CN106292203B - A kind of automatic focusing to Barebone and alignment methods - Google Patents
A kind of automatic focusing to Barebone and alignment methods Download PDFInfo
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- CN106292203B CN106292203B CN201510268931.4A CN201510268931A CN106292203B CN 106292203 B CN106292203 B CN 106292203B CN 201510268931 A CN201510268931 A CN 201510268931A CN 106292203 B CN106292203 B CN 106292203B
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Abstract
The present invention provide a kind of automatic focusing to Barebone and alignment methods, it successively include: light source, wavelength selection unit, illuminate microscope group, illumination adjustments unit, beam splitting unit, image-forming objective lens group, spectrophotometric unit, reference marker face and reference marker, silicon wafer and alignment mark, sports platform, spectrophotometric unit is sequentially connected imaging and adjusts unit, microscope group is imaged, detector, detector, imaging adjusts unit, illumination adjustments unit, sports platform is all connect with signal processing with control unit, illumination light irradiates reference marker and alignment mark simultaneously, system first searches for and demarcates the optimal focal plane of reference marker, then the interference envelope extreme value of the formation of interference fringes of the light reflected on reference marker and alignment mark is calculated in the position in reference marker region, can determine on alignment mark with optimal focal plane deviation value, alignment mark is moved to most Good focal plane is focused and is completed, and the present invention has the characteristics that automatic, accurate, rapidly focusing and reducing environment influences alignment accuracies.
Description
Technical field
The present invention relates to a kind of semiconductor lithography field, in particular to a kind of automatic focusing to Barebone and alignment side
Method.
Background technique
In semiconducter IC ic manufacturing process, a complete chip is usually required by multiple photolithographic exposure
It can complete.Other than first time photoetching, the photoetching of remaining level before exposure will be by the figure of the level and with front layer
The secondary figure left that exposes is accurately positioned, and just be can guarantee there is correct relative position between each layer pattern in this way, that is, is covered
Carve precision.Under normal conditions, alignment precision is the 1/3~1/5 of litho machine resolution ratio index, for 100 nanometers of litho machines
Speech, alignment precision index request are less than 35nm.When characteristic size CD requires smaller, requirement to alignment precision and thus produce
The requirement of raw alignment precision becomes more stringent, as the CD size of 90nm requires 10nm or smaller alignment precision.
The integrated of the two-dimensional surface device of multiple-level stack is for another example realized in semiconductor devices Advanced Packaging processing procedure, to silicon wafer
The double-sided alignment of pattern more stringent requirements are proposed, be aligned to known skill with the back side that the principle of machine vision carries out penetration
Art, due to needing to carry out back side alignment with the infrared mode for penetrating silicon wafer, influence of the above-mentioned technique to alignment precision is more severe.
A kind of system for using and alignment mark position being determined with reference marker is disclosed in the prior art, is aligned by detection
The extreme value of label and the interference signal of the superposition image of reference marker on the detector determines that the vertical position of alignment mark passes through meter
The relative positional relationship of alignment mark and reference marker on the detector is calculated to determine that horizontal direction is directed at position.
This technology solves using Self-referencing interferometer when determining alignment mark position that structure is complicated, resetting difficulty is high
And realize difficult problem.But detector cells obtain alignment mark and reference marker horizontal direction relative positional relationship it
Before, it is necessary to first obtain the blur-free imaging of alignment mark, interference and increasingly small chip size due to environment, so that silicon wafer
On alignment mark be difficult blur-free imaging, it is therefore necessary to invent one kind be able to solve Barebone is easy by environmental disturbances and
The optical path for the problem of searching for optimal focal plane is difficult to Barebone for the alignment mark of small size on silicon wafer.
Summary of the invention
To solve the above problems, the invention proposes a kind of optical paths with automatic focusing and reference marker to Barebone,
The optimal focal plane of alignment camera lens is searched for using the comparison effect of reference marker with enabling the system to fast accurate, meanwhile, it improves
The adaptability of situations such as to Barebone to complicated technology, temperature change.
In order to achieve the above objectives, the present invention provide a kind of automatic focusing to Barebone, successively include: light source, wavelength choosing
It selects unit, illumination microscope group, illumination adjustments unit, beam splitting unit, image-forming objective lens group, spectrophotometric unit, reference marker face and is located at ginseng
Reference marker in index face, silicon wafer and alignment mark, sports platform positioned at silicon chip surface are examined, the spectrophotometric unit is also successively
Connection imaging adjusts unit, imaging microscope group, detector, and the detector, imaging adjust unit, illumination adjustments unit, sports platform
All with signal processing and control unit circuit connection, the detector detects the alignment mark and the reference marker position
Interference information, and it is sent to the signal processing and control unit, the signal processing unit is according to the interference information to institute
Sports platform is stated to be controlled.
Preferably, the lighting source is nonmonochromatic source.
Preferably, the reference marker cross section is that both sides have bevel edge and dimpled shape is arranged in bottom surface.
Preferably, the alignment mark is cross, the side length of the reference marker is less than in alignment mark cross
Between the rectangular side length that is crossed to form.
Preferably, being arranged between the spectrophotometric unit and the reference marker face, shutter cutting is described to refer to incident light
Road.
Preferably, the input path on the silicon wafer is irradiated to, with the measurement reflected light by the silicon wafer back reflection
The angle on road is between 0 ° to 90 °.
The present invention also provides a kind of silicon slice alignment method to Barebone using above-mentioned automatic focusing, this method include with
Lower step:
Step 1: the silicon wafer is placed on sports platform；
Step 2:, moving movement platform, until occurring the alignment mark and the reference marker in visual field；
Step 3: moving movement platform, by the alignment mark moved on in visual field at the reference marker figure, until
The area of the overlapping region of the alignment mark and the reference marker is greater than 0；
Step 4: opening light source, regulation illumination adjustments unit is light illumination mode, and it is imaging pattern that regulation imaging, which adjusts unit,；
Step 5: the dry of the alignment mark and the reference marker position generated in step 2 is shown in detector
Information is related to, and is sent to the signal processing and control unit；
Step 6: the signal processing and control unit by carrying out processing regulation to the interference information described in step 5,
The distance that the optimal focal plane z of imaging is deviateed in the current vertical position of alignment mark is calculated, control sports platform is moved to described to fiducial mark
Remember the position of optimal focal plane z, at this time alignment mark blur-free imaging, automatic focusing is completed；
Step 7: the alignment mark level is removed to the position of the reference marker, the signal processing and control unit
The position of the alignment mark, the alignment mark position are determined according to the positional relationship of the alignment mark and the reference marker
Calibration is set to complete.
Preferably, the signal processing and control unit demarcate the reference on the bevel edge of the reference marker in advance
The optimal focal plane position z of label0, the optimal focal plane position z of the reference marker0The position of the as described alignment mark optimal focal plane z
It sets.
Preferably, the signal processing and control unit are closed according to the position of the alignment mark and the reference marker
When system determines the position of the alignment mark, by monitoring the position excursion amount of the reference marker come to the alignment mark
Position carries out corresponding position compensation.
Compared with prior art, the beneficial effects of the present invention are: the present invention is compared using reference marker, using polychromatic light
The alignment mark on the reference marker and the silicon wafer is irradiated simultaneously, and system first searches for and demarcates the best of the reference marker
Focal plane, then the optimal focal plane of reference marker is the optimal focal plane of alignment mark, then by the reference marker and the alignment
The interference envelope extreme value of the formation of interference fringes of the light reflected on label is calculated in the position in reference marker region, can be true
Determine alignment mark and optimal focal plane deviation value, then can be driven alignment mark mobile according to the deviation value moving movement platform
To optimal focal plane, it is achieved that system it is automatic, precisely, rapidly focusing function；When system has searched on alignment mark
Alignment mark can be removed the reference marker by the position of optimal focal plane, then determine the vertical position where alignment mark,
Since reference marker is a part for belonging to system, the position in imaging viewing field is formed by system and is fixed, therefore even if is
Reference marker when being influenced by the external world of uniting produces position excursion, can also pass through the position excursion for monitoring the reference marker
Amount does position compensation for alignment every time, to reduce influence of the environment to system alignment accuracy.In conclusion the present invention has
Have it is automatic, accurate, rapidly focus search for optimal focal plane and reduce environment on system alignment accuracy influence the characteristics of.
Detailed description of the invention
Fig. 1 is the system structure diagram of the embodiment of the present invention one；
Fig. 2 is the silicon slice alignment method figure of a pair of of embodiment of the present invention Barebone；
Fig. 3 is the schematic cross-section of reference marker in the embodiment of the present invention one；
Fig. 4 is spectral interference light path schematic diagram in the embodiment of the present invention one；
Fig. 5 is the schematic diagram that alignment mark moves on to visual field reference marker position in the embodiment of the present invention one；
Fig. 6 is the schematic diagram that alignment mark removes reference marker position in visual field in the embodiment of the present invention one；
Fig. 7 is to interfere envelope λ formation basic theory schematic diagram in the embodiment of the present invention one；
Fig. 8 is the schematic illustration for searching for optimal focal plane in the embodiment of the present invention one automatically；
Fig. 9 is reference marker optimal focal plane position view in the embodiment of the present invention one；
Figure 10 is the system structure diagram of the embodiment of the present invention two；
Figure 11 is reference marker schematic cross-section in the embodiment of the present invention three；
Figure 12 is reference marker schematic cross-section in the embodiment of the present invention four；
Figure 13 is reference marker schematic cross-section in the embodiment of the present invention five；
Figure 14 is spectral interference light path schematic diagram in the embodiment of the present invention six；
Figure 15 is spectral interference light path schematic diagram in the embodiment of the present invention seven.
In figure: 10- light source, 20- wavelength selection unit, 30- illumination microscope group, 40- illumination adjustments unit, 50- beam splitting unit,
Microscope group, 70- spectrophotometric unit, 80- silicon wafer, 801- alignment mark, 802- sports platform, 90- ginseng is imaged in 601- image-forming objective lens group, 602-
Index face, 901- reference marker are examined, 100- imaging adjusts unit, the first input path of 101-, and 102a- measures input path,
102b- measures reflected light path, and 103a- refers to input path, and 103b- refers to reflected light path, the first reflected light path of 104-, 105- the
Two reflected light paths, 110- detector, 200- signal processing and control unit；
λ-interference envelope, z- alignment mark optimal focal plane, z0Reference marker optimal focal plane.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Embodiment one
Fig. 1 is automatic focusing provided by the present invention to the structural schematic diagram of Barebone, and as shown in the figure, described is automatic
Focusing system includes at least:
Light source 10, for providing lighting source；
Wavelength selection unit 20, for filtering the optical signal with interfering wavelength or bandwidth；
Microscope group 30 is illuminated, for providing illumination light for the alignment mark 801 on 80 surface of silicon wafer；
Illumination adjustments unit 40 provides manual lighting mode and automatic illuminating mould for the label to 80 surface of silicon wafer
The switching of formula and adjusting luminous intensity and polarization state distribution etc.；
Beam splitting unit 50, for the reflected light path of the illumination path passed through and process at vertical distribution and to be divided；
Reference marker face 90, surface have reference marker 901, and the reference marker 901 is relative to the reference marker
The rectangular-ambulatory-plane structure of 90 protrusion of face, as shown in figure 3, the shape of the cross section of the reference marker 901 is isosceles trapezoid, the ginseng
Label 901 is examined for comparing with the alignment mark 801 on 80 surface of silicon wafer, for determine silicon wafer 80 object best coke
Face, the label 801 on 80 surface of silicon wafer are that any side length is greater than 901 cross of reference marker；
Illumination light is divided into the reference input path 103a and illumination silicon on illumination 90 surface of reference marker face by spectrophotometric unit 70
Two branches of measurement input path 102a on 80 surface of piece, and the reference reflected light path that will be reflected from the reference marker face 90
The measurement reflected light path 102b of 80 surface reflection of 103b and the silicon wafer gathers and output optical signal；
Image-forming objective lens group 601, as shown in figure 4, spectrophotometric unit 70 collects 80 surface of silicon wafer and the reference marker face
Optical signal is converged after 90 light reflected and is sent to image-forming objective lens group 601, and focuses output first via image-forming objective lens group 601
Reflected light path 104；
Imaging adjusts unit 100, has imaging modulation function, and the output optical signal after imaging modulation；
Microscope group 602 is imaged, the imaging is adjusted the optical signal that unit 100 is exported and is imaged and exports imaging and is believed
Number；
Detector 110, the imaging signal that the imaging modules 602 are exported forms electric signal, and electric signal is exported；
Sports platform 802 for placing wafer such as silicon wafer 80, and can move alignment by moving movement platform 802
Position of 801 labels in visual field.
Signal processing and control unit 200, with detector 110, illumination adjustments unit 40, imaging adjust unit 100 and
Sports platform 802 is connected, and the optical signal exported according to detector 110 carries out signal data analysis to adjust illumination adjustments unit
40, imaging adjusts the parameter of unit 100 and the position of sports platform 802.
The automatic focusing it is as follows to the working principle of Barebone: when the light source 10 issue light after, by the wave
After long selecting unit 20 filters out the light with interfering wavelength or bandwidth, light and defeated is received by the illumination microscope group 30
Out, by the illumination adjustments unit 40 formed the first input path 101, then by the beam splitting unit 50 reflex to it is described at
It as objective lens 601, is then passed through the spectrophotometric unit 70 and splits the light into two-way, all the way the ginseng to irradiate the reference marker face 90
Input path 103a is examined, another way is the measurement input path 102a for irradiating the silicon wafer 80；By 80 surface reflection of silicon wafer
The measurement input path 102a forms measurement reflected light path 102b, referred to as described in 90 surface reflection of reference marker face into
It penetrates optical path 103a to be formed with reference to reflected light path 103b, by the spectrophotometric unit 70 by the measurement reflected light path 102b and with reference to anti-
It penetrates optical path 103b to collect, the first reflected light path 104 is exported by the image-forming objective lens group 601, and pass through the beam splitting unit
First reflected light path 104 is transmitted the second reflected light path 105 of formation by 50, is with the straight line where the measurement reflected light path 102b
Axis, first reflected light path 104 and second reflected light path 105 and the measurement reflected light path 102b are coaxial, the survey
Axis angulation where measuring input path 102a and the measurement reflected light path 102b is 0 °；Second reflected light path
105, which adjust unit 100 by the imaging, receives, and is then transferred to the detector 110 by the imaging microscope group 602 focusing,
And by optical signal transmission to the signal processing and control unit 200, by the signal processing to control unit 200 according to corresponding
Signal make instruct and be adjusted to 802 send instructions signal of sports platform.
Preferably, light source 10 is nonmonochromatic source, such as ultraviolet source, visible light source or infrared light supply.This reality
Apply the nonmonochromatic source in example it is preferable to use two or more, i.e. secondary color light source.
The present invention also provides a kind of silicon slice alignment methods to Barebone using above-mentioned automatic focusing, as shown in Fig. 2, should
Method the following steps are included:
Step 1: silicon wafer 80 is placed on sports platform 802；
Step 2: light is irradiated to silicon wafer 80 and reference marker face 90, moving movement platform 802, so that occurring silicon in visual field
The alignment mark 801 on 80 surface of piece and the reference marker 901 in reference marker face 90；
Step 3: referring to figure 5., moving movement platform 802, so that the alignment mark 801 on 80 surface of silicon wafer moves on in visual field
901 position of reference marker in reference marker face 90, so that the figure of the two is at least partly overlapped, it is preferred that in the figure of the two
The heart is overlapped；
Step 4: please continue to refer to Fig. 2, opening light source 10, regulation illumination adjustments unit 40 is light illumination mode, regulation imaging
Adjusting unit 100 is imaging pattern；
Step 5: the alignment mark 801 generated in step 2 and 901 position of reference marker can be shown in detector 110
Interference information, and the signal processing and control unit 200 are emitted to by detector 110；
Step 6: the signal processing and control unit 200 on the alignment mark 801 in step 5 by reflecting
The interference information that both reference beams reflected on measuring beam and 901 two bevel edges of the reference marker are formed carries out processing tune
Control, concrete principle are as follows:
Fig. 7 is please referred to, for a bit on optical axis, forms the different wave length λ of light source1、λ2……λnIt is reflected from silicon wafer 80
The measuring beam of formation will form the interference fringe of different spacing from both the reference beams reflected from reference marker face 90,
The light intensity expression of interference fringe are as follows:
Wherein k=2 π/λiFor corresponding wavelength λiWave number, i=1,2,3......n, IR(k)、IOIt (k) is respectively reference light
The light intensity DC quantity of beam and measuring beam, phase change φ=(2k (L1-L2) cos θ), L1-L2For from silicon chip mark 801 and ginseng
Examine the optical path difference between label 901, L1The distance of beam splitter 70, L are arrived for silicon chip mark 8012For the best of reference marker 901
Focal plane z0To the distance of beam splitter 70, θ is the deflection for being incident on the light beam of silicon chip mark 801 and reference marker 901 for position.
The superimposed rear generation interference envelope λ of interference fringe that the different wave length of secondary color light source is formed is formed, the peak position of envelope is interfered
It is zero position for different wave length optical path difference, interferes the expression formula of envelope are as follows: I (z')=I'(1+ γ (z') cos (koz')
Wherein I' is the background light intensity for interfering envelope, and γ (z') is interference envelope function, z'=z-zoFor silicon chip mark 801
Position z relative to the optical path difference between the optimal focal plane position of reference marker 901, i.e. z' is silicon chip mark 801 relative to ginseng
Examine the optimal focal plane position z of label 9010Vertical height, silicon chip mark 801 and the relative position of reference marker 901 become
Change, interferes position of the peak value of envelope on 901 bevel edge of reference marker that will change, please refer to Fig. 8 and Fig. 9, z0Position is
The bevel edge angle [alpha] of the optimal focal plane position for the reference marker 901 demarcated, reference marker 901 is Accurate Calibration value, therefore passes through meter
Interference envelope extreme point is calculated on reference marker 901 relative to z0The distance X of position, you can get it silicon chip mark 801 relative to
The optimal focal plane position z of reference marker 9010Vertical height z', calculation formula are as follows: z'=Xtan (α)
And the optimal focal plane position z of reference marker 9010Be the optimal focal plane position of alignment mark 801, signal processing and
Alignment mark 801 is moved to optimal focal plane position z according to the z' value moving movement platform 802 of calculating by control unit 2000, until
This automatic focusing is completed.
Step 7: as shown in fig. 6, the alignment mark 801 is moved horizontally until removing the position of the reference marker 901
It sets, then please continue to refer to Fig. 2, alignment mark 801 and reference marker 901 is imaged respectively to the detector 110, by described
The image-forming information of the two is fed back the signal processing and control into the signal processing and control unit 200 by detector 110
Unit 200 determines the position of the alignment mark 801 according to the alignment mark 801 with the positional relationship of the reference marker 901
It sets, so far the location position of the alignment mark 801 is completed.
The signal processing and control unit 200 are closed according to the position of the alignment mark 801 and the reference marker 901
When system determines the position of the alignment mark 801, under the interference of environment, the position of the reference marker 901 can be regarded in alignment
Drift is generated in, the alignment mark 801 when by monitoring the position excursion amount of the reference marker 901 come each alignment
Position carry out corresponding position compensation.
Embodiment two
As shown in Figure 10, the difference between this embodiment and the first embodiment lies in using the measurement reflected light path 102b as axis, institute
It states the first reflected light path 104 and second reflected light path 105 and the measurement reflected light path 102b is coaxial, the measurement is incident
Axis angulation where the optical path 102a and measurement reflected light path 102b is this off-axis illumination side between 0 ° to 90 °
Formula can promote contrast, reduce interference.In addition shutter 902 is installed to switch in described this optical path of reference marker 901,
After first silicon wafer photoetching, it the shutter 902 that can be used will be incident to the reference input path 103a of the reference marker 901
To closing, it is described can be according to the automatic search optimal focal plane position z of aligned data record of first silicon wafer to Barebone, while can be with
When subsequent mask mould being avoided to be aligned with silicon wafer, interference of the reference marker 901 in visual field.
Embodiment three
As shown in figure 11, the present embodiment and the difference of embodiment one, embodiment two are the transversal of the reference marker 901
Face is the isosceles trapezoid of relatively described 90 protrusion of reference marker face.
Example IV
As shown in figure 12, the difference between this embodiment and the first embodiment lies in the cross section of the reference marker 901 is opposite
It falls isosceles trapezoid and to have the figure of rectangle protrusion at the upper bottom of isosceles trapezoid in the reference marker face 90 recess, i.e.,
There is a square protruding among 901 upper bottom surface of reference marker.In the situation that bad environments cause optical signal unstable
Under, system can be with the optimal focal plane z of default reference label 9010Position on the upper surface of square protruding, avoid due to system
In the optimal focal plane z of oneself location reference marks 9010Position when because optical signal it is unstable due to lead to not carry out.
Embodiment five
As shown in figure 13, the difference of the present embodiment and embodiment three is that the cross section of reference marker 901 is opposite refers to
The isosceles trapezoid of the protrusion of index face 90 and have a rectangular platform of one piece of recess in upper surface, function with it is rectangular in example IV
Protrusion effect is similar.
Embodiment six
As shown in figure 14, the difference between this embodiment and the first embodiment lies in the image-forming objective lens group 601 is separately positioned on institute
It states between spectrophotometric unit 70 and the reference marker face 90, silicon wafer 80, the image-forming objective lens group 601 is anti-by 80 surface of silicon wafer respectively
The measurement reflected light path 102b penetrated is focused with the optical path 103b that reference marker face 90 is reflected, and optical signal is exported to described point
Light unit 70, and exported the optical signal collection of the two together by the spectrophotometric unit 70.
Embodiment seven
As shown in figure 15, the difference between this embodiment and the first embodiment lies in the reference marker face 90 and the image-forming objective lens
On same straight line, the reference marker face 90 is located at the imaging object for group 601, the spectrophotometric unit 70 and the silicon wafer 80
Between microscope group 601 and the spectrophotometric unit 70.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment, as appurtenance is wanted
The various shapes to be formed can be combined with pit for isosceles trapezoid by seeking the cross-sectional morphology of middle reference marker 901, isosceles trapezoid
Bevel edge is also possible to waveform.Obvious those skilled in the art can carry out various modification and variations without departing from this to invention
The spirit and scope of invention.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent skill
Within the scope of art, then the invention is also intended to include including these modification and variations.
Claims (9)
1. a kind of automatic focusing to Barebone, which is characterized in that successively include: light source (10), wavelength selection unit (20), shine
Bright mirror group (30), illumination adjustments unit (40), beam splitting unit (50), image-forming objective lens group (601), spectrophotometric unit (70), with reference to mark
Note face (90) and the reference marker (901) being located on reference marker face (90), silicon wafer (80) and it is located at silicon wafer (80) surface
Alignment mark (801), sports platform (802), the spectrophotometric unit are also sequentially connected imaging and adjust unit (100), imaging microscope group
(602), detector (110), the detector (110), imaging adjust unit (100), illumination adjustments unit (40), sports platform
(802) all with signal processing and control unit (200) circuit connection；The light source (10) issues light, by the wavelength selection
After unit (20), light is received by the illumination microscope group (30) and is exported, form first by the illumination adjustments unit (40) and enter
Optical path (101) are penetrated, the image-forming objective lens group (601) is then reflexed to by the beam splitting unit (50), is then passed through the light splitting
Unit (70) splits the light into two-way, is all the way the reference input path (103a) for irradiating the reference marker face (90), another way
For the measurement input path (102a) for irradiating the silicon wafer (80)；Input path is measured as described in the silicon wafer (80) surface reflection
(102a) forms measurement reflected light path (102b), and input path is referred to as described in reference marker face (90) surface reflection
(103a), which is formed, refers to reflected light path (103b), by the measurement reflected light path (102b) and is referred to by the spectrophotometric unit (70)
Reflected light path (103b) collects, and exports the first reflected light path (104) by the image-forming objective lens group (601), and described in process
First reflected light path (104) are transmitted and form the second reflected light path (105) by beam splitting unit (50)；Second reflected light path
(105) unit (100) are adjusted by the imaging to receive, is then focused by the imaging microscope group (602) and is transferred to the detection
Device (110)；The detector (110) detects the alignment mark (801) and the interference of the reference marker (901) position is believed
Breath, and it is sent to the signal processing and control unit (200), the signal processing and control unit (200) are according to described dry
It relates to information and calculates the distance that the optimal focal plane of imaging is deviateed in the current vertical position of the alignment mark (801), to the sports platform
(802) it is controlled.
2. automatic focusing as described in claim 1 to Barebone, which is characterized in that the lighting source be nonmonochromatic light
Source.
3. automatic focusing as described in claim 1 to Barebone, which is characterized in that reference marker (901) cross section
There is bevel edge for both sides and dimpled shape is set in bottom surface.
4. automatic focusing as described in claim 1 to Barebone, which is characterized in that the alignment mark (801) be cross
Shape, the side length of the reference marker (901) are less than the rectangular side length being crossed to form among alignment mark (801) cross.
5. automatic focusing as described in claim 1 to Barebone, which is characterized in that the spectrophotometric unit (70) and the ginseng
It is described with reference to input path (103a) to examine setting shutter (902) cutting between index face (90).
6. automatic focusing as described in claim 1 to Barebone, which is characterized in that be irradiated to entering on the silicon wafer (80)
Optical path (102a) is penetrated, the angle with the measurement reflected light path (102b) by the silicon wafer (80) back reflection is between 0 ° to 90 °.
7. a kind of silicon slice alignment method to Barebone using automatic focusing described in any one of claim 1~6, special
Sign is, method includes the following steps:
Step 1: the silicon wafer (80) is placed on sports platform (802)；
Step 2:, moving movement platform (802), until occurring the alignment mark (801) and the reference marker in visual field
(901)；
Step 3: moving movement platform (802) moves on to the alignment mark (801) and the reference marker (901) in visual field
At figure, until the area of the overlapping region of the alignment mark (801) and the reference marker (901) is greater than 0；
Step 4: opening light source (10), regulation illumination adjustments unit (40) is light illumination mode, and regulation imaging adjusts unit (100) and is
Imaging pattern；
Step 5: the alignment mark (801) and the reference marker generated in step 2 is shown in detector (110)
(901) interference information of position, and it is sent to the signal processing and control unit (200)；
Step 6: the signal processing and control unit (200) by carrying out processing regulation to the interference information described in step 5,
The distance that the optimal focal plane z of imaging is deviateed in alignment mark (801) current vertical position is calculated, control sports platform (802) is moved to
The position of alignment mark (801) the optimal focal plane z, alignment mark (801) blur-free imaging, automatic focusing are completed at this time；
Step 7: by the horizontal position for removing the reference marker (901) of the alignment mark (801), the signal processing and control
Unit (200) processed determines the alignment mark according to the positional relationship of the alignment mark (801) and the reference marker (901)
(801) position, alignment mark (801) location position are completed.
8. the silicon slice alignment method to Barebone of automatic focusing as described in claim 7, which is characterized in that the signal
Processing and control unit (200) demarcate the best of the reference marker (901) on the bevel edge of the reference marker (901) in advance
Position of focal plane z0, the optimal focal plane position z of the reference marker (901)0The position of as described alignment mark (801) the optimal focal plane z
It sets.
9. the silicon slice alignment method to Barebone of automatic focusing as described in claim 7, which is characterized in that the signal
Processing and control unit (200) are according to the positional relationship of the alignment mark (801) and the reference marker (901) determination
When the position of alignment mark (801), by monitoring the position excursion amount of the reference marker (901) come to the alignment mark
(801) position carries out corresponding position compensation.
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| CN108598032B (en) * | 2018-05-23 | 2020-09-11 | 华天慧创科技（西安）有限公司 | Wafer bonding alignment system and alignment method |
| CN109116685B (en) * | 2018-09-14 | 2020-11-20 | 重庆惠科金渝光电科技有限公司 | Exposure method and exposure device thereof |
| CN110441034A (en) * | 2019-08-24 | 2019-11-12 | 天津大学青岛海洋技术研究院 | Optical device attenuation characteristic test device and method based on Mach-Zehnder interferometer |
| CN111601051B (en) * | 2020-05-13 | 2021-07-16 | 长江存储科技有限责任公司 | Alignment image acquisition method, device and system |
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| JPS5972728A (en) * | 1982-10-20 | 1984-04-24 | Canon Inc | Automatic alignment device |
| JPH06160020A (en) * | 1992-11-20 | 1994-06-07 | Canon Inc | Measuring device |
| JPH10326734A (en) * | 1997-05-26 | 1998-12-08 | Nikon Corp | Detecting method of focal point and projection aligner using the same method |
| CN103309163B (en) * | 2012-03-07 | 2015-08-26 | 上海微电子装备有限公司 | External reference interference silicon chip alignment system |
| CN104133350B (en) * | 2013-05-03 | 2017-02-08 | 上海微电子装备有限公司 | Aligning system and aligning method for photolithographic device |
| CN103913961A (en) * | 2014-04-17 | 2014-07-09 | 中国科学院光电技术研究所 | Coaxial focus-detecting device based on light beam wavefront modulation |
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