CN207132981U - A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment - Google Patents

A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment Download PDF

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Publication number
CN207132981U
CN207132981U CN201721104345.7U CN201721104345U CN207132981U CN 207132981 U CN207132981 U CN 207132981U CN 201721104345 U CN201721104345 U CN 201721104345U CN 207132981 U CN207132981 U CN 207132981U
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China
Prior art keywords
sliding platform
bar
slide
semiconductor laser
testing equipment
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CN201721104345.7U
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Chinese (zh)
Inventor
邓文祥
赵克宁
汤庆敏
肖成峰
郑兆河
徐现刚
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Shandong Huaguang Optoelectronics Co Ltd
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Shandong Huaguang Optoelectronics Co Ltd
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Abstract

A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment, including:Base, support, slide bar, slide plate, feeler, bundle chaining pin, spring, sliding platform, sliding platform drive mechanism and sliding platform longitudinal driving device.Sliding platform drive mechanism driving sliding platform moves forward and backward, until each component on bar bar is in contact with pricking chaining pin respectively, the sliding platform of sliding platform longitudinal driving device driving afterwards gradually moves upwards from lower dead point position, the driving of bar bar is pricked chaining pin and moved up, compression spring during slide plate moves up, now feeler disconnects, and illustrates now to prick the pressure that chaining pin pressure exceedes spring, the indicator lamp of feeler goes out.It can be adjusted with measuring pressure is pricked, and pressure output is stable, reducing manual operation influences, and improves to prick and surveys the advantages of result accuracy is high.And can avoid in production process, prick luminous site and cause product to be damaged, improve product qualification rate.

Description

A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment
Technical field
It the utility model is related to laser detection technique field, and in particular to a kind of semiconductor laser encapsulation process medium wave Long automatic testing equipment.
Background technology
At present in semiconductor laser application process, to its excitation wavelength and light during same laser application direction difference Spectrum signature has different requirements;In order to meet market application requirement, generally optical maser wavelength is surveyed by comprehensive parameters in industry at present Try instrument and carry out sifting sort, the method for classification has the classification of finished product wavelength, bar bar classification, the classification of epitaxial wafer wavelength after encapsulation
Chinese patent literature CN101515701B, which discloses a kind of wavelength filtering device of semiconductor laser device, to be included Pillar, seat, slip pipe, inner sliding pipe, regulation emit, nut, cantilever beam, fritillaria, swing to pipe, gauge head and scaffold tower, and pillar is fixed on seat On plate, one end of pillar is threadedly coupled with seat, and slip pipe is fixedly connected with seat, and slip pipe is screwed company with inner sliding pipe Connect, inner sliding pipe is connected with nut thread, and regulation emits to be connected with nut thread, and cantilever beam is connected with nut, inner sliding pipe contact, shellfish It is female with swing to pipe screw thread and connect, gauge head is connected with swinging to tubular elastic, and scaffold tower is screwed with seat to be connected.The present invention is beneficial Effect is:Features simple and practical process, it is easy to operate, bar bar test of the different wave length of pulse or low duty ratio can be completed, is solved The disadvantage of wavelength can be just selected after encapsulation, improves yield rate and production efficiency, meets user to wavelength and half-linear width index Requirement, effectively reduce cost.
A kind of bar bar test systems with normal temperature detection with high temperature detection twin tong of CN104101425A, including normal temperature bar Bar fixture and bar bar electrical property testing device, are additionally provided with a high temperature bar bar fixture and normal temperature bar bar fixture is arranged on same workbench On.Feeding manipulator is arranged on the side of mounting seat, and feeding manipulator is next to a bar bar automatic arrangement mechanism, reclaimer robot Installed in the opposite side of mounting seat, bar bar house platform, normal temperature bar bar fixture and high temperature bar bar folder are provided with beside reclaimer robot Have in the working region between feeding manipulator and reclaimer robot.The present invention is separated using normal temperature fixture and high-temperature clamp Set, after bar bar completes normal temperature test, a bar bar is placed on high-temperature clamp by feeding manipulator, can carry out high temperature side immediately Examination, it is time-consuming greatly to save test.
Wavelength filtering device during a kind of individual laser packages of CN 206161280U, the device, including base, objective table, Horizontal mobile mechanism, support, regulation bearing, bundle chaining pin bar and spring needle;Horizontal mobile mechanism, regulation bearing and support are respectively provided with On base;Prick chaining pin bar to be arranged on regulation bearing, spring needle, which is connected to, to be pricked on chaining pin bar;Objective table, which is arranged on, to be moved horizontally In mechanism, tabletting is provided with objective table;Electron microscope is provided with support.Objective table and spring needle are joined with comprehensive respectively The both positive and negative polarity connection of number tester, electron microscope is connected with display;Chip of laser semi-finished product are fixed on objective table On;Make a chip semi-finished product to be measured be in the bundle of the needle point of spring needle to survey on direction, spring needle connects with chip semi-finished product to be measured Touch, measure the exact wavelengths of single chip semi-finished product to be measured.The device is simple to operate, pricks and surveys accurately, and classification is accurate, solves encapsulation The problem of initial stage, wavelength screening was inaccurate.
Above-mentioned various semiconductor laser encapsulation technologies, although respectively there is advantage, pricking dynamometry degree can not accurately control, Prick and survey result and had a great influence and less efficient by artificial gimmick.
The content of the invention
The utility model is in order to overcome the shortcomings of above technology, there is provided a kind of wavelength at individual laser package initial stage screening is accurate Really, improve production efficiency and prick the semiconductor laser encapsulation process medium wavelength automatic testing equipment for surveying result accuracy.
Technical scheme is used by the utility model overcomes its technical problem:
A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment, including:
Base;
Support, it is installed on base;
Slide bar, is vertically arranged to pedestal upper end, and the slide bar upper end is coaxially arranged with screw rod, nut is combined with screw rod;
Slide plate, it is horizontally disposed with, and it is set on slide bar along longitudinal sliding motion;
Feeler, it is installed on support;
Chaining pin is pricked, is vertically arranged on slide plate;
Spring, it is set on screw rod, its upper end is in contact with nut lower surface, and its lower end connects with the upper surface of slide plate Touch, when spring is in free state, the slide plate triggers feeler;
Sliding platform, it is installed on base along longitudinal sliding motion, and bar bar is placed on the operation planar of sliding platform upper end, and It is positioned at the underface for pricking chaining pin;
Sliding platform drive mechanism, it is used to drive sliding platform opposite brackets to slide back and forth;And
Sliding platform longitudinal driving device, its drive sliding platform pumped with certain amplitude, when prick chaining pin with Bar bar upper surface is in contact and sliding platform longitudinal driving device driving sliding platform position during slide plate triggering feeler In lower dead point position.
Above-mentioned sliding platform drive mechanism include be horizontally installed on base motor I, be installed on the output shaft of motor I Leading screw, some slide rails I being horizontally installed on base, it is slidably installed with respect to base by slide rail I and is connected with lead screw transmission Slide and the slide rail II being vertically arranged on slide, the sliding platform are slidably mounted on slide rail II.
Above-mentioned sliding platform longitudinal driving device includes the motor II being installed on slide, is installed on the output shaft of motor II Cam and be arranged at sliding platform lower end and the projection that is contacted with cam slide.
Further, above-mentioned motor II is stepper motor.
In order to carry out limited block that is spacing, in addition to being arranged on slide to sliding platform, when sliding platform is positioned at lower dead During point, it is in contact with limited block.
In order that sliding platform Rapid reset, in addition to extension spring, the extension spring upper end are connected with sliding platform, its lower end It is connected with slide.
For the ease of workpiece is positioned, in addition to the cylinder that is installed on sliding platform and it is slidably installed in the horizontal direction In the push pedal on sliding platform, the push pedal is connected with the piston rod of cylinder, and when the piston rod of cylinder all stretches out, push pedal will Bar bar is pushed to positioned at the underface for pricking chaining pin.
In order to improve the reasonable stress of support, above-mentioned support is in the " cantilever structure of " " shape.
In order to which fixed bar bar is firm, some vacuum absorption holes are provided with aforesaid operations plane
The beneficial effects of the utility model are:When needing to be tested, a bar bar is placed on operation planar, and makes a bar bar Positioned at the underface for pricking chaining pin, by rotating nuts so as to adjust the decrement of spring, chaining pin pair is pricked so as to be able to adjustment The bundle measuring pressure of bar bar.Sliding platform drive mechanism driving sliding platform moves along the longitudinal direction, therefore can pass through horizontal fortune It is dynamic the spaced apart each components of Ba Tiaoshang is in contact respectively with pricking chaining pin, it is allowed to be detected successively, sliding platform is indulged Gradually moved upwards from lower dead point position to drive device driving sliding platform, a bar bar driving is pricked chaining pin and moved up, and is moved past on slide plate Compression spring in journey, now sensing contact disconnection, illustrate now to prick the pressure that chaining pin pressure exceedes spring, feeler Indicator lamp go out.It can be adjusted with measuring pressure is pricked, and pressure output is stable, reducing manual operation influences, and improves to prick and surveys result The advantages of accuracy is high.And can avoid in production process, prick luminous site and cause product to be damaged, it is qualified to improve product Rate..
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the side elevational cross-section structural representation at slide position of the present utility model;
In figure, the spring 9. of 1. base, 2. support, 3. slide bar, 4. feeler, 5. slide plate, 6. screw rod, 7. nut 8. The slide rail II 17. of 15. cam of chaining pin 10. motor, I 11. leading screw, 12. slide rail, I 13. slide, 14. stepper motor 16. is pricked to slide Platform 18. limited block, 19. projection, 20. cylinder, 21. push pedal, 22. operation planar, 23. bars of extension springs of bar 24..
Embodiment
1 pair of the utility model is described further below in conjunction with the accompanying drawings.
A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment, including:Base 1;Support 2, is installed on bottom On seat 1;
Slide bar 3, is vertically arranged to the upper end of support 2, and the upper end of slide bar 3 is coaxially arranged with screw rod 6, nut is combined with screw rod 6 7;Slide plate 5, it is horizontally disposed with, and it is set on slide bar 3 along longitudinal sliding motion;Feeler 4, it is installed on support 2;Prick chaining pin 9, it is vertically arranged on slide plate 5;Spring 8, it is set on screw rod 6, its upper end is in contact with the lower surface of nut 7, its lower end and cunning The upper surface of plate 5 is in contact, and when spring 8 is in free state, slide plate 5 triggers feeler 4;Sliding platform 17, its edge Longitudinal sliding motion is installed on base 1, and bar bar 23 is placed on the operation planar 22 of the upper end of sliding platform 17, and it is located at bundle chaining pin 9 Underface;Sliding platform drive mechanism, it is used to drive the opposite brackets 2 of sliding platform 17 to slide back and forth;And sliding platform Longitudinal driving device, it drives sliding platform 17 to be pumped with certain amplitude, when bundle chaining pin 9 and the upper surface phase of bar bar 23 Sliding platform longitudinal driving device driving sliding platform 17 is located at lower dead point position when contact and the triggering feeler 4 of slide plate 5. When needing to be tested, bar bar 23 is placed on operation planar 22, and bar bar 23 is passed through positioned at the underface for pricking chaining pin 9 Rotating nuts 7 prick bundle measuring pressure of the chaining pin 9 to bar bar 23 so as to adjust the decrement of spring 8, so as to be able to adjustment.Slide Stage driving driving sliding platform 17 moves along the longitudinal direction, therefore can make to be spaced cloth on bar bar 23 by transverse movement The each component put is in contact with pricking chaining pin 9 respectively, is allowed to be detected successively, and the driving of sliding platform longitudinal driving device is slided Moving platform 17 gradually moves upwards from lower dead point position, and the driving of bar bar 23 is pricked chaining pin 9 and moved up, and slide plate 5 compresses bullet during moving up Spring 8, now feeler 4 disconnect, illustrate now to prick the pressure that chaining pin 9 pressure exceedes spring 8, feeler 4 Indicator lamp goes out.It can be adjusted with measuring pressure is pricked, and pressure output is stable, reduction manual operation influences, and improves to prick and surveys result standard The advantages of really property is high.And can avoid in production process, prick luminous site and cause product to be damaged, improve product qualification rate.
Embodiment 1:
Sliding platform drive mechanism can be following structure, and it includes motor I 10, the installation being horizontally installed on base 1 In the leading screw 11 on the output shaft of motor I 10, some slide rails I 12 being horizontally installed on base 1, pass through the relative bottom of slide rail I 12 Seat 1 is slidably installed and the slide 13 being connected with leading screw 11 and the slide rail II 16 being vertically arranged on slide 13, The sliding platform 17 is slidably mounted on slide rail II 16.When needing to drive the movement of the fore-and-aft direction of sliding platform 17, electricity Machine I 10 rotates, and it drives leading screw 11 to rotate, so as to drive slide 13 to be moved forward and backward along base 1.
Embodiment 2:
Sliding platform longitudinal driving device is following structure, and it includes the motor II being installed on slide 13, is installed on electricity Cam 15 on the output shaft of machine II and be arranged at the lower end of sliding platform 17 and with the projection 19 of the sliding contact of cam 15.When bar When bar 23 contacts with pricking chaining pin 9, the driving cam 15 of motor II is rotated, and projection 19 is gradually passed through in the rotary course of cam 15 and promotes cunning Moving platform 17 passes through the upward sliding of slide rail II 16, now bar bar 23 on operation planar 22 promote prick chaining pin 9 drive slide plate 5 to Upper motion and compression spring 8.When sliding platform 17 moves up to upper dead center position, cam 15 continues to rotate, and now slides Platform 17 is begun to decline, until it drops to lower dead point position, in order to test use next time.
Embodiment 3:
The motor II that driving cam 15 rotates is stepper motor 14.By stepper motor 14 angular displacement of the cam can be made defeated Go out stabilization, make the raising height of sliding platform 17 more accurate.
Embodiment 4:
Further, in addition to the limited block 18 that is arranged on slide 13, when sliding platform 17 is located at bottom dead centre, its with Limited block 18 is in contact.It is descending by setting limited block 18 that sliding platform 17 can be made to stop when reaching lower dead point position, carry The high limitation to its movement locus.
Embodiment 5:
Preferably, in addition to extension spring 24, the upper end of extension spring 24 are connected with sliding platform 17, and its lower end is connected with slide 13 Connect.When sliding platform 17 moves upwards with respect to slide 13, extension spring 24 is stretched, therefore when sliding platform 17 reaches after top dead center When needing descending, under the elastic force effect of spring 24, it can pull sliding platform 17 descending rapidly, improve efficiency.
Embodiment:6:
Further, in addition to the cylinder 20 that is installed on sliding platform 17 and slip is slidably mounted in the horizontal direction Push pedal 21 on platform 17, push pedal 21 are connected with the piston rod of cylinder 20, when the piston rod of cylinder 20 all stretches out, push pedal 21 Bar bar 23 is pushed to positioned at the underface for pricking chaining pin 9.During operation, bar bar 23 can be placed into operation planar 22 by staff Optional position, exhaust hood 20 piston rod it is protruding, it is moved by push pedal 21, and bar bar 23 is pushed to finger by push pedal 21 Positioning is put, and makes bar bar 23 positioned at the underface of bundle chaining pin 9, therefore improve the convenience of operation.
Embodiment 7:
Preferably, support 2 is in the " cantilever structure of " " shape.Support 2 is in " " " shape structure not only light weight, while its stress Stability is good, reduces manufacturing cost.
Embodiment 8:
Some vacuum absorption holes can be provided with aforesaid operations plane 22, vacuum area can firmly adsorb bar bar 23 It is fixed on operation planar 22, so as to prevent test process mini-bus bar 23 to be moved.

Claims (9)

  1. A kind of 1. semiconductor laser encapsulation process medium wavelength automatic testing equipment, it is characterised in that including:
    Base(1);
    Support(2), it is installed on base(1)On;
    Slide bar(3), it is vertically arranged to support(2)Upper end, the slide bar(3)Upper end is coaxially arranged with screw rod(6), screw rod(6)On It is combined with nut(7);
    Slide plate(5), it is horizontally disposed with, and it is set in slide bar along longitudinal sliding motion(3)On;
    Feeler(4), it is installed on support(2)On;
    Prick chaining pin(9), it is vertically arranged to slide plate(5)On;
    Spring(8), it is set in screw rod(6)On, its upper end and nut(7)Lower surface is in contact, its lower end and slide plate(5)Upper end Face is in contact, and works as spring(8)During in free state, the slide plate(5)Trigger feeler(4);
    Sliding platform(17), it is installed on base along longitudinal sliding motion(1)On, bar bar(23)It is placed in sliding platform(17)The behaviour of upper end Make plane(22)On, and it is located at bundle chaining pin(9)Underface;
    Sliding platform drive mechanism, it is used to drive sliding platform(17)Opposite brackets(2)Slide back and forth;And
    Sliding platform longitudinal driving device, it drives sliding platform(17)Pumped with certain amplitude, when bundle chaining pin(9) With a bar bar(23)Upper surface is in contact and slide plate(5)Trigger feeler(4)Shi Suoshu sliding platforms longitudinal driving device drives Dynamic sliding platform(17)Positioned at lower dead point position.
  2. 2. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 1, it is characterised in that:Institute Stating sliding platform drive mechanism includes being horizontally installed to base(1)On motor I(10), be installed on motor I(10)On output shaft Leading screw(11), be horizontally installed to base(1)On some slide rails I(12), pass through slide rail I(12)With respect to base(1)Slide peace Dress and and leading screw(11)The slide of drive connection(13)And vertically it is arranged at slide(13)On slide rail II(16), institute State sliding platform(17)It is slidably mounted on slide rail II(16)On.
  3. 3. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 2, it is characterised in that:Institute Stating sliding platform longitudinal driving device includes being installed on slide(13)On motor II, the cam being installed on motor output shaft (15)And it is arranged at sliding platform(17)Lower end and and cam(15)The projection of sliding contact(19).
  4. 4. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 3, it is characterised in that:Institute It is stepper motor to state motor II(14).
  5. 5. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 3, it is characterised in that:Also Including being arranged at slide(13)On limited block(18), work as sliding platform(17)During positioned at bottom dead centre, itself and limited block(18)Phase Contact.
  6. 6. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 3, it is characterised in that:Also Including extension spring(24), the extension spring(24)Upper end and sliding platform(17)It is connected, its lower end and slide(13)It is connected.
  7. 7. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 1, it is characterised in that:Also Including being installed on sliding platform(17)On cylinder(20)And sliding platform is slidably mounted in the horizontal direction(17)On push away Plate(21), the push pedal(21)With cylinder(20)Piston rod be connected, work as cylinder(20)Piston rod all stretch out when, push pedal (21)By bar bar(23)Push to positioned at bundle chaining pin(9)Underface.
  8. 8. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 1, it is characterised in that:Institute State support(2)In " the cantilever structure of " " shape.
  9. 9. semiconductor laser encapsulation process medium wavelength automatic testing equipment according to claim 1, it is characterised in that:Institute State operation planar(22)On be provided with some vacuum absorption holes.
CN201721104345.7U 2017-08-31 2017-08-31 A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment Active CN207132981U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721104345.7U CN207132981U (en) 2017-08-31 2017-08-31 A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721104345.7U CN207132981U (en) 2017-08-31 2017-08-31 A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment

Publications (1)

Publication Number Publication Date
CN207132981U true CN207132981U (en) 2018-03-23

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CN201721104345.7U Active CN207132981U (en) 2017-08-31 2017-08-31 A kind of semiconductor laser encapsulation process medium wavelength automatic testing equipment

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110850528A (en) * 2018-08-20 2020-02-28 山东华光光电子股份有限公司 Coupling optical fiber manufacturing method and assembly fixture
CN114486180A (en) * 2020-10-27 2022-05-13 山东华光光电子股份有限公司 COS wavelength testing device and testing method for semiconductor laser

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110850528A (en) * 2018-08-20 2020-02-28 山东华光光电子股份有限公司 Coupling optical fiber manufacturing method and assembly fixture
CN114486180A (en) * 2020-10-27 2022-05-13 山东华光光电子股份有限公司 COS wavelength testing device and testing method for semiconductor laser

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