover 4 as shown in Figure 6 with substantially rectangular (shape roughly the same with the opening portion 33 of framework 3) mainboard 41, with
And 4 side plate 42a~42d of setting are straightened (hereinafter, being also referred to as when indiscriminative in each peripheral part of mainboard 41
" side plate 42 ") and it is formed the sub- shape of saucer, such as Fig. 1, shown in 11, to cover the form of the opening portion 33 (referring to Fig. 4) of framework 3
It is configured to be installed on framework 3.In the case, cover 4 is formed by carrying out injection molding to resin.
In addition, as shown in fig. 6, mainboard 41 inner face (with the upper surface in figure), be provided with multiple (such as 3) protrusions
Portion 43.In the case, as shown in Figure 10, when cover 4 is installed on framework 3 for accommodating installation base plate 2, Neng Gou
It is not contacted with setting protrusion 43 on any position for being installed in the electric component 22 of back side 21b of substrate 21.The protrusion
43 be used to make front end be connected to the installation base being contained in framework 3 when manufacturing convertor device 1 as shown in the figure
The back side 21b of substrate 21 in plate 2 and 31 side of bottom plate that installation base plate 2 is pressed to framework 3.
In addition, as shown in fig. 6, in mainboard 41, it is formed with each input terminal 23a for making installation base plate 2 and each
The insertion hole 45 of a output terminal 23b insert.In addition, 2 edge parts relative to each other on mainboard 41 and being straightened are set
2 side plates 42b, 42d of these edge parts are placed in, are formed and being respectively formed with a part by cutting away them and and frame
Connecting hole 44 that the claw 35 of body 3 fastens (also referring to Figure 10,11).
Filler 5 is thermohardening type silicone resin (thermohardening type silicone elastomer) as an example, has insulating properties
And becomes the gel with mobility in the state of before curing process, solidified and become by curing process (heat treatment)
It is melted into rubber-like.In addition, using the heat cure that pyroconductivity is high and is excellent in terms of thermal diffusivity for the filler 5
Type silicone resin.The filler 5 be filled in accommodate in the framework 3 of installation base plate 2, specifically the bottom plate 31 of framework 3 with
Between the substrate 21 of installation base plate 2, has and installation base plate 2 is fixed on framework 3 (movement of limitation installation base plate 2) and makes electricity
Heat caused by gas component 22 carries out heat transfer to reject heat to external function via framework 3.
Then, referring to attached drawing, the convertor device manufacturing method of manufacture convertor device 1 is explained as follows.In addition,
In Fig. 7~Figure 10, in order to illustrate the inside of framework 3 state and carry out figure to have an X-rayed the state of the side plate 32 of paper front side
Show.
Firstly, as shown in fig. 7, using distributor (dispenser) 50 and by the solidification of the specified amount only predetermined
Gelatinous filler 5 before processing is injected into framework 3.Then, as shown in figure 8, with the peace of the substrate 21 in installation base plate 2
Installation base plate 2 is contained in framework 3 by posture dress face 21a opposite with the bottom plate 31 of framework 3.
In the case, in the convertor device 1, framework 3 is formed as the center 31a of bottom plate 31 as symmetric points
The shape of point symmetry (referring to Fig. 5).That is, even if framework 3 will not as its plan view shape exchange left and right (even if 180 ° of rotation)
Changed structure.Therefore, it is not that the structure of point symmetry is different from the plan view shape of framework 3, is contained in by installation base plate 2
When framework 3, it is not necessary that carry out the left and right of framework 3 towards the left and right of Matching installation substrate 2 towards such operation, institute
Can correspondingly improve manufacture efficiency.
Then, as shown in figure 9, cover 4 is installed on framework 3 to cover the form of the opening portion 33 of framework 3.It is specific next
It says, each through-hole 45 for making the input terminal 23a of installation base plate 2 and output terminal 23b be inserted through cover 4 then makes cover
4 move downward.
Then, as shown in Figure 10, in the front end of protrusion 43 moving and be connected to installation base plate by downward cover 4
Cover 4 is pressed when the back side 21b of substrate 21 in 2 (to the opening portion 33 of framework 3) downwards, so that installation base plate 2 be pushed away
It is pressed onto 31 side of bottom plate of framework 3.At this point, pressure is applied to filler 5 by moving for substrate 21, filler 5, which is flowed into, is pacified
Gap or each electric component 22 and mounting surface between each electric component 22 of mounting surface 21a loaded on substrate 21
Gap between 21a.As a result, filler 5 is filled in these gaps with not omitting as shown in the figure.
Then, phase is released when the mounting surface 21a of substrate 21 is connected to the upper end for being formed on the rib 34 of framework 3
Pressing (loosing one's grip from cover 4) for cover 4.In this state, such as Figure 10, shown in 11, claw 35 and the cover 4 of framework 3
Connecting hole 44 carries out engaging and falls off to be reliably prevented cover 4 from framework 3.In addition, being carried out by claw 35 and connecting hole 44
Engaging is to be able to maintain that installation base plate 2 is pushed to the state of 31 side of bottom plate of framework 3 unclamping hand from cover 4.
According to the above, filling, the receiving of installation base plate 2 and the installation of cover 4 of filler 5 are completed.Then, it holds
Curing process of the row relative to filler 5.In the curing process, by the filling of filler 5, the receiving of installation base plate 2 and
Framework 3 (hereinafter also referred to as " framework 3 that assembling the is over ") setting (set) of cover 4 being installed is in the heating dress outside figure
It sets and carries out the heat treatment as curing process.In the case, as previously discussed, it is carried out by claw 35 and connecting hole 44
Engaging falls off from framework 3 to be reliably prevented cover 4 and is able to maintain that installation base plate 2 is pushed to the bottom plate 31 of framework 3
The state of side, so without that, come operation as fixed frame 3 and cover 4, assembling can be over by fixing member etc.
Framework 3 be set to heating device like this to carry out heat treatment to filler 5, so can be improved manufacture efficiency.
Filler 5 is carried out solidifying by above-mentioned heat treatment (curing process) and changes to rubber-like from gel.In addition,
Solidification is carried out by filler 5 to which installation base plate 2 is reliably fixed to framework 3.Convertor device 1 is completed as a result,.At this
In convertor device 1, as previously discussed, between filler 5 is filled between each electric component 22 with not omitting
Gap between gap or each electric component 22 and mounting surface 21a.Therefore, it in the convertor device 1, can effectively play
The heat sinking function of filler 5.
In this way, the bottom plate 31 of mounting surface 21a and framework 3 is opposite, and is supported with mounting surface 21a in the convertor device 1
It is connected to and is formed on the state of the rib 34 of side plate 32a, 32c of framework 3 installation base plate 2 is contained in framework 3, filler 5 is filled out
It fills between bottom plate 31 and the mounting surface 21a of installation base plate 2, the protrusion 43 for being arranged at cover 4 is connected to the base of installation base plate 2
The back side 21b of plate 21 is to be installed on framework 3 for cover 4 with the state that installation base plate 2 is pressed to 31 side of bottom plate.Therefore, exist
In the convertor device 1, will without omitting it be filled out caused by protrusion 43 to the pushing of the installation base plate 2 of 31 side of bottom plate
Between filling between the gap or each electric component 22 and mounting surface 21a that agent 5 is filled between each electric component 22
Gap.Therefore, according to the variator device 1, the heat sinking function of filler 5 can effectively be played.In addition, being filled according to the converter
1 is set, because being contained in installation base plate 2 with the mounting surface 21a state that opposite and mounting surface 21a is connected to rib 34 with bottom plate 31
Framework 3, so the substrate 21 of installation base plate 2 can be made to be located at 33 side of opening portion of framework 3.Therefore, according to the convertor device
1, by by 21 area of substrate of the horizontal area Matching installation substrate 2 of 33 side of opening portion and forming framework 3, so as to make bottom
The horizontal area of 31 side of plate is less than 21 area of substrate, and as a result, it is possible to minimize to framework.
In addition, passing through the cuboid for being formed as framework 3 there is opening portion 33 in a face according to the convertor device 1
Shape, so as to the configuration space of convertor device 1 be rectangular shape when with by useless gap be suppressed to compared with
Convertor device 1 is configured at the configuration space by few state.
In addition, constituting framework 3 by having claw 35 according to the convertor device 1 and having and block in the mounted state
Cover 4 is constituted together in the connecting hole 44 of claw 35, so that only pressing cover 4 towards the opening portion of framework 3 33 can make
Claw 35 is engaged with connecting hole 44 and is reliably prevented cover 4 to be fallen off from framework 3, and is able to maintain that and will installed
Substrate 2 is pressed to the state of 31 side of bottom plate of framework 3.In addition, because claw 35 is engaged with connecting hole 44, without
By fixing member etc. come operation as fixed frame 3 and cover 4, because can be by the filling of filler 5, installation base plate 2
Receiving and the framework 3 being installed of cover 4 be for example set to heating device and carry out heating relative to filler 5
It handles (curing process), so can be improved manufacture efficiency.
In addition, framework 3 is formed as and using the center 31a of bottom plate 31 as symmetric points according to the convertor device 1
The shape of point symmetry, to be accommodated because different from the framework 3 of shape for not being formed point symmetry by installation base plate 2
When framework 3, it is not necessary that it carries out the left and right of framework 3 towards the left and right of Matching installation substrate 2 towards such operation,
So manufacture efficiency can be improved correspondingly.
In addition, the filler 5 of the state with mobility is injected into framework 3 according to the convertor device manufacturing method
It is interior, installation base plate 2 is contained in framework 3 with posture mounting surface 21a opposite with the bottom plate 31 of framework 3, is installed by cover 4
When framework 3, the back side 21b for the substrate 21 for being connected to the protrusion 43 of cover 4 on installation base plate 2, until mounting surface
Installation base plate 2 is pressed to 31 side of bottom plate until the rib 34 that 21a is connected to framework 3, later, by make the solidification of filler 5 to
Without omitting filler 5 can be made to be filled in the pushing of the installation base plate 2 of 31 side of bottom plate caused by protrusion 43
The gap between gap or each electric component 22 and mounting surface 21a between each electric component 22.Therefore, according to
The convertor device manufacturing method can manufacture the convertor device 1 that can effectively play the heat sinking function of filler 5.
In addition, convertor device and convertor device manufacturing method are not limited to above-mentioned structure and method.Example
Such as, the example about the side plate 32a, 32c that each rib 34 is set to framework 3, is described above, however, it is also possible to
Side plate 32b, 32d or the structure that each rib 34 is set to all 4 side plates 32 are set to using by each rib 34.In addition,
The quantity for being arranged at the rib 34 of each side plate 32 is not limited to 1, is also possible to multiple.In addition, about with plan view shape
As point symmetry form formed framework 3 example, described above, however, it is also possible to using plan view shape not at
For the framework 3 of the structure of point symmetry.
In addition, be respectively formed in side plate 32b about by the claw 35 for being used as holding section, 32d and engaged part will be used as
Connecting hole 44 be respectively formed in the examples of 2 edge parts and 2 side plates 42b, 42d relative to each other on mainboard 41,
It is described above, however, it is also possible to arbitrarily provide the forming position or quantity of claw 35 or connecting hole 44.In addition,
The shape of claw 35 or connecting hole 44 also can be changed arbitrarily.In addition, about the master that 3 protrusions 43 are set to cover 4
The example of plate 41 is described above, and still, protrusion 43 also can be not limited to 3 and be specified to any amount (1
It is a or 2, preferably 3 or more).In addition, can be using the converter of the framework 3 or cover 4 that have above-mentioned other structures
Device and its convertor device manufacturing method.
In addition, an example as filler 5, carries out about the structure and method for using thermohardening type silicone resin
Explanation, still, it's not limited to that for filler 5, be able to use the various fillers for being suitable for above-mentioned structure and method
5。
In addition, about by framework 3 be formed as a face have opening portion 33 rectangular shape example, above into
Narration is gone, still, the shape of framework 3 can be provided arbitrarily.Be formed as that there is opening portion in a face for example, can use
Cubic shaped framework 3 or be formed as an end have opening portion cylindrical shape framework.
The explanation of symbol
1 convertor device
2 installation base plates
3 frameworks
4 covers
5 fillers
21 substrates
21a mounting surface
The back side 21b
22 electric components
31 bottom plates
The center 31a
32a~32d side plate
33 opening portions
34 ribs
35 claws
41 mainboards
43 protrusions
44 connecting holes.
Claims (7)
1. a kind of convertor device, which is characterized in that
It is to have that the installation base plate of electric component is installed, there is opening portion in a face and accommodates the installation base plate in substrate
Framework and the cover that the framework is installed in the form of covering the opening portion, and by being housed inside with covering
The form filler of the electric component of the installation base plate of the framework is filled in the framework converter constituted
Device,
The framework by more than one pair of rib is arranged at inner face relative to each other to constitute,
The installation base plate is opposite and described with the bottom plate with the mounting surface for being equipped with the substrate of the electric component
The state that mounting surface is connected to the rib is housed inside the framework,
The filler is filled between the bottom plate and the mounting surface of the installation base plate,
The cover passes through the protrusion with the inner face for being arranged at shape roughly the same with the opening portion of the framework
Come the back side for the substrate for constituting, and being connected in the installation base plate with the protrusion and the installation base plate is pushed
State to the bottom plate side is installed in the framework.
2. convertor device as described in claim 1, which is characterized in that
The framework is formed the rectangular shape for having opening portion in a face.
3. convertor device as described in claim 1, which is characterized in that
The framework is formed the cubic shaped for having opening portion in a face.
4. convertor device as described in claim 1, which is characterized in that
The framework is formed the cylindrical shape that portion at one end has opening portion.
5. the convertor device as described in any one in Claims 1 to 4, which is characterized in that
The framework is constituted by having the holding section for the edge part for being formed the opening portion side on the side plate,
The cover is by having the engaged part for being sticked in the holding section in the state of being installed in the framework come structure
At.
6. the convertor device as described in any one in Claims 1 to 5, which is characterized in that
The framework is formed under the overlooking state for overlooking the bottom plate using the center of the bottom plate as symmetric points a little pair
The shape of title.
7. a kind of convertor device manufacturing method, which is characterized in that
It is the convertor device manufacturing method for manufacturing convertor device, the convertor device, which has, is equipped with electrical part in substrate
The installation base plate of part has opening portion in a face and accommodates the framework of the installation base plate and to cover the opening portion
Form is installed in the cover of the framework, and passes through the electricity to cover the installation base plate for being housed inside the framework
The form filler of gas component, which is filled in the framework, to be constituted,
By the filler of the state with mobility be injected by more than one pair of rib be arranged at it is relative to each other in
Face come in the framework that constitutes,
Mounting surface to be equipped with the substrate of the electric component posture opposite with the bottom plate is by the installation base plate
It is contained in the framework,
It will be provided in the inner face of shape roughly the same with the opening portion of the framework in the form of covering the opening portion
When the cover of protrusion is installed on the framework, the protrusion is made to be connected to the base in the installation base plate
The installation base plate is pressed to the bottom plate side until the mounting surface is connected to the rib by the back side of plate,
Later, the filler is made to solidify and manufacture the convertor device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-143201 | 2015-07-17 | ||
| JP2015143201A JP6645057B2 (en) | 2015-07-17 | 2015-07-17 | Converter device and converter device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106358412A CN106358412A (en) | 2017-01-25 |
| CN106358412B true CN106358412B (en) | 2019-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610529221.7A Active CN106358412B (en) | 2015-07-17 | 2016-07-06 | Convertor device and convertor device manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP6645057B2 (en) |
| CN (1) | CN106358412B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6992449B2 (en) * | 2017-11-28 | 2022-01-13 | 富士電機株式会社 | Inverter device |
| CN112912695A (en) * | 2018-09-25 | 2021-06-04 | 弗瑞柏私人有限公司 | Sensor device |
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| JPS62201975A (en) * | 1986-01-23 | 1987-09-05 | Chugoku Toryo Kk | Antifouling coating |
| JP2000068446A (en) * | 1998-08-25 | 2000-03-03 | Hitachi Ltd | Power semiconductor module |
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|---|---|---|---|---|
| JPS4981867A (en) * | 1972-12-13 | 1974-08-07 | ||
| JPS5617999Y2 (en) * | 1975-09-26 | 1981-04-27 | ||
| JPH034057Y2 (en) * | 1986-06-13 | 1991-02-01 | ||
| JP2602612Y2 (en) * | 1993-02-13 | 2000-01-24 | ティーディーケイ株式会社 | Power supply |
| JP2917758B2 (en) * | 1993-07-15 | 1999-07-12 | アンデン株式会社 | Printed circuit board housing box with vibration parts |
| JP2882313B2 (en) * | 1995-06-06 | 1999-04-12 | 住友電装株式会社 | PCB storage case |
| JP2837391B2 (en) * | 1996-06-03 | 1998-12-16 | 富士通テン株式会社 | Resin case fitting structure |
| JP2002203425A (en) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Works Ltd | Discharge lamp lighting device |
| JP3722702B2 (en) * | 2001-01-18 | 2005-11-30 | 三菱電機株式会社 | Car electronics |
| JP3748253B2 (en) * | 2002-11-14 | 2006-02-22 | 三菱電機株式会社 | In-vehicle electronic device housing structure |
| WO2007026499A1 (en) * | 2005-08-30 | 2007-03-08 | Matsushita Electric Industrial Co., Ltd. | Board structure and electronic device |
| JP4365388B2 (en) * | 2006-06-16 | 2009-11-18 | 株式会社日立製作所 | Semiconductor power module and manufacturing method thereof |
| JP4934559B2 (en) * | 2007-09-27 | 2012-05-16 | オンセミコンダクター・トレーディング・リミテッド | Circuit device and manufacturing method thereof |
| JP2009294077A (en) * | 2008-06-05 | 2009-12-17 | Denso Corp | Semiconductor package |
| JP5281121B2 (en) * | 2011-06-14 | 2013-09-04 | 三菱電機株式会社 | Substrate storage housing for in-vehicle electronic devices |
| JP2014146688A (en) * | 2013-01-29 | 2014-08-14 | Panasonic Corp | Semiconductor device |
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2015
- 2015-07-17 JP JP2015143201A patent/JP6645057B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS62201975A (en) * | 1986-01-23 | 1987-09-05 | Chugoku Toryo Kk | Antifouling coating |
| JP2000068446A (en) * | 1998-08-25 | 2000-03-03 | Hitachi Ltd | Power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106358412A (en) | 2017-01-25 |
| JP2017028020A (en) | 2017-02-02 |
| JP6645057B2 (en) | 2020-02-12 |
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