CN106356324A - 一种晶圆输送机构 - Google Patents

一种晶圆输送机构 Download PDF

Info

Publication number
CN106356324A
CN106356324A CN201510426968.5A CN201510426968A CN106356324A CN 106356324 A CN106356324 A CN 106356324A CN 201510426968 A CN201510426968 A CN 201510426968A CN 106356324 A CN106356324 A CN 106356324A
Authority
CN
China
Prior art keywords
wafer
conveying mechanism
oar
slide rail
wafer conveying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510426968.5A
Other languages
English (en)
Inventor
王燚
刘亿军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Piotech Inc
Original Assignee
Piotech Shenyang Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Piotech Shenyang Co Ltd filed Critical Piotech Shenyang Co Ltd
Priority to CN201510426968.5A priority Critical patent/CN106356324A/zh
Publication of CN106356324A publication Critical patent/CN106356324A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Abstract

一种晶圆输送机构，包括无尘气缸，直线滑轨，传片桨和晶圆存放托盘。传片桨的一端与无尘气缸连接，晶圆存放托盘放置在传片桨的另一端。传片桨在直线滑轨上滑动。通过采用此晶圆输送机构，在整个沉积应用过程中，可以很好的实现晶圆在反应腔室内的自动取放，减轻操作人员的劳动强度，操作便捷，节约时间，大大降低高温对操作人员的危险因素。

Description

一种晶圆输送机构
技术领域
本发明涉及一种输送机构，尤其是一种实现晶圆在反应腔室内的自动取放的输送机构，属于半导体薄膜沉积应用及制备技术领域。
背景技术
为了满足国内外半导体、太阳能、LED、光波导等行业的生产及科研需求，各设备制造商相继研发设计了有单个或多个反应腔室的沉积膜设备。在现有单腔结构形式的半导体沉积膜设备中，在没有晶圆输送机构的情况下，需要手动进行晶圆输送过程，将晶圆向腔室内放置及从腔室内取出。如此，在晶圆薄膜沉积应用中，需要消耗很多时间来进行晶圆的输送。而且，如果是高温的晶圆沉积应用，沉积结束后，反应腔室内部温度很高，晶圆表面温度也很高，需要晶圆在腔室内部冷却一定时间后才能进行晶圆取出工作。总之，整个应用过程中，人员的工作量很大，操作复杂，需要很长时间，高温对操作人员也有危险因素。
发明内容
针对上述现有技术的不足，本发明提供了一种晶圆输送机构。
为实现上述目的，本发明采用的技术方案是：一种晶圆输送 机构，包括无尘气缸，直线滑轨，传片桨和晶圆存放托盘。传片桨的一端与无尘气缸连接，晶圆存放托盘放置在传片桨的的另一端。传片桨在直线滑轨上滑动。
本发明的有益效果及特点：通过采用此晶圆输送机构，在整个沉积应用过程中，可以很好的实现晶圆在反应腔室内的自动取放，减轻操作人员的劳动强度，操作便捷，节约时间，大大降低高温对操作人员的危险因素。
附图说明
图1是本发明的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清晰、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1所示：一种晶圆输送机构，包括无尘气缸1，直线滑轨2，传片桨3和晶圆存放托盘4。传片桨3的一端与无尘气缸1连接，晶圆存放托盘4放置在传片桨3的的另一端。传片桨3在直线滑轨2上滑动。
在真空无尘气缸1上安装传送桨3，传送桨3前端放置晶圆存放托盘4，通过控制气缸活塞的水平移动带动传送桨3及晶圆存放托盘4一起移动实现晶圆自动输送。
上述机构的使用方法，将晶圆存放托盘放置在传送桨前端半圆弧凹槽内，通过控制气缸活塞的水平移动带动传送桨及晶圆存放托盘一起移动。向腔室内放置晶圆时，将晶圆放置在晶圆存放托盘上，根据沉积要求，调整晶圆方向标识于指定方位。启动无尘气缸，随着活塞移动，传送桨将承载着晶圆的托盘送至反应腔沉积位置，反应腔沉积承载装置升起，将晶圆存放托盘顶起。托盘脱离传送桨后，反应腔沉积承载装置停止运动，控制无尘气缸，活塞带动无托盘的传送桨从反应腔室退出，回到原始位置。

Claims (1)

1.一种晶圆输送机构，其特征在于：包括无尘气缸，直线滑轨，传片桨和晶圆存放托盘；传片桨的一端与无尘气缸连接，晶圆存放托盘放置在传片桨的的另一端，传片桨在直线滑轨上滑动。
CN201510426968.5A 2015-07-20 2015-07-20 一种晶圆输送机构 Pending CN106356324A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510426968.5A CN106356324A (zh) 2015-07-20 2015-07-20 一种晶圆输送机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510426968.5A CN106356324A (zh) 2015-07-20 2015-07-20 一种晶圆输送机构

Publications (1)

Publication Number Publication Date
CN106356324A true CN106356324A (zh) 2017-01-25

Family

ID=57843025

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510426968.5A Pending CN106356324A (zh) 2015-07-20 2015-07-20 一种晶圆输送机构

Country Status (1)

Country Link
CN (1) CN106356324A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113035762A (zh) * 2021-03-08 2021-06-25 苏州长光华芯光电技术股份有限公司 一种晶圆传片系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113035762A (zh) * 2021-03-08 2021-06-25 苏州长光华芯光电技术股份有限公司 一种晶圆传片系统

Similar Documents

Publication Publication Date Title
CN103143489B (zh) 一种层架式热固化机
CN202742376U (zh) 机械手抓取工件用夹具结构
CN107365980A (zh) 一种石墨舟自动装卸片设备
CN106783710A (zh) 晶圆转移装置
CN207497689U (zh) 一种电路板自动送板机
CN203473916U (zh) 一种电气动搬运装置
CN206484546U (zh) 一种机械手横向调节装置
CN106356324A (zh) 一种晶圆输送机构
CN204927255U (zh) 晶圆输送装置
CN209350254U (zh) 一种双冲双夹机械手
CN208841429U (zh) 一种机械手夹具
CN103898448A (zh) 用于调节托盘温度的腔室及半导体加工设备
CN110132011A (zh) 自动进出料装置及焗炉
CN105752698A (zh) 双轨四工位旋转切换式上料机
CN203386852U (zh) 自动油导热压设备
CN202186741U (zh) 一种硅片输送中的吸盘结构
CN201817086U (zh) 一种膜片弹簧热处理自动出料v型定位装置
CN212517147U (zh) Pecvd设备无载板硅片传送机构及与该传送机构配合的工艺腔室
CN205021283U (zh) 制动盘生产转运设备
CN209291373U (zh) 一种板式pecvd的自动上料设备
CN105398752A (zh) 一种可调速托盘传送装置
CN201773818U (zh) 节能灯自动上灯头装置
CN116504686B (zh) 一种基于液态均匀温控的半导体加热盘
CN205708901U (zh) 双轨四工位旋转切换式上料机
CN201594534U (zh) 用于转载石英舟的自动传输装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170125

WD01 Invention patent application deemed withdrawn after publication