CN106358411B - Convertor device and convertor device manufacturing method - Google Patents
Convertor device and convertor device manufacturing method Download PDFInfo
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- CN106358411B CN106358411B CN201610527759.4A CN201610527759A CN106358411B CN 106358411 B CN106358411 B CN 106358411B CN 201610527759 A CN201610527759 A CN 201610527759A CN 106358411 B CN106358411 B CN 106358411B
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- framework
- installation base
- base plate
- substrate
- convertor device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dc-Dc Converters (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to convertor device and convertor device manufacturing methods, improve heat sinking function and realize miniaturization.Have and the installation base plate (2) of electric component (22) is installed in substrate (21), and accommodate the framework (3) of installation base plate (2), filler (5) is filled in framework (3) in the form of the electric component (22) to cover the installation base plate (2) for being housed inside framework (3) and is constituted, at least one insertion hole (21d) by being formed in and constituting between substrate (21) and the bottom surface of electric component (22) with the opposite opposed area (21c) in the bottom surface of electric component (22) (transformer (22a)) in gap in the electric component (22) for the mounting surface (21a) for being installed on substrate (21) by installation base plate (2), and framework (3) are housed inside with mounting surface (21a) and bottom plate (31) opposite state, filler (5) It is filled between bottom plate (31) and the mounting surface (21a) of installation base plate (2).
Description
Technical field
The present invention relates to the covers for the opening portion for having installation base plate, accommodating the framework of installation base plate and covering framework simultaneously
And in the form of the electric component for covering installation base plate by filler be filled into the intracorporal converter of frame (converter) device,
And manufacture the convertor device manufacturing method of the convertor device.
Background technique
As this kind of device, as we all know there are following resin packed electronic-circuit devices disclosed in patent document 1 (with
Down also referred to as " electronic-circuit device ").The electronic-circuit device passes through the wiring base that has shell (case), be equipped with component
Plate, the opening portion for covering shell cover shape frame constitute.In addition, being housed inside shell in the electronic-circuit device with covering
Potting resin is filled in shell by the form of the component of intracorporal wiring substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication 03-6879 bulletin (page 3~4, the 1st~3 figure)
However, there is following problem for existing electronic-circuit device.That is, in existing electronic-circuit device
In, so that wiring substrate is contained in the bottom side of shell simultaneously by the state (towards the state of the opening portion side of shell) that component is upward
The potting resin with mobility is flowed into simultaneously coating member from thereon.In the case, potting resin is because of its major function
To make hot heat transfer caused by component and via shell to radiating except shell, it is advantageous to exhaustive be filled in component that
The gap between gap and component and shell between this gap, component and substrate.However, only being flowed on component
When potting resin, so that potting resin is filled in above-mentioned each gap and be difficult.Therefore, with regard to existing electronics electricity
For the device of road, there is a problem of effectively playing heat sinking function of potting resin etc..In addition, being used for this kind of electronics
The shell of the resin of circuit device is generally formed by injection molding, still, in injection molding, in order to ensure taking off for molded part
Mould, it is necessary to which shell is configured to horizontal area with the shape to broaden from bottom side towards opening portion side.Therefore, it is inciting somebody to action
Wiring substrate is contained in the existing electronic-circuit device of the bottom side of shell, and the horizontal area of the opening portion side on shell is big
In the area of wiring substrate.Therefore, in existing electronic-circuit device, because being opened compared to the intracorporal wiring substrate of shell
There are more wasted spaces in the region of oral area side, so correspondingly miniaturization becomes difficult.
Summary of the invention
The present invention is the invention completed in view of above-mentioned technical problem, its main purpose is, providing one kind can mention
High heat sinking function and the convertor device that can be realized miniaturization.
In order to achieve the above object, convertor device according to the present invention, it is characterised in that: be to have to install in substrate
There is the installation base plate of electric component and there is opening portion in a face and accommodate the framework of the installation base plate, and by cover
The form filler that lid is housed inside the electric component of the installation base plate of the framework, which is filled in the framework, carrys out structure
At convertor device, the installation base plate is formed on and is installed in the installation of the substrate by least one insertion hole
Have the bottom surface of electric component in gap opposite between the substrate and the bottom surface of the electric component in the electric component in face
Region to constitute, and the framework, the filler quilt are housed inside with the mounting surface state opposite with the bottom plate
It is filled between the bottom plate and the mounting surface of the installation base plate.
In addition, convertor device according to the present invention, the electric component with the gap is transformer, the transformation
Device using a pair of end sub-portion is fixed in the substrate and as the region between each portion of terminal of the bottom surface from the base
The separated state of the mounting surface of plate is installed in the mounting surface, the insertion hole be formed on the substrate with it is described each
The opposite region in region between a portion of terminal.
In addition, convertor device according to the present invention, the insertion hole is formed round, shape of slit and combination
Any one shape in round and shape of slit shape.
In addition, convertor device according to the present invention, the framework is arranged at relative to each other 2 by rib respectively
The inner face of the side plate is constituted, and the installation base plate is housed inside the frame with the state that the mounting surface is connected to the rib
Body.
In addition, convertor device according to the present invention, has described in being installed in the form of covering the opening portion
The cover of framework, the cover are constituted by having the protrusion for being arranged at inner face, and the protrusion is described to be connected to
The back side of the substrate in installation base plate and the state that the installation base plate is pressed to the bottom plate side is installed in described
Framework.
In addition, convertor device according to the present invention, the framework is by having the institute being formed on the side plate
The holding section of the edge part of opening portion side is stated to constitute, the cover is blocked in the state of being installed in the framework by having
It is constituted together in the engaged part of the holding section.
In addition, convertor device according to the present invention, the framework should under the overlooking state for overlooking the bottom plate
The center of bottom plate is formed the shape of point symmetry as symmetric points.
In addition, convertor device manufacturing method according to the present invention, which is characterized in that be the change for manufacturing convertor device
Exchanger unit manufacturing method, the convertor device, which has, is equipped with the installation base plate of electric component in substrate and in a face
With opening portion and the framework that the installation base plate is is accommodated, and by cover the installation base plate for being housed inside the framework
The form filler of the electric component be filled in the framework and constitute, by the filling of the state with mobility
Agent is injected into the framework, will be formed on and be installed in the electricity of the mounting surface of the substrate by least one insertion hole
In gas component between the substrate and the bottom surface of the electric component with the opposite region in the bottom surface of electric component in gap
The installation base plate to constitute is contained in the framework with the mounting surface state opposite with the bottom plate, by the installation
Substrate is pressed to the bottom plate side, later, the filler is made to solidify and manufacture the convertor device.
Related convertor device according to the present invention, by that will be inserted with the mounting surface state opposite with the bottom plate of framework
Hole is formed on and is installed in having in the electric component of the mounting surface of substrate between substrate and the bottom surface of electric component
The installation base plate in the opposite region in the bottom surface of the electric component in gap is contained in framework and filler is filled in bottom plate and installation
Between the mounting surface of substrate, so that space between the bottom plate of framework and the mounting surface of substrate is from the installation to the bottom plate side of framework
The pushing of substrate and when reduce, the air exhaust in space can be reliably made via the insertion hole, as a result, it is possible to can
The pushing of the installation base plate to the bottom plate side of framework is carried out by ground.In addition, because can reliably make the air exhaust in space,
So air will not be made to remain on each electric component equal gaps and that filler can be made to be filled into is each electrical each other
Each corner such as between component.Therefore, according to the convertor device, the heat sinking function of filler can effectively be played.
In addition, according to the convertor device, because installation base plate is contained in framework, energy with the mounting surface state opposite with bottom plate
The substrate of installation base plate is enough set to be located at the opening portion side of framework.Therefore, according to the convertor device, by by the water of opening portion side
The area of the substrate of plane product Matching installation substrate simultaneously forms framework, so as to make the horizontal area of bottom plate side be less than real estate
Product, as a result, it is possible to minimize to framework.
In addition, in convertor device according to the present invention, using the region between the portion of terminal as bottom surface from base
The opposite substrate in the region between each portion of terminal on the mounted transformer of the separated state of the mounting surface of plate it is opposite
Region is formed with insertion hole.In the case, it in the case where convertor device is, for example, AC-DC converter, is being equipped with pair
In the installation base plate of the transformer intersected between primary side and primary side, because in the substrate opposite with the bottom surface of transformer
Opposed area have to ensure that safety it is upper as defined in creepage distance, so conductor fig can not be arranged in the opposed area,
And it is necessary to gap is arranged between substrate and the bottom surface of transformer.Therefore, according to the convertor device, by by insertion hole
It is set to opposite opposite in region between each portion of terminal as bottom surface for the transformer for meeting such mounting condition
Region, so as to improve the effective rate of utilization of substrate, as a result, it is possible to seek to minimize.
In addition, being connected to the side plate for being formed on framework with mounting surface in convertor device according to the present invention
Installation base plate is contained in framework by the state of rib.Therefore, according to the convertor device, by be longer than from the base in installation base plate
The mode of the maximum height of the electric component of the mounting surface of plate provides the length of the upper end from bottom plate to rib, thus that will pacify
When dress substrate is pressed to the bottom plate side of framework, mounting surface is connected to the upper end of rib before electric component is contacted with bottom plate
Portion, it is thus possible to be reliably prevented contact of the electric component with bottom plate.
In addition, being connected to installation base in convertor device according to the present invention to be arranged at the protrusion of cover
Cover is simultaneously installed on framework by the state that installation base plate is pressed to the bottom plate side of framework by the back side of the substrate of plate.Therefore, according to
The convertor device presses installation base plate without finger tip etc., will reliably be pacified by the way that cover is installed on framework
Dress substrate is pressed to the bottom plate side of framework.
In addition, convertor device involved according to the present invention, has holding section to constitute framework and have in installation shape
The engaged part of holding section is sticked under state to constitute cover, to only can make towards the opening portion of framework pressing cover
Holding section, which is engaged with engaged part and is reliably prevented cover, to be fallen off from framework and is able to maintain that by installation base plate
It is pressed to the state of the bottom plate side of framework.In addition, because holding section is engaged with engaged part without being used by fixed
Component etc. comes fixed frame and the such operation of cover, because by the filling of filler, the receiving of installation base plate and cover
The framework being installed for example is arranged (set) in heating device and carries out the heat treatment relative to filler (at solidification
Reason), so can be improved manufacture efficiency.
In addition, convertor device involved according to the present invention, by using the center of bottom plate as symmetric points and by framework
Be formed as the shape of point symmetry, to hold because different from the framework for not being formed point symmetry shape by installation base plate
It is not necessarily to carry out when being contained in framework by the left and right of framework towards the left and right of Matching installation substrate towards such operation, institute
Can be improved the manufacture efficiency of part.
In addition, convertor device manufacturing method involved according to the present invention, by the filler of the state with mobility
It is injected into framework and is installed on transformer with the separated state of the mounting surface of the region between each portion of terminal from substrate
Insertion hole is formed on the region between portion of terminal on substrate with the mounting surface state opposite with the bottom plate of framework by dress face
The installation base plate in opposite region is contained in framework and installation base plate is pressed to bottom plate side, later, by solidifying filler
So as to the pushing of the installation base plate of the bottom plate side of framework and the sky between the bottom plate of framework and the mounting surface of substrate
Between when reduce, the air exhaust in space can be reliably made by the insertion hole, as a result, it is possible to reliably carry out to
The pushing of the installation base plate of the bottom plate side of framework.In addition, because reliably the air in space can be exhausted, no
Can make air remain on each electric component each other equal gaps and can make filler be filled into each electric component that
Each corner such as between this.Therefore, according to the convertor device manufacturing method, can manufacture can effectively play filler
The convertor device of heat sinking function.
Detailed description of the invention
Fig. 1 is the perspective view of convertor device 1.
Fig. 2 is the perspective view of the convertor device 1 for the state for unloading cover-dropping part 4.
Fig. 3 is the perspective view of installation base plate 2.
Fig. 4 is the main view for the installation base plate 2 seen with the direction of the arrow A in Fig. 3.
Fig. 5 is the perspective view of framework 3.
Fig. 6 is the top view for the framework 3 seen from 33 side of opening portion.
Fig. 7 is the perspective view of cover 4.
Fig. 8 is the 1st explanatory diagram for illustrating the manufacturing method of convertor device 1.
Fig. 9 is the 2nd explanatory diagram for illustrating the manufacturing method of convertor device 1.
Figure 10 is the 3rd explanatory diagram for illustrating the manufacturing method of convertor device 1.
Figure 11 is the 4th explanatory diagram for illustrating the manufacturing method of convertor device 1.
Figure 12 is the 5th explanatory diagram for illustrating the manufacturing method of convertor device 1.
Specific embodiment
Hereinafter, (being also only known as " manufacture below to convertor device and convertor device manufacturing method referring to attached drawing
Method ") embodiment be illustrated.
Firstly, just the structure work of convertor device 1 represented by Fig. 1 as an example of convertor device is said as follows
It is bright.Convertor device 1 is, for example, a kind of input AC electric current and exports the AC-DC converter of DC current, such as Fig. 1 and Fig. 2
It is shown, it is constituted by having installation base plate 2, framework 3 and cover 4.In addition, in the convertor device 1, such as Figure 11 institute
Show, filler 5 is filled in framework 3.
Such as Fig. 3 of installation base plate 2, by having substrate 21 and being installed in the various electric components 22 of substrate 21 shown in 4
To constitute.Substrate 21 is formed to overlook substantially rectangular (such as generally rectangular) as shown in the figure.Each 22 structure of electronic component
At the processing circuit for carrying out AC-DC conversion process.In addition, the transformer on the installation base plate 2, in each electric component 22
The large electrics such as 22a or capacitor 22b component 22 is installed in the mounting surface 21a of substrate 21 (with the lower surface in figure).
In the case, transformer 22a passes through the skeleton 51 for having the winding being formed with outside figure as shown in Figure 4, is equipped
Core 52 around skeleton 51, be equipped on skeleton 51 end the (portion of terminal of primary side and secondary of a pair of end sub-portion 53
The portion of terminal of grade side) it constitutes.In addition, each portion of terminal 53 is fixed in substrate 21 to transformer 22a as shown in the figure.In addition,
Transformer 22a is because ensure creepage distance between each portion of terminal 53 and the winding of skeleton 51 or space length and each
Creepage distance or space length between portion of terminal 53 and core 52, so with each terminal on the bottom surface of skeleton 51 and core 52
Region between portion 53 (is the region opposite with mounting surface 21a on skeleton 51 and core 52, hereinafter also referred to " intermediate region
54 ") from mounting surface 21a separated state (have the state in gap between the bottom surface and substrate of skeleton 51 and core 52 21)
It is installed in mounting surface 21a.
In addition, the back side 21b (being the face of the opposite side of mounting surface 21a, Fig. 3, the upper surface in 4) in substrate 21 is equipped
2 input terminals (primary side terminal) 23a of input AC electric current and 2 output terminal (primary sides for exporting DC current
Terminal) 23b.
Further more, as shown in figure 4, the region of the substrate 21 opposite with the intermediate region 54 of transformer 22a (hereinafter also referred to
" opposed area 21c ") it is formed with circular 2 insertion hole 21d (also referring to Fig. 3).21d is according to described below for the insertion hole
Peace with the bottom plate 31 and substrate 21 that will be present in framework 3 when convertor device manufacturing method manufactures convertor device 1
The function or make to be injected into bottom plate 31 and substrate that the air in the space between the 21a of dress face is vented to the back side side 21b of substrate 21
Filler 5 between 21 mounting surface 21a is reliably filled in the intermediate region 54 of transformer 22a and the opposed area of substrate 21
Function between 21c.In the case, opposed area 21c is because be generally to ensure that the creepage distance between each portion of terminal 53
Or space length, so becoming the structure that other electric components 22 or wiring is not arranged.In the convertor device 1, in this way, logical
Crossing has the function of above-mentioned insertion hole 21d in the opposed area 21c formation that other electric components 22 or wiring can not be arranged,
So as to efficiently use opposed area 21c.
In addition, installation base plate 2 is opposite (that is, transformer or electricity with mounting surface 21a and the bottom plate 31 of framework 3 as shown in figure 11
The large electrics such as container component 22 becomes downward) and substrate 21 be located at the state of 33 side of opening portion of framework 3 and be housed inside frame
Body 3.
Such as Fig. 5 of framework 3 is straightened and is set with substantially rectangular bottom plate 31 and in each peripheral part of bottom plate 31 shown in 6
The 4 side plate 32a~32d (below when indiscriminative also referred to as " side plate ") set, and be formed to have in a face and open
The box-shaped of the approximately cuboid of oral area 33.In the case, framework 3 by carrying out injection molding to resin because formed, institute
Release property when in order to ensure molding and be formed with from 31 side of bottom plate towards 33 side of opening portion and horizontal area gradually
The shape to broaden.
Here, in the convertor device 1, as previously discussed, with mounting surface 21a and the bottom plate 31 of framework 3 it is opposite and
Installation base plate 2 is contained in framework 3 (referring to Fig.1 1) by the state that substrate 21 is located at 33 side of opening portion of framework 3.Therefore, in the change
In exchanger unit 1, because frame can be formed the area of the substrate 21 of the horizontal area Matching installation substrate 2 of 33 side of opening portion
Body 3, so the horizontal area of 31 side of bottom plate can be made to be less than 21 area of substrate.Therefore, in the convertor device 1, and with base
The state that plate 21 is located at 31 side of bottom plate compares the structure that installation base plate 2 is contained in framework 3, and the miniaturization of framework 3 becomes can
Energy.In other words, in the case where making 3 same size of framework, and it is located at the state of 31 side of bottom plate with substrate 21 for installation base plate 2
The structure for being contained in framework 3 compares, and can increase the horizontal area of substrate 21.
In addition, as shown in fig. 6, being set respectively on the inner face of 2 the side plates 32a, 32c relative to each other in each side plate 32
It is equipped with rib 34 (also referring to Fig. 5).The rib 34 has installation when installation base plate 2 is contained in framework 3 as shown in figure 11
The edge part of mounting surface 21a on the substrate 21 of substrate 2 is abutted and supports the function of installation base plate 2.In addition, rib 34 as
It is slightly larger than with the length until the upper end of bottom plate 31 to rib 34 (part for being connected to substrate 21) from installation base plate 2 shown in figure
In substrate 21 mounting surface 21a rise electric component 22 maximum height (in the figure until the length of lower end) shape
Formula is formed.
In addition, the opening portion 33 on 2 side plates 32b, 32d relative to each other such as Fig. 5, shown in 6, in each side plate 32
The edge part of side is respectively formed with the claw 35 to fasten with the connecting hole 44 of cover 4 (engaged part being equivalent to, referring to Fig. 7)
(holding section).
In addition, framework 3 is as shown in Figure 6 under the overlooking state for overlooking bottom plate 31 using the center 31a of bottom plate 31 as symmetrical
Put and be formed the shape of point symmetry.That is, the forming position of each rib 34 or the forming position of each claw 35 are with by bottom plate
The form that 31 center 31a becomes point symmetry as symmetric points is prescribed.
Cover 4 has substantially rectangular mainboard 41 as shown in Figure 7 and is straightened setting in each peripheral part of mainboard 41
4 side plate 42a~42d (below when indiscriminative also referred to as " side plate 42 ") and be formed the sub- shape of saucer, such as Fig. 1,
Shown in 12, it is configured to be installed on framework 3 to cover the form of opening portion 33 (referring to Fig. 5) of framework 3.In the case,
Cover 4 is formed by carrying out injection molding to resin.
In addition, as shown in fig. 7, multiple (such as 3) protrusions are arranged on the inner face (with the upper surface in figure) of mainboard 41
Portion 43.It in the case, as shown in figure 11, can be when cover 4 is installed on framework 3 for accommodating installation base plate 2
It is not contacted with setting protrusion 43 on the arbitrary position for being installed in the electric component 22 of back side 21b of substrate 21.The protrusion
Portion 43 be used to make front end be connected to the installation being contained in framework 3 when manufacturing convertor device 1 as shown in the figure
The back side 21b of substrate 21 in substrate 2 and 31 side of bottom plate that installation base plate 2 is pressed to framework 3.
In addition, as shown in fig. 7, in mainboard 41, it is formed with each input terminal 23a for making installation base plate 2 and each
The insertion hole 45 of a output terminal 23b insert.In addition, 2 edge parts relative to each other on mainboard 41 and being straightened are set
2 side plates 42b, 42d of these edge parts are placed in, are formed and being respectively formed with a part by cutting away them and and framework
Connecting hole 44 that 3 claw 35 fastens (also referring to Figure 11,12).
Filler 5 is a kind of thermohardening type silicone resin (thermohardening type silicone elastomer) as an example, is had exhausted
Edge and become the gel with mobility in the state of before curing process, is carried out by curing process (heat treatment)
Solidify and is changing into rubber-like.In addition, being excellent in using pyroconductivity height and in terms of thermal diffusivity for the filler 5
Thermohardening type silicone resin.The filler 5 be filled in accommodate in the framework 3 of installation base plate 2, specifically framework 3
Between bottom plate 31 and the substrate 21 of installation base plate 2, has and installation base plate 2 is fixed on framework 3 (movement of limitation installation base plate 2)
And heat caused by electric component 22 is made to carry out heat transfer to reject heat to external function via framework 3.
Then, referring to attached drawing, the convertor device manufacturing method of manufacture convertor device 1 is explained as follows.In addition,
In Fig. 8~Figure 11, in order to illustrate the inside of framework 3 state and carry out figure to have an X-rayed the state of the side plate 32 of paper front side
Show.
Firstly, as shown in figure 8, using distributor (dispenser) 50 come by the solidification of the specified amount only predetermined
Gelatinous filler 5 before processing is injected into framework 3.Then, as shown in figure 9, with the peace of the substrate 21 in installation base plate 2
Installation base plate 2 is contained in framework 3 by posture dress face 21a opposite with the bottom plate 31 of framework 3.
In the case, in the convertor device 1, framework 3 is formed as the center 31a of bottom plate 31 as symmetric points
The shape of point symmetry (referring to Fig. 6).That is, even if framework 3 will not as its plan view shape exchange left and right (even if 180 ° of rotation)
Changed structure.It therefore, is not that the structure of point symmetry is different from the plan view shape of framework 3, because holding by installation base plate 2
It is not necessarily to carry out when being contained in framework 3 by the left and right of framework 3 towards the left and right of Matching installation substrate 2 towards such behaviour
Make, so manufacture efficiency can be improved correspondingly.
Then, as shown in Figure 10, cover 4 is installed on framework 3 in the form for covering the opening portion 33 of framework 3.It is specific next
It says, each through-hole 45 for making the input terminal 23a of installation base plate 2 and output terminal 23b be inserted through cover 4 then makes cover
4 move downward.
Then, as shown in figure 11, in the front end of protrusion 43 moving and be connected to installation base plate by downward cover 4
Cover 4 is pressed when the back side 21b of substrate 21 in 2 (to the opening portion 33 of framework 3) downwards, so that installation base plate 2 be pushed away
It is pressed onto 31 side of bottom plate of framework 3.At this point, pressure is applied in filler 5 by moving for substrate 21, filler 5 be injected by
The gap or each electric component 22 that are installed between each electric component 22 on the mounting surface 21a of substrate 21 and installation
Gap between the 21a of face.As a result, filler 5 is filled in these gaps with not omitting as shown in the figure.
Here, insertion hole 21d as shown in Figure 4 is formed on the middle area with transformer 22a in the convertor device 1
The opposed area 21c of the opposite substrate 21 in domain 54.Therefore, the sky between the bottom plate 31 of framework 3 and the mounting surface 21a of substrate 21
Between from being reduced to the pushing of the installation base plate 2 of 31 side of bottom plate of framework 3 when, can be via insertion hole 21d reliably
It is vented the air in space to the back side 21b of substrate 21, as a result, it is possible to reliably real 31 sides of bottom plate carried out to framework 3
Installation base plate 2 pushing.In addition, air will not be made to remain on because can reliably make the air exhaust in space
It is each between waiting gaps between each electric component 22 and filler 5 capable of being made to be filled into each electric component 22 etc.
A corner.
In addition, being flowed into filler 5 between the intermediate region 54 of transformer 22a and the opposed area 21c of substrate 21
When gap, which is filled in insertion hole 21d (referring to Fig.1 0).In the case, in convertor device 1,
It, can be by being filled into insertion hole because the high thermohardening type silicone resin of pyroconductivity is used as filler 5
Filler 5 in 21d and so that the heat of the transformer 22a more generated than other electric components 22 is carried out heat transfer and dissipate
Heat.
Then, the releasing pair when the mounting surface 21a of substrate 21 is connected to the upper end for being formed on the rib 34 of framework 3
In the pressing (loosing one's grip from cover 4) of cover 4.In this state, such as Figure 11, the claw 35 of framework 3 shown in 12 and the engaging of cover 4
Hole 44 carries out engaging and falls off to be reliably prevented cover 4 from framework 3.In addition, being engaged by claw 35 with connecting hole 44
To be able to maintain that installation base plate 2 is pushed to the state of 31 side of bottom plate of framework 3 unclamping hand from cover 4.
According to the above, filling, the receiving of installation base plate 2 and the installation of cover 4 of filler 5 are completed.Then, right
Curing process is executed in filler 5.In the curing process, by the filling of filler 5, the receiving of installation base plate 2 and cover 4
The heating device that is set to outside figure of the framework 3 (hereinafter also referred to " framework 3 that assembling is over ") being installed and made
For the heat treatment of curing process.In the case, as previously discussed because by claw 35 engaged with connecting hole 44 from
And it is reliably prevented cover 4 and falls off and be able to maintain that from framework 3 and be pushed to 31 side of bottom plate of framework 3 in installation base plate 2
State, so It is not necessary to carrying out by fixing member etc. come operation as fixed frame 3 and cover 4, because can be by group
The framework 3 installed is set to heating device to carry out the heat treatment to filler 5, so can be improved manufacture like this
Efficiency.
Filler 5 is carried out solidifying by above-mentioned heat treatment (curing process) and changes to rubber-like from gel.In addition,
Solidification is carried out by filler 5 to which installation base plate 2 is reliably fixed to framework 3.Convertor device 1 is completed as a result,.At this
In convertor device 1, as previously discussed, between filler 5 is filled between each electric component 22 with not omitting
Gap between gap or each electric component 22 and mounting surface 21a.Therefore, it can effectively be played in the convertor device 1
The heat sinking function of filler 5.
In this way, according to the convertor device 1, by that will be inserted with state mounting surface 21a opposite with the bottom plate 31 of framework 3
Hole 21d be formed on and be installed in the electric component 22 of the mounting surface 21a of substrate 21 in substrate 21 and electric component 22
Bottom surface between the installation base plate 2 of the opposite opposed area 21c in bottom surface of the electric component 22 with gap be contained in framework 3 simultaneously
Filler 5 is filled between bottom plate 31 and the mounting surface 21a of installation base plate 2, thus in the bottom plate 31 and substrate 21 of framework 3
It can be via this when space between mounting surface 21a to the pushing of the installation base plate 2 of 31 side of bottom plate of framework 3 from reducing
Insertion hole 21d reliably makes the air exhaust in space, and as a result, it is possible to reliably carry out the peace to 31 side of bottom plate of framework 3
Fill the pushing of substrate 2.In addition, air will not be made to remain on each because can reliably make the air exhaust in space
Each angle such as between waiting gaps between electric component 22 and filler 5 capable of being made to be filled into each electric component 22
It falls.Therefore, according to the convertor device 1, the heat sinking function of filler 5 can effectively be played.In addition, being filled according to the converter
1 is set, because installation base plate 2 is contained in framework 3 with state mounting surface 21a opposite with bottom plate 31, can make that base is installed
The substrate 21 of plate 2 is located at 33 side of opening portion of framework 3.Therefore, according to the convertor device 1, by by the water of 33 side of opening portion
21 area of substrate of plane product Matching installation substrate 2 simultaneously forms framework 3, so as to make the horizontal area of 31 side of bottom plate be less than base
21 area of plate, as a result, it is possible to minimize to framework 3.
In addition, in the convertor device 1, using the intermediate region 54 between the portion of terminal 53 as bottom surface from substrate 21
The mounted transformer 22a (electric component 22) of the separated state of mounting surface 21a the substrate 21 opposite with intermediate region 54
Opposed area 21c formed insertion hole 21d.In the case, it in AC-DC converter, that is, convertor device 1, is being equipped with pair
In the installation base plate 2 of the transformer 22a intersected between primary side and primary side, because in the bottom surface phase with transformer 22a
Pair the opposed area 21c of substrate 21 have to ensure that the creepage distance being prescribed for the sake of safety, so in opposed area 21c
Conductor fig can not be set, and it is necessary to gap is arranged between substrate 21 and the bottom surface of transformer 22a.Therefore, according to
The convertor device 1, by being set to insertion hole 21d with the transformer 22a of the such mounting condition of satisfaction as bottom surface
The opposite opposed area 21c in intermediate region 54, so as to improve the effective rate of utilization of substrate 21, as a result, it is possible to seek
Miniaturization.
In addition, according to the convertor device 1, because by the way that insertion hole 21d is formed as circle so as to simple
It processes operation and forms insertion hole 21d, so can be improved the manufacture efficiency of installation base plate 2.
In addition, being connected to mounting surface 21a and being formed on the side plate 32a, 32c of framework 3 in the convertor device 1
The state of rib 34 installation base plate 2 is contained in framework 3.Therefore, according to the convertor device 1, by be longer than from installation base
The mode of the maximum height of the electric component 22 of the mounting surface 21a of substrate 21 in plate 2 is provided from bottom plate 31 to the upper of rib 34
The length of end, to be connected to bottom plate in electric component 22 when installation base plate 2 to be pressed to 31 side of bottom plate of framework 3
Mounting surface 21a is connected to the upper end of rib 34 before 31, it is thus possible to be reliably prevented the contact of electric component 22 with bottom plate 31.
In addition, in the convertor device 1, to be arranged at the substrate that the protrusion 43 of cover 4 is connected to installation base plate 2
Cover 4 is simultaneously installed on framework 3 by the state that installation base plate 2 is pressed to 31 side of bottom plate of framework 3 by 21 back side 21b.Therefore, root
According to the convertor device 1, installation base plate 2 is pressed without finger tip etc., by the way that cover 4 is installed on framework 3 so as to reliable
Installation base plate 2 is pressed to 31 side of bottom plate of framework 3 by ground.
In addition, constituting framework 3 by having claw 35 according to the convertor device 1 and having and block in the mounted state
Cover 4 is constituted together in the connecting hole 44 of claw 35, so that only pressing cover 4 towards the opening portion of framework 3 33 can make
Claw 35 is engaged with connecting hole 44 and is reliably prevented that cover 4 is fallen off from framework 3 and base will installed by being able to maintain that
Plate 2 is pressed to the state of 31 side of bottom plate of framework 3.In addition, because claw 35 engaged with connecting hole 44 without by
Fixing member etc. carrys out the such operation of fixed frame 3 and cover 4, because can be by the filling of filler 5 and installation base plate 2
It accommodates and the framework 3 of cover 4 being installed for example is set to heating device and carries out the heat treatment for filler 5
(curing process), so can be improved manufacture efficiency.
In addition, framework 3 is formed as and using the center 31a of bottom plate 31 as symmetric points according to the convertor device 1
The shape of point symmetry, to be contained in because different from the framework 3 of point symmetry shape is not formed by installation base plate 2
It is not necessarily to carry out when framework 3 by the left and right of framework 3 towards the left and right of Matching installation substrate 2 towards such operation, institute
Manufacture efficiency can be improved correspondingly.
In addition, the filler 5 of the state with mobility is injected into framework 3 according to the convertor device manufacturing method
It is interior and pacified transformer 22a from the mounting surface 21a of substrate 21 separated state with the intermediate region 54 between each portion of terminal 53
Insertion hole 21d is formed on and base loaded on mounting surface 21a, and with state mounting surface 21a opposite with the bottom plate 31 of framework 3
The installation base plate 2 of the opposite opposed area 21c in intermediate region 54 on plate 21 is contained in framework 3 and is pressed to installation base plate 2
31 side of bottom plate, later, by solidifying filler 5 so as to and the pushing of the installation base plate 2 of 31 side of bottom plate of framework 3
It can be reliable via the insertion hole 21d when reduced space between the bottom plate 31 of framework 3 and the mounting surface 21a of substrate 21
Ground makes the air exhaust in space, and as a result, it is possible to reliably carry out the pushing of the installation base plate 2 to 31 side of bottom plate of framework 3.
In addition, air will not be made to remain on each electric component 22 because reliably the air in space can be exhausted
Each corner such as between waiting gaps each other and filler 5 capable of being made to be filled into each electric component 22.Therefore, root
According to the convertor device manufacturing method, the convertor device 1 that can effectively play the heat sinking function of filler 5 can be manufactured.
In addition, convertor device and convertor device manufacturing method are not limited to above-mentioned structure and method.Example
Such as, opposite about the intermediate region 54 being formed in insertion hole 21d between each portion of terminal 53 on the bottom surface of transformer 22a
Substrate 21 opposed area 21c example, described above, but it is also possible to gap be present in substrate 21 with
Between bottom surface other electric components 22 (such as in the case where converter is AC-DC converter, to primary side and primary side it
Between the photoelectrical coupler etc. that is intersected) insertion hole 21d is formed in and the electric component when be installed in mounting surface 21a
The opposed area of the opposite substrate 21 in 22 bottom surface.
In addition, the example about the opposed area 21c that 2 insertion hole 21d are formed in substrate 21, is chatted above
It states, but it is possible to using the structure for forming 1 or 3 or more insertion hole 21d.In addition, about circular insertion hole is formed
The example of 21d is described above, and still, the shape of insertion hole 21d can be provided arbitrarily, for example, can use narrow
The insertion hole 21d of slit shape is combined with round and shape of slit insertion hole 21d.
In addition, the example about the side plate 32a, 32c that rib 34 is set to framework 3 respectively, is described above, but
It is that can also use and rib 34 is set to side plate 32b, 32d or the knot that rib 34 is respectively arranged to all 4 side plates 32 respectively
Structure.In addition, the quantity for being set to the rib 34 of each side plate 32 is not limited to 1, it is also possible to multiple.In addition, about by frame
Body 3 is formed as example of the plan view shape as the shape of point symmetry, is described above, however, it is also possible to using overlooking
Shape does not become the framework 3 of the structure of point symmetry.
In addition, about the claw 35 as holding section is formed in side plate 32b respectively, 32d and respectively will be as by card
The connecting hole 44 in conjunction portion is formed in the example of 2 edge parts and 2 side plates 42b, 42d relative to each other on mainboard 41,
It is described above, still, the forming position and quantity of claw 35 and connecting hole 44 can be provided arbitrarily.In addition, claw
35 and the shape of connecting hole 44 also can arbitrarily change.In addition, about the mainboard 41 that 3 protrusions 43 are set to cover 4
Example, described above, still, protrusion 43 is not limited to 3, can be specified to any amount (1 or
2, preferably 3 or more).In addition, can be using the convertor device of the framework 3 or cover 4 that have above-mentioned other structures
And its convertor device manufacturing method.
In addition, an example as filler 5, carries out the structure and method that use thermohardening type silicone resin
Illustrate, still, it's not limited to that for filler 5, is able to use the various fillers 5 for being suitable for above-mentioned structure and method.
The explanation of symbol
1 convertor device
2 installation base plates
3 frameworks
4 covers
5 fillers
21 substrates
21a mounting surface
The back side 21b
21c opposed area
21d insertion hole
22 electric components
22a transformer
31 bottom plates
The center 31a
32a~32d side plate
33 opening portions
34 ribs
35 claws
41 mainboards
43 protrusions
44 connecting holes
53 portion of terminal
54 intermediate regions.
Claims (8)
1. a kind of convertor device, it is characterised in that:
It is to have that the installation base plate of electric component is installed and is had in a face in substrate opening portion and to accommodate the installation base plate
Framework, and by cover be housed inside the framework the installation base plate the electric component in the form of make filler
The convertor device constituted is filled in the framework,
The installation base plate is formed on the region opposite with the bottom surface of electric component by least one insertion hole to constitute, and is somebody's turn to do
Bottom surface is to be installed in having in the electric component of the mounting surface of the substrate between the substrate and the bottom surface of the electric component
There is the bottom surface of the electric component in gap, and the installation base plate is housed inside institute with the mounting surface state opposite with bottom plate
Framework is stated,
The filler is filled between the bottom plate and the mounting surface of the installation base plate.
2. convertor device as described in claim 1, it is characterised in that:
Electric component with the gap is transformer,
The transformer using a pair of end sub-portion is fixed in the substrate and as between each portion of terminal of the bottom surface
The separated state of mounting surface of region from the substrate be installed in the mounting surface,
The insertion hole is formed on the opposite region in the region between each portion of terminal on the substrate.
3. convertor device as described in claim 1 or 2, it is characterised in that:
The insertion hole is formed circle, shape of slit and any one being combined in round and shape of slit shape
Shape.
4. convertor device as described in claim 1 or 2, it is characterised in that:
The framework is arranged at the inner face of 2 side plates relative to each other respectively by rib to constitute,
The installation base plate is housed inside the framework with the state that the mounting surface is connected to the rib.
5. convertor device as described in claim 1 or 2, it is characterised in that:
Have the cover that the framework is installed in the form of covering the opening portion,
The cover is constituted by having the protrusion for being arranged at inner face, and the protrusion is to be connected to the installation base plate
In the substrate the back side and the state that the installation base plate is pressed to the bottom plate side is installed in the framework.
6. convertor device as claimed in claim 5, it is characterised in that:
The framework is constituted by having the holding section of the edge part for the opening portion side being formed on side plate,
The cover is by having the engaged part for being sticked in the holding section in the state of being installed in the framework come structure
At.
7. convertor device as described in claim 1 or 2, it is characterised in that:
The framework is formed under the overlooking state for overlooking the bottom plate using the center of the bottom plate as symmetric points a little pair
The shape of title.
8. a kind of convertor device manufacturing method, it is characterised in that:
It is the convertor device manufacturing method for manufacturing convertor device, the convertor device, which has, is equipped with electrical part in substrate
The installation base plate of part has opening portion in a face and accommodates the framework of the installation base plate and to cover the shape of the opening portion
Formula is installed in the cover of the framework, and by with cover be housed inside the framework the installation base plate it is described electrical
The form of component is filled in filler in the framework to constitute,
The filler of state with mobility is injected into the framework,
The installation base plate is contained in the framework with the mounting surface state opposite with bottom plate, the installation base plate is by least
1 insertion hole is formed on the region opposite with the bottom surface of electric component to constitute, which is installed in the substrate
The bottom of the electric component between the substrate and the bottom surface of the electric component with gap in the electric component of the mounting surface
Face,
The installation base plate is pressed to the bottom plate side,
Later, the filler is made to solidify and manufacture the convertor device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-143206 | 2015-07-17 | ||
| JP2015143206A JP6500667B2 (en) | 2015-07-17 | 2015-07-17 | Converter device and method of manufacturing converter device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106358411A CN106358411A (en) | 2017-01-25 |
| CN106358411B true CN106358411B (en) | 2019-07-26 |
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ID=57843085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610527759.4A Active CN106358411B (en) | 2015-07-17 | 2016-07-06 | Convertor device and convertor device manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6500667B2 (en) |
| CN (1) | CN106358411B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024099704A1 (en) * | 2022-11-09 | 2024-05-16 | Robert Bosch Gmbh | Electronic device and method for producing an electronic device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7053177B2 (en) * | 2017-07-06 | 2022-04-12 | 日立Astemo株式会社 | Electronic control device and manufacturing method |
| WO2020017121A1 (en) * | 2018-07-20 | 2020-01-23 | 株式会社島津製作所 | Power-supply device, mass spectroscopy device, and power-supply device manufacturing method |
| JP7458836B2 (en) | 2020-03-13 | 2024-04-01 | 能美防災株式会社 | electronic module |
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|---|---|---|---|---|
| JP2002216886A (en) * | 2001-01-18 | 2002-08-02 | Mitsubishi Electric Corp | On-vehicle electronic device |
| CN101273673A (en) * | 2005-08-30 | 2008-09-24 | 松下电器产业株式会社 | Board structure and electronic device |
| CN102833983A (en) * | 2011-06-14 | 2012-12-19 | 三菱电机株式会社 | Board housing case for vehicle-mounted electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691325B2 (en) * | 1985-07-23 | 1994-11-14 | 松下電器産業株式会社 | Waterproof electronic component mounting device |
| JP2563568B2 (en) * | 1989-03-29 | 1996-12-11 | 松下電器産業株式会社 | Printed circuit board device |
| JP2602612Y2 (en) * | 1993-02-13 | 2000-01-24 | ティーディーケイ株式会社 | Power supply |
| JP2837391B2 (en) * | 1996-06-03 | 1998-12-16 | 富士通テン株式会社 | Resin case fitting structure |
| JP3748253B2 (en) * | 2002-11-14 | 2006-02-22 | 三菱電機株式会社 | In-vehicle electronic device housing structure |
| JP5543044B1 (en) * | 2013-08-30 | 2014-07-09 | 新電元工業株式会社 | ELECTRIC DEVICE, ITS MANUFACTURING METHOD, AND ELECTRIC DEVICE DESIGNING METHOD |
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2015
- 2015-07-17 JP JP2015143206A patent/JP6500667B2/en active Active
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2016
- 2016-07-06 CN CN201610527759.4A patent/CN106358411B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002216886A (en) * | 2001-01-18 | 2002-08-02 | Mitsubishi Electric Corp | On-vehicle electronic device |
| CN101273673A (en) * | 2005-08-30 | 2008-09-24 | 松下电器产业株式会社 | Board structure and electronic device |
| CN102833983A (en) * | 2011-06-14 | 2012-12-19 | 三菱电机株式会社 | Board housing case for vehicle-mounted electronic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024099704A1 (en) * | 2022-11-09 | 2024-05-16 | Robert Bosch Gmbh | Electronic device and method for producing an electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106358411A (en) | 2017-01-25 |
| JP6500667B2 (en) | 2019-04-17 |
| JP2017028796A (en) | 2017-02-02 |
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