CN106341946A - 柔性印刷电路及其制造方法、聚光光伏模块及面板 - Google Patents
柔性印刷电路及其制造方法、聚光光伏模块及面板 Download PDFInfo
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Abstract
提供一种柔性印刷电路及其制造方法、聚光光伏模块及面板,增加柔性印刷电路的可制造性。根据本发明的用于聚光光伏的柔性印刷电路(12)包括:导电层(127),发电元件(121)被连接到该导电层;绝缘层(126),其具有绝缘性质;以及加强层(124),用于加强所述绝缘层(126),并且导电层、绝缘层以及加强层被按照此顺序接合在一起。在柔性印刷电路(12)中,加强层(124)由与导电层(127)相同的材料形成。
Description
技术领域
本发明涉及一种柔性印刷电路、聚光光伏模块以及聚光光伏面板,其在聚光光伏(CPV)中被用于通过使日光集中到发电元件来发电,并且还涉及一种用于制造柔性印刷电路的方法。
背景技术
到目前为止,已知被配置成借助于水平地且垂直地布置许多聚光光伏模块的聚光光伏面板(例如参见专利文献1)来获得期望的发电的聚光光伏装置。
在根据专利文献1的发电装置中使用的发电模块在器皿形壳体中包括具有发电元件的柔性印刷电路,并且通过借助于在壳体的上表面侧提供的聚光透镜来使日光集中到发电元件而在发电元件处发电。
引用列表
[专利文献]
专利文献1:日本公开专利公开号2013-80760
发明内容
[技术问题]
根据专利文献1的柔性印刷电路包括:由铜制成的导电层,其被连接到发电元件;以及绝缘层,其使导电层与壳体侧面绝缘,并且具有一定的柔性从而能够被以与壳体紧密接触的方式安装到壳体。为了易于其在制造期间的处置,在绝缘层的后表面侧提供用于对柔性印刷电路给予一定刚性的加强板。此加强板由具有散热性质以便将来自发电元件和导电层的热释放到壳体侧的铝材料形成。
然而,由铝材料形成的加强板必须是厚的,以便确保充分的散热性质,这使得难以减小柔性印刷电路的重量等。
另外,由铜制成的导电层和由铝制成的加强板具有相互不同的热膨胀系数。因此,由于通过热压等将这些接合时的热膨胀的差异,很可能发生其尺寸的变化。然后,当从通过将导电层、绝缘层以及加强板接合而获得的中间材料切掉具有期望形状的柔性印刷电路时,必须将用于分别地由不同材料形成的导电层和加强板两者的切割条件考虑在内。因此,在实际操作中,采用一种制造方法,其中,分别地将导电层、绝缘层以及加强板单独地切割成期望的形状,并且然后接合在一起。在这种情况下,增加了制造所需的步骤的数目,并且接合时的对准是困难的。
此外,在加强板的刚性低的情况下,在切割之后通过热压等来接合是困难的。因此,不但就如上所述的散热性质而言,而且就制造而言,必须将加强板形成为厚的以增加其刚性。
本发明的目的是解决就如上所述的制造而言的问题等,以增加可制造性。
[问题的解决方案]
根据本发明的柔性印刷电路包括:
导电层,发电元件被连接到该导电层;绝缘层,其具有绝缘性质;以及加强层,其用于加强绝缘层,导电层、绝缘层以及加强层被依次接合在一起,其中
加强层由与导电层相同的材料形成。
根据本发明的聚光光伏模块包括:
壳体,其具有安装表面;
上述柔性印刷电路被接合到该安装表面;以及
透镜元件,其被安装到壳体,以便对应于发电元件,该透镜元件被配置成使日光聚光在发电元件上。
根据本发明的聚光光伏面板是通过将多个上述聚光光伏模块组合而形成的。
根据本发明的用于制造柔性印刷电路的方法包括以下步骤:
通过接合发电元件被连接到的导电层、具有绝缘性质的绝缘层以及由与导电层相同的材料形成的且用于加强绝缘层的加强层,形成用于聚光光伏模块的柔性印刷电路的中间材料;以及
将中间材料切割成期望形状。
[本发明的有利效果]
根据本发明,能够增加柔性印刷电路的可制造性。
附图说明
图1是示出了根据本发明的一个实施例的聚光光伏装置的透视图。
图2是聚光光伏模块的放大图的透视图(被部分切掉)。
图3是图2中所示的部分III的放大图。
图4是在提供发电元件的部分处的聚光光伏模块的部分横截面的示意图。
图5图示出根据本实施例的和根据现有技术的柔性印刷电路的横截面之间的比较。
具体实施方式
[实施例的概述]
本发明的实施例的概述包括至少以下内容。
(1)根据实施例的柔性印刷电路是用于聚光光伏模块的柔性印刷电路,所述柔性印刷电路包括:
导电层,发电元件被连接到该导电层;绝缘层,其具有绝缘性质;以及加强层,其用于加强绝缘层,导电层、绝缘层以及加强层被按照此顺序接合在一起,其中
加强层由与导电层相同的材料形成。
用此配置,加强层和导电层的热膨胀系数彼此相同。因此,即使通过热压等将包括这些层的层接合在一起,也不太可能发生尺寸的变化。另外,由于可以在同一条件下加工该加强层和导电层,所以可以将包括这些层的层在接合在一起的状态下容易地加工成期望的形状。应注意的是根据本实施例的柔性印刷电路不排除导电层与绝缘层之间和绝缘层与加强层之间的另一层的存在。例如,可在导电层与绝缘层之间和绝缘层与加强层之间提供粘合层。
(2)导电层和加强层可由铜制成。
在加强层由铜制成的情况下,其热传导率高于由铝制成的常规加强层。因此,可以在确保散热性质的情况下形成薄的加强层。因此,可以减小柔性印刷电路的重量。
(3)优选地,被接合到绝缘层的加强层的一个表面已经受黑化处理。
因此,可以增加加强层与绝缘层之间的接合强度。
(4)优选地,加强层的厚度被设定在从30至140μm范围内。
这是因为:如果加强层的厚度小于此范围,则散热性质和加强的效果降低;以及如果加强层的厚度大于此范围,则重量减小、柔性以及成本降低的效果降低。
(5)可以以避开发电元件的方式提供保护层,该保护层覆盖发电元件被连接到的导电层的表面。
用此配置,用保护层来保护导电层,并且因此增加其耐久性,并且另外可以防止漏电的发生。
(6)可在与绝缘层被接合到的加强层的表面相反的加强层的表面上提供用于将加强层接合到聚光光伏模块的壳体的粘合层。
用此配置,可以快速地且容易地执行将柔性印刷电路结合并安装到聚光光伏模块的壳体的工作。
(7)根据实施例的聚光光伏模块包括:
壳体,其具有安装表面;将被接合到安装表面的根据上述(1)至(6)中的任一项的柔性印刷电路;以及透镜元件,其被安装到壳体,从而对应于柔性印刷电路的发电元件,该透镜元件被配置成使日光聚光在发电元件上。
用此配置,可以提供具有良好可制造性的聚光光伏模块。
(8)通过组装根据上述(7)的多个聚光光伏模块来形成根据实施例的聚光光伏面板。
用此配置,可以提供具有良好可制造性的聚光光伏面板。
(9)根据实施例的用于制造柔性印刷电路的方法包括以下步骤:
通过接合发电元件被连接到的导电层、具有绝缘性质的绝缘层以及由与导电层相同的材料形成的且用于加强绝缘层的加强层,形成用于聚光光伏模块的柔性印刷电路的中间材料;以及
将中间材料切割成期望形状。
用此配置,由于导电层和加强层由相同材料制成,所以可以将包括这些层的层在接合在一起的状态下容易地切割成期望的形状。因此,可以减少制造步骤的数目,并且可以降低制造成本。由于被预先结合在一起的包括导电层和加强层的层被切割成期望的形状,所以可以降低切割期间的加强层所需的刚性。因此,可以将该加强层制造成薄的。
[实施例的细节]
图1是示出了根据本发明的一个实施例的聚光光伏装置的透视图。
在图1中,聚光光伏装置100包括:聚光光伏面板1;支柱2,其在聚光光伏面板1的后表面上的中心处支撑聚光光伏面板1;以及底座3,支柱2被安装在其上面。
通过垂直地且水平地组装不包括例如用于连接到支柱2的中心部分的62(长度上的7个×宽度上的9个-1)个聚光光伏模块1M而形成聚光光伏面板1。
一个聚光光伏模块1M具有例如约120W的额定输出,并且然后,整个聚光光伏面板1具有约7.5kW的额定输出。
光伏面板1可以通过未示出的旋转机构在方位和高度的两个方向上旋转,利用支柱2作为轴。可以促使聚光光伏面板1在始终面对太阳方向的同时追踪太阳。
图2是示出了聚光光伏模块(在下文中,也简称为模块)1M的放大图的透视图(被部分切掉)。
作为主要部件,模块1M包括:采取具有底板11a的器皿形状(大桶形状)的壳体11;与底板11a的上表面(安装表面)接触地提供的柔性印刷电路12;以及被以使壳体11的打开部分关闭的方式安装到凸缘部分11b的主要聚光部分13。壳体11由金属制成,并且优选地由铝制成。由于由金属制成,壳体11具有良好的热传导率。因此,从柔性印刷电路12到壳体11的散热尤其是良好的。相对于模块1M的尺寸,长度宽度以及深度可以分别地是例如840mm、640mm、85mm。
主要聚光部分13是菲涅耳透镜阵列,并且通过以矩阵形状布置用作使日光聚光的透镜元件的多个(例如,长度上的16个×宽度上的12个,总共192个)菲涅耳透镜13f而形成。可以通过例如在被用作基础材料的玻璃板的后表面(内侧)上形成硅酮树脂而获得主要聚光部分13。每个菲涅耳透镜13f在此树脂膜上形成。在壳体11的外表面上,提供了用于从模块1M取出输出的连接器14。
图3是图2中所示的部分III的放大图。在图3中,柔性印刷电路12包括:具有条带形状的柔性基板12f;在其上表面上提供的发电元件(太阳能电池)121;以及被提供为覆盖发电元件121的辅助聚光部分122。在对应于主要聚光部分13的菲涅耳透镜13f的位置处提供与菲涅耳透镜13f的数目相同的发电元件121和辅助聚光部分122的组。每个辅助聚光部分122使从与其相对应的菲涅耳透镜13f入射的日光聚光到发电元件121上。辅助聚光部分122是例如透镜。在本实施例中,使用球面透镜,但是透镜可具有除球形之外的形状。替换地,作为透镜的替代,可使用在不规则地反射光的同时向下引导光的反射镜。
图4是在提供发电元件121的部分处的聚光光伏模块1M的部分横截面的示意图。
柔性基板12f在粘合层等被视为其一部分时从底部开始依次包括:粘合层123;加强板(加强层)124;粘合层125;绝缘基础材料(绝缘层)126;图案(导电层)127;以及覆盖膜(coverlay)(保护层)128。通过集成形成柔性基板12f、发电元件121以及辅助聚光部分122的层而形成柔性印刷电路12。应注意的是图4中所示的各层123至128的厚度基本上与其实际厚度成比例。
发电元件121具有作为输出端子的引线框架121a,并且引线框架121a被电连接到图案127的预定部分。图4中的参考标号122a表示在发电元件121上支撑辅助聚光部分122的支撑主体。
图案127由例如铜箔制成,并且通过蚀刻等在绝缘基础材料126上形成。
绝缘基础材料126例如由在耐热性方面良好的聚酰亚胺制成。图案127通过绝缘基础材料126与壳体11绝缘。
最下粘合层123结合到壳体11的底板11a和加强板124。粘合层123具有导电性,从而将壳体11和加强板124保持在相同电位(接地电位)。粘合层123由例如双面胶带构成,并且在柔性印刷电路12未被安装到壳体11的状态下,被预先安装到加强板124的下表面。
另一粘合层125结合到加强板124和绝缘基础材料126。具体地,加强板124和绝缘基础材料126被通过热压经由粘合层125接合在一起。绝缘基础材料126和图案127在狭义上形成柔性基板12f。
覆盖图案127的覆盖膜128是由绝缘材料制成的层,并且在耐压方面是优良的。覆盖膜128可以例如由诸如聚酰亚胺之类的合成树脂制成。覆盖膜128被通过热焊接以与图案127紧密接触的方式接合到图案127。覆盖膜128通过将图案127覆盖来保护图案127,并且另外防止漏电的发生。
覆盖膜128的热传导率被设置成约0.2[W/m·K]。通过将覆盖膜128的热传导率设置成相当低,可以抑制日光的热的传导。从此观点出发,优选地,覆盖膜128具有基于“白色”的颜色,其具有针对日光的高反射率。
加强板124向柔性印刷电路12提供轻微的刚性达到使得柔性印刷电路12不失去柔性的程度。这使得柔性印刷电路12在发电模块1M的制造等期间易于处置。另外,通过加强板124,可以获得防止整个柔性印刷电路12的变形的效果,并且因此可以保持图案127的形状。
根据本实施例的加强板124由铜制成。因此,加强板124具有用于将来自发电元件121、图案127等的热量耗散到壳体11的底板11a的优良热传导率(散热性质)。
表1示出了用于柔性印刷电路12中的每个层的厚度的推荐值和适用范围。表1中的层的上下方向上的列出顺序对应于图4中所示的层的上下方向的堆叠顺序。
[表1]
根据本实施例的加强板124由铜制成,并且从散热性质和加强的观点出发,其期望厚度是105μm。另一方面,常规(参见例如专利文献1)柔性基板的加强板由铝制成。铝的热传导率是240W/mK,其小于400W/mK的铜的热传导率。因此,为了获得期望的散热性质,必须进一步增加厚度。
具体地,根据本实施例的由铜制成的加强板124具有105μm的厚度,而由铝制成的常规加强板具有800μm的厚度。结果,如果假设除加强板124之外的层的厚度在根据本实施例的柔性印刷电路12与常规柔性印刷电路之间是相同的,并且根据本实施例的柔性印刷电路12的厚度为常规柔性印刷电路的厚度的约1/5。图5是本实施例与现有技术之间的柔性印刷电路12的厚度的差的直观表示。在图5中,用具有“'”的参考标号来表示与根据本实施例的那些相对应的根据现有技术的层。
同时,铜的比重为约9.0,其大于约2.7的铝的比重。然而,根据本实施例的加强板124的厚度(105μm)被从由铝制成的常规加强板的厚度(800μm)大大减小。因此,根据本实施例的加强板124的重量是常规加强板的约一半。因此,在根据本实施例的加强板124中,与常规加强板中的那些相比减小了厚度和重量,由此可以降低材料的成本。
由于减小了加强板124的厚度和重量,所以可以将整体的柔性印刷电路12制造成薄的,并且可以减小其重量。这进一步使得柔性印刷电路12易于处置,并且因此可以改善制造光伏模块时的可加工性。
铝的莫氏硬度约为2.5,而铜的莫氏硬度约为3.0,其略大于铝的。然而,根据本实施例的加强板124具有比常规加强板124的较小厚度,并且因此可以充分地确保柔性印刷电路12所需的柔性。
如表1中所示,可以将加强板124的厚度设定在从30μm至140μm的范围内。这是因为:如果加强板124的厚度小于30μm,则散热性质和加强的效果降低;并且如果加强板124的厚度大于140μm,则柔性印刷电路12的重量减小、柔性以及成本降低的效果降低。在加强板124的重量减小、柔性以及成本降低很重要的情况下,更优选地是将加强板124的厚度设定在从30μm至110μm的范围内。
以以下方式获得柔性印刷电路12。也就是说,将加强板124经由粘合层125接合到具有在其上面形成的图案127的绝缘基础材料126,并且然后通过压印机等的使用将得到的构件切割(冲压)成预定形状(加长条带形状)。替换地,将加强板124接合到具有在其上面形成的图案127的绝缘基础材料126,并且然后将发电元件121和辅助聚光部分122安装在图案127上,将粘合层123安装到加强板124,并且然后将得到的构件切割成预定形状。
在本实施例中,由于图案127和加强板124两者由铜制成,所以可以在基本上相同的条件下对这些进行切割。因此,不需要单独地切割具有在其上面形成的图案127的绝缘基础材料126和加强板124,但是可以在接合在一起的状态下同时地切割。因此,当与单独地切割具有在其上面形成的图案127的绝缘基础材料126和加强板124的情况相比,可以减少制造步骤的数目。
图案127和加强板124由相同材料制成,并且其热膨胀系数也彼此相同。因此,不太可能发生当通过热压将图案127和加强板124接合在一起时引起的热膨胀的差异以及在将图案127和加强板124接合并冷却时发生的热收缩的差异所引起的尺寸变化。因此,可以增加产品的尺寸准确度,减少有缺陷产品,并可以改善产率。
此外,在单独地切割具有在其上面形成的图案127的绝缘基础材料126和加强板124且然后通过热压接合在一起的情况下,如果加强板124的刚性是低的,则其通过热压的适当接合是困难的。然而,在本实施例中,由于具有在其上面形成的图案127的绝缘基础材料126和加强板124被预先接合在一起且然后被切割,所以降低了加强板124所需的刚性,并且因此可以使得加强板124更薄。另外,在本实施例中,由于由铜制成的加强板124具有比由铝制成的常规加强板更好的可加工性,所以可以延长在切割中使用的冲模的寿命。此外,薄铜板在市场上大量地出售,可以抑制成本。
相对于加强板124,在粘合层125侧的表面已经受黑化处理,由此在表面上形成细凸块。因此,可以增加到绝缘基础材料126的粘合力,并且可以抑制气泡的产生。在本实施例中,可以将粘合力增加至约3至5倍。另外,加强板124的粘合层123侧的表面被镜面抛光。此表面经由粘合层123具有与壳体11的底板11a相同的电位就足够了且因此不需要经受黑化处理。
在上述实施例中,壳体11由金属制成,但不限于此。壳体11可由树脂制成。在这种情况下,壳体11变得在重量方面尤其轻,并且整体的聚光光伏模块1M变得在重量方面尤其轻。应注意的是树脂也具有一定的热传导率,并且因此可以获得一定的散热性质。特别地,已添加了具有高热传导率的绝缘填料(例如,氧化铝、硅石、碳化硅、氧化镁等)的树脂是适合的,因为此类树脂在热传导率方面是优良的,并且因此改善了散热性质。此外,通过对树脂的表面施加金属涂层,可以增加表面的热传导率,从而与等效于金属。
在上述实施例中,将辅助聚光部分122连同发电元件121一起安装在柔性基板12f上。然而,可以与柔性基板12f分开地提供辅助聚光部分122。此外,可以省略辅助聚光部分。
图案127和加强板124可由除铜之外的金属形成,只要其由相同材料形成即可。
表1中所示的层的推荐值和适用范围仅仅是示例。不一定局限于此,可以根据层的材料而改变此类推荐值和适用范围。特别地,相对于加强板,设定与由铝制成的常规加强板相比就散热性质、重量减小、柔性以及成本而言获得与由铝制成的常规加强板的结果基本上等价的结果或者获得在散热性质、重量减小、柔性以及成本中的至少一个方面优良的结果的厚度或范围就足够了。
应注意的是本文公开的实施例在所有方面仅仅是说明性的,并且不应被认为是限制性的。本发明的范围由权利要求的范围限定,并且意图包括等价于权利要求的范围和该范围内的所有修改的意义。
参考标号列表
1 聚光光伏面板
1M 聚光光伏模块
2 支柱
3 底座
11 壳体
11a 底板
11b 凸缘部分
12 柔性印刷电路
12f 柔性基板
13 主要聚光部分
13f 菲涅耳透镜
14 连接器
100 聚光光伏装置
121 发电元件
121a 引线框架
122 辅助聚光部分
123 粘合层
123' 粘合层
124 加强板(加强层)
124' 加强板(加强层)
125 粘合层
125' 粘合层
126 绝缘基础材料(绝缘层)
126' 绝缘基础材料(绝缘层)
127 图案(导电层)
127' 图案(导电层)
128 覆盖膜(保护层)
128' 覆盖膜(保护层)
Claims (10)
1.一种柔性印刷电路,包括:
导电层,发电元件被连接到所述导电层;
绝缘层,所述绝缘层具有绝缘性质;以及
加强层,所述加强层用于加强所述绝缘层,
所述导电层、所述绝缘层以及所述加强层被依次接合在一起,其中
所述加强层由与所述导电层的材料相同的材料形成。
2.根据权利要求1所述的柔性印刷电路,其中
所述导电层和所述加强层由铜制成。
3.根据权利要求1所述的柔性印刷电路,其中
被接合到所述绝缘层的所述加强层的一个表面已经受黑化处理。
4.根据权利要求2所述的柔性印刷电路,其中
被接合到所述绝缘层的所述加强层的一个表面已经受黑化处理。
5.根据权利要求2所述的柔性印刷电路,其中
所述加强层的厚度被设定在从30至140μm的范围内。
6.根据权利要求1至权利要求5中的任一项所述的柔性印刷电路,其中
以避开所述发电元件的方式提供保护层,所述保护层覆盖所述发电元件被连接到的所述导电层的表面。
7.根据权利要求1至权利要求5中的任一项所述的柔性印刷电路,其中
在所述加强层的下述表面上,提供用于将所述加强层接合到聚光光伏模块的壳体的粘合层,其中所述加强层的所述表面与所述加强层的所述绝缘层被接合到的表面相反。
8.一种聚光光伏模块,包括:
壳体,所述壳体具有安装表面;
根据权利要求1至权利要求5中的任一项所述的柔性印刷电路,所述柔性印刷电路被接合到所述安装表面;以及
透镜元件,所述透镜元件被安装到所述壳体,以便对应于所述柔性印刷电路的发电元件,所述透镜元件被配置成将日光聚光在所述发电元件上。
9.一种聚光光伏面板,所述聚光光伏面板通过组装多个根据权利要求8所述的聚光光伏模块来形成。
10.一种制造柔性印刷电路的方法,所述方法包括以下步骤:
通过接合导电层、绝缘层以及加强层,来形成用于聚光光伏模块的柔性印刷电路的中间材料,其中发电元件被连接到所述导电层,所述绝缘层具有绝缘性质,所述加强层由与所述导电层的材料相同的材料形成并且用于加强所述绝缘层;以及
将所述中间材料切割成期望的形状。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101472390A (zh) * | 2007-12-28 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | 补强板及包括该补强板的补强软性电路板 |
CN101789560A (zh) * | 2009-01-23 | 2010-07-28 | 索尼公司 | 半导体激光器设备 |
JP2013149831A (ja) * | 2012-01-20 | 2013-08-01 | Sumitomo Electric Ind Ltd | 集光型太陽光発電モジュール、集光型太陽光発電パネル、及び、集光型太陽光発電モジュール用フレキシブルプリント配線板 |
CN103247302A (zh) * | 2012-02-10 | 2013-08-14 | 日东电工株式会社 | 配线电路基板及其制造方法 |
KR20140075211A (ko) * | 2012-12-11 | 2014-06-19 | 엘지디스플레이 주식회사 | 에프피씨 및 이를 포함하는 디스플레이장치 |
CN104582242A (zh) * | 2014-07-04 | 2015-04-29 | 广东丹邦科技有限公司 | 一种对柔性印刷线路板起支撑加强作用的补强板 |
CN205902206U (zh) * | 2015-07-09 | 2017-01-18 | 住友电气工业株式会社 | 柔性印刷电路、聚光光伏模块及聚光光伏面板 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58111206A (ja) * | 1981-12-24 | 1983-07-02 | 住友電気工業株式会社 | 耐過負荷用絶縁電線 |
US4512818A (en) * | 1983-05-23 | 1985-04-23 | Shipley Company Inc. | Solution for formation of black oxide |
JPH0722721A (ja) * | 1993-06-29 | 1995-01-24 | Asahi Print Kogyo Kk | 金属ベース印刷配線板 |
US6803514B2 (en) * | 2001-03-23 | 2004-10-12 | Canon Kabushiki Kaisha | Mounting structure and mounting method of a photovoltaic element, mounting substrate for mounting a semiconductor element thereon and method for mounting a semiconductor element on said mounting substrate |
JP4185755B2 (ja) * | 2002-10-31 | 2008-11-26 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 配線基板及びその製造方法 |
CA2656977A1 (en) * | 2006-07-05 | 2008-01-10 | Stellaris Corporation | Apparatus and method for forming a photovoltaic device |
KR20090043633A (ko) * | 2007-10-30 | 2009-05-07 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 열전도성 점착제 및 이를 이용하는 점착테이프 |
US20090266395A1 (en) * | 2007-11-08 | 2009-10-29 | Sunrgi | Solar concentration and cooling devices, arrangements and methods |
JP5117839B2 (ja) * | 2007-12-14 | 2013-01-16 | シャープ株式会社 | 集光型太陽光発電装置 |
US20090223555A1 (en) * | 2008-03-05 | 2009-09-10 | Stalix Llc | High Efficiency Concentrating Photovoltaic Module Method and Apparatus |
US20100326492A1 (en) * | 2009-06-30 | 2010-12-30 | Solarmation, Inc. | Photovoltaic Cell Support Structure Assembly |
CN103155176A (zh) * | 2010-06-07 | 2013-06-12 | 森普留斯公司 | 具有离轴图像显示的光伏器件 |
JP5814725B2 (ja) * | 2011-10-03 | 2015-11-17 | 住友電気工業株式会社 | 集光型太陽光発電モジュール及び集光型太陽光発電パネル |
JP5841893B2 (ja) * | 2012-04-23 | 2016-01-13 | ヘンケルジャパン株式会社 | 積層シート用接着剤 |
WO2013179288A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
JP5971271B2 (ja) * | 2014-03-06 | 2016-08-17 | 住友電気工業株式会社 | フレキシブルプリント基板および太陽光発電モジュール |
-
2015
- 2015-07-09 JP JP2015137836A patent/JP6561638B2/ja active Active
-
2016
- 2016-05-19 US US15/742,344 patent/US20180198013A1/en not_active Abandoned
- 2016-05-19 AU AU2016290374A patent/AU2016290374B2/en active Active
- 2016-05-19 MA MA042898A patent/MA42898A/fr unknown
- 2016-05-19 EP EP16821103.5A patent/EP3321976B1/en active Active
- 2016-05-19 WO PCT/JP2016/064907 patent/WO2017006632A1/ja active Application Filing
- 2016-05-19 MA MA43068A patent/MA43068B1/fr unknown
- 2016-06-14 TW TW105118581A patent/TW201711538A/zh unknown
- 2016-07-06 CN CN201620707521.5U patent/CN205902206U/zh active Active
- 2016-07-06 CN CN201610529166.1A patent/CN106341946A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101472390A (zh) * | 2007-12-28 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | 补强板及包括该补强板的补强软性电路板 |
CN101789560A (zh) * | 2009-01-23 | 2010-07-28 | 索尼公司 | 半导体激光器设备 |
JP2013149831A (ja) * | 2012-01-20 | 2013-08-01 | Sumitomo Electric Ind Ltd | 集光型太陽光発電モジュール、集光型太陽光発電パネル、及び、集光型太陽光発電モジュール用フレキシブルプリント配線板 |
CN103247302A (zh) * | 2012-02-10 | 2013-08-14 | 日东电工株式会社 | 配线电路基板及其制造方法 |
KR20140075211A (ko) * | 2012-12-11 | 2014-06-19 | 엘지디스플레이 주식회사 | 에프피씨 및 이를 포함하는 디스플레이장치 |
CN104582242A (zh) * | 2014-07-04 | 2015-04-29 | 广东丹邦科技有限公司 | 一种对柔性印刷线路板起支撑加强作用的补强板 |
CN205902206U (zh) * | 2015-07-09 | 2017-01-18 | 住友电气工业株式会社 | 柔性印刷电路、聚光光伏模块及聚光光伏面板 |
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