CN106353666A - Deducting and deduction testing methods for <60>Co Gamma-ray radiation response of SOI (silicon on insulator) NMOSFET (N-channel metal oxide semiconductor field-effect transistor) - Google Patents

Deducting and deduction testing methods for <60>Co Gamma-ray radiation response of SOI (silicon on insulator) NMOSFET (N-channel metal oxide semiconductor field-effect transistor) Download PDF

Info

Publication number
CN106353666A
CN106353666A CN201610806351.0A CN201610806351A CN106353666A CN 106353666 A CN106353666 A CN 106353666A CN 201610806351 A CN201610806351 A CN 201610806351A CN 106353666 A CN106353666 A CN 106353666A
Authority
CN
China
Prior art keywords
ray
radiation
gamma
under
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610806351.0A
Other languages
Chinese (zh)
Other versions
CN106353666B (en
Inventor
�田�浩
贺凌翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Tiancheng Hui Core Technology Co Ltd
Original Assignee
Chengdu Tiancheng Hui Core Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Tiancheng Hui Core Technology Co Ltd filed Critical Chengdu Tiancheng Hui Core Technology Co Ltd
Priority to CN201610806351.0A priority Critical patent/CN106353666B/en
Publication of CN106353666A publication Critical patent/CN106353666A/en
Application granted granted Critical
Publication of CN106353666B publication Critical patent/CN106353666B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/265Contactless testing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Radiation (AREA)

Abstract

The invention provides deducting and deduction testing methods for <60>Co Gamma-ray radiation response of SOI (silicon on insulator) NMOSFET (N-channel metal oxide semiconductor field-effect transistor); in a very low electric field, two SOI NMOSFETs under same structure and process conditions are subjected to X-ray radiation and <60>Co Gamma-ray radiation respectively; ratios of threshold voltage drifts under X-ray radiation and <60>Co Gamma-ray radiation due to oxide layer trap charge are compared to extract a DEF (dose effect factor); radiation dose level of X-ray test data is multiplied by the DEF, threshold voltage drift value due to radiation is multiplied by the factor 0.7, and radiation response to <60>Co Gamma-ray is acquired accordingly; the methods have small application limits, Vth deduction is more accurate, mass radiation tests for <60>Co source can be omitted, testing cost is greatly reduced, the advantage of X-ray in facilitating and quickening the provision of feedback is given to full play, and research and development efficiency is improved.

Description

Soi nmosfet's60The response of co gamma Rays is derived and derivation test method
Technical field
The present invention relates to a kind of soi nmosfet60The response of co gamma Rays is derived and derivation test method, particularly Be related to a kind of be applied to semiconductor components and devices to soi nmosfet's60The derivation derived of response of co gamma Rays and Derivation test method.
Background technology
For a long time, the accumulated dose ionizing radiation test of semiconductor components and devices has been used up co source as radiation source.The U.S. Military's testing standard mil-std-883c also specifies60The standard testing source that co gamma-rays are tested for integral dose radiation.But large-scale co Naturally radioactive can only be used in source60Co material, big to environmental hazard, radiation dose rate is relatively low, and radiated time is long, thus can not The requirement meeting Acceleration study and single silicon chip level wafer being carried out with irradiation test, being not suitable for extensive particularly manufacturing enterprise makes With.
And x-ray has safe ready, close rate precise control and wide ranges as radiation source, silicon chip level can be carried out Test and can be tested on a production line, encapsulation, test, the cost of transport can be substantially reduced, improve efficiency of research and development etc. Advantage, is particularly suitable for radiation hardened screening.
Therefore, attempt using the rdaiation response under device radiation, x-ray derive its60Under co gamma Rays, response becomes One direction of foreign study.Derive feasible if this, safer easily not only can radiate using x-ray is this Source carries out integral dose radiation test, and can also be according to derivation60Co test result provides space radiation assessment, thus has Important meaning.
For soi nmosfet, existing utilization radiation, x-ray derivation device exists60Two kinds of response under co gamma Rays Method: first method is that schwank et al. mentions the integral dose radiation causing under higher doses using x-ray in the literature Respond and to estimate60The response that co gamma-rays cause, using than60The x-ray that co dose value exceeds 60% or 40% dose value is surveyed Test result is estimating.But the result ratio that this method is estimated60The actual damage that co causes is serious.Further for different knots The device ratio producing under structure, different technology conditions is different, is therefore hardly resulted in merely full according to simple proportionate relationship The result of meaning.Another kind of method is that the electric field improving soi device oxygen buried layer under radiation, x-ray makes thus improving its electric charge yield Under two kinds of radiation, the electric charge of oxygen buried layer accumulation is equal.This method needs the device substrate in radiation, x-ray to add biasing, but Add how high biasing to be but difficult to determine.Therefore, it is difficult to estimate that under all bias conditions, x-ray arrives by the method60Co γ penetrates The damage of line.
Content of the invention
The technical problem to be solved in the present invention is to provide a kind of application limitation little, and derive more accurately soi nmosfet 's60The response of co gamma Rays is derived and derivation test method.
The technical solution used in the present invention is as follows: a kind of soi nmosfet's60Co gamma Rays respond derivation method, Method particularly includes: under extremely low electric field, to the two pieces soi nmosfet under same structure and process conditions, one carries out x and penetrates Line, another is carried out60Co gamma Rays;Contrast x-ray with60Drawn by oxide trapped charge under the two kinds of radiation of co gamma-rays The ratio of the threshold voltage shift rising extracts dosage enhancer def;The irradiation dose level of x-ray test data is multiplied by def, The threshold voltage shift amount that irradiation is caused is multiplied by the factor 0.7, thus obtaining60The gamma-ray rdaiation response of co;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
Safe ready, close rate precise control and wide ranges are had as radiation source using x-ray, silicon chip level can be carried out Test and can be tested on a production line, can substantially reduce encapsulation, test, transport cost, improve efficiency of research and development Etc. advantage.X-ray replaces the test that co source carries out silicon chip level can improve efficiency of research and development, is particularly suitable for radiation hardened screening.
Under extremely low electric field (< 0.05mv/cm), the electric charge yield that x-ray leads to and60Co gamma-rays reach unanimity.This is Because under extremely low electric field, oxide layer is insensitive to radiating, Most electronic-hole that radiation produces is to all again multiple in the original location Close, the hole escaped is little.Should under the conditions of x-ray and60The electric charge yield that co gamma Rays lead to is equal, then now cause The different sole cause of device oxide trapped charge amount is exactly Dose Enhancement Effects, thus by oxygen under being radiated using two kinds The ratio changing the threshold voltage shift amount that layer trapped charge causes extracts dosage enhancer def.
Described radiation, x-ray source is the radiation, x-ray source of 10kev.
On biasing under, contrast x-ray with60The lower δ v of two kinds of radiation of co gamma-raysotVariation relation extractant with dosage Amount enhancer def.
Oxygen buried layer is had little to no effect due to biasing added by positive grid under on biasing, thus oxygen buried layer internal electric field meets and is less than 0.05mv/cm.Therefore on biasing for, can by contrast x-ray with60Co gamma-rays δ votVariation relation with dosage Extract dosage enhancer def.
A kind of soi nmosfet's60Co gamma Rays respond derivation test method, method particularly includes: with soi Nmosfet device in x-ray and60Under co gamma Rays, it is respectively adopted the spoke under on biasing, pg biasing and off bias conditions Penetrate response data as analysis foundation, by x-ray and60The threshold voltage shift total amount that co gamma-rays are done experiment carries out electric charge and divides From obtaining the contribution margin δ v to threshold voltage shift for the oxide-trapped chargeotWith the contribution margin to threshold voltage shift for the interfacial state δvit, and then obtain δ votVariation relation with total radiation dose;Under on bias conditions, by two kinds of rays (x-ray and60Co gamma-rays) the lower δ v of radiationotVariation relation with total radiation dose extracts dosage enhancer def;X-ray is tested number According to irradiation dose level be multiplied by def, the threshold voltage shift amount that irradiation is caused is multiplied by the factor 0.7, thus obtaining60Co γ penetrates The rdaiation response of line;With the experimental data under pg biasing and off biasing as foundation, the dosage extracting under checking on bias condition increases The reasonability of the strong factor, and derivation is responded by radiation, x-ray60The whole derivation method accuracy of co gamma Rays response;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
Oxide-trapped charge is the direct result escaping the hole oxidized layer trap capture being initially combined, and carries out electric charge It becomes possible to the interference of exclusion interfacial state after separating, determine the contribution to threshold voltage shift for the oxide charge.
Described radiation, x-ray source is the radiation, x-ray source of 10kev.
On biasing under, contrast x-ray with60The lower δ v of two kinds of radiation of co gamma-raysotVariation relation extractant with dosage Amount enhancer def.
Compared with prior art, the invention has the beneficial effects as follows: application limitation is little, δ vthIt is more accurate to derive;Can save Go60The substantial amounts of radiation test of co source, thus substantially reducing experimentation cost and playing x-ray and can conveniently and efficiently provide the excellent of feedback Gesture, improves the efficiency of research and development.Although still needing to carry out once60Co tests, as long as but device architecture and process conditions are constant, here Afterwards60Co test just can be utilized the method to pass through x-ray experimental data direct derivation.The method is implemented simply, and by real Test data verification and can reach very high precision.The proposition of test method substitutes for x-ray60Co gamma-rays carry out integral dose radiation examination Test to provide and provide powerful support for, there is realistic meaning.
Brief description
Fig. 1 is under on biasing60Under co gamma-ray irradiation, oxide charge and interfacial state are to soi nmosfet backgate threshold value electricity The contribution margin schematic diagram of pressure drift.
Fig. 2 is the δ v of two kinds of radiation under on bias conditionotRelation schematic diagram and Equilibrium dose between.
Fig. 3 is in the specific embodiment of the invention, the δ v that the x-ray verified under pg biasing is derivedotChange with accumulated dose Change relation with60The comparison of co gamma-rays curve.
Fig. 4 is in the specific embodiment of the invention, the δ v that the x-ray verified under off biasing is derivedotWith accumulated dose Variation relation with60The comparison of co gamma-rays curve.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples, right The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only in order to explain the present invention, not For limiting the present invention.
Any feature disclosed in this specification (including summary and accompanying drawing), unless specifically stated otherwise, all can be equivalent by other Or the alternative features with similar purpose are replaced.I.e., unless specifically stated otherwise, each feature is a series of equivalent or class Like one of feature example.
Specific embodiment 1
A kind of soi nmosfet's60Co gamma Rays respond derivation method, method particularly includes: under extremely low electric field, right Two pieces soi nmosfet under same structure and process conditions, one carries out x-ray, and another is carried out60Co gamma Rays; Contrast x-ray with60The ratio of the threshold voltage shift being caused by oxide trapped charge under the two kinds of radiation of co gamma-rays extracts dosage Enhancer def;The irradiation dose level of x-ray test data is multiplied by def, the threshold voltage shift amount that irradiation is caused is taken advantage of With the factor 0.7, thus obtaining60The gamma-ray rdaiation response of co;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
Specific embodiment 2
On the basis of specific embodiment 1, described radiation, x-ray source is the radiation, x-ray source of 10kev.
Specific embodiment 3
On the basis of specific embodiment 1 or 2, on biasing under, contrast x-ray with60The lower δ of two kinds of radiation of co gamma-rays votVariation relation with dosage extracts dosage enhancer def.
Oxygen buried layer is had little to no effect due to biasing added by positive grid under on biasing, thus oxygen buried layer internal electric field meets and is less than 0.05mv/cm.Therefore on biasing for, can by contrast x-ray with60Co gamma-rays δ votVariation relation with dosage Extract dosage enhancer def.
Specific embodiment 4
A kind of soi nmosfet's60Co gamma Rays respond derivation test method, method particularly includes: with soi Nmosfet device in x-ray and60Under co gamma Rays, it is respectively adopted the spoke under on biasing, pg biasing and off bias conditions Penetrate response data as analysis foundation, by x-ray and60The threshold voltage shift total amount that co gamma-rays are done experiment carries out electric charge and divides From obtaining the contribution margin δ v to threshold voltage shift for the oxide-trapped chargeotWith the contribution margin to threshold voltage shift for the interfacial state δvit, and then obtain δ votVariation relation with total radiation dose;Under on bias conditions, by two kinds of rays (x-ray and60Co gamma-rays) the lower δ v of radiationotVariation relation with total radiation dose extracts dosage enhancer def;X-ray is tested number According to irradiation dose level be multiplied by def, the threshold voltage shift amount that irradiation is caused is multiplied by the factor 0.7, thus obtaining60Co γ penetrates The rdaiation response of line;With the experimental data under pg biasing and off biasing as foundation, the dosage extracting under checking on bias condition increases The reasonability of the strong factor, and derivation is responded by radiation, x-ray60The whole derivation method accuracy of co gamma Rays response;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
Specific embodiment 5
On the basis of specific embodiment 4, described radiation, x-ray source is the radiation, x-ray source of 10kev.
Specific embodiment 6
On the basis of specific embodiment 4 or 5, on biasing under, contrast x-ray with60The lower δ of two kinds of radiation of co gamma-rays votVariation relation with dosage extracts dosage enhancer def.
Specific embodiment 7
On the basis of one of specific embodiment 4 to 6, implement the content of specific embodiment 1.
First separation of charge is carried out to the buries oxide layer total electrical charge causing soi nmosfet backgate threshold voltage shift.Root Understand according to cmos/soi device Study on Irradiation Effects, after accumulated dose ionizing radiation, in buries oxide layer, radiate the oxidation inducted Thing trapped charge and heterointerface state charge all can cause transistor backgate threshold voltage shift.For nmosfet, oxide trap electricity The accumulation of lotus can make threshold voltage reduce, and the effect of interfacial state is contrary with the effect of oxide charge, is so that threshold voltage is increased. Oxide-trapped charge is the direct result escaping the hole oxidized layer trap capture being initially combined, after carrying out separation of charge, The interference of interfacial state just can be excluded, determine the contribution to threshold voltage shift for the oxide charge.Separate mos transistor after irradiation Oxide-trapped charge and heterointerface state charge most common method be the Asia that winokur and mcwhorter et al. grows up Threshold i-v technology.With under on bias condition60Under co gamma-ray irradiation, the result of soi nmosfet separation of charge is as shown in Figure 1.Fig. 1 Middle x-axis is irradiation dose level, and y-axis is the drift value of threshold voltage, δ vthFor the total amount of threshold voltage shift, δ votFor oxygen The contribution margin to threshold voltage shift for the compound trapped charge, δ vitFor the contribution margin to threshold voltage shift for the interfacial state.
By x-ray and60Co gamma-rays understand, two kinds radiation-induced to the Analysis on Mechanism of soi device ionization radiation effect The difference of oxide layer stored charge amount can be attributed to electric charge yield (ratio being initially combined is escaped in hole) and Dose Enhancement Effects Caused.Due to Dose Enhancement Effects, the absorbed dose of radiation, x-ray rear oxidation layer are higher, thus producing more electron-holes Right, but under certain current field condition, the electron-hole pair of generation is escaped the ratio being initially combined and is but less than60Co gamma-rays. Dose enhancement factors and initial complex effect for x-ray and60The total dose damage that co gamma-rays cause acts as in the opposite direction With Dose enhancement factors make the rdaiation response of x-ray more severe, and initial complex effect makes60The shadow of co gamma Rays response Sound is more serious.Actually any in two kinds of effects more get the upper hand, for manufacturing process different, structure is different, radiation condition is different Etc. different situations, its result also differs.It is thus desirable to weighing the impact that both effects produce to device rdaiation response respectively, And then the rdaiation response being caused by x-ray derives60The gamma-ray rdaiation response of co.
Under extremely low electric field, contrast x-ray with60The threshold value being caused by oxide trapped charge under the two kinds of radiation of co gamma-rays The ratio of voltage drift extracts dosage enhancer def;The irradiation dose level of x-ray test data is multiplied by def, irradiation is made The threshold voltage shift amount becoming is multiplied by the factor 0.7, obtains60The gamma-ray rdaiation response of co.
Under extremely low electric field (< 0.05mv/cm), the electric charge yield that x-ray leads to and60Co gamma-rays reach unanimity.This is Because under extremely low electric field, oxide layer is insensitive to radiating, Most electronic-hole that radiation produces is to all again multiple in the original location Close, the hole escaped is little.Should under the conditions of x-ray and60The electric charge yield that co gamma Rays lead to is equal, then now cause The different sole cause of device oxide trapped charge amount is exactly Dose Enhancement Effects, thus by oxygen under being radiated using two kinds The ratio changing the threshold voltage shift amount that layer trapped charge causes extracts dosage enhancer def.
On biasing under, contrast x-ray with60The lower δ v of two kinds of radiation of co gamma-raysotVariation relation extractant with dosage Amount enhancer def.
Oxygen buried layer is had little to no effect due to biasing added by positive grid under on biasing, thus oxygen buried layer internal electric field meets and is less than 0.05mv/cm.Therefore on biasing for, can by contrast x-ray with60Co gamma-rays δ votVariation relation with dosage Extract dosage enhancer def.
As shown in Fig. 2 under on bias condition x-ray with60The two kinds of radiation of co gamma-rays are caused by oxygen buried layer trapped charge The δ v of backgate threshold voltage shiftotThe example of the relation and Equilibrium dose between.The def=1.60 obtaining in exemplary plot.
It is it should be noted that Dose Enhancement Effects are a kind of interfacial effects, only relevant with oxidated layer thickness, device architecture, Unrelated with oxide layer internal electric field;And initially complex effect is relevant with electric field, but unrelated with oxidated layer thickness, device architecture.Thus For same device, under 10kev radiation, x-ray, its dose enhancement is constant.
According under on bias condition, extract def=1.60 (x-ray/60Co gamma-rays), it is possible to use the examination of x-ray Test data to be derived under other various bias conditions60The gamma-ray rdaiation response of co.Def is multiplied by Equilibrium dose level permissible Obtain actual absorption dosage level.Under other bias conditions based on experience value and data, x-ray irradiates lower electric charge product Volume is about60Under the irradiation of co gamma-rays 70%.Thus the abscissa (irradiation dose level) of x-ray test data is multiplied by def, Again the threshold voltage shift amount (vertical coordinate) that irradiation causes is multiplied by the factor 0.7, you can obtain60The gamma-ray rdaiation response of co.
Taking the experimental data under pg biasing as a example.According to Dose enhancement factors factor def=1.60, then x-ray is in Equilibrium dose Level is respectively actual absorption dosage difference when 55.56krad (sio2), 0.28mrad (sio2) and 0.56mrad (sio2) For 88.9krad (sio2), 0.45mrad (sio2) and 0.9mrad (sio2).Under pg biasing, oxygen buried layer internal electric field higher (> 0.3mv/cm), the lower electric charge yield obvious difference of now two kinds of radiation, the electric charge yield taking x-ray is60The 70% of co.Examine respectively After considering the impact of two kinds of effects, the δ v that x-ray is derived by weotVariation relation and reality with accumulated dose60Co gamma-rays are bent Line is contrasted, as shown in Figure 3.In the same way, derived using the experimental data under off biasing, result such as Fig. 4 Shown.Can with the contrast of 60co actual curve by the curve that the x-ray experimental data under different bias conditions is derived twice See, the result of derivation can be coincide well with actual value, thus demonstrate the Dose enhancement factors factor extracted under on bias condition being Reasonably, responded by radiation, x-ray and derive60The whole derivation method precision of co gamma Rays response is higher.

Claims (6)

1. a kind of soi nmosfet60Co gamma Rays respond derivation method, method particularly includes: under extremely low electric field, to same Two pieces soi nmosfet under spline structure and process conditions, one carries out x-ray, and another is carried out60Co gamma Rays;Right Than x-ray with60The ratio of the threshold voltage shift being caused by oxide trapped charge under the two kinds of radiation of co gamma-rays extracts dosage and increases Strong factor def;The irradiation dose level of x-ray test data is multiplied by def, the threshold voltage shift amount that irradiation is caused is multiplied by The factor 0.7, thus obtain60The gamma-ray rdaiation response of co;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
2. rdaiation response derivation method according to claim 1, radiation, x-ray source is the radiation, x-ray source of 10kev.
3. rdaiation response derivation method according to claim 1 and 2, on biasing under, contrast x-ray with60Co gamma-rays δ v under two kinds of radiationotVariation relation with dosage extracts dosage enhancer def.
4. a kind of soi nmosfet60Co gamma Rays respond derivation test method, method particularly includes: with soi nmosfet Device in x-ray and60Under co gamma Rays, it is respectively adopted the rdaiation response number under on biasing, pg biasing and off bias conditions According to as analysis foundation, by x-ray and60The threshold voltage shift total amount that co gamma-rays are done experiment carries out separation of charge, obtains The contribution margin δ v to threshold voltage shift for the oxide-trapped chargeotWith the contribution margin δ v to threshold voltage shift for the interfacial stateit, And then obtain δ votVariation relation with total radiation dose;Under on bias conditions, by two kinds of rays (x-ray and60coγ Ray) the lower δ v of radiationotVariation relation with total radiation dose extracts dosage enhancer def;Spoke by x-ray test data It is multiplied by def according to dosage level, the threshold voltage shift amount that irradiation is caused is multiplied by the factor 0.7, thus obtaining60The gamma-ray spoke of co Penetrate response;With the experimental data under pg biasing and off biasing as foundation, the Dose enhancement factors factor of extraction under checking on bias condition Reasonability, and by radiation, x-ray respond derive60The whole derivation method accuracy of co gamma Rays response;
Described extremely low electric field is less than the electric field intensity of 0.05mv/cm for electric field.
5. rdaiation response according to claim 4 is derived and derivation test method, and described radiation, x-ray source is the x of 10kev Ray radiation source.
6. the rdaiation response according to claim 4 or 5 is derived and derivation test method, under on biasing, contrasts x-ray With60The lower δ v of two kinds of radiation of co gamma-raysotVariation relation with dosage extracts dosage enhancer def.
CN201610806351.0A 2016-09-07 2016-09-07 SOI NMOSFET's60The response of Co gamma Rays derives and derives test method Active CN106353666B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610806351.0A CN106353666B (en) 2016-09-07 2016-09-07 SOI NMOSFET's60The response of Co gamma Rays derives and derives test method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610806351.0A CN106353666B (en) 2016-09-07 2016-09-07 SOI NMOSFET's60The response of Co gamma Rays derives and derives test method

Publications (2)

Publication Number Publication Date
CN106353666A true CN106353666A (en) 2017-01-25
CN106353666B CN106353666B (en) 2018-12-25

Family

ID=57859743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610806351.0A Active CN106353666B (en) 2016-09-07 2016-09-07 SOI NMOSFET's60The response of Co gamma Rays derives and derives test method

Country Status (1)

Country Link
CN (1) CN106353666B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108254668A (en) * 2018-02-09 2018-07-06 哈尔滨工业大学 It is a kind of to analyze the method for interface state defects being accelerated to be formed during electronic component ionization radiation injury mechanism
CN112379240A (en) * 2020-11-13 2021-02-19 中国科学院新疆理化技术研究所 Method for evaluating total dose radiation performance of radiation-resistant reinforced SOI material
CN113568028A (en) * 2021-07-26 2021-10-29 中国科学院新疆理化技术研究所 Aging screening method of radiation dose sensor for satellite

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007024302A2 (en) * 2005-05-16 2007-03-01 Ii-Vi Incorporated High performance cdxzn1-xte x-ray and gamma ray radiation detector and method of manufacture thereof
CN101752391A (en) * 2008-11-28 2010-06-23 北京师范大学 Snow slide drifting detector with MOS fully-depleted drifting channel and detecting method thereof
CN103116176A (en) * 2013-01-23 2013-05-22 哈尔滨工业大学 Ground equivalent fluence calculating method for electronic component charged particle irradiation effect
CN103675646A (en) * 2013-08-20 2014-03-26 西交利物浦大学 A real time on-line test system for MOS chip gamma ray radiation responses

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007024302A2 (en) * 2005-05-16 2007-03-01 Ii-Vi Incorporated High performance cdxzn1-xte x-ray and gamma ray radiation detector and method of manufacture thereof
CN101752391A (en) * 2008-11-28 2010-06-23 北京师范大学 Snow slide drifting detector with MOS fully-depleted drifting channel and detecting method thereof
CN103116176A (en) * 2013-01-23 2013-05-22 哈尔滨工业大学 Ground equivalent fluence calculating method for electronic component charged particle irradiation effect
CN103675646A (en) * 2013-08-20 2014-03-26 西交利物浦大学 A real time on-line test system for MOS chip gamma ray radiation responses

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
何玉娟 等: "SOI器件X射线与60 Coγ射线总剂量效应比较", 《电子器件》 *
田浩 等: "SOI NMOS晶体管在高剂量的X射线与60Coγ射线辐射作用下的背栅闭值电压漂移饱和效应的研究及比对", 《功能材料与器件学报》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108254668A (en) * 2018-02-09 2018-07-06 哈尔滨工业大学 It is a kind of to analyze the method for interface state defects being accelerated to be formed during electronic component ionization radiation injury mechanism
CN108254668B (en) * 2018-02-09 2020-05-26 哈尔滨工业大学 Method for accelerating formation of interface state defects in process of analyzing ionizing radiation damage of device
CN112379240A (en) * 2020-11-13 2021-02-19 中国科学院新疆理化技术研究所 Method for evaluating total dose radiation performance of radiation-resistant reinforced SOI material
CN112379240B (en) * 2020-11-13 2024-04-05 中国科学院新疆理化技术研究所 Method for evaluating total dose radiation performance of radiation-resistant reinforced SOI material
CN113568028A (en) * 2021-07-26 2021-10-29 中国科学院新疆理化技术研究所 Aging screening method of radiation dose sensor for satellite
CN113568028B (en) * 2021-07-26 2023-12-15 中国科学院新疆理化技术研究所 Aging screening method of satellite radiation dose sensor

Also Published As

Publication number Publication date
CN106353666B (en) 2018-12-25

Similar Documents

Publication Publication Date Title
Sadrozinski et al. Ultra-fast silicon detectors (UFSD)
Celestin et al. Variability in fluence and spectrum of high‐energy photon bursts produced by lightning leaders
Fang et al. Thermal neutron-induced soft errors in advanced memory and logic devices
CN103926519A (en) Quantitative test method used for cross NPN transistor ionizing radiation damage
CN107229775A (en) The method that photoelectronic imaging device radiation injury is assessed using Monte Carlo simulation
CN106353666A (en) Deducting and deduction testing methods for &lt;60&gt;Co Gamma-ray radiation response of SOI (silicon on insulator) NMOSFET (N-channel metal oxide semiconductor field-effect transistor)
CN103926518A (en) Quantitative testing method for ionizing radiation damage of longitudinal NPN transistor
RU2495446C2 (en) Method to test semiconductor cmos/soi of lsi technology for resistance to effects of single failures from impact of heavy charged particles of space
Zebrev et al. Microdose induced drain leakage effects in power trench MOSFETs: Experiment and modeling
Vittone Semiconductor characterization by scanning ion beam induced charge (IBIC) microscopy
Barnaby et al. Origins of total-dose response variability in linear bipolar microcircuits
Pejović et al. Sensitivity of P‐Channel MOSFET to X‐and Gamma‐Ray Irradiation
Wang et al. Transient current analysis of a GaN radiation detector by TCAD
Petrosyants et al. Effective radiation damage models for TCAD simulation of silicon bipolar and MOS transistor and sensor structures
Baldassarri et al. Signal formation in irradiated silicon detectors
Moscatelli et al. Measurements and TCAD simulations of bulk and surface radiation damage effects in silicon detectors
Fourches A novel CMOS detector based on a deep trapping gate
Mandurrino TCAD simulation of silicon detectors
Fu et al. A novel simulation method to evaluate the collection performance of a monolithic active pixel sensor
Tapero Low dose rate effects in silicon-based devices and integrated circuits: a review
Sauvaud et al. Low‐Altitude Observations of Recurrent Short‐Lived keV Ion Microinjections Inside the Diffuse Auroral Zone
Puzanov et al. Computational and experimental simulation of static memory cells of submicron microcircuits under the effect of neutron fluxes
Fourches et al. Progress in particle tracking and vertexing detectors
Baranov et al. Simulating single-event effects associated with high-energy neutrons for different VLSI technologies
Smolin et al. Modeling charge buildup in deposited oxides under x-ray and gamma irradiation

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant