CN208188267U - A kind of flip LED chips receipts flash ranging test-run a machine - Google Patents
A kind of flip LED chips receipts flash ranging test-run a machine Download PDFInfo
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- CN208188267U CN208188267U CN201820889149.3U CN201820889149U CN208188267U CN 208188267 U CN208188267 U CN 208188267U CN 201820889149 U CN201820889149 U CN 201820889149U CN 208188267 U CN208188267 U CN 208188267U
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Abstract
The utility model provides a kind of flip LED chips receipts flash ranging test-run a machine, including test machine ontology, the test machine ontology includes control system, levelness regulating system, feed system, transport Transmission system, precision alignment system and test macro, the utility model feeding system can place multiple flip LED chips to be measured simultaneously, it transports Transmission system and precision alignment system cooperates, test macro is aligned to flip LED chips to be measured one by one, after alignment, flip LED chips to be measured are promoted and are sticked in test macro by feeding system, so that a pair of test macro bottom tests the positive and negative pin of probe contact measured flip LED chips and applies corresponding test voltage, flip LED chips to be measured are made to shine, light is received optical port and is integrated ball collection, it can be calculated upside-down mounting LE to be measured by spectrometer The optical parameter of D chip, test probe can measure the electrical parameter of flip LED chips to be measured.
Description
Technical field
The utility model relates to flip LED chips performance test apparatus technical field, in particular to a kind of flip LED chips
Receive flash ranging test-run a machine.
Background technique
With the fast development of LED technology, LED street lamp, LED flash, LED glare light electric torch, LED automobile headlamp etc. are produced
Product initially enter the life of ordinary people, but since to be limited to lesser power, current distribution not equal enough for traditional packed LED chip
R&D direction steering can be born higher-wattage and heat radiation energy by the poor reason of uniform heat dissipation performance, major LED chip enterprise
The preferable flip LED chips of power.
Flip LED chips have different degrees of improvement compared with traditional packed LED chip, light efficiency and production cost, therefore
Importance of the flip LED chips in LED technology application is also more prominent.In flip LED chips manufacturing process, optical tests are received
It is the committed step for judging chip quality quality.Since the structure of flip LED chips and traditional packed LED chip have larger area
Not, therefore receipts optical tests cannot be carried out to flip LED chips using the receipts optical test set of traditional packed LED chip, needed
Develop more efficient, the lower receipts optical test set dedicated for flip LED chips of cost.
Utility model content
(1) the technical issues of solving
To solve the above-mentioned problems, the utility model provides a kind of flip LED chips receipts flash ranging test-run a machine, and feeding system can
Multiple flip LED chips to be measured are placed simultaneously, transport Transmission system and precision alignment system cooperates, one by one by test macro
Alignment flip LED chips to be measured, after alignment, flip LED chips to be measured are promoted and stick on test macro by feeding system
On, so that the positive and negative pin of a pair of of test probe contact measured flip LED chips of test macro bottom and the corresponding survey of application
Try voltage, make flip LED chips to be measured shine, light through receive optical port be integrated ball collect, by spectrometer can be calculated to
The optical parameter of flip LED chips is surveyed, test probe can measure the electrical parameter of flip LED chips to be measured, to complete to treat
The receipts optical tests for surveying flip LED chips, can be tested in batches, and testing efficiency is high, at low cost.
(2) technical solution
A kind of flip LED chips receive flash ranging test-run a machine, including test machine ontology, the test machine ontology include control system,
Levelness regulating system, feed system, transport Transmission system, precision alignment system and test macro, the control system include
Console, the console is interior to be equipped with control module and image processing module, and the back side of the console is equipped with power supply line, described
The bottom of console connects the levelness regulating system, and the levelness regulating system includes upper bed-plate, lower bottom base and adjusting
Screw rod, the top of the upper bed-plate are connected with the bottom of the console, and the bottom inside of the upper bed-plate is equipped with internal screw thread,
It is fixedly linked at the top of one end of the adjusting screw rod and the lower bottom base, the other end of the adjusting screw rod and the upper bed-plate
The internal screw thread bolt, placed in the middle on front side of the top of the console to be equipped with feed system, the feed system includes mentioning
It rises cylinder, feeding table and chip support plate, the pedestal of the lifting cylinder and is fixed on the top of the console, the lifting cylinder
Piston rod the placed in the middle connection feeding table in end bottom, the top of the feeding table is circumferentially uniform is equipped with four it is solid
Fixed pole, the chip support plate are located at the top of the feeding table, and the top of the chip support plate is uniformly equipped with several placing grooves,
The width of the placing groove is corresponding with the width of chip to be measured, and the top of the chip support plate is circumferentially uniform to set that there are four solid
Determine hole, the position of the fixation hole is corresponding with the fixed link, and the chip support plate and the feeding table pass through the fixation
Hole is connected with the fixed link, and the transport Transmission system includes X-axis platform and Y-axis platform, and the X-axis platform is located at described
The top rear of console, the X-axis platform include X-axis guide rail and X-axis sliding shoe, the bottom of the X-axis guide rail and the control
It is connected at the top of platform processed, the X-axis guide rail is embedded with the X-axis sliding shoe, and the X-axis sliding shoe can be led along the X-axis
Rail sliding, the X-axis platform are connected by support plate with the Y-axis platform, and the Y-axis platform includes Y-axis guide rail and Y-axis
It is connected at the top of sliding shoe, one end of the support plate and the X-axis sliding shoe, the other end of the support plate and the Y
Axis rail is connected, and the Y-axis guide rail is to be arranged downward, and the Y-axis guide rail is embedded with the Y-axis sliding shoe, the Y-axis sliding
Block can be slided along the Y-axis guide rail, and the precision alignment system includes that camera, first position sensor and the second position pass
Sensor, the head-down lower front set on the Y-axis sliding shoe of camera shooting, the first position sensor are located at the X
In axis sliding shoe, the second position sensor is located in the Y-axis sliding shoe, and the bottom of the Y-axis sliding shoe is placed in the middle to be set
There is test macro, the test macro includes that test box, integrating sphere and a pair of of test probe, the test box are hollow structure,
The test box includes cabinet, and the top of the cabinet is connected with the Y axis sliding shoe, and the bottom of the cabinet is placed in the middle
Equipped with light hole, the inner sidewall of the cabinet is equipped with the link block of outwardly convex, the integrating sphere by the link block with
The inner sidewall of the cabinet is connected, and the receipts optical port of the integrating sphere faces the light hole, and the aperture of the light hole is not
Less than the bore for receiving optical port, a pair of test probe is symmetrically set to the two sides of the bottom of the cabinet, Yi Duisuo between two parties
The spacing for stating test probe is corresponding with the width of the placing groove, the camera, the first position sensor and described
Second position sensor connects the input terminal of the control module, and the output end of the control module is separately connected at described image
Module, the X-axis sliding shoe, the Y-axis sliding shoe, the lifting cylinder, the integrating sphere and the test probe are managed, it is described
Power supply line connects external power supply, and the external power supply provides operating voltage for the test machine ontology.
Further, the X-axis sliding shoe and the Y-axis sliding shoe are electronics sliding block.
Further, the first position sensor and the second position sensor select photoelectrical position sensor.
Further, the camera selects 3D depth camera.
Further, the control module selects 16 single-chip microcontroller MC95S12DJ128.
(3) beneficial effect
The utility model provides a kind of flip LED chips receipts flash ranging test-run a machine, by flip LED chips face down to be measured
Be put into the placing groove of chip support plate so that the positive and negative pin of flip LED chips to be measured be arranged upward, on chip support plate it is multiple
Placing groove can carry out receipts optical tests to flip LED chips to be measured in batches, improve testing efficiency, while chip support plate and feeding
Platform is fixedly linked by way of fixation hole and fixed link, very easily can carry out fast assembling-disassembling, time saving province to chip support plate
Power meets different size model and falls to need replacing the chip support plate of different size model flip LED chips according to test
The receipts optical tests demand of LED chip is filled, Transmission system is transported and precision alignment system cooperates, test macro is right one by one
Quasi- flip LED chips to be measured, camera acquire the location information of flip LED chips to be measured in real time, handle through image processing module
It is sent into control module later to be analyzed, first position sensor acquires the location information of X-axis sliding shoe in real time, and the second position passes
Sensor acquires the location information of Y-axis sliding shoe, the acquisition information and first position sensor of control module combination camera in real time
With the feedback signal of second position sensor, X-axis sliding shoe and Y-axis sliding shoe are controlled accordingly towards flip LED chips to be measured
Direction sliding, makes test macro be located at the surface of flip LED chips to be measured, and the piston rod of lifting cylinder is by feeding table liter at this time
Rise, make chip support plate close to test macro, a pair of of test probe of test macro bottom respectively with flip LED chips to be measured just
Negative pin is in contact and applies corresponding test voltage, so that flip LED chips to be measured is shone, the light of sending is received through light hole
Optical port is collected, and by diffusing reflection and LED flip chip to be measured is calculated by spectrometer inside integrating sphere in light
Optical parameter, test probe can measure the electrical parameter of flip LED chips to be measured, to complete to flip LED chips to be measured
Optical tests are received, automation and intelligence degree are high, and levelness regulating system can be directed to the special test wrapper of certain ground out-of-flatnesses
Border, to guarantee the accuracy and validity of test, simple in sturcture, ingenious in design, system power dissipation is low, and measuring accuracy is high, response
Speed is fast, stability and good reliability, has good practicability and scalability, reduces testing cost, can be widely used for
Other occasions of flip LED chips performance test.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of flip LED chips receipts flash ranging test-run a machine involved in the utility model.
Fig. 2 is received inside the levelness regulating system of flash ranging test-run a machine for a kind of flip LED chips involved in the utility model
Structural schematic diagram.
Fig. 3 is a kind of feeding table and chip support plate of flip LED chips receipts flash ranging test-run a machine involved in the utility model
Structural schematic diagram.
Fig. 4 shows for the X-axis platform cross-sectional structure that a kind of flip LED chips receive flash ranging test-run a machine involved in the utility model
It is intended to.
Fig. 5 is a kind of test system structure schematic diagram of flip LED chips receipts flash ranging test-run a machine involved in the utility model.
Fig. 6 shows for the test macro internal structure that a kind of flip LED chips receive flash ranging test-run a machine involved in the utility model
It is intended to.
Fig. 7 is a kind of System Working Principle figure of flip LED chips receipts flash ranging test-run a machine involved in the utility model.
Specific embodiment
Embodiment involved in the utility model is described in further details with reference to the accompanying drawing.
In conjunction with FIG. 1 to FIG. 7, a kind of flip LED chips receive flash ranging test-run a machine, including test machine ontology, test machine ontology include
Control system, levelness regulating system, feed system, transport Transmission system, precision alignment system and test macro, control system
Including console 1, control module and image processing module are equipped in console 1, the back side of console 1 is equipped with power supply line, control
The bottom of platform 1 connects levelness regulating system, and levelness regulating system includes upper bed-plate 2, lower bottom base 3 and adjusting screw rod 4, upper bottom
The top of seat 2 is connected with the bottom of console 1, and the bottom inside of upper bed-plate 2 is equipped with internal screw thread 5, one end of adjusting screw rod 4 and
The top of lower bottom base 3 is fixedly linked, the other end of adjusting screw rod 4 and 5 bolt of internal screw thread of upper bed-plate 2, the top of console 1
Front side it is placed in the middle be equipped with feed system, feed system includes lifting cylinder 6, feeding table 8 and chip support plate 10, lifting cylinder 6
Pedestal is fixed on the top of console 1, the bottom of the end of the piston rod 7 of lifting cylinder 6 connection feeding table 8 placed in the middle, feeding
The top of platform 8 is circumferentially uniform to be equipped with four fixed links 9, and chip support plate 10 is located at the top of feeding table 8, chip support plate 10
Top is uniformly equipped with several placing grooves 11, and the width of placing groove 11 is corresponding with the width of chip to be measured, chip support plate 10
Top is circumferentially uniform to set that there are four fixation holes 12, and the position of fixation hole 12 is corresponding with fixed link 9, chip support plate 10 with give
Material platform 8 is connected by fixation hole 12 with fixed link 9, and transport Transmission system includes X shaft platform and Y-axis platform, X-axis platform position
In the top rear of console 1, X-axis platform includes X-axis guide rail 13 and X-axis sliding shoe 14, the bottom of X-axis guide rail 13 and console
1 top is connected, and X-axis guide rail 13 is embedded with X-axis sliding shoe 14, and X-axis sliding shoe 14 can be slided along X-axis guide rail 13, X-axis
Platform is connected by support plate 15 with Y-axis platform, and Y-axis platform includes Y-axis guide rail 16 and Y-axis sliding shoe 17, support plate 15
One end is connected with the top of X-axis sliding shoe 14, and the other end of support plate 15 is connected with Y-axis guide rail 16, and Y axis rail 16 is
It is arranged downward, Y-axis guide rail 16 is embedded with Y-axis sliding shoe 17, and Y-axis sliding shoe 17 can be slided along Y-axis guide rail 16, precisely aligns and is
System includes camera 19, first position sensor and second position sensor, and camera 19 is directed downwardly to be set to Y-axis sliding shoe 17
Lower front, first position sensor is located in X-axis sliding shoe 14, and second position sensor is located in Y-axis sliding shoe 17, Y
The bottom of axis sliding shoe 17 it is placed in the middle be equipped with test macro, test macro includes that test box 18, integrating sphere 22 and a pair of of test are visited
Needle 24, test box 18 are hollow structure, and test box 18 includes cabinet, and the top of cabinet is connected with Y-axis sliding shoe 17, cabinet
Bottom it is placed in the middle be equipped with light hole 20, the inner sidewall of cabinet is equipped with the link block 21 of outwardly convex, and integrating sphere 22 passes through company
It connects block 21 to be connected with the inner sidewall of cabinet, the receipts optical port 23 of integrating sphere 22 faces light hole 20, and the aperture of light hole 20 is not
Less than the bore for receiving optical port 23, a pair of test probe 24 symmetrical two sides of the bottom for being set to cabinet placed in the middle, a pair of test probe 24
Spacing it is corresponding with the width of placing groove 11, camera 19, first position sensor connect control with second position sensor
The input terminal of module, the output end of control module are separately connected image processing module, X-axis sliding shoe 14, Y-axis sliding shoe 17, mention
It rises cylinder 6, integrating sphere 22 and test probe 24, power supply line and connects external power supply, external power supply provides work for test machine ontology
Voltage.
By in the placing groove 11 for being put into chip support plate 10 of flip LED chips face down to be measured, make flip LED to be measured
The positive and negative pin of chip is upward.Multiple placing grooves 11 are uniformly set simultaneously on chip support plate 10, it can be in batches to flip LED to be measured
Chip carries out receipts optical tests, improves testing efficiency, reduces testing cost.
Chip support plate 10 is fixedly linked by fixation hole 12 with fixed link 9 with feeding table 8, fixation hole 12 and fixed link 9
Connection type is installed, fast assembling-disassembling very easily can be carried out to chip support plate 10, it is time saving and energy saving, to be needed more according to test
The chip support plate for changing different size model flip LED chips meets the receipts optical tests of different size model flip LED chips
Demand.
The camera 19 of the precision alignment system bottom directed downwardly positioned at Y-axis sliding shoe 17, for acquiring placing groove in real time
11 location information, and be sent into image processing module and handled.Camera 19 selects 3D depth camera, can be comprehensive and accurate
The specific location image for acquiring each placing groove 11, improves the accuracy of alignment.First position sensor for acquiring in real time
The location information of X-axis sliding shoe 14, second position sensor for acquiring the location information of Y-axis sliding shoe 17 in real time.First
It sets sensor and second position sensor selects photoelectrical position sensor, be a kind of optoelectronic position based on lateral photo effect
Sensing detector has the characteristics that high sensitivity, high resolution, fast response time and circuit configuration are simple.Control module combines
The location information of the X-axis sliding shoe 14 of location drawing picture, first position sensor feedback that camera 19 acquires and the second position
The location information of the Y-axis sliding shoe 17 of sensor feedback, and responded, X-axis sliding shoe 14 and Y-axis sliding shoe 17 are controlled respectively
It is slided respectively towards 11 direction of placing groove of flip LED chips to be measured, X-axis sliding shoe 14 and Y-axis sliding shoe are electronics sliding block.
X-axis sliding shoe 14 and the cooperation sliding of Y-axis sliding shoe 17, finally make test macro be located at the surface of feed system.In view of control
Processing procedure sequence simplifies as far as possible, since multiple placing grooves 11 on chip support plate 10 are uniformly arranged, once Y-axis sliding shoe 17
Be accurately positioned after one of placing groove 11, state can be remained stationary, only by X-axis sliding shoe 14 position it is next it is to be measured fall
Fill the placing groove 11 of LED chip, so that it may which realization is one by one accurately positioned placing groove 11, improves testing efficiency, drops
Low system power dissipation.
After test macro is directed at one of placing groove 11, the lifting cylinder 6 of feed system works, lifting cylinder 6
Driving piston rod 7 rises feeding table 8, so that chip support plate 10 is close to test macro.Due to placing groove 11 width with it is to be measured
Of same size, and the spacing and placing groove between a pair of of test probe 24 of 18 two sides of the bottom of test box of flip LED chips
11 it is of same size, i.e., when chip support plate 10 againsts test macro, a pair of test probe 24 just with flip LED core to be measured
The positive and negative pin of piece is in contact.Control module applies corresponding test voltage at test probe 24 at this time, makes flip LED to be measured
The light of chip light emitting, sending enters in test box 18 through light hole 20.The aperture of light hole 20 is not less than the receipts of integrating sphere 22
The bore of optical port 23 enables light adequately to be entered by light hole 20 and receives optical port 23, ensure that the accuracy and test of test
Efficiency.The light for receiving 23 pairs of optical port sendings is collected, and light by diffusing reflection and passes through spectrum instrument meter inside integrating sphere 22
Calculation obtains the optical parameter of LED flip chip to be measured.Meanwhile test probe 24 can measure the electricity ginseng of flip LED chips to be measured
Number, to complete the receipts optical tests to flip LED chips to be measured, automation and intelligence degree are high.Complete one of place
After the receipts optical tests of flip LED chips to be measured in slot 11, lifting cylinder 6 resets, and is directed at next placement in test macro
11 lifting cylinder 6 of slot again rises feeding table 8.
Control module respectively to the input signal of camera 19, first position sensor and second position sensor at
Reason, output control signal control image processing module, X-axis sliding shoe 14, Y-axis sliding shoe 17, lifting cylinder 6, integrating sphere respectively
22 work with test probe 24.In order to simplify circuit, cost is reduced, the scalability in system later period, control module are improved
The EEPROM of the RAM and 2KB of 16 single-chip microcontrollers MC95S12DJ128, Flash, 8KB of built-in 128KB are selected, has 5V defeated
Enter and driving capability, CPU working frequency can reach 50MHz.The independent number I/O interface in 29 tunnels, 20 road bands interrupt and wake up function
The digital I/O interface of energy, 10 A/D converters in 28 channels, input capture/output with 8 channels are compared, and also have 8
A programmable channel PWM.With 2 serial asynchronous communication interface SCI, 2 synchronous serial Peripheral Interface SPI, I2C buses and
CAN functional module etc., meets design requirement.
It is possible that the special test environment of ground out-of-flatness can be encountered, the accuracy and validity of test will affect, at this time
It can be by the levelness regulating system of adjusting 1 bottom of console, by adjusting the length of 4 precession upper bed-plate of adjusting screw rod, 2 internal screw thread 5
Degree makes console 1 keep horizontality, to ensure that the accuracy and validity of test.
The utility model provides a kind of flip LED chips receipts flash ranging test-run a machine, by flip LED chips face down to be measured
Be put into the placing groove of chip support plate so that the positive and negative pin of flip LED chips to be measured be arranged upward, on chip support plate it is multiple
Placing groove can carry out receipts optical tests to flip LED chips to be measured in batches, improve testing efficiency, while chip support plate and feeding
Platform is fixedly linked by way of fixation hole and fixed link, very easily can carry out fast assembling-disassembling, time saving province to chip support plate
Power meets different size model and falls to need replacing the chip support plate of different size model flip LED chips according to test
The receipts optical tests demand of LED chip is filled, Transmission system is transported and precision alignment system cooperates, test macro is right one by one
Quasi- flip LED chips to be measured, camera acquire the location information of flip LED chips to be measured in real time, handle through image processing module
It is sent into control module later to be analyzed, first position sensor acquires the location information of X-axis sliding shoe in real time, and the second position passes
Sensor acquires the location information of Y-axis sliding shoe, the acquisition information and first position sensor of control module combination camera in real time
With the feedback signal of second position sensor, X-axis sliding shoe and Y-axis sliding shoe are controlled accordingly towards flip LED chips to be measured
Direction sliding, makes test macro be located at the surface of flip LED chips to be measured, and the piston rod of lifting cylinder is by feeding table liter at this time
Rise, make chip support plate close to test macro, a pair of of test probe of test macro bottom respectively with flip LED chips to be measured just
Negative pin is in contact and applies corresponding test voltage, so that flip LED chips to be measured is shone, the light of sending is received through light hole
Optical port is collected, and by diffusing reflection and LED flip chip to be measured is calculated by spectrometer inside integrating sphere in light
Optical parameter, test probe can measure the electrical parameter of flip LED chips to be measured, to complete to flip LED chips to be measured
Optical tests are received, automation and intelligence degree are high, and levelness regulating system can be directed to the special test wrapper of certain ground out-of-flatnesses
Border, to guarantee the accuracy and validity of test, simple in sturcture, ingenious in design, system power dissipation is low, and measuring accuracy is high, response
Speed is fast, stability and good reliability, has good practicability and scalability, reduces testing cost, can be widely used for
Other occasions of flip LED chips performance test.
Embodiment described above is only that preferred embodiments of the present invention are described, not practical to this
Novel conception and scope is defined.Without departing from the design concept of the present utility model, ordinary people in the field couple
The all variations and modifications that the technical solution of the utility model is made, should fall within the protection scope of the present utility model, this reality
With novel claimed technology contents, it is all described in the claims.
Claims (5)
1. a kind of flip LED chips receive flash ranging test-run a machine, including test machine ontology, it is characterised in that: the test machine ontology includes
Control system, levelness regulating system, feed system, transport Transmission system, precision alignment system and test macro, the control
System includes console, and control module and image processing module are equipped in the console, and the back side of the console is equipped with electricity
Source line, the bottom of the console connect the levelness regulating system, and the levelness regulating system includes upper bed-plate, bottom
Seat and adjusting screw rod, the top of the upper bed-plate are connected with the bottom of the console, and the bottom inside of the upper bed-plate is set
Have internal screw thread, be fixedly linked at the top of one end of the adjusting screw rod and the lower bottom base, the other end of the adjusting screw rod with
The internal screw thread bolt of the upper bed-plate, it is placed in the middle on front side of the top of the console to be equipped with feed system, the feeding
System includes lifting cylinder, feeding table and chip support plate, and the pedestal of the lifting cylinder is fixed on the top of the console, institute
The end of the piston rod of the lifting cylinder bottom for connecting the feeding table placed in the middle is stated, the top of the feeding table is circumferentially uniform
Equipped with four fixed links, the chip support plate is located at the top of the feeding table, and the top of the chip support plate is uniformly equipped with
Several placing grooves, the width of the placing groove is corresponding with the width of chip to be measured, and the top of the chip support plate is circumferentially uniform
Set there are four fixation hole, the position of the fixation hole is corresponding with the fixed link, the chip support plate and the feeding table
It is connected by the fixation hole with the fixed link, the transport Transmission system includes X-axis platform and Y-axis platform, the X-axis
Platform is located at the top rear of the console, and the X-axis platform includes X-axis guide rail and X-axis sliding shoe, the X-axis guide rail
It is connected at the top of bottom and the console, the X-axis guide rail is embedded with the X-axis sliding shoe, and the X-axis sliding shoe can edge
X-axis guide rail sliding, the X-axis platform be connected by support plate with the Y-axis platform, the Y-axis platform includes Y-axis
Be connected at the top of guide rail and Y-axis sliding shoe, one end of the support plate and the X-axis sliding shoe, the support plate it is another
End is connected with the Y-axis guide rail, and the Y-axis guide rail is to be arranged downward, and the Y-axis guide rail is embedded with the Y-axis sliding shoe, institute
Stating Y-axis sliding shoe can slide along the Y-axis guide rail, the precision alignment system include camera, first position sensor and
Second position sensor, the head-down lower front set on the Y-axis sliding shoe of camera shooting, the first position sensor
In the X-axis sliding shoe, the second position sensor is located in the Y-axis sliding shoe, the bottom of the Y-axis sliding shoe
Placed in the middle to be equipped with test macro, the test macro includes test box, integrating sphere and a pair of of test probe, during the test box is
Hollow structure, the test box include cabinet, and the top of the cabinet is connected with the Y-axis sliding shoe, the bottom of the cabinet
Placed in the middle is equipped with light hole, and the inner sidewall of the cabinet is equipped with the link block of outwardly convex, and the integrating sphere passes through the company
It connects block to be connected with the inner sidewall of the cabinet, the receipts optical port of the integrating sphere faces the light hole, the light hole
Aperture is symmetrically set to the two sides of the bottom of the cabinet not less than the bore for receiving optical port, a pair of test probe between two parties,
The spacing of a pair of test probe is corresponding with the width of the placing groove, the camera, the first position sensor
The input terminal of the control module is connected with the second position sensor, the output end of the control module is separately connected described
Image processing module, the X-axis sliding shoe, the Y-axis sliding shoe, the lifting cylinder, the integrating sphere and the test are visited
Needle, the power supply line connect external power supply, and the external power supply provides operating voltage for the test machine ontology.
2. a kind of flip LED chips according to claim 1 receive flash ranging test-run a machine, it is characterised in that: the X-axis sliding shoe and
The Y-axis sliding shoe is electronics sliding block.
3. a kind of flip LED chips according to claim 1 receive flash ranging test-run a machine, it is characterised in that: the first position passes
Sensor and the second position sensor select photoelectrical position sensor.
4. a kind of flip LED chips according to claim 1 receive flash ranging test-run a machine, it is characterised in that: the camera is selected
3D depth camera.
5. a kind of flip LED chips according to claim 1 receive flash ranging test-run a machine, it is characterised in that: the control module choosing
With 16 single-chip microcontroller MC95S12DJ128.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820889149.3U CN208188267U (en) | 2018-06-08 | 2018-06-08 | A kind of flip LED chips receipts flash ranging test-run a machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820889149.3U CN208188267U (en) | 2018-06-08 | 2018-06-08 | A kind of flip LED chips receipts flash ranging test-run a machine |
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| Publication Number | Publication Date |
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| CN208188267U true CN208188267U (en) | 2018-12-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111550480A (en) * | 2020-04-29 | 2020-08-18 | 四川大学 | Space precision pose alignment method |
| CN113262942A (en) * | 2021-05-08 | 2021-08-17 | 桂林芯飞光电子科技有限公司 | Dispensing device convenient to carry out chip package |
-
2018
- 2018-06-08 CN CN201820889149.3U patent/CN208188267U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111550480A (en) * | 2020-04-29 | 2020-08-18 | 四川大学 | Space precision pose alignment method |
| CN111550480B (en) * | 2020-04-29 | 2021-03-23 | 四川大学 | Space precision pose alignment method |
| CN113262942A (en) * | 2021-05-08 | 2021-08-17 | 桂林芯飞光电子科技有限公司 | Dispensing device convenient to carry out chip package |
| CN113262942B (en) * | 2021-05-08 | 2022-08-19 | 桂林芯飞光电子科技有限公司 | Dispensing device convenient to carry out chip package |
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