JP6500667B2 - Converter device and method of manufacturing converter device - Google Patents

Description

  According to the present invention, there is provided a converter device including a mounting substrate, a housing for housing the mounting substrate, and a lid portion covering the opening of the housing, and wherein the housing is filled with a filler so as to cover the electrical components of the mounting substrate; The present invention relates to a converter device manufacturing method for manufacturing a converter device.

  As a device of this type, a resin-sealed electronic circuit device (hereinafter, also referred to as an “electronic circuit device”) disclosed in Patent Document 1 below is known. The electronic circuit device includes a case, a wiring board on which components are mounted, and a lid-like frame covering an opening of the case. Further, in the electronic circuit device, a filling resin is filled in the case so as to cover the components of the wiring board housed in the case.

Japanese Utility Model Application Publication No. 03-6879 (pages 3-4, FIG. 1-3)

  However, the conventional electronic circuit device has the following problems. That is, in the conventional electronic circuit device, the wiring substrate is accommodated on the bottom side of the case with the component facing upward (the case facing the opening), and the fluid filling resin is poured from above the wiring substrate. Covering parts. In this case, the main function of the filling resin is to conduct heat generated by the components and dissipate the heat to the outside of the case through the case. Therefore, the gap between the components, the gap between the components and the substrate, And it is desirable that the gap between the part and the case be evenly filled. However, it is difficult to uniformly fill the filling resin in the above-mentioned gaps only by pouring the filling resin from above the part. For this reason, the conventional electronic circuit device has a problem that the heat dissipation function of the filling resin can not be effectively exhibited. In addition, although the resin case used for this type of electronic circuit device is generally formed by injection molding, in injection molding, in order to ensure the releasability of the molded article, the opening side from the bottom side It is necessary to configure the case in a shape in which the horizontal area becomes larger as it goes to. For this reason, in the conventional electronic circuit device in which the wiring board is accommodated on the bottom side of the case, the horizontal area on the opening side of the case is larger than the area of the wiring board. For this reason, in the conventional electronic circuit device, a large amount of useless space exists in the region closer to the opening than the wiring substrate in the case, which makes downsizing difficult.

  The present invention has been made in view of the above problems, and has as its main object to provide a converter device that can realize miniaturization while enhancing the heat dissipation function.

In order to achieve the above object, a converter device according to the present invention includes a mounting substrate on which an electric component is mounted on the substrate, and a case having an opening on one side and accommodating the mounting substrate, The converter device is configured such that a filler is filled in the case so as to cover the electrical components of the mounted substrate housed, wherein the mounting substrate is an electrical component mounted on the mounting surface of the substrate. At least one insertion hole is formed in a region opposite to the bottom surface of the electrical component having a gap between the substrate and the bottom surface of the electrical component, and the mounting surface is a bottom plate of the housing. It is accommodated in the said housing | casing in the state which opposes, and the said filler is filled between the said baseplate and the said mounting surface of the said mounting board.

  Further, in the converter device according to the present invention, the electric component having the gap is a transformer, and a pair of terminal portions of the transformer is fixed to the substrate so that an area between the respective terminal portions as the bottom surface It mounts on the said mounting surface in the state spaced apart from the mounting surface of the said board | substrate, and the said penetration hole is formed in the area | region facing the area | region between each said terminal part in the said board | substrate.

  Further, in the converter device according to the present invention, the insertion hole is formed in a circular shape, a slit shape, or a shape obtained by combining a circular shape and a slit shape.

Further, in the converter device according to the present invention, the housing is formed by providing ribs on the inner surfaces of two mutually facing side plates of four side plates standing on each outer peripheral portion of the bottom plate. The mounting substrate is accommodated in the housing in a state where the mounting surface is in contact with the rib.

  Further, the converter device according to the present invention includes a lid mounted on the housing so as to cover the opening, and the lid is configured to have a protrusion provided on an inner surface, the protrusion The part is mounted on the housing in a state where the part is in contact with the back surface of the mounting substrate and the mounting substrate is pressed against the bottom plate.

  Further, in the converter device according to the present invention, the case is configured to include an engaging portion formed at an edge on the side of the opening in the side plate, and the lid is attached to the case. It is comprised including the to-be-engaged part engaged with the said engaging part in a state.

  Further, in the converter device according to the present invention, the casing is formed in a point symmetrical shape with the center of the bottom plate as a symmetry point in a plan view in which the bottom plate is planarly viewed.

Further, in the converter device manufacturing method according to the present invention, the mounting substrate on which the electric component is mounted on the substrate, a case having an opening on one surface and accommodating the mounting substrate, and the cover so as to cover the opening. A converter device for manufacturing a converter device comprising: a lid portion mounted on a housing; and a filler filled in the housing to cover the electrical components of the mounting substrate housed in the housing. In the manufacturing method, the filler in a fluid state is injected into the housing, and a gap is formed between the substrate of the electrical components mounted on the mounting surface of the substrate and the bottom surface of the electrical component. accommodating the mounting substrate in which at least one insertion hole is constituted formed in a region facing the bottom surface of the electrical component, in the housing in a state in which the mounting surface is opposed to the bottom plate of the housing with a, The mounting board is on the bottom plate side E attached, then, to produce the converter device by curing the filler.

  According to the converter device of the present invention, the insertion hole is formed in the region facing the bottom surface of the electrical component having a gap between the substrate of the electrical component mounted on the mounting surface of the substrate and the bottom surface of the electrical component The mounting board is housed in the housing with the mounting surface facing the bottom plate of the housing, and the space between the bottom plate and the mounting surface of the mounting board is filled with a filler, whereby mounting on the bottom plate side of the housing When the space between the bottom plate of the housing and the mounting surface of the housing is reduced by the pressing of the substrate, air in the space can be reliably exhausted through the insertion hole, and as a result, the bottom plate side of the housing The mounting board can be securely pressed to the housing. In addition, since the air in the space can be reliably exhausted, the filler can be filled up to every corner of each electrical component without leaving air in a gap between each electrical component or the like. Therefore, according to this converter device, the heat dissipation function of the filler can be effectively exhibited. Further, according to this converter device, since the mounting substrate is accommodated in the housing with the mounting surface facing the bottom plate, the substrate of the mounting substrate can be positioned on the opening of the housing. Therefore, according to this converter device, the horizontal area on the bottom plate side can be made narrower than the area of the substrate by forming the casing by matching the horizontal area on the opening side to the area of the substrate on the mounting substrate , The housing can be miniaturized.

  Further, in the converter device according to the present invention, the insertion hole is formed in the opposing region of the substrate facing the region between the terminal portions in the transformer mounted with the region between the terminal portions as the bottom surface being separated from the mounting surface of the substrate. It is formed. In this case, in the case where the converter device is, for example, an AC-DC converter, in a mounting substrate mounted with a transformer crossing between the primary side and the secondary side, the opposing region of the substrate facing the bottom surface of the transformer In order to secure the creepage distance specified for safety, it is not possible to provide a conductor pattern in this opposing area, and it is necessary to provide a gap between the substrate and the bottom of the transformer. Therefore, according to this converter device, the effective utilization rate of the substrate can be increased by providing the insertion holes in the opposing region facing the region between the terminal portions as the bottom of the transformer satisfying such mounting conditions, As a result, miniaturization can be achieved.

  Further, in the converter device according to the present invention, the mounting substrate is accommodated in the housing in a state where the mounting surface is in contact with the rib formed on the side plate of the housing. For this reason, according to this converter device, the length of the bottom plate to the upper end of the rib is specified to be longer than the maximum height of the electrical component from the mounting surface of the substrate on the mounting substrate, thereby housing the mounting substrate When the electric component is pressed against the bottom plate side, the mounting surface abuts on the upper end of the rib before the electric component contacts the bottom plate, and the contact between the electric component and the bottom plate can be reliably prevented.

  Further, in the converter device according to the present invention, the lid portion is mounted on the housing in a state where the projection provided on the lid portion abuts on the back surface of the mounting substrate and the mounting substrate is pressed against the bottom plate side of the housing. It is done. Therefore, according to this converter device, the mounting substrate can be reliably pressed to the bottom plate side of the housing by mounting the lid on the housing without pressing the mounting substrate with a fingertip or the like.

  Further, according to the converter device of the present invention, the housing includes the engaging portion to configure the housing, and the cover portion is configured to include the engaged portion that engages with the engaging portion in the mounted state. Only by pressing the lid toward the opening of the body, the engaging portion and the engaged portion are engaged, so that the lid can be reliably prevented from falling off the housing and the mounting substrate Can be maintained in a state of being pressed to the bottom plate side of the housing. In addition, since the engaging portion and the engaged portion are engaged, filling of the filler, accommodation of the mounting substrate, and the like, without performing an operation such as fixing the housing and the lid with a fixing member or the like. And since the case where attachment of the cover part was completed can be set to a heating device, for example, and heat treatment (hardening treatment) to a filler can be performed, manufacturing efficiency can be improved.

  Further, according to the converter device of the present invention, the housing is formed in a point-symmetrical shape with the center of the bottom plate as the symmetry point, so unlike the case where the case is not formed in the point-symmetrical shape, When being accommodated in the housing, it is not necessary to perform an operation to match the left and right orientations of the housing with the left and right orientations of the mounting substrate, so that the manufacturing efficiency can be improved accordingly.

  Further, according to the converter device manufacturing method of the present invention, the filler is injected into the housing in a fluid state, and the transformer is mounted on the mounting surface in a state where the region between the terminal portions is separated from the mounting surface of the substrate. A mounting substrate, which is mounted and in which insertion holes are formed in a region facing the region between the terminal portions in the substrate, is housed in the housing with the mounting surface facing the bottom plate of the housing, and the mounting substrate is on the bottom plate side When the space between the bottom plate of the housing and the mounting surface of the substrate is reduced by pressing the mounting substrate against the bottom plate side of the housing by subsequently pressing the filler and curing the filler, As a result of the fact that air can be reliably evacuated through this insertion hole, the mounting substrate can be reliably pressed to the bottom plate side of the housing. In addition, since the air in the space can be reliably exhausted, the filler can be filled up to every corner of each electrical component without leaving air in a gap between each electrical component or the like. Therefore, according to this converter device manufacturing method, it is possible to manufacture a converter device capable of effectively exhibiting the heat dissipation function of the filler.

FIG. 2 is a perspective view of converter device 1; It is a perspective view of converter device 1 in the state where lid 4 was removed. FIG. 2 is a perspective view of a mounting substrate 2; FIG. 4 is a front view of the mounting substrate 2 viewed in the direction of arrow A in FIG. 3; FIG. 3 is a perspective view of a housing 3; It is a top view of case 3 seen from opening 33 side. FIG. 4 is a perspective view of a lid 4; FIG. 8 is a first explanatory view illustrating the method of manufacturing the converter device 1; FIG. 8 is a second explanatory view illustrating the method of manufacturing converter device 1; FIG. 13 is a third explanatory view illustrating the method of manufacturing converter device 1; FIG. 14 is a fourth explanatory view illustrating the method of manufacturing converter device 1; FIG. 18 is a fifth explanatory view illustrating the method of manufacturing converter device 1;

  Hereinafter, embodiments of a converter device and a converter device manufacturing method (hereinafter, also simply referred to as “manufacturing method”) will be described with reference to the attached drawings.

  First, the configuration of converter device 1 shown in FIG. 1 as an example of the converter device will be described. The converter device 1 is, for example, an AC-DC converter that receives an alternating current and outputs a direct current, and includes a mounting substrate 2, a housing 3, and a lid 4 as shown in FIG. 2 and FIG. Is configured. Further, in the converter device 1, as shown in FIG. 11, the filler 3 is filled in the housing 3.

  As shown in FIGS. 3 and 4, the mounting substrate 2 includes a substrate 21 and various electric components 22 mounted on the substrate 21. The substrate 21 is formed in a substantially rectangular shape (for example, a substantially rectangular shape) in plan view, as shown in the figure. Each electrical component 22 constitutes a processing circuit that performs AC-DC conversion processing. Further, in the mounting substrate 2, the large-sized electric components 22 such as the transformer 22 a and the capacitor 22 b among the electric components 22 are mounted on the mounting surface 21 a (the lower surface in the figure) of the substrate 21.

  In this case, as shown in FIG. 4, the transformer 22 a is disposed at the end of the bobbin 51 on which the unillustrated winding is formed, the core 52 disposed around the bobbin 51, and the bobbin 51. A pair of terminal parts 53 (terminal parts on the primary side and terminal parts on the secondary side) are provided. Further, as shown in the figure, each terminal portion 53 of the transformer 22 a is fixed to the substrate 21. Further, the transformer 22 a is provided with bobbins 51 in order to secure creepage distances and spatial distances between the respective terminal portions 53 and the windings of the bobbin 51 and creepage distances and spatial distances between the respective terminal portions 53 and the core 52. And a region between the terminal portions 53 on the bottom surface of the core 52 (a region facing the mounting surface 21 a of the bobbin 51 and the core 52 and hereinafter also referred to as “intermediate region 54”) separated from the mounting surface 21 a It is mounted on the mounting surface 21a (with a gap between the bottom surfaces of the bobbin 51 and core 52 and the substrate 21).

  In addition, on the back surface 21b of the substrate 21 (the surface opposite to the mounting surface 21a, which is the upper surface in FIGS. 3 and 4), two input terminals (primary side terminals) 23a for inputting an alternating current, and a direct current , And two output terminals (secondary side terminals) 23b for outputting.

  Furthermore, as shown in FIG. 4, in the region of the substrate 21 facing the intermediate region 54 of the transformer 22 a (hereinafter also referred to as “facing region 21 c”), two circular insertion holes 21 d (see also FIG. 3) It is formed. The insertion holes 21 d are formed on the space between the bottom plate 31 of the housing 3 and the mounting surface 21 a of the substrate 21 when the converter device 1 is manufactured according to the converter device manufacturing method described later. The function of exhausting to the side, and the function of reliably filling the filler 5 injected between the bottom plate 31 and the mounting surface 21a of the substrate 21 between the intermediate region 54 of the transformer 22a and the opposing region 21c of the substrate 21 Have. In this case, the opposing region 21c generally has a configuration in which no other electrical component 22 or wiring is provided in order to secure a creeping distance and a spatial distance between the terminal portions 53. In this converter device 1, it is possible to effectively use the opposing region 21c by forming the insertion hole 21d having the above-described function in the opposing region 21c in which the other electric components 22 and the wiring can not be disposed. ing.

  In addition, as shown in FIG. 11, the mounting surface 2 a of the mounting substrate 2 faces the bottom plate 31 of the housing 3 (that is, the large electric components 22 such as a transformer and a capacitor face downward). Are housed in the housing 3 in a state where the housing 3 is positioned on the opening 33 side.

  As shown in FIGS. 5 and 6, the housing 3 includes four side plates 32 a to 32 d (hereinafter, also referred to as “side plates 32” when not distinguished from each other). ) And is formed in a substantially rectangular box shape having an opening 33 on one side. In this case, since the housing 3 is formed by injection molding of a resin, the horizontal area gradually increases from the bottom plate 31 side toward the opening 33 in order to ensure releasability during molding. It is formed in shape.

  Here, in the converter device 1, as described above, the mounting substrate 2 is in a state in which the mounting surface 21 a faces the bottom plate 31 of the housing 3 and the substrate 21 is positioned on the opening 33 side of the housing 3. 3 (see FIG. 11). For this reason, in the converter device 1, since the housing 3 can be formed in accordance with the horizontal area of the opening 33 side to the area of the substrate 21 of the mounting substrate 2, the horizontal area of the bottom plate 31 is the area of the substrate 21. It is possible to make it narrower than that. For this reason, in the converter device 1, the housing 3 can be miniaturized as compared with a configuration in which the mounting substrate 2 is accommodated in the housing 3 with the substrate 21 positioned on the bottom plate 31 side. There is. In other words, when the casing 3 has the same size, the horizontal area of the substrate 21 is large compared to the configuration in which the mounting substrate 2 is accommodated in the casing 3 with the substrate 21 positioned on the bottom plate 31 side. It is possible to

  Further, as shown in FIG. 6, ribs 34 (see also FIG. 5) are respectively provided on the inner surfaces of the two side plates 32a and 32c of the side plates 32 facing each other. As shown in FIG. 11, when the mounting substrate 2 is accommodated in the housing 3, the rib 34 has a function of supporting the mounting substrate 2 by contacting the edge of the mounting surface 21 a of the substrate 21 of the mounting substrate 2. have. Further, as shown in the figure, the length from the bottom plate 31 to the upper end portion (portion in contact with the substrate 21) of the rib 34 is an electric component 22 from the mounting surface 21a of the substrate 21 in the mounting substrate 2. It is formed to be slightly longer than the maximum height of (the length to the lower end in the same figure).

  Further, as shown in FIGS. 5 and 6, at the edge portion on the opening 33 side of the two side plates 32b and 32d facing each other among the side plates 32, the engagement hole 44 (engaged portion of the lid 4) The claw portions 35 (engagement portions) are formed to engage with each other (see FIG. 7).

  Further, as shown in FIG. 6, the housing 3 is formed in a point symmetrical shape with the center 31 a of the bottom plate 31 as a symmetry point in a plan view in which the bottom plate 31 is viewed in plan. That is, the formation positions of the ribs 34 and the formation positions of the claws 35 are defined so as to be point symmetrical with respect to the center 31 a of the bottom plate 31.

  As shown in FIG. 7, the lid 4 includes a substantially rectangular main plate 41 and four side plates 42 a to 42 d (hereinafter also referred to as “side plates 42” when not distinguished) erected on the outer peripheral portions of the main plate 41. It is formed in a shallow dish shape, and as shown in FIGS. 1 and 12, it is configured to be attachable to the housing 3 so as to cover the opening 33 (see FIG. 5) of the housing 3. In this case, the lid 4 is formed by injection molding of a resin.

  Further, as shown in FIG. 7, a plurality of (for example, three) protrusions 43 are provided on the inner surface (upper surface in the figure) of the main plate 41. In this case, as shown in FIG. 11, when the lid 4 is attached to the housing 3 in which the mounting substrate 2 is housed, it is at an arbitrary position not in contact with the electric component 22 mounted on the back surface 21 b of the substrate 21. A protrusion 43 can be provided. As shown in the figure, when the converter device 1 is manufactured, the protrusion 43 abuts the front end of the mounting substrate 2 in the mounting substrate 2 housed in the housing 3, so that the mounting substrate 2 is mounted. Is pressed against the bottom plate 31 side of the housing 3.

  Further, as shown in FIG. 7, in the main plate 41, insertion holes 45 for inserting the input terminals 23 a and the output terminals 23 b of the mounting substrate 2 are formed. Further, in the two edges facing each other in the main plate 41 and the two side plates 42b and 42d erected at these edges, these are formed by cutting away a part of the claws of the housing 3 Engaging holes 44 (see also FIGS. 11 and 12) for engaging with 35 are respectively formed.

  The filler 5 is, for example, a thermosetting silicone resin (thermosetting silicone elastomer), which has insulating properties and in the state before curing treatment forms a gel having flowability, and curing treatment (heat treatment) ) To cure into rubber-like. Further, as the filler 5, a thermosetting silicone resin having high thermal conductivity and excellent heat dissipation is used. The filler 5 is filled in the housing 3 in which the mounting substrate 2 is accommodated, specifically, between the bottom plate 31 of the housing 3 and the substrate 21 of the mounting substrate 2, and the mounting substrate 2 is housed in the housing While fixing to 3 (regulating the movement of the mounting substrate 2), it has a function of thermally conducting the heat generated by the electric component 22 and radiating the heat to the outside through the housing 3.

  Next, a converter device manufacturing method of manufacturing converter device 1 will be described with reference to the drawings. 8 to 11 illustrate the side plate 32 on the front side of the drawing as seen through in order to explain the internal state of the housing 3.

  First, as shown in FIG. 8, the gel-like filler 5 before curing treatment is injected into the housing 3 by a prescribed amount determined in advance using the dispenser 50. Next, as shown in FIG. 9, the mounting substrate 2 is accommodated in the housing 3 in a posture in which the mounting surface 21 a of the substrate 21 in the mounting substrate 2 faces the bottom plate 31 of the housing 3.

  In this case, in the converter device 1, the housing 3 is formed in a point-symmetrical shape with the center 31a of the bottom plate 31 as a symmetry point (see FIG. 6). That is, the housing 3 has a configuration in which the shape in plan view does not change even when the left and right are interchanged (even when rotated 180 °). Therefore, unlike the configuration in which the planar view shape of the housing 3 is not point-symmetrical, when the mounting substrate 2 is accommodated in the housing 3, the left and right orientations of the housing 3 are aligned with the left and right orientations of the mounting substrate 2. Since it is not necessary to carry out such work, it is possible to improve the manufacturing efficiency by that much.

  Subsequently, as shown in FIG. 10, the lid 4 is attached to the housing 3 so as to cover the opening 33 of the housing 3. Specifically, the input terminal 23a and the output terminal 23b of the mounting substrate 2 are inserted into the through holes 45 of the lid 4, and then the lid 4 is moved downward.

  Subsequently, as shown in FIG. 11, when the tip of the projection 43 abuts against the back surface 21 b of the substrate 21 of the mounting substrate 2 by the downward movement of the lid 4, the lid 4 is directed downward (case The mounting substrate 2 is pressed against the opening 33 of the body 3 to press the mounting substrate 2 to the bottom plate 31 side of the housing 3. At this time, pressure is applied to the filler 5 by the movement of the substrate 21, and gaps between the electric components 22 mounted on the mounting surface 21 a of the substrate 21 or between the electric components 22 and the mounting surface 21 a The filler 5 flows into the interstices of As a result, as shown in the figure, the filler 5 is uniformly filled in these gaps.

  Here, in the converter device 1, as shown in FIG. 4, an insertion hole 21d is formed in the facing area 21c of the substrate 21 facing the intermediate area 54 of the transformer 22a. Therefore, when the space between the bottom plate 31 of the housing 3 and the mounting surface 21a of the substrate 21 is reduced by pressing the mounting substrate 2 to the bottom plate 31 side of the housing 3, air in the space is inserted As a result of being able to reliably exhaust air to the back surface 21b side of the substrate 21 through the holes 21d, it is possible to reliably press the mounting substrate 2 to the bottom plate 31 side of the housing 3. In addition, since the air in the space can be reliably exhausted, the filler 5 is filled up to every corner of the electric components 22 without leaving air in the gaps between the electric components 22 or the like. Is possible.

  When the filler 5 flows into the gap between the intermediate region 54 of the transformer 22a and the facing region 21c of the substrate 21, the filler 5 is filled in the insertion hole 21d (see FIG. 10). In this case, in the converter device 1, the thermosetting silicone resin having high thermal conductivity is used as the filler 5, so the heat of the transformer 22 a generated more than the other electric components 22 is filled in the insertion hole 21 d It is possible to conduct heat efficiently and dissipate heat by the filled filler 5.

  Next, when the mounting surface 21 a of the substrate 21 abuts on the upper end of the rib 34 formed on the housing 3, the pressing on the lid 4 is released (the hand is released from the lid 4). In this state, as shown in FIGS. 11 and 12, the claws 35 of the housing 3 and the engagement holes 44 of the lid 4 are engaged to reliably prevent the lid 4 from falling off the housing 3. Be done. In addition, the engagement between the claws 35 and the engagement holes 44 maintains the state in which the mounting substrate 2 is pressed against the bottom plate 31 of the housing 3 even when the cover 4 is released.

  Thus, the filling of the filler 5, the accommodation of the mounting substrate 2 and the mounting of the lid 4 are completed. Subsequently, a curing process for the filler 5 is performed. In this curing process, the casing 3 (hereinafter also referred to as “the assembled case 3”) in which the filling of the filler 5, the accommodation of the mounting substrate 2 and the mounting of the lid 4 is completed And heat treatment as curing treatment. In this case, as described above, the engagement between the claws 35 and the engagement holes 44 reliably prevents the lid 4 from being detached from the housing 3, and the mounting substrate 2 is made of the housing 3. Since the state pressed down to the bottom plate 31 side is maintained, the assembled case 3 is heated as it is without performing the operation of fixing the case 3 and the lid 4 with a fixing member or the like. Since the filler 5 can be heat-treated by being set in the apparatus, the manufacturing efficiency can be improved.

  The filler 5 is cured by the above heat treatment (hardening treatment) to change from gel to rubber. In addition, the mounting substrate 2 is securely fixed to the housing 3 by curing the filler 5. Thereby, converter device 1 is completed. In the converter device 1, as described above, the filler 5 is uniformly filled in the gaps between the electric components 22 and the gaps between the electric components 22 and the mounting surface 21a. For this reason, in the converter device 1, it is possible to effectively exhibit the heat dissipation function of the filler 5.

  As described above, according to the converter device 1, the bottom surface of the electrical component 22 having a gap between the substrate 21 of the electrical components 22 mounted on the mounting surface 21 a of the substrate 21 and the bottom surface of the electrical component 22 is opposed The mounting substrate 2 in which the insertion hole 21d is formed in the facing region 21c is accommodated in the housing 3 with the mounting surface 21a facing the bottom plate 31 of the housing 3, and the bottom plate 31 and the mounting surface 21a of the mounting substrate 2 When the space between the bottom plate 31 of the housing 3 and the mounting surface 21 a of the substrate 21 is reduced by the pressing of the mounting substrate 2 to the bottom plate 31 side of the housing 3 by filling the filler 5 between As a result, the air in the space can be reliably exhausted through the insertion holes 21d. As a result, the mounting substrate 2 can be reliably pressed to the bottom plate 31 side of the housing 3. In addition, since the air in the space can be reliably exhausted, the filler 5 is filled up to every corner of the electric components 22 without leaving air in the gaps between the electric components 22 or the like. Can. Therefore, according to the converter device 1, the heat dissipation function of the filler 5 can be effectively exhibited. Further, according to the converter device 1, since the mounting substrate 2 is accommodated in the housing 3 in a state where the mounting surface 21 a faces the bottom plate 31, the substrate 21 of the mounting substrate 2 is on the opening 33 side of the housing 3. It can be located in Therefore, according to the converter device 1, the horizontal area on the bottom plate 31 side is made larger than the area of the substrate 21 by forming the housing 3 so that the horizontal area on the opening 33 side matches the area of the substrate 21 of the mounting substrate 2. As a result, the case 3 can be miniaturized.

  Further, in the converter device 1, the substrate 21 facing the intermediate region 54 of the transformer 22 a (electrical component 22) mounted in a state where the intermediate region 54 between the terminal portions 53 as the bottom surface is separated from the mounting surface 21 a of the substrate 21. The insertion hole 21d is formed in the opposing area 21c of In this case, in the converter device 1 which is an AC-DC converter, in the mounting substrate 2 on which the transformer 22a crossing between the primary side and the secondary side is mounted, the substrate 21 faces the bottom surface of the transformer 22a. In the area 21c, since a creeping distance defined for safety must be secured, no conductor pattern can be provided in the facing area 21c, and a gap needs to be provided between the substrate 21 and the bottom surface of the transformer 22a. There is. Therefore, according to the converter device 1, the effective utilization rate of the substrate 21 can be raised by providing the insertion holes 21 d in the facing area 21 c facing the intermediate area 54 as the bottom surface of the transformer 22 a satisfying such mounting conditions. As a result, miniaturization can be achieved.

  Further, according to this converter device 1, since the insertion holes 21d can be formed by a simple processing operation by forming the insertion holes 21d in a circular shape, the manufacturing efficiency of the mounting substrate 2 can be improved. .

  Further, in the converter device 1, the mounting substrate 2 is accommodated in the housing 3 in a state where the mounting surface 21 a is in contact with the ribs 34 formed on the side plates 32 a and 32 c of the housing 3. Therefore, according to the converter device 1, the length from the bottom plate 31 to the upper end portion of the rib 34 is specified to be longer than the maximum height of the electric component 22 from the mounting surface 21a of the substrate 21 in the mounting substrate 2. Then, when the mounting substrate 2 is pressed to the bottom plate 31 side of the housing 3, the mounting surface 21 a abuts on the upper end portion of the rib 34 before the electrical component 22 contacts the bottom plate 31, and the electrical component 22 and the bottom plate 31 Contact with the body can be reliably prevented.

  Further, in the converter device 1, the lid 43 in a state where the projection 43 provided on the lid 4 abuts on the back surface 21 b of the substrate 21 of the mounting substrate 2 and presses the mounting substrate 2 against the bottom plate 31 of the housing 3. The unit 4 is attached to the housing 3. Therefore, according to the converter device 1, the mounting substrate 2 is securely mounted on the bottom plate 31 side of the housing 3 by mounting the lid 4 on the housing 3 without pressing the mounting substrate 2 with a fingertip or the like. It can be held down.

  Further, according to the converter device 1, the housing 3 is configured to include the claw portion 35, and the cover 4 is configured to include the engagement hole 44 that engages with the claw portion 35 in the mounted state. Only by pressing the lid 4 toward the opening 33 of the body 3, the claws 35 and the engagement holes 44 may be engaged to reliably prevent the lid 4 from falling off the housing 3. While being possible, the mounting substrate 2 can be maintained in the state of being pressed against the bottom plate 31 side of the housing 3. In addition, since the claws 35 and the engagement holes 44 engage with each other, the filler 5 is filled, the mounting substrate, and the like without fixing the housing 3 and the lid 4 with a fixing member or the like. The housing 3 in which the housing 2 and the cover 4 have been completely mounted can be set in, for example, a heating apparatus to perform the heating process (curing process) on the filler 5, so that the manufacturing efficiency can be improved.

  Further, according to this converter device 1, the case 3 is formed in a point-symmetrical shape with the center 31 a of the bottom plate 31 as the symmetry point, so unlike the case 3 which is not formed in the point-symmetrical shape When housing the substrate 2 in the housing 3, there is no need to perform an operation to match the left and right orientations of the housing 3 with the left and right orientations of the mounting substrate 2, so the manufacturing efficiency can be improved accordingly. .

  Moreover, according to this converter device manufacturing method, the filler 5 in a fluid state is injected into the housing 3, and the intermediate region 54 between the terminal portions 53 is separated from the mounting surface 21 a of the substrate 21. The mounting surface 21 a faces the bottom plate 31 of the housing 3 with the mounting substrate 2 having the insertion holes 21 d formed in the facing region 21 c facing the intermediate region 54 of the substrate 21 while the transformer 22 a is mounted on the mounting surface 21 a. The housing 3 is accommodated in the housing 3, and the mounting substrate 2 is pressed to the bottom plate 31 side, and thereafter the filler 5 is cured to hold the mounting substrate 2 to the bottom plate 31 side of the housing 3. When the space between the bottom plate 31 and the mounting surface 21a of the substrate 21 is reduced, the air in the space can be reliably exhausted through the insertion hole 21d. As a result, to the bottom plate 31 side of the housing 3 With mounting board 2 It can be carried out reliably. In addition, since the air in the space can be reliably exhausted, the filler 5 is filled up to every corner of the electric components 22 without leaving air in the gaps between the electric components 22 or the like. Can. Therefore, according to this converter device manufacturing method, converter device 1 capable of effectively exhibiting the heat dissipation function of filler 5 can be manufactured.

  The converter device and the converter device manufacturing method are not limited to the above-described configuration and method. For example, although an example in which the insertion hole 21d is formed in the facing region 21c of the substrate 21 facing the intermediate region 54 between the terminal portions 53 on the bottom surface of the transformer 22a has been described above, others have a gap between the substrate 21 and the bottom surface The bottom surface of the electric component 22 is mounted on the mounting surface 21 a when the electric component 22 (for example, a photocoupler crossing the primary side and the secondary side in the case of an AC-DC converter) is mounted on the mounting surface 21 a. The insertion holes 21 d can also be formed in the facing area of the substrate 21 facing the face.

  Further, although the example in which the two insertion holes 21d are formed in the facing area 21c of the substrate 21 is described above, a configuration in which one or more insertion holes 21d are formed can be adopted. Further, although the example in which the circular insertion hole 21d is formed is described above, the shape of the insertion hole 21d can be defined arbitrarily. For example, it is possible to adopt a slit-shaped insertion hole 21d or a shape in which a circular shape and a slit shape are combined.

  Further, although the above description has been made of the example in which the side plates 32a and 32c of the housing 3 are provided with the ribs 34, the ribs 34 are provided on the side plates 32b and 32d, or the ribs 34 are provided on all four side plates 32. Can also be adopted. Further, the number of ribs 34 provided on each side plate 32 is not limited to one, and may be plural. Further, although the case where the casing 3 is formed so that the shape in plan view is point-symmetrical is described above, the casing 3 having a configuration in which the shape in plan view is not point-symmetrical may be employed.

  Further, the claws 35 as engaging portions are respectively formed on the side plates 32b and 32d, the two edge portions of the main plate 41 facing each other, and the engaging holes 44 as engaged portions on the two side plates 42b and 42d. Although the example which each formed was mentioned above, the formation position and number of the nail | claw part 35 and the engagement hole 44 can be prescribed | regulated arbitrarily. Also, the shapes of the claws 35 and the engagement holes 44 can be arbitrarily changed. Moreover, although the above-mentioned example demonstrated the example which provided the three projection parts 43 in the main plate 41 of the cover part 4, the projection parts 43 are not limited to three but arbitrary numbers (one or two, preferably three or more) It can be defined. Moreover, the converter apparatus provided with the housing | casing 3 of another structure and the cover part 4 which were mentioned above, and its converter apparatus manufacturing method are employable.

  Moreover, although the configuration and method using thermosetting silicone resin are described above as an example of the filler 5, the filler 5 is not limited to this, and various fillers 5 compatible with the above configuration and method are used. Can.

DESCRIPTION OF SYMBOLS 1 converter device 2 mounting substrate 3 housing 4 cover 5 filler 21 substrate 21a mounting surface 21b back surface 21c facing region 21d insertion hole 22 electric component 22a transformer 31 bottom plate 31a center 32a to 32d side plate 33 opening 34 rib 35 claw 41 Main plate 43 Protrusion part 44 Engagement hole 53 Terminal part 54 Middle area

Claims (8)

A mounting substrate on which an electric component is mounted on a substrate, and a case having an opening on one surface to receive the mounting substrate, and covering the electric components of the mounting substrate received in the case A converter device in which a filler is filled in the case and configured.
The mounting substrate has at least one insertion hole in a region of the electrical component having a gap between the substrate and the bottom surface of the electrical component among the electrical components mounted on the mounting surface of the substrate. to be constituted by forming the mounting surface is accommodated in the housing in a state facing the bottom plate of the housing,
The converter device, wherein the filler is filled between the bottom plate and the mounting surface of the mounting substrate. The electrical component having the gap is a transformer,
The transformer is mounted on the mounting surface in a state where a pair of terminal portions is fixed to the substrate and an area between the terminal portions as the bottom surface is separated from the mounting surface of the substrate.
The converter device according to claim 1, wherein the insertion hole is formed in a region facing the region between the terminal portions in the substrate.   The converter device according to claim 1, wherein the insertion hole is formed in a circular shape, a slit shape, or a shape combining a circular shape and a slit shape. The housing is formed by providing ribs on the inner surfaces of two mutually facing side plates of the four side plates erected on each outer peripheral portion of the bottom plate ,
The converter device according to any one of claims 1 to 3, wherein the mounting substrate is accommodated in the housing in a state where the mounting surface is in contact with the rib. And a lid mounted on the case so as to cover the opening;
The lid portion is configured to have a protrusion provided on the inner surface, and the case is in a state in which the protrusion abuts on the back surface of the substrate on the mounting substrate to press the mounting substrate against the bottom plate side. The converter device according to claim 4 attached to a body. The housing is configured to include an engaging portion formed at an edge on the opening side of the side plate,
The converter device according to claim 5, wherein the lid portion includes an engaged portion that engages with the engaging portion in a state of being attached to the housing.   The converter device according to any one of claims 1 to 6, wherein the case is formed in a point-symmetrical shape with the center of the bottom plate as a point of symmetry in a plan view in which the bottom plate is viewed in plan. A mounting substrate on which an electric component is mounted on the substrate, a case having an opening on one side to accommodate the mounting substrate, and a lid mounted on the case so as to cover the opening; A converter device manufacturing method for manufacturing a converter device in which a filler is filled in the housing so as to cover the electrical components of the mounting substrate housed in the housing,
Injecting the filler in a fluid state into the housing;
At least one insertion hole is formed in a region facing the bottom surface of the electric component having a gap between the substrate of the electric components mounted on the mounting surface of the substrate and the bottom surface of the electric component It said mounting substrate, said mounting surface is accommodated in the housing in a state facing the bottom plate of the housing has,
Pressing the mounting substrate against the bottom plate side,
Then, the converter is manufactured by curing the filler to manufacture the converter.

Images