CN106353073A - Device and method for screening wavelengths in laser device packaging procedures - Google Patents
Device and method for screening wavelengths in laser device packaging procedures Download PDFInfo
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- CN106353073A CN106353073A CN201610833249.XA CN201610833249A CN106353073A CN 106353073 A CN106353073 A CN 106353073A CN 201610833249 A CN201610833249 A CN 201610833249A CN 106353073 A CN106353073 A CN 106353073A
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- object stage
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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Abstract
The invention discloses a device and a method for screening wavelengths in laser device packaging procedures. The device comprises a base, a carrying table, a horizontal movement mechanism, a bracket, an adjusting support, a pricking and measuring needle bar and a spring needle. The horizontal movement mechanism, the adjusting support and the bracket are arranged on the base; the pricking and measuring needle bar is mounted on the adjusting support, and the spring needle is connected onto the pricking and measuring needle bar; the carrying table is arranged on the horizontal movement mechanism, and a pressure sheet is arranged on the carrying table; an electronic microscope is arranged on the bracket. The carrying table and the spring needle are respectively connected with an anode and a cathode of a comprehensive parameter tester, and the electronic microscope is connected with a display; semi-finished chips of laser devices can be fixed onto the carrying table; a single to-be-measured semi-finished chip can be positioned in a pricking and measuring direction of a needle point of the spring needle, the spring needle can be in contact with the to-be-measured semi-finished chip, and the accurate wavelengths of the single to-be-measured semi-finished chip can be measured. The device and the method have the advantages of simplicity in operation, accurate pricking, measuring and classifying and capability of solving the problem of inaccurate wavelength screening in initial packaging stages.
Description
Technical field
The present invention relates to a kind of device and method for screening optical maser wavelength during individual laser package, belong to quasiconductor
Laser package technical field.
Background technology
In semiconductor laser application process, to its excitation wavelength and spectral signature when same laser application direction is different
There are different requirements；In order to meet market application requirement, generally optical maser wavelength is entered by comprehensive parameter tester in current industry
Row sifting sort, the method for classification has the classification of finished product wavelength, the classification of bar bar, the classification of epitaxial wafer wavelength after encapsulation.
Chinese patent literature cn104568386a provides a kind of optical maser wavelength screening technique and its device, walks including following
Rapid: laser wavelength tuner module drives testing laser device to carry out Laser Modulation length scanning；It is full of Standard Gases, profit in air chamber
Pass through the laser of air chamber with standard aspiration；Laser wavelength acquisition module receives and gathers the light of the laser from air chamber output
By force；Laser wavelength screening module, according to the laser intensity collecting, calculates the center of testing laser device by respective algorithms
Wavelength.The method is applied to the detection screening of completed semiconductor laser wavelength, but the yield controling power of large-scale production medium wavelength
Degree is weaker.
Cn105203305a discloses a kind of semiconductor laser lossless wavelength category filter method, by electroluminescent initial survey
And technique piece full wafer scan photoluminescence spectrum recheck method, can Effective selection different wavelength range semiconductor laser extension
Piece.But this invention can only realize the rough classification of epitaxial wafer wave-length coverage, and needs during package application for epitaxial wafer to cut into list
Grain encapsulation, slightly poor to the classification accuracy of simple grain optical maser wavelength in this way.
Cn101515701b discloses a kind of wavelength filtering device of semiconductor laser, comprising: pillar, seat board, slip pipe, interior
Slip pipe, adjustment cap, the first nut, cantilever beam, the second nut, guide pipe, gauge head and scaffold tower, pillar is fixed on seat board, pillar
One end threaded with seat board, slip pipe is fixedly connected with seat board, and slip pipe is screwed with inner sliding pipe and is connected, inner sliding pipe with
First nut thread connects, and adjustment cap is connected with the first nut thread, and cantilever beam is connected with the first nut, inner sliding pipe contact,
Second nut and guide pipe are threaded, gauge head and guide pipe elastic connection, and scaffold tower is screwed with seat board and is connected.This dress
Although putting the bar bar test of the different wave length that can complete pulse or low duty ratio, the disadvantage of wavelength after solving encapsulation, just can be selected
Disease, but be not given laser small-sized when bar bar be accurately positioned solution, and once can only test single only heat sink and tube core
The wavelength of the semi-finished product after die bond, the efficiency for test encapsulation early stage semi-finished product is lower slightly.
In sum, above prior art exists and accurately can not screen at the initial stage producing individual laser package process in enormous quantities
The shortcoming of wavelength.
Content of the invention
For the deficiencies in the prior art, the present invention provides Wavelength filtering device during a kind of individual laser package, to solve
Encapsulation initial stage wavelength screens inaccurate problem, improves yield rate and production efficiency.Meanwhile, provide this device a kind of to laser instrument
The screening technique of wavelength.
Wavelength filtering device during the individual laser package of the present invention, using following technical solution:
This Wavelength filtering device, including base, object stage, horizontal mobile mechanism, support, adjust bearing, prick chaining pin bar and
Spring needle；Horizontal mobile mechanism, regulation bearing and support are arranged on base；Prick chaining pin bar to be arranged on regulation bearing, bullet
Spring pin is connected on bundle chaining pin bar；Object stage is arranged on horizontal mobile mechanism, and object stage is provided with tabletting；Arrange on support
There is ultramicroscope.
The upper planar tilt of described object stage, angle is 0 degree of -90 degree and horizontal plane between.
Described regulation bearing is spring module, and this elastic module is to be provided with adjusting screw, adjusting screw on a bearing
On be set with spring.
Described horizontal mobile mechanism, including mobile platform, longitudinal moving mechanism and transverse moving mechanism, mobile platform connects
On longitudinal moving mechanism, longitudinal moving mechanism is arranged on transverse moving mechanism.Transverse moving mechanism drives and vertically moves machine
Structure transverse shifting, longitudinal moving mechanism drives mobile platform to vertically move, thus realizing moving horizontally of mobile platform.Longitudinally move
Motivation structure and transverse moving mechanism can adopt screw nut driven mechanism, arrange adjusting knob on leading screw.
With plane on object stage in vertical state, error is less than 10 degree to the axis of described spring needle.
The elastic force of described spring needle is less than 0.5n.
The method that said apparatus carry out wavelength screening during individual laser package, comprises the following steps:
(1) object stage and spring needle are connected with the both positive and negative polarity of comprehensive parameter tester respectively, by ultramicroscope with aobvious
Show that device connects；
(2) pass through adjust bearing adjust prick chaining pin bar height, so that spring needle is in directly over object stage, but not with loading
Platform contacts；
(3) mobile support so as on electron microscope observation to the needle point of spring needle can be clearly shown in and electricity
On the display that sub- microscope is connected；
(4) by tabletting, at least one chip of laser semi-finished product is fixed on object stage；
(5) pass through horizontal mobile mechanism, the position of adjustment object stage, make chip semi-finished product to be measured be in spring needle
The bundle of needle point is surveyed on direction；
(6) so that bundle chaining pin bar and spring needle is moved down by adjusting bearing, make spring needle and prick the chip to be measured surveyed on direction
Semi-finished product contact；
(7) open comprehensive parameter tester main switch, setting electric current and voltage, record the standard of single chip semi-finished product to be measured
Really wavelength；
(8) state keeping comprehensive parameter tester to open, repeats above step (5) and step (6), completes on object stage
All samples test.
The present invention is simple to operate, can once assemble and test the semi-finished product after multiple heat sink and die bondings, prick survey accurate
Really, classify accurately, prick and continue rear end encapsulation further according to user's request after surveying classification, solve the screening of encapsulation initial stage wavelength inaccurate
Problem, greatly increases yield rate and production efficiency, effectively reduces cost of manufacture.
Brief description
Fig. 1 is the structural representation of Wavelength filtering device during individual laser package of the present invention.
In figure: 1, base, 2, transverse moving mechanism, 3, mobile platform, 4, object stage, 5, tabletting, 6, support, 7, electronic display
Micro mirror, 8, display, 9, prick chaining pin bar, 10, adjusting screw, 11, spring module, 12, spring needle, 13, longitudinal moving mechanism.
Specific embodiment
As shown in figure 1, Wavelength filtering device during the individual laser package of the present invention, including base 1, move horizontally machine
Structure, support 6, ultramicroscope 7, regulation bearing, bundle chaining pin bar 9 and spring needle 12.
Adjust bearing, horizontal mobile mechanism and support 6 to be installed on base 1.Adjust bearing and adopt spring module 11, prick
Chaining pin bar 9 is connected on spring module 11 by adjusting screw 10, and the spring in spring module 11 is through in adjusting screw 10, pricks
Chaining pin bar 9 is between this spring and adjusting screw 10 head, rotates adjusting screw 10, and the elastic force pricking chaining pin bar 9 in spring is made
With lower adjustable-height and fix.Spring needle 12 is connected to the end pricking chaining pin bar 9.Object stage 4 is fixed on the machine of moving horizontally
On structure, object stage 4 is made up of radiating good material, is the inclined-plane having certain angle with horizontal plane above it.Logical on object stage 4
Cross screw and be fixed with the tabletting 5 for test product positioning.
Described horizontal mobile mechanism, including mobile platform 3, longitudinal moving mechanism 13 and transverse moving mechanism 2, mobile platform
3 are connected on longitudinal moving mechanism 13, and longitudinal moving mechanism 13 is arranged on transverse moving mechanism 2.Transverse moving mechanism 2 drives
Longitudinal moving mechanism 13 transverse shifting, longitudinal moving mechanism 13 drives mobile platform 3 to vertically move, thus realizing mobile platform
Move horizontally.Longitudinal moving mechanism 13 and transverse moving mechanism 2 can adopt screw nut driven mechanism, and setting on leading screw is adjusted
Section knob (in figure is not drawn into).
Support 6 is located at the rear of mobile platform 3, and support 6 is fixed with ultramicroscope 6, ultramicroscope 6 and display
8 connections.Spring needle 12 is fixed on the end pricking chaining pin bar 9 according to certain angle, spring needle 12 with object stage 4 in vertical state,
Error is 10 degree, that is, spring needle 12 is 90 ± 10 degree with object stage 4 angulation, and spring needle 12 material is copper oxide top layer
Gold-plated, elastic force is less than 0.5n.
Said apparatus can once assemble and test the semi-finished product after multiple heat sink and die bondings, prick and survey after classification root again
Continue rear end encapsulation according to user's request, greatly increase yield rate and production efficiency.
Object stage 4 and spring needle 12 are connected with the both positive and negative polarity of comprehensive parameter tester respectively, by heat sink and die bonding
Chip of laser semi-finished product afterwards are fixed on object stage 4 by tabletting 5, and adjusting bracket 6 can clearly occur in display 8
Prick the image of chaining pin 12, by rotating the adjusting knob on longitudinal moving mechanism 13 and transverse moving mechanism 2, so that chip to be measured is put
Below spring needle 12, rotate adjusting screw 10, make spring needle 12 and die contact turning circuit, open comprehensive parameter tester
Record this exact wavelengths.Specific operation process is as follows:
(1) object stage 4 and spring needle 12 are connected with the both positive and negative polarity of comprehensive parameter tester respectively, by ultramicroscope 6
It is connected with display 8；
(2) rotate adjusting screw 10, adjust the height pricking chaining pin bar 9, so that spring needle 12 is in directly over object stage 4, but
Do not contact with object stage 4；
(3) adjustment support 6 so as on spring needle 12 needle point observed of ultramicroscope 7 can be clearly shown in
In the display 8 that ultramicroscope 7 is connected；
(4) multiple heat sink and after die bonding chip of laser semi-finished product are fixed on object stage 4 by tabletting 5；
(5) pass through to rotate the adjusting knob (driving leading screw to rotate) on longitudinal moving mechanism 13 and transverse moving mechanism 2, make
Mobile platform 3 all around moves, and changes the position of object stage 4 on mobile platform 3, makes chip semi-finished product to be measured be in bullet
The bundle of the needle point of spring pin 12 is surveyed on direction；
(6) rotate adjusting screw 10, so that bundle chaining pin bar 9 and spring needle 12 is moved down, spring needle 12 surveys treating on direction with pricking
Survey the contact of chip semi-finished product；
(7) open comprehensive parameter tester main switch, as desired setting electric current and voltage, record single chip to be measured half
The exact wavelengths of finished product；
(8) state keeping comprehensive parameter tester to open, repeats above step (5) and step (6), can be rapidly completed
The test of all samples on object stage 4.
Present invention could apply to semiconductor laser encapsulate early stage heat sink with chip die bond after wavelength screening, treat wavelength
Require further according to specific client after screening stepping, the wavelength of different gears carried out back segment encapsulation, actually used during heat sink
When different from the encapsulated electrode mode of tube core, can be by adjusting the mode of connection realization test with comprehensive parameter tester.
Claims (7)
1. Wavelength filtering device during a kind of individual laser package, including base, object stage, horizontal mobile mechanism, support, regulation
Bearing, bundle chaining pin bar and spring needle；It is characterized in that: horizontal mobile mechanism, regulation bearing and support are arranged on base；Prick and survey
Shank is arranged on regulation bearing, and spring needle is connected on bundle chaining pin bar；Object stage is arranged on horizontal mobile mechanism, object stage
On be provided with tabletting；Ultramicroscope is provided with support.
2. Wavelength filtering device during individual laser package according to claim 1, is characterized in that, described object stage upper
Between planar tilt, and horizontal plane, angle is 0 degree of -90 degree.
3. Wavelength filtering device during individual laser package according to claim 1, is characterized in that, described regulation bearing is
Spring module, this elastic module is to be provided with adjusting screw on a bearing, and adjusting screw is set with spring.
4. Wavelength filtering device during individual laser package according to claim 1, is characterized in that, described moves horizontally machine
Structure, including mobile platform, longitudinal moving mechanism and transverse moving mechanism, mobile platform is connected on longitudinal moving mechanism, longitudinally
Travel mechanism is arranged on transverse moving mechanism.
5. Wavelength filtering device during individual laser package according to claim 1, is characterized in that, the axle of described spring needle
With plane on object stage in vertical state, error is less than 10 degree to line.
6. Wavelength filtering device during individual laser package according to claim 1, is characterized in that, the bullet of described spring needle
Power is less than 0.5n.
7. the method that during individual laser package described in a kind of claim 1, Wavelength filtering device carries out wavelength screening, its feature
It is to comprise the following steps:
(1) object stage and spring needle are connected with the both positive and negative polarity of comprehensive parameter tester respectively, by ultramicroscope and display
Connect；
(2) pass through to adjust the height that bearing adjusts bundle chaining pin bar, so that spring needle is in directly over object stage, but do not connect with object stage
Touch；
(3) mobile support so as on electron microscope observation to the needle point of spring needle can be clearly shown in and electronic display
In the display that micro mirror is connected；
(4) by tabletting, at least one chip of laser semi-finished product is fixed on object stage；
(5) pass through horizontal mobile mechanism, the position of adjustment object stage, make chip semi-finished product to be measured be in the needle point of spring needle
Bundle survey direction on；
(6) so that bundle chaining pin bar and spring needle is moved down by adjusting bearing, make spring needle and become with the chip to be measured half pricked on survey direction
Product contact；
(7) open comprehensive parameter tester main switch, setting electric current and voltage, record the accurate ripple of single chip semi-finished product to be measured
Long；
(8) state keeping comprehensive parameter tester to open, repeats above step (5) and step (6), completes the institute on object stage
There is the test of sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610833249.XA CN106353073A (en) | 2016-09-20 | 2016-09-20 | Device and method for screening wavelengths in laser device packaging procedures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610833249.XA CN106353073A (en) | 2016-09-20 | 2016-09-20 | Device and method for screening wavelengths in laser device packaging procedures |
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| Publication Number | Publication Date |
|---|---|
| CN106353073A true CN106353073A (en) | 2017-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610833249.XA Pending CN106353073A (en) | 2016-09-20 | 2016-09-20 | Device and method for screening wavelengths in laser device packaging procedures |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839351A (en) * | 2017-11-24 | 2019-06-04 | 山东华光光电子股份有限公司 | A kind of laser plated film film layer sticks system safety testing device and method |
| CN114264450A (en) * | 2020-09-16 | 2022-04-01 | 山东华光光电子股份有限公司 | COS light spot binding device and method for semiconductor laser |
| CN114486180A (en) * | 2020-10-27 | 2022-05-13 | 山东华光光电子股份有限公司 | COS wavelength testing device and testing method for semiconductor laser |
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| EP0841552A1 (en) * | 1997-01-16 | 1998-05-13 | Hewlett-Packard Company | Optical time domain reflectometer for measurement in optical networks with currently applied traffic signals |
| EP1148668A2 (en) * | 2000-04-21 | 2001-10-24 | Nec Corporation | Method and device for selecting light source for optical communication |
| CN101515701A (en) * | 2009-04-07 | 2009-08-26 | 中国科学院长春光学精密机械与物理研究所 | Wavelength filtering device of semiconductor laser |
| CN203224350U (en) * | 2013-04-16 | 2013-10-02 | 何选民 | Fluorescent powder test system |
| CN206161280U (en) * | 2016-09-20 | 2017-05-10 | 山东华光光电子股份有限公司 | Laser packaging in -process wavelength sieving mechanism |
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2016
- 2016-09-20 CN CN201610833249.XA patent/CN106353073A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0841552A1 (en) * | 1997-01-16 | 1998-05-13 | Hewlett-Packard Company | Optical time domain reflectometer for measurement in optical networks with currently applied traffic signals |
| EP1148668A2 (en) * | 2000-04-21 | 2001-10-24 | Nec Corporation | Method and device for selecting light source for optical communication |
| CN101515701A (en) * | 2009-04-07 | 2009-08-26 | 中国科学院长春光学精密机械与物理研究所 | Wavelength filtering device of semiconductor laser |
| CN203224350U (en) * | 2013-04-16 | 2013-10-02 | 何选民 | Fluorescent powder test system |
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Non-Patent Citations (1)
| Title |
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| 田民波等: "《高密度封装基板》", 31 December 2003, 清华大学出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839351A (en) * | 2017-11-24 | 2019-06-04 | 山东华光光电子股份有限公司 | A kind of laser plated film film layer sticks system safety testing device and method |
| CN114264450A (en) * | 2020-09-16 | 2022-04-01 | 山东华光光电子股份有限公司 | COS light spot binding device and method for semiconductor laser |
| CN114486180A (en) * | 2020-10-27 | 2022-05-13 | 山东华光光电子股份有限公司 | COS wavelength testing device and testing method for semiconductor laser |
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Application publication date: 20170125 |
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