JP2009294077A - Semiconductor package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor package which constitutes a sensor assembly for detecting a change in a physical quantity for any of three axes even when a mounting surface of a packaging member is formed of only one plane. <P>SOLUTION: On the occasion when an acceleration sensor 6 is housed in a case 2, the case 2 is so constituted that it includes a first packaging surface on which it is packaged in relation to the packaging member and includes a second packaging surface being perpendicular to the first packaging surface, while terminals 3 are provided on the first and second packaging surfaces, and the first or second packaging surface is made perpendicular to the direction of detection of the acceleration sensor 6. According to the semiconductor package thus constituted, the semiconductor package is packaged in the packaging member so that acceleration is detected for any of the three axes even when the mounting surface of the packaging member is formed of only one plane. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor package in which a semiconductor device is housed in a case, and is particularly suitable for application to a sensor assembly configured by electrically connecting a plurality of semiconductor packages to a mounting member.

  Conventionally, a semiconductor package has been disclosed in which a recess is formed in a case, a semiconductor device is accommodated in the recess, and a terminal is formed on the back surface of the case to be electrically connected to a mounting member such as a printed circuit board. (For example, refer to Patent Document 1). Specifically, in such a semiconductor package, a through hole penetrating between the back surface of the case and the bottom surface of the recess is formed and a wiring is provided in the through hole. The device and the terminal are electrically connected.

  In such a semiconductor package, when a semiconductor device contains, for example, a uniaxial detection acceleration sensor configured to include a fixed electrode and a movable electrode that is displaced according to a change in acceleration. The semiconductor package is mounted on the mounting member such that the arrangement direction of the fixed electrode and the movable electrode is parallel to the direction in which the acceleration is applied.

Specifically, when the back surface of the case is a plane parallel to the xy plane, when detecting acceleration in the x-axis direction or the y-axis direction, the arrangement direction of the fixed electrode and the movable electrode is x-axis or A semiconductor package is mounted so as to be parallel to the y-axis. For this reason, for example, when a sensor assembly that can detect acceleration in both the x-axis direction and the y-axis direction using two semiconductor packages is configured, one of the semiconductor packages is connected to the fixed electrode and the movable electrode. The semiconductor package is mounted on the mounting member so that the arrangement direction is parallel to the x-axis direction, and the other semiconductor package is mounted so that the arrangement direction of the fixed electrode and the movable electrode is parallel to the y-axis direction.
JP-A-8-78569

  However, in order to detect the acceleration in the z-axis direction using the semiconductor package of Patent Document 1, a surface parallel to the z-axis so that the arrangement direction of the fixed electrode and the movable electrode is parallel to the z-axis. A semiconductor package must be mounted on a mounting member having a mounting surface. Therefore, when a sensor assembly that can detect acceleration in the x-axis direction, the y-axis direction, and the z-axis direction using a plurality of semiconductor packages of Patent Document 1 is configured, the xy plane is defined as a mounting surface. In addition to the mounting member to be mounted, a mounting member having a surface parallel to the z-axis must be newly added, resulting in an increase in manufacturing steps and complexity. Here, the acceleration sensor is described as an example of the semiconductor device, but the same problem occurs when an angular velocity sensor is applied as the semiconductor device.

  In view of the above, the present invention provides a semiconductor package capable of constituting a sensor assembly capable of detecting a change in physical quantity with respect to any of three axes even if the mounting surface is a mounting member having only one plane. The purpose is to do.

  In order to achieve the above object, according to the first aspect of the present invention, the case (2) includes an acceleration sensor (6) that outputs a signal in accordance with a change in acceleration in the detection direction. The terminal (3) mounted on the surface (5) and electrically and mechanically connected to the mounting member is disposed on the outer wall surface of the case (2), and the wiring (7) is formed on the case (2). A first mounting surface on which the terminal (3) and the acceleration sensor (6) are electrically connected via the wiring (7), and the case (2) is mounted on the mounting member; And a second mounting surface that is perpendicular to the first mounting surface. The terminal (3) is provided on the first mounting surface and the second mounting surface, and the first mounting surface or the second mounting surface is an acceleration sensor ( It is characterized by being perpendicular to the detection direction of 6).

  According to such a semiconductor package, the first mounting surface or the second mounting surface of the case (2) is perpendicular to the detection direction of the acceleration sensor (6), and the terminal (3) is the first mounting surface and the second mounting surface. Since the surface is provided, even if the mounting member has only one plane on which the acceleration sensor (6) can be mounted, acceleration can be detected for any of the three axes. The semiconductor package can be mounted on the mounting member as possible. Therefore, by using a plurality of such semiconductor packages, even if the mounting member has only one plane on which the acceleration sensor (6) can be mounted, a change in acceleration with respect to any of the three axes can be detected. Possible sensor assemblies can be constructed.

  Further, for example, as in the invention described in claim 2, an angular velocity sensor that detects an angular velocity when an angular velocity having one direction as a central axis is applied and outputs a signal according to a change in the angular velocity is provided in a case (2 ) Having a first mounting surface on which the case (2) is mounted on the mounting member and a second mounting surface perpendicular to the first mounting surface. The semiconductor package may be configured such that the terminal (3) is provided on the first mounting surface and the second mounting surface, and the first mounting surface or the second mounting surface is perpendicular to the central axis.

  According to such a semiconductor package, the first mounting surface or the second mounting surface of the case (2) is perpendicular to the central axis, and the terminals (3) are provided on the first mounting surface and the second mounting surface. Therefore, even if the mounting surface on which the angular velocity sensor can be mounted is only one plane, the semiconductor package is mounted on the mounting member so that a change in angular velocity about any of the three axes can be detected. Can be arranged. Therefore, by using a plurality of such semiconductor packages, even if the mounting member has only one plane on which the angular velocity sensor can be mounted, the angular velocity changes about any of the three axes as the central axis. A detectable sensor assembly can be constructed.

  Further, as in the invention described in claim 3, the case (2) is a rectangular parallelepiped, the recess (4) is formed on the surface of the case (2), and the mounting surface (5) is formed on the wall surface of the recess (4). The lid (11) is arranged on the surface of the case (2) so as to cover the recess (4), and the circumference of the outer wall surface of the lid (11) is set to the lid (11) of the case (2). It can also be configured to be the same as the circumference of the outer wall surface that is vertical or smaller than the circumference of the outer wall surface. When the circumference of the outer wall surface of the lid (11) is the same as the circumference of the outer wall surface perpendicular to the lid (11) of the case (2), the invention according to claim 4 In addition, the outer shape formed by the case (2) and the lid (11) may be a cube.

  Further, as in the invention described in claim 5 or claim 6, the case (2) is made of resin, the wiring (7) is insert-molded in the case (2), and the acceleration sensor (5) or The angular velocity sensor can be resin-molded. In this case, as in the invention described in claim 7, the outer mold shape of the case (2) can be a cube.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a perspective view of a semiconductor package according to the present embodiment, which will be described with reference to FIG. In this embodiment, the semiconductor package is a cube, each side of the front and back surfaces of the semiconductor package is a side parallel to the x-axis or y-axis, and a side shared by adjacent side surfaces of the semiconductor package is a z-axis. This will be described below as parallel sides.

  As shown in FIG. 1, a case 2 is configured by laminating a plurality of ceramic layers 1. In addition, a plurality of terminals 3 electrically connected to a mounting member such as a printed circuit board are provided on the xy plane and the xz plane of the outer wall surface of the case 2. The outer wall surface is provided so as to straddle the yz plane. In the present embodiment, the xy plane and the xz plane correspond to the first mounting surface and the second mounting surface of the present invention.

  2 is a cross-sectional view of the semiconductor package shown in FIG. As shown in FIG. 2, a recess 4 is formed on the case 2 from the surface, and a mounting surface 5 is formed on the bottom surface of the recess 4, and an acceleration sensor 6 is mounted on the mounting surface 5. . As the acceleration sensor 6, for example, a well-known sensor that includes a fixed electrode (not shown) and a movable electrode that is displaced in accordance with a change in acceleration and that has one direction as an acceleration detection direction can be used. 1 and 2, the acceleration sensor 6 is mounted on the mounting surface 5 so that the acceleration detection direction is parallel to the y-axis direction, and the xz plane is perpendicular to the detection direction of the acceleration sensor 6. It is supposed to be.

  FIG. 3 is a cross-sectional view of the semiconductor package shown in FIG. As shown in FIGS. 2 and 3, the case 2 is formed with a wiring 7 made of Al, Cu or the like so as to penetrate the outer wall surface and the wall surface of the recess 4. The acceleration sensor 6 is electrically connected to the pad 8 provided on the wiring 7 via the wire 9, and the acceleration sensor 6 and the terminal 3 are electrically connected to each other via the wiring 7. Further, the terminal 3 disposed in the portion including the xz plane and the terminal 3 disposed in the portion including the xy plane are electrically connected through the pad 8 and the wiring 7, respectively.

  The wiring 7 is formed in the case 2 so as to penetrate the surface of the plurality of ceramic layers 1 and the ceramic layer 1, and the wiring 7 formed so as to penetrate the ceramic layer 1 is formed in the ceramic layer 1. It is arranged in the formed through hole 10. And the wiring 7 arrange | positioned on the surface of the ceramic layer 1 is electrically connected with the terminal 3 arrange | positioned in the part containing xz surface, and the wiring 7 arrange | positioned in the through hole 10 is x. By being electrically connected to the terminal 3 disposed in the portion including the −y plane, the terminal 3 disposed in the portion including the xz plane and the portion including the xy plane is disposed. Terminals 3 are electrically connected to each other.

  In addition, the wiring 7 is disposed in a portion that electrically connects the terminal 3 and the pad 8 disposed in the portion including the xy plane of the case 2 and in a portion including the xz plane of the case 2. The width and thickness are adjusted so that the internal resistances of the terminal 3 and the pad 8 where electrical connection is made are the same.

  As shown in FIG. 1, a lid 11 is disposed on the surface of the case 2 so as to cover the recess 4. The circumference of the outer wall surface of the lid 11 is configured to be the same as the circumference of the outer wall surface perpendicular to the lid 11 in the case 2. In this embodiment, the case 2 and the lid 11 The case 2 and the lid 11 are configured so that the configured outer mold shape is a cube.

  Such a semiconductor package is manufactured as follows.

  First, a part where the recess 4 is formed and a part where the through hole 10 is formed are punched out of a part of the ceramic layer 1 constituting the case 2 with a mold or the like. Next, wiring 7 is formed by embedding a conductor in the through hole 10 in the ceramic layer 1 in which the through hole 10 is formed, and the wiring 7 is formed by patterning the conductor on the surface of the ceramic layer 1. Then, a conductor is arranged on the side surface of the ceramic layer 1 so as to be electrically connected to the wiring 7 formed on the surface, thereby forming the terminal 3. Thereafter, a pad 8 electrically connected to the acceleration sensor 6 is formed on one of the ceramic layers 1.

  Subsequently, the ceramic layers 1 are press-laminated and fired so as to have the above shape, thereby forming the case 2 in which the recesses 4 are formed from the surface. Then, Ni plating or Au plating is performed on the surface of the case 2. Thereafter, the acceleration sensor 6 is mounted on the mounting surface 5, and the acceleration sensor 6 and the pad 8 are electrically connected via the wire 9. Finally, the semiconductor package of the present embodiment is manufactured by disposing the lid 11 on the surface of the case 2 so as to cover the recess 4 formed in the case 2.

  According to such a semiconductor package, the terminals 3 are arranged on the xz plane of the case 2 and the xy plane perpendicular to the xz plane, and the xz plane is the detection direction of the acceleration sensor 6. The semiconductor package is mounted so that acceleration can be detected with respect to any of the three axes even in a mounting member on which the surface on which the acceleration sensor 6 can be mounted is only one plane. It can be mounted on a member. Specifically, in this embodiment, the acceleration in the x-axis direction and the y-axis direction is achieved by rotating the semiconductor package around the z-axis using the terminals 3 provided on the xy plane and mounting the semiconductor package on the mounting member. Can be detected. Further, the acceleration in the z-axis direction can also be detected by mounting the semiconductor package on the mounting member using the terminal 3 provided on the xz plane which is a plane perpendicular to the detection direction of the acceleration sensor 6. it can. Therefore, by using a plurality of semiconductor packages of the present embodiment, acceleration can be detected for any of the three axes of the mounting member on which the surface on which the acceleration sensor 6 can be mounted is only one plane. It is possible to configure a sensor assembly that can Further, since the sensor assembly can be configured in this way, it is not necessary to newly add a mounting member.

  Furthermore, since the terminal 3 is arranged so as to straddle the yz plane, for example, when the xy plane of the case 2 is mounted on the mounting member via solder, the terminal 3 is placed on the yz plane of the case 2. The connection between the solder that wraps around and the terminal 3 disposed on the yz plane can be visually confirmed, and the connection between the solder and the terminal 3 can be confirmed.

  Further, the circumferential length of the outer wall surface of the lid 11 is configured to be the same as the circumferential length of the outer wall surface perpendicular to the lid 11 in the case 2, and is configured by the lid 11 and the case 2. Since the outer shape is a cube, for example, even when the surface on which the semiconductor package is mounted is changed from the xy plane to the xz plane, the mounting area does not change. For this reason, when the semiconductor package is mounted on the mounting member, changes in the structural resonance frequency and the vibration resistance of the acceleration sensor 6 caused by changing the mounting surface can be reduced.

  Furthermore, the wiring 7 which connects between the terminal 3 arrange | positioned in the part containing the x-y surface of the case 2 and the pad 8, and the terminal 3 arrange | positioned in the part containing the xz surface of the case 2; Since the internal resistance of the wiring 7 connecting between the pad 8 and the pad 8 is the same, even if the mounting surface of the case 2 is changed and mounted on the mounting member, the electrical connection to the acceleration sensor 6 is achieved. The influence can be suppressed.

(Second Embodiment)
A second embodiment of the present invention will be described. The semiconductor package of this embodiment is different from the first embodiment in that the case 2 is made of a material having a resin and the manufacturing process of the semiconductor package is changed, and the rest is the same as in the first embodiment. Therefore, the description is omitted here.

  FIG. 4 is a diagram showing the manufacturing process of the semiconductor package of this embodiment. As shown in FIG. 4A, first, the wiring 7 is insert-molded to form an L-shaped insert case 2a having an xy plane and a yz plane. In the present embodiment, in the L-shaped insert case 2a, the xy surface located inside is the mounting surface 5, and the xy surface and yz surface located outside are the first mounting surface and the second surface. Mounting surface. Then, a pad 8 that is electrically connected to the wiring 7 that is insert-molded is disposed on the mounting surface 5, and the terminal 3 that is electrically connected to the wiring 7 that is insert-molded on the xy plane and the yz plane. Place. Subsequently, the acceleration sensor 6 is disposed on the mounting surface 5 and is electrically connected to the pad 8 via a wire.

  Subsequently, as shown in FIG. 4B, the insert case 2 a is molded again to form the case 2. At this time, the acceleration sensor 6 is resin-molded, and the outer shape of the case 2 is a cube.

  According to such a semiconductor package, since the case 2 is a cube having three equal sides, the structural resonance frequency and vibration resistance can be further reduced when the mounting surface is changed and mounted on the mounting member. And the same effects as those of the first embodiment can be obtained.

(Other embodiments)
In the first embodiment, the semiconductor package in which the acceleration sensor 6 is mounted on the mounting surface 5 of the case 2 has been described. However, a semiconductor package in which an angular velocity sensor is disposed on the mounting surface 5 of the case 2 may be used. For example, similarly to the acceleration sensor 6 described in the first embodiment, an angular velocity sensor having a fixed electrode and a movable electrode that is displaced in accordance with a change in angular velocity is accommodated in the case 2 so that a semiconductor package is obtained. It may be configured. In this case, when the angular velocity sensor is mounted on the mounting surface 5 of the case 2 so that the angular velocity can be detected when the angular velocity having the central axis in the z-axis direction is applied, the xy plane is perpendicular to the central axis. For example, by providing the terminals 3 on the xy plane and the xz plane, the same effect as in the first embodiment can be obtained. Therefore, by using a plurality of the semiconductor packages, even if the surface on which the angular velocity sensor can be mounted is a mounting member having only one plane, it is possible to detect a change in angular velocity with any of the three axes as the central axis. A sensor assembly can be constructed.

  In the first embodiment, the example in which the acceleration sensor 6 and the pad 8 are electrically connected via the wire 9 has been described. For example, the acceleration sensor 6 and the pad 8 are electrically connected via the bump. You may connect.

  Further, in the first embodiment, the circumference of the outer wall surface of the lid 11 is configured to be the same as the circumference of the outer wall surface perpendicular to the lid 11 in the case 2. The circumference of the outer wall can be configured to be smaller than the circumference of the outer wall that is perpendicular to the lid 11.

  Moreover, in the said 1st Embodiment, although the terminal 3 is formed so that it may straddle to a yz plane, of course, the terminal 3 can also be set as the structure which is not formed so that it may straddle to a yz plane. .

  Furthermore, in the first embodiment and the second embodiment, a plurality of semiconductor packages can be stacked and mounted on a mounting member. In this case, if the back surface of the case 2 is the first mounting surface, the terminal 3 may be arranged on the surface of the lid 11 or the surface of the case 2.

  When a sensor assembly is configured by stacking a plurality of semiconductor packages, if the signal line is a bus line using a digital signal or the like, the position of the terminal 3 of the semiconductor package is adjusted and the semiconductor package is stacked. All the acceleration sensors 6 or angular velocity sensors can be operated simply by electrically and mechanically connecting the contacting terminals 3 to each other by soldering or the like, which is very effective. Also, by stacking a plurality of semiconductor packages, a sensor assembly having a plurality of detection axes can be configured without increasing the mounting area of the mounting member, or a sensor assembly having redundancy even with the same detection axis Can be configured. Of course, a plurality of semiconductor packages are connected to a mounting member without stacking a plurality of semiconductor packages and mounted, thereby forming a sensor assembly having a plurality of detection axes, or even with the same detection axis. A sensor assembly having redundancy can be configured.

  In the first embodiment, the outer shape formed by the case 2 and the lid 11 may not be a cube. In the second embodiment, the outer shape formed by the case 2 is not a cube. It is good also as a structure.

It is a figure which shows the cross-sectional structure of the semiconductor package in 1st Embodiment of this invention. It is AA arrow sectional drawing of the semiconductor package shown in FIG. It is BB arrow sectional drawing of the semiconductor package shown in FIG. (A) And (b) is a figure which shows the manufacturing process of the semiconductor package in 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic layer 2 Case 3 Terminal 4 Recessed part 5 Mounting surface 6 Acceleration sensor 7 Wiring 8 Pad 9 Wire 10 Through hole 11 Lid

Claims (7)

An acceleration sensor (6) that outputs a signal in accordance with a change in the acceleration in the detection direction, wherein one direction is an acceleration detection direction;
A case (2) in which a mounting surface (5) is formed and the acceleration sensor (6) is mounted on the mounting surface (5);
A terminal (3) disposed on the outer wall surface of the case (2) and electrically and mechanically connected to the mounting member;
The case (2) includes a wiring (7) that electrically connects the terminal (3) and the acceleration sensor (6). The case (2) is connected to the mounting member. A first mounting surface to be mounted and a second mounting surface perpendicular to the first mounting surface are configured, and the terminal (3) is provided on the first mounting surface and the second mounting surface. The semiconductor package is characterized in that the first mounting surface or the second mounting surface is perpendicular to the detection direction. An angular velocity sensor that detects the angular velocity when an angular velocity having a central axis as a central axis is applied, and outputs a signal in accordance with a change in the angular velocity;
A case (2) in which a mounting surface (5) is formed and the angular velocity sensor is mounted on the mounting surface (5);
A terminal (3) disposed on the outer wall surface of the case (2) and electrically and mechanically connected to the mounting member;
The case (2) includes a wiring (7) electrically connected to the terminal (3) and the angular velocity sensor, and the case (2) is mounted on the mounting member. A first mounting surface and a second mounting surface perpendicular to the first mounting surface; and the terminal (3) is provided on the first mounting surface and the second mounting surface, A semiconductor package, wherein the first mounting surface or the second mounting surface is perpendicular to the central axis.   The case (2) is a rectangular parallelepiped, the concave portion (4) is formed on the case (2) from the surface, the mounting surface (5) is constituted by the wall surface of the concave portion (4), and the case ( 2), a lid (11) is disposed so as to cover the recess (4), and the circumference of the outer wall surface of the lid (11) is perpendicular to the lid (11) of the case (2). 3. The semiconductor package according to claim 1, wherein the semiconductor package is configured to be equal to or smaller than a circumference of a certain outer wall surface. 4.   The case (2) is a rectangular parallelepiped, the concave portion (4) is formed on the case (2) from the surface, the mounting surface (5) is constituted by the wall surface of the concave portion (4), and the case ( A lid (11) is disposed on the surface of 2) so as to cover the concave portion (4), and the circumferential length of the outer wall surface of the lid (11) corresponds to the lid (11) of the case (2). The outer mold shape that is the same as the circumference of the outer wall surface that is vertical and that includes the case (2) and the lid (11) is a cube. Semiconductor package.   The case (2) is configured to have a resin, the wiring (7) is insert-molded in the case (2), and the acceleration sensor (6) is resin-molded. Item 14. A semiconductor package according to Item 1.   The case (2) is configured to have a resin, the wiring (7) is insert-molded in the case (2), and the angular velocity sensor is resin-molded. The semiconductor package described.   7. The semiconductor package according to claim 5, wherein the outer shape of the case (2) is a cube.

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