CN108121177B - A kind of alignment measurement systems and alignment methods - Google Patents

A kind of alignment measurement systems and alignment methods Download PDF

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Publication number
CN108121177B
CN108121177B CN201611075055.4A CN201611075055A CN108121177B CN 108121177 B CN108121177 B CN 108121177B CN 201611075055 A CN201611075055 A CN 201611075055A CN 108121177 B CN108121177 B CN 108121177B
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light source
light
module
level
alignment
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CN108121177A (en
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忻斌杰
孙建超
李运锋
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection

Abstract

The invention discloses a kind of alignment measurement systems and alignment methods, the system provides four kinds of light beams with different wave length by first light source module and second light source module, the opening and closing of different light sources in first light source module and second light source module are controlled by light source control module, the light beam that the first light source module being emitted on alignment mark by image-forming module, second light source module issue is imaged on respectively on the different location of the first reference grating, the second reference grating;First reference grating and the second reference grating provide the reference marker of different cycles for the different level diffraction lights of four kinds of light beams;Signal acquisition process module acquisition through the first reference grating, the second reference grating light intensity signal and handled, and calculated by alignment function and management module and be directed at position.The present invention may be implemented to four kinds of wavelength while measure, and obtain the optimal wavelength of performance, carries out the photoetching under the process conditions using the wavelength and produces, improves Technological adaptability.

Description

A kind of alignment measurement systems and alignment methods
Technical field
The present invention relates to technical field of lithography, and in particular to a kind of alignment measurement systems and alignment methods.
Background technique
In semiconducter IC ic manufacturing process, a complete chip is usually required by multiple photolithographic exposure It can complete.Other than first time photoetching, the photoetching of remaining level before exposure will be by the figure of the level and with front layer The secondary figure left that exposes is accurately positioned, and just be can guarantee there is correct relative position between each layer pattern in this way, that is, is covered Carve precision.Under normal conditions, alignment precision is the 1/3~1/5 of litho machine resolution ratio index, for 100 nanometers of litho machines Speech, alignment precision index request are less than 35nm.Alignment precision is one of the key technical indexes of projection mask aligner, and mask and silicon Alignment precision between piece is the key factor for influencing alignment precision.When characteristic size (Critical Dimension, CD) is wanted More hour is asked, the requirement of requirement and resulting alignment precision to alignment precision becomes more stringent, such as the CD of 90nm Size requires 10nm or smaller alignment precision.
Alignment between mask and silicon wafer, which can be used mask (coaxial) and be aligned, is directed at the mode combined with silicon wafer (off-axis), Bridge is labeled as with work stage sports platform datum plate, establishes the positional relationship between mask label and silicon chip mark.Alignment Basic process are as follows: first by mask alignment system, realize the alignment between mask label and sports platform datum plate label, then Using silicon chip alignment system, the alignment between silicon chip mark and work stage sports platform datum plate label is completed, and then is realized indirectly Silicon chip mark is aligned between marking with mask.
A kind of silicon wafer (off-axis) is provided in the prior art to Barebone, and alignment photograph is carried out using dual-wavelength laser light source It is bright, deviation is carried out to the different grade sub-beams of each wavelength using wedge block or clapboard, makes the alignment diffraction light of each wavelength Spot is imaged respectively to before being located at each level reference grating of different location, to realize that 1-7 grades of registration signals separately detect.Using The alignment light source of two kinds of wavelength is carried out to locating tab assembly, although Technological adaptability improves for Single wavelength to Barebone, It is that contemporary semiconductor manufacturing process is increasingly sophisticated, the technique number of plies obviously increases, and keeps the alignment measurement systems technique of two kinds of wavelength suitable Answering property is also limited to increasingly.Increase to two kinds of wavelength from Single wavelength, if pointing out using together quasi-optical for two wavelength in the prior art One optical path needs 48 wedge blocks to replace Single wavelength feelings in order to avoid the overlapping of level hot spot each between different wave length imaging 24 independent wedge blocks under condition, or using 12 clapboards instead of 6 pieces of clapboards in the case of Single wavelength.In the prior art It is also mentioned that another scheme, i.e., separates the optical path of two wavelength, a respective optical path, illuminating bundle is finally by PBS After (Polarization Beam Splitter, polarization beam apparatus) closes beam, it is irradiated to silicon wafer face alignment mark, then pass through PBS By the diffracted beam separation of two wavelength, into respective imaging optical path.This means that light channel structure will if being further added by wavelength It will increase, become more complicated so as to cause alignment system bulk, structure.
Summary of the invention
The present invention provides a kind of alignment measurement systems and alignment methods, to solve problems of the prior art.
In order to solve the above-mentioned technical problem, the technical scheme is that a kind of alignment measurement systems, comprising:
First light source module, including first light source and second light source provide the first light beam and second with different wave length Light beam;
First bundling device carries out conjunction beam to the first light beam and the second light beam;
Second light source module, including third light source and the 4th light source, provide the third light beam and the 4th with different wave length Light beam;
Second bundling device carries out conjunction beam to third light beam and the 4th light beam;
Light source control module controls the opening and closing of different light sources in first light source module and second light source module;
Work stage carries the silicon wafer with alignment mark;
First reference grating, the different level diffraction lights for the first light beam and/or the second light beam provide the ginseng of different cycles Examine label;
Second reference grating, the different level diffraction lights for third light beam and/or the 4th light beam provide the ginseng of different cycles Examine label;
The light beam that the first light source module, second light source module issue is irradiated to the alignment mark by image-forming module On, and first reference grating, the difference of the second reference grating are imaged on after collecting the light beam reflected through the alignment mark On position;
Signal acquisition process module, acquisition through the first reference grating, the second reference grating light intensity signal and located Reason;
Station acquisition and motion-control module acquire the location information of work stage;And
Alignment function and management module receive the letter of signal acquisition process module and station acquisition and motion-control module Number, calculate alignment position.
Further, the image-forming module includes the first image-forming module, the second image-forming module and polarization beam apparatus, and described the One image-forming module and the second image-forming module are symmetrical arranged about the polarization beam apparatus, and first bundling device and described second closes The light beam that beam device issues irradiates the alignment mark after the polarization beam apparatus, the light beam quilt through the alignment mark diffraction First image-forming module and second image-forming module imaging are respectively enterd after the polarization beam apparatus beam splitting.
Further, first image-forming module and the second image-forming module include the lighting unit set gradually, first Reflecting element, light beam deflection element, the second reflecting element and imaging len, light beam penetrate the lighting unit after by described first Reflecting element reflexes to the polarization beam apparatus, is incident to the alignment mark later, the light beam through the alignment mark diffraction It is successively imaged after the light beam deflection element, the second reflecting element and imaging len after the polarization beam apparatus.
Further, mutually arranged six kinds of the formation of deflection structure on the light beam deflection element including 3 kinds of deviation angles Deviation region.
Further, the signal acquisition process module include respectively with first image-forming module and the second image-forming module Corresponding first signal acquisition module and second signal acquisition module, first signal acquisition module and second signal acquire mould Block includes detection optical fiber and intensity collection element.
Further, the detection optical fiber includes level-one optical detection optical fiber, three-level optical detection optical fiber, Pyatyi optical detection optical fiber With seven grades of optical detection optical fiber.
Further, the level-one optical detection optical fiber, three-level optical detection optical fiber, Pyatyi optical detection optical fiber and seven grades of optical detections Optical fiber is respectively equipped with one.
Further, each level-one optical detection optical fiber, three-level optical detection optical fiber, Pyatyi optical detection optical fiber and seven grades of light Detection optical fiber respectively corresponds an intensity collection element.
Further, the level-one optical detection optical fiber and three-level optical detection optical fiber are respectively equipped with one, and the Pyatyi light is visited It surveys optical fiber and seven grades of optical detection optical fiber is respectively equipped with two.
Further, the level-one optical detection optical fiber and three-level optical detection optical fiber respectively correspond two intensity collection elements, Wavelength Splitter is equipped between the level-one optical detection optical fiber and three-level optical detection optical fiber and corresponding intensity collection element, each The Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber respectively correspond an intensity collection element.
Further, the intensity collection element uses photodiode.
The present invention also provides a kind of alignment methods of alignment measurement systems, comprising the following steps:
S1: the light beam that first light source module, second light source module issue projects the alignment on silicon wafer by image-forming module Label;
S2: by institute after the light beam progress diffraction that the alignment mark issues first light source module and second light source module Image-forming module difference interference imaging is stated in the first reference grating and the second reference grating;
S3: signal acquisition process module acquisition through first reference grating, the second reference grating light intensity signal simultaneously It is handled and is sent to alignment function and management module;
S4: the location information of station acquisition and motion-control module acquisition work stage, and it is sent to alignment function and management Module;
S5: the alignment function and management module receive the signal acquisition process module and station acquisition and motion control The signal of module calculates alignment position.
Further, in step S2, the image-forming module carries out Polarization Modulation to the light beam through the alignment mark diffraction, The diffracted beam of different wave length is imaged respectively to the reference marker of each level of different location.
Further, first light source is controlled by light source control module and second light source timesharing is opened, while controlling third Light source and the 4th light source timesharing are opened, and the signal acquisition process module acquisition time is through the first reference grating, the second reference The light intensity signal of grating is simultaneously sent to alignment function after being handled and calculates separately with management module and be directed at position.
Further, first light source, second light source, third light source, the 4th light source are controlled simultaneously by light source control module It opens, the signal acquisition process module acquires the first~the 4th light through the first reference grating, the second reference grating simultaneously The light intensity signal of beam is simultaneously sent to alignment function after being handled and is directed at position with management module calculating.
Further, the image-forming module is provided with six kinds of deviation modulation areas, and deviation modulates the first light source respectively And/or the level-one light of the second light source, the three-level light of the first light source and/or the second light source, the first light source Pyatyi light, the Pyatyi light of the second light source, seven grades of light of the first light source, seven grades of light of the second light source.
Further, the signal acquisition process module collect respectively through first reference grating first light source or Level-one light intensity signal, three-level light intensity signal, Pyatyi light intensity signal, the seven grades of light intensity signals of second light source, and collect respectively saturating Cross the third light source of second reference grating or the level-one light intensity signal of the 4th light source, three-level light intensity signal, Pyatyi light intensity letter Number, seven grades of light intensity signals.
Further, the signal acquisition process module collect respectively through first reference grating first light source and The level-one light intensity signal of second light source, the three-level light intensity signal of first light source and second light source, first light source Pyatyi light intensity letter Number, seven grades of light intensity signals of seven grades of light intensity signals of the Pyatyi light intensity signal of second light source, first light source and second light source, and Collect level-one light intensity signal, third light source and the 4th light source of the third light source and the 4th light source through second reference grating Three-level light intensity signal, the Pyatyi light intensity signal of third light source, the Pyatyi light intensity signal of the 4th light source, third light source seven grades of light Seven grades of light intensity signals of strong signal and the 4th light source;
Again to the level-one light intensity signal for the first light source and second light source for being collected into transmission first reference grating, first The three-level light intensity signal of light source and second light source, and through the third light source of second reference grating and the level-one of the 4th light source The three-level light intensity signal of light intensity signal, third light source and the 4th light source is split, and collects the level-one light of the first light source Strong signal, the level-one light intensity signal of second light source, the three-level light intensity signal of first light source, second light source three-level light intensity signal, The level-one light intensity signal of third light source, the level-one light intensity signal of the 4th light source, third light source three-level light intensity signal, the 4th light source Three-level light intensity signal.
Alignment measurement systems and alignment methods provided by the invention pass through setting first light source module and second light source module Four kinds of light beams for having different wave length are provided, are controlled in first light source module and second light source module not by light source control module With the opening and closing of light source, the first light source module, the second light source module that are emitted by image-forming module on alignment mark The light beam of sending is imaged on respectively on the different location of the first reference grating, the second reference grating;First reference grating and second Reference grating provides the reference marker of different cycles for the different level diffraction lights of four kinds of light beams;Pass through signal acquisition process module Acquisition through the first reference grating, the second reference grating light intensity signal and handled, pass through station acquisition and motion control Module acquires the location information of work stage, and is directed at position with management module calculating by alignment function.The present invention not only may be used The multi-wavelength time-sharing multiplex for realizing the same optical path is being joined when avoiding the light beam of two wavelength in same light source module while illuminating 1 grade of light imaging overlapping, the 3 grades of light overlappings for examining two wavelength on grating, also may be implemented to four kinds of wavelength while measuring, finally Four kinds of wavelength alignment repeatability are compared, the optimal wavelength of performance under the process conditions is obtained, carries out the technique item using the wavelength Photoetching production under part, improves Technological adaptability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of alignment measurement systems in the embodiment of the present invention 1;
Fig. 2 is the diffraction pattern distribution map that first light beam and the second light beam correspond to X, Y-direction in the embodiment of the present invention 1;
Fig. 3 is the distribution map of modulation areas on light beam deflection element in the embodiment of the present invention 1;
Fig. 4 is the distribution situation that first reference grating surface reference marks in the embodiment of the present invention 1;
Fig. 5 is the structural schematic diagram of Signal acquiring and processing module in the embodiment of the present invention 1;
Fig. 6 is the structural schematic diagram of Signal acquiring and processing module in the embodiment of the present invention 2.
It is as shown in the figure: 11, first light source;12, second light source;13, third light source;14, the 4th light source;21, first beam is closed Device;22, the first bundling device;31, the first image-forming module;32, the second image-forming module;33, lighting unit;34, light beam deflection element; 35, the second reflecting element;36, imaging len;37, polarization beam apparatus;38, the first reflecting element;4, work stage;5, silicon wafer;51, Alignment mark;71, the first reference grating;72, the second reference grating;8, signal acquisition process module;8a, the first signal processing mould Block;8b, second signal processing module;81, detection optical fiber;811, level-one optical detection optical fiber;812, three-level optical detection optical fiber;813, Pyatyi optical detection optical fiber;814, seven grades of optical detection optical fiber;82, intensity collection element;83, Wavelength Splitter;9, station acquisition with Motion-control module;10, alignment function and management module.
Specific embodiment
The present invention is described in detail with reference to the accompanying drawing.
Embodiment 1
As shown in Figure 1, the present invention provides a kind of alignment measurement systems, comprising:
First light source module, including first light source 11 and second light source 12, provide the first light beam with different wave length and Second light beam;In the present embodiment, the laser of first light source 11 and the selection of second light source 12 532nm, 633nm.
First bundling device 21 carries out conjunction beam to the first light beam and the second light beam.
Second light source module, including third light source 13 and the 4th light source 14, provide third light beam with different wave length and 4th light beam;In the present embodiment, the laser of third light source 13 and the selection of the 4th light source 14 780nm, 852nm.
Second bundling device 22 carries out conjunction beam to third light beam and the 4th light beam.
Light source control module (not shown) controls opening for different light sources in first light source module and second light source module It opens and closes.
Work stage 4 carries the silicon wafer 5 with alignment mark 51.
First reference grating 71, the different level diffraction lights for the first light beam and/or the second light beam provide different cycles Reference marker.Second reference grating 72, the different level diffraction lights for third light beam and/or the 4th light beam provide different cycles Reference marker.
The light beam that the first light source module, second light source module issue is irradiated on alignment mark 51 by image-forming module, And first reference grating 71, the second reference grating 72 are imaged on not after collecting the light beam reflected through the alignment mark 51 With on position;The image-forming module include the first image-forming module 31, the second image-forming module 32 and polarization beam apparatus 37, described first Image-forming module 31 and the second image-forming module 32 are symmetrical arranged about the polarization beam apparatus 37, first bundling device 21 and described The light beam that second bundling device 22 issues irradiates the alignment mark 51 after the polarization beam apparatus 37, through the alignment mark The light beam of 51 diffraction is respectively enterd first image-forming module 31 and second imaging after 37 beam splitting of polarization beam apparatus Module imaging 32, in the present embodiment, polarization beam apparatus 37 uses PBS and wave plate combined element.
Preferably, first image-forming module 31 and the second image-forming module 32 include the lighting unit 33 set gradually, First reflecting element 38, light beam deflection element 34, the second reflecting element 35 and imaging len 36.Light beam penetrates the lighting unit The polarization beam apparatus 37 is reflexed to by first reflecting element 34 after 33, the alignment mark 51 is incident to later, through institute The light beam of 51 diffraction of alignment mark is stated after the polarization beam apparatus 37 successively through the light beam deflection element 34, the second reflector It is imaged after part 35 and imaging len 36.Deflection structure on the light beam deflection element 34 including 3 kinds of deviation angles is mutually arranged Six kinds of deviation regions are formed, for six kinds of deviation regions in the first image-forming module 31, are respectively used to first described in deviation The three-level light of the level-one light of light beam and/or the second light beam, the first light beam and/or the second light beam, the Pyatyi light of the first light beam, second The Pyatyi light of light beam, seven grades of light of the first light beam, seven grades of light of the second light beam.
As shown in Fig. 2, being the first light beam (wavelength 532nm) and the corresponding X of the second light beam (wavelength 633nm), Y-direction Diffraction pattern distribution map, it can be seen from the figure that 1 grade of diffraction pattern of the two-beam is largely overlapped, 3 grades of diffraction patterns have few Overlapping is measured, what 5 grades and 7 grades of diffraction patterns were completely separate.
It is illustrated in figure 3 the distribution map of modulation areas on light beam deflection element 34, can see in conjunction in Fig. 3, if will 1 grade of light, the 3 grades of light of two-beam put together deviation modulation, then being needed in total to 6 light beams (1 grade, two-beam of two-beam 3 grades, 5 grades of the first light beam, 5 grades of the second light beam, 7 grades of the first light beam, 7 grades of the second light beam) carry out deviation modulation, therefore 6 kinds of deviations are needed to form, by the mutually arranged formation of the deflection element of 3 kinds of deviation angles.In Fig. 4, border circular areas a is to 1 grade of light Deviation modulation areas is carried out, border circular areas b is that 3 grades of light are carried out with deviation modulation areas, and circle region c 1 is to the 5 of the first light beam Grade light carry out deviation modulation areas, circle region c 2 be the second light beam 5 grades of light carry out deviation modulation areas, border circular areas d1, D2 is 7 grades of light deflection modulation areas of two-beam respectively.Deflection element can be using wedge-shaped panel element or in reflecting element table The reflecting surface that face increases modulation beam angle is realized.For 1,3 grade of diffracted beam, two-beam all passes through the same zone of deflection element Domain, therefore the deviation modulation angle that light beam is passed through is identical, but due to different wave length, the refractive index of two-beam difference, Therefore the angle of two-beam has slightly difference after deviation, and finally will lead to the interference image position for being imaged onto reference grating face has summary Elementary errors is other, it is therefore desirable to which the reference marker of corresponding level can cover the interference image of two kinds of wavelength.
As shown in figure 4, for the distribution situation (the second reference grating 72 is similar) of 71 surface reference of the first reference grating label, Because the refractive index of two-beam is different, there is deviation in the imaging center position of 1 grade, 3 grades light beam, and offset distance can be according to formula (n1-n2) ﹡ α ﹡ f, which is calculated, obtains, and n1, n2 are respectively the refractive index of the first light beam and the corresponding deflection element of the second light beam, and α is should The deviation of grade sub-beams modulates angle, and f is the focal length of imaging len.In order to cover the interference image of two-beam, 1 grade, 3 grades of ginseng Examine label slightly than 5 grades, it is 7 grades big.For 5 grades, 7 grades, the interference image imaging position of two-beam is separated by deviation, Therefore 5 grades, 7 grades of reference markers only respectively correspond the interference image of light beam.
Signal acquisition process module 8, acquisition are gone forward side by side through the light intensity signal of the first reference grating 71, the second reference grating 72 Row processing.The signal acquisition process module 8 includes corresponding with first image-forming module 31 and the second image-forming module 32 respectively The first signal acquisition module 8a and second signal acquisition module 8b, the first signal acquisition module 8a and second signal acquisition Module 8b includes detection optical fiber 81 and intensity collection element 82.The detection optical fiber 81 includes level-one optical detection optical fiber 811, three Grade optical detection optical fiber 812, Pyatyi optical detection optical fiber 813 and seven grades of optical detection optical fiber 814.As shown in figure 5, the level-one optical detection Optical fiber 811, three-level optical detection optical fiber 812, Pyatyi optical detection optical fiber 813 and seven grades of optical detection optical fiber 814 are respectively equipped with one.Often A level-one optical detection optical fiber 811, three-level optical detection optical fiber 812, Pyatyi optical detection optical fiber 813 and seven grades of optical detection optical fiber 817 respectively correspond an intensity collection element 82, and the intensity collection element 82 uses photodiode.
Station acquisition and motion-control module 9, acquire the location information of work stage.
Alignment function and management module 10 receive signal acquisition process module 8 and station acquisition and motion-control module 9 Signal calculates alignment position.
The present invention also provides a kind of alignment methods of alignment measurement systems, comprising the following steps:
S1: the light beam that first light source module, second light source module issue projects the alignment on silicon wafer 5 by image-forming module Label 51;
S2: by imaging after the light beam progress diffraction that alignment mark 51 issues first light source module and second light source module Module distinguishes interference imaging in the first reference grating 71 and the second reference grating 72;Specifically, the image-forming module is to through institute The light beam for stating 51 diffraction of alignment mark carries out Polarization Modulation, and the diffracted beam of different wave length is imaged respectively to the first reference grating 71 or 72 different location of the second reference grating each level reference marker at.
S3: signal acquisition process module 8 acquisition through the first reference grating 71, the second reference grating 72 light intensity signal simultaneously It is handled and is sent to alignment function and management module 10;
S4: station acquisition and motion-control module 9 acquire the location information of work stage 4, and are sent to alignment function and pipe Manage module 10;
S5: alignment function and management module 10 receive signal acquisition process module 8 and station acquisition and motion-control module 9 Signal, calculate alignment position.Preferably, first light source 11 is controlled by light source control module and 12 timesharing of second light source is beaten It opens, while controlling third light source 13 and 14 timesharing of the 4th light source and opening, 8 acquisition time of signal acquisition process module is through the One reference grating 71, the light intensity signal of the second reference grating 72 are simultaneously sent to alignment function after being handled and management module 10 is divided Position Ji Suan be directed at.The image-forming module is provided with six kinds of deviation modulation areas, and deviation modulates the first light source 11 respectively And/or the level-one light of the second light source 12, the three-level light of the first light source 11 and/or the second light source 12, described The Pyatyi light of one light source 11, the Pyatyi light of the second light source 12, seven grades of light of the first light source 11, the second light source 12 Seven grades of light.The signal acquisition process module 8 collects the first light source 11 or the through first reference grating 71 respectively Level-one light intensity signal, three-level light intensity signal, Pyatyi light intensity signal, the seven grades of light intensity signals of two light sources 12, and collect respectively saturating Cross the third light source 13 of second reference grating 72 or level-one light intensity signal, the three-level light intensity signal, Pyatyi of the 4th light source 14 Light intensity signal, seven grades of light intensity signals.Specifically, interference image is imaged to the first reference grating 71 or the second reference grating 72, It is referenced mark modulation, is ultimately formed to locating tab assembly optical signal, is had after each reference marker of reference grating corresponding Detection optical fiber 81, to collect alignment optical signal.Since 5 grades, 7 grades of optical signals only correspond to the optical signal of light beam, two beams 5 grades of light, 7 grades of optical signals can acquire simultaneously, but 1 grade, in 3 grades of optical signals include two-beam signal, therefore in acquisition 1 When grade, 3 grades of optical signals, timesharing is needed to carry out.Detailed process are as follows: first turn on first light source 11, third light source 13, close second Light source 12, the 4th light source 14 carry out alignment scanning using the first light beam, third light beam, and obtain alignment repeatability;It is then switched off First light source 11, third light source 13 open second light source 12, the 4th light source 14, and second light source 12, the 4th light source 14 are aligned Scanning, and obtain alignment repeatability;Four kinds of wavelength alignment repeatability are compared, the optimal wavelength of performance under the process conditions is obtained; The photoetching under the process conditions is carried out using the wavelength to produce.
Embodiment 2
As shown in fig. 6, unlike the first embodiment, the level-one optical detection optical fiber 811 and three-level optical detection optical fiber 812 It is respectively equipped with one, the Pyatyi optical detection optical fiber 813 and seven grades of optical detection optical fiber 814 are respectively equipped with two.Preferably, described Level-one optical detection optical fiber 811 and three-level optical detection optical fiber 812 respectively correspond two intensity collection elements 82, the level-one optical detection Wavelength Splitter 83 is equipped between optical fiber 811 and three-level optical detection optical fiber 812 and corresponding intensity collection element 82, it is each described Pyatyi optical detection optical fiber 813 and seven grades of optical detection optical fiber 814 respectively correspond an intensity collection element 82.
In the present embodiment, light source control module controls first light source 11, second light source 12, third light source 13, the 4th light source 14 open simultaneously, the signal acquisition process module 8 acquire simultaneously through the first reference grating 71, the second reference grating 72 the The light intensity signal of one~the 4th light beam is simultaneously sent to alignment function after being handled and is directed at position with the calculating of management module 10.It is described Image-forming module is provided with six kinds of deviation modulation areas, and deviation modulates the first light source 11 and/or the second light source 12 respectively Level-one light, the three-level light of the first light source 11 and/or the second light source 12, the Pyatyi light of the first light source 11, institute State the Pyatyi light of second light source 12, seven grades of light of the first light source 11, seven grades of light of the second light source 12.The signal is adopted Collection processing module 8 collects the level-one light intensity of first light source 11 and second light source 12 through first reference grating 71 respectively The three-level light intensity signal of signal, first light source 11 and second light source 12, the Pyatyi light intensity signal of first light source 11, second light source 12 Pyatyi light intensity signal, seven grades of light intensity signals of first light source 11 and seven grades of light intensity signals of second light source 12, and collect saturating Cross the third light source 13 of second reference grating 72 and level-one light intensity signal, third light source 13 and the 4th light of the 4th light source 14 Three-level light intensity signal, the Pyatyi light intensity signal of third light source 13, the Pyatyi light intensity signal of the 4th light source 14, the third light source in source 14 13 seven grades of light intensity signals and seven grades of light intensity signals of the 4th light source 14;Again to being collected into through first reference grating 71 The three-level light intensity signal of the level-one light intensity signal of first light source 11 and second light source 12, first light source 11 and second light source 12, and Level-one light intensity signal, the third light source 13 and the 4th of third light source 13 and the 4th light source 14 through second reference grating 72 The three-level light intensity signal of light source 14 is split, and collects the level-one light intensity signal of the first light source 11, second light source 12 Level-one light intensity signal, the three-level light intensity signal of first light source 11, the three-level light intensity signal of second light source 12, third light source 13 one The three-level of grade light intensity signal, the level-one light intensity signal of the 4th light source 14, the three-level light intensity signal of third light source 13, the 4th light source 14 Light intensity signal.Specifically, containing the signal light of two wavelength in 1 grade of light, the signal of two kinds of wavelength is also contained in 3 grades of light Light, therefore set a Wavelength Splitter 83 after level-one optical detection optical fiber 811 and three-level optical detection optical fiber 812 and separate two-beam It opens, and information collection is carried out by an intensity collection element 82 respectively, and the information of acquisition is exported to alignment function and pipe Manage module 10.There was only a kind of registration signal light of wavelength in 5 grades of light, two-beam is corresponding, and there are two reference markers, are corresponding with two Pyatyi optical detection optical fiber 813 distinguishes collecting signal light, also there was only a kind of registration signal light of wavelength, two-beam in same 7 grades of light Corresponding there are two reference markers, are corresponding with two Pyatyi optical detection optical fiber 813 and distinguish collecting signal light.It can be achieved in the present embodiment It is acquired while the registration signal of the light beam of four kinds of wavelength, no longer needs to individually carry out acquisition time.Due to the light beam of different wave length An optical path is shared, in beam splitting, needs to design dichroic filter plate, increase narrow-band-filter film is harassed to reduce color.
In conclusion alignment measurement systems provided by the invention and alignment methods, pass through setting first light source module and the Two light source modules provide four kinds of light beams with different wave length, control first light source module and the second light by light source control module The opening and closing of different light sources in source module are emitted onto first light source module on alignment mark, the by image-forming module The light beam that two light source modules issue is imaged on respectively on the different location of the first reference grating 71, the second reference grating 72;Pass through The reference that first reference grating 71 and the second reference grating 72 provide different cycles for the different level diffraction lights of four kinds of light beams is marked Note;The first reference grating 71, the light intensity signal of the second reference grating 72 and progress are penetrated by the acquisition of signal acquisition process module 8 Processing is acquired the location information of work stage by station acquisition and motion-control module 9, and passes through alignment function and management mould Block 10 calculates alignment position.The present invention can not only realize the multi-wavelength time-sharing multiplex of the same optical path, avoid same light source module In two wavelength light beam simultaneously when illuminating, the 1 grade of light imaging overlapping, 3 grades of light overlappings of two wavelength in reference grating can also be real Now four kinds of wavelength are measured simultaneously, it is best to obtain performance under the process conditions for four kinds of wavelength alignment repeatability of final comparison Wavelength, using the wavelength carry out the photoetching under the process conditions produce, improve Technological adaptability.
Although embodiments of the present invention are illustrated in specification, these embodiments are intended only as prompting, It should not limit protection scope of the present invention.It is equal that various omission, substitution, and alteration are carried out without departing from the spirit and scope of the present invention It should be included within the scope of the present invention.

Claims (18)

1. a kind of alignment measurement systems characterized by comprising
First light source module, including first light source and second light source provide the first light beam and the second light beam with different wave length;
First bundling device carries out conjunction beam to the first light beam and the second light beam;
Second light source module, including third light source and the 4th light source provide third light beam and the 4th light beam with different wave length;
Second bundling device carries out conjunction beam to third light beam and the 4th light beam;
Light source control module controls the opening and closing of different light sources in first light source module and second light source module;
Work stage carries the silicon wafer with alignment mark;
First reference grating provides the reference mark of different cycles for the different level diffraction lights of the first light beam and/or the second light beam Note;
Second reference grating provides the reference mark of different cycles for the different level diffraction lights of third light beam and/or the 4th light beam Note;
The light beam that the first light source module, second light source module issue is irradiated on the alignment mark by image-forming module, and The different location of first reference grating, the second reference grating is imaged on after collecting the light beam reflected through the alignment mark On;
Signal acquisition process module, acquisition through first reference grating, the second reference grating light intensity signal and located Reason;
Station acquisition and motion-control module acquire the location information of work stage;And
Alignment function and management module receive the signal of signal acquisition process module and station acquisition and motion-control module, meter Calculate alignment position.
2. alignment measurement systems according to claim 1, which is characterized in that the image-forming module includes the first imaging mould Block, the second image-forming module and polarization beam apparatus, first image-forming module and the second image-forming module are about the polarization beam apparatus It is symmetrical arranged, described in the light beam that first bundling device and second bundling device issue irradiates after the polarization beam apparatus Alignment mark respectively enters the first imaging mould after the light beam of the alignment mark diffraction is by the polarization beam apparatus beam splitting Block and second image-forming module imaging.
3. alignment measurement systems according to claim 2, which is characterized in that first image-forming module and the second imaging mould Block includes the lighting unit set gradually, the first reflecting element, light beam deflection element, the second reflecting element and imaging len, Light beam reflexes to the polarization beam apparatus by first reflecting element through after the lighting unit, and it is described right to be incident to later Fiducial mark note, through the light beam of the alignment mark diffraction after the polarization beam apparatus successively through the light beam deflection element, second It is imaged after reflecting element and imaging len.
4. alignment measurement systems according to claim 3, which is characterized in that include 3 kinds inclined on the light beam deflection element Six kinds of deviation regions of the mutually arranged formation of the deflection structure of dog-ear degree.
5. alignment measurement systems according to claim 2, which is characterized in that the signal acquisition process module includes difference The first signal acquisition module corresponding with first image-forming module and the second image-forming module and second signal acquisition module, it is described First signal acquisition module and second signal acquisition module include detection optical fiber and intensity collection element.
6. alignment measurement systems according to claim 5, which is characterized in that the detection optical fiber includes level-one optical detection light Fibre, three-level optical detection optical fiber, Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber.
7. alignment measurement systems according to claim 6, which is characterized in that the level-one optical detection optical fiber, three-level light are visited It surveys optical fiber, Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber and is respectively equipped with one.
8. alignment measurement systems according to claim 7, which is characterized in that each level-one optical detection optical fiber, three-level Optical detection optical fiber, Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber respectively correspond an intensity collection element.
9. alignment measurement systems according to claim 6, which is characterized in that the level-one optical detection optical fiber and three-level light are visited It surveys optical fiber and is respectively equipped with one, the Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber are respectively equipped with two.
10. alignment measurement systems according to claim 9, which is characterized in that the level-one optical detection optical fiber and three-level light Detection optical fiber respectively corresponds two intensity collection elements, the level-one optical detection optical fiber and three-level optical detection optical fiber and corresponding light It is equipped with Wavelength Splitter between strong acquisition elements, each Pyatyi optical detection optical fiber and seven grades of optical detection optical fiber respectively correspond one A intensity collection element.
11. alignment measurement systems according to claim 5, which is characterized in that the intensity collection element uses photoelectricity two Pole pipe.
12. a kind of alignment methods using alignment measurement systems as described in claim 1, which is characterized in that including following step It is rapid:
S1: the light beam that first light source module, second light source module issue projects the alignment mark on silicon wafer by image-forming module;
S2: by institute after the light beam progress diffraction that the alignment mark issues the first light source module and second light source module Image-forming module difference interference imaging is stated in the first reference grating and the second reference grating;
S3: signal acquisition process module acquisition is through first reference grating, the light intensity signal of the second reference grating and progress It handles and is sent to alignment function and management module;
S4: the location information of station acquisition and motion-control module acquisition work stage, and it is sent to the alignment function and management Module;
S5: the alignment function and management module receive the signal acquisition process module and station acquisition and motion-control module Signal, calculate alignment position.
13. alignment methods according to claim 12, which is characterized in that in step S2, the image-forming module is described in warp The light beam of alignment mark diffraction carries out Polarization Modulation, and the diffracted beam of different wave length is imaged respectively to each level of different location Reference marker at.
14. alignment methods according to claim 13, which is characterized in that control first light by light source control module Source and second light source timesharing are opened, while controlling the third light source and the 4th light source timesharing opening, the signal acquisition process Module acquisition time through the first reference grating, the light intensity signal of the second reference grating and is sent to alignment function after being handled It is calculated separately with management module and is directed at position.
15. alignment methods according to claim 13, which is characterized in that control first light by light source control module Source, second light source, third light source, the 4th light source open simultaneously, and the signal acquisition process module is acquired simultaneously through the first ginseng Examine grating, the second reference grating the first~the 4th light beam light intensity signal and alignment function and management are sent to after being handled Module calculates alignment position.
16. alignment methods according to claim 14 or 15, which is characterized in that the image-forming module is provided with six kinds of deviations Modulation areas, deviation modulates the level-one light of the first light source and/or the second light source respectively, the first light source and/or The three-level light of the second light source, the Pyatyi light of the first light source, the Pyatyi light of the second light source, the first light source Seven grades of light, seven grades of light of the second light source.
17. alignment methods according to claim 14, which is characterized in that the signal acquisition process module is collected thoroughly respectively Cross the first light source of first reference grating or the level-one light intensity signal of second light source, three-level light intensity signal, Pyatyi light intensity letter Number, seven grades of light intensity signals, and respectively collect through second reference grating third light source or the 4th light source level-one light Strong signal, three-level light intensity signal, Pyatyi light intensity signal, seven grades of light intensity signals.
18. alignment methods according to claim 15, which is characterized in that the signal acquisition process module is collected thoroughly respectively Cross the three-level of the first light source of first reference grating and the level-one light intensity signal of second light source, first light source and second light source Light intensity signal, the Pyatyi light intensity signal of first light source, the Pyatyi light intensity signal of second light source, first light source seven grades of light intensity signals And seven grades of light intensity signals of second light source, and collect the one of the third light source and the 4th light source that penetrate second reference grating Grade light intensity signal, third light source and the three-level light intensity signal of the 4th light source, the Pyatyi light intensity signal of third light source, the 4th light source Pyatyi light intensity signal, seven grades of light intensity signals of third light source and seven grades of light intensity signals of the 4th light source;
Again to the first light source and the level-one light intensity signal of second light source, first light source being collected into through first reference grating With the three-level light intensity signal of second light source, and through second reference grating third light source and the 4th light source level-one light intensity The three-level light intensity signal of signal, third light source and the 4th light source is split, and collects the level-one light intensity letter of the first light source Number, the three-level light intensity signal of the level-one light intensity signal of second light source, first light source, the three-level light intensity signal of second light source, third The level-one light intensity signal of light source, the level-one light intensity signal of the 4th light source, the three-level light intensity signal of third light source, the 4th light source three Grade light intensity signal.
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