CN106271088A - A kind of Fresnel zone plate array making method based on femtosecond laser and application - Google Patents
A kind of Fresnel zone plate array making method based on femtosecond laser and application Download PDFInfo
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- CN106271088A CN106271088A CN201610720185.2A CN201610720185A CN106271088A CN 106271088 A CN106271088 A CN 106271088A CN 201610720185 A CN201610720185 A CN 201610720185A CN 106271088 A CN106271088 A CN 106271088A
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- fresnel
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- femtosecond laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
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Abstract
A kind of Fresnel zone plate array making method based on femtosecond laser and the application in micro-nano structure is processed thereof.Including utilizing femtosecond laser directly to process Fresnel chip arrays, and the processed good Fresnel chip arrays of femtosecond laser focus on after direct processing micro structure.By the method, we can make the Fresnel chip arrays of various different arrangement mode, and processes the micro structure array corresponding with its arrangement mode based on these array of zone plates.The method has the features such as working (machining) efficiency is high, processing method is simple, motility is good.
Description
Technical field
The invention belongs to femtosecond laser micro-nano technology field, relate to a kind of Fresnel chip arrays based on femtosecond laser
Manufacture method and the application in micro-nano technology thereof.
Background technology
" optics " first volume (author: Zhao Kaihua, Zhong Xihua) book published according to BJ University Press 1984 the
202-206 page of introduction, Fresnel zone plate has the focus characteristics similar to lens, and it can make light focus on, and with thoroughly
Fresnel zone plate unlike mirror also has focus many times in addition to prime focus.According to the U.S. " Optical Society of
America " " OPTICS LETTERS " (Vol.16, No.12, June 1991, p931-933) report of 1991 years publishing,
A.Marrakchi et al. is the Fresnel zone plate array pattern of loading programmable in spatial light modulator, and light is through this space
Photomodulator also creates relevant lattice array after propagating a segment distance.Utilize Fresnel chip arrays that femtosecond laser is focused on
Becoming this character of lattice array, we can pass through Fresnel chip arrays parallel fabrication micro-nano structure, so make to add work efficiency
Rate is high, easy to operate and processing structure has extraordinary motility.
Inquire about through related data, have several documents to report and utilize the femtosecond laser single Fresnel zone plate of direct ablation,
Such as, " the OPTICS EXPRESS " that publish according to U.S. " Optical Society ofAmerica " 2002 (Vol.10,
No.19, September 2002, p978-983) report, WataruWatanabe et al. utilizes femto-second laser pulse at quartz glass
Single Fresnel zone plate is machined on glass；Laser and optoelectronics international conference (CLEO:2011-Laser in 2011
Science to Photonic Applications, entitled " the Fabrication of binary Fresnel of article
Lenses in PMMAby femtosecond laser micromachining ") report, R.
Mart í nez V á zquez et al. utilizes femtosecond laser single Fresnel zone plate of ablation on PMMA material.
But utilize femtosecond laser at transparent material surface direct ablation Fresnel chip arrays, the most not yet find relevant
Report.
For utilizing Fresnel chip arrays to process micro-nano structure, there is document to report and utilize spatial light modulator to generate
Fresnel chip arrays processing micro-nano structure, such as, within 2006, go out according to the U.S. " Optical Society ofAmerica "
" OPTICS LETTERS " (Vol.31, No.11, June 2006, p1705-1707) report of version, Satoshi Hasegawa
Et al. in spatial light modulator, load the pattern being made up of multiple phase place Fresnel Lenses, then femtosecond laser is through this space
After photomodulator on microscope slide ablation multiple holes array structures.But spatial light modulator can not bear the highest power,
And the transparent material media such as glass can bear the highest power, so for utilizing the Fei Nie of ablation on the transparent materials such as glass
That zone plate parallel fabrication micro-nano structure, it is higher to the energy utilization efficiency of femtosecond laser, and can process more simultaneously
Micro-nano structure.The most not yet find that pertinent literature utilizes the Fresnel chip arrays of the direct ablation of femtosecond laser to carry out parallel fabrication
The report of micro structure.
Summary of the invention
Goal of the invention is the problems such as inefficiency and the micro-nano structure course of processing complexity of solution micro-nano technology, it is provided that one
Plant Fresnel zone plate array making method based on femtosecond laser and the application in micro-nano technology thereof.
Technical scheme:
The manufacture method of a kind of Fresnel chip arrays based on femtosecond laser, the making step of the method is as follows: fly
Second laser (1) in transparent dielectric material ablation pore structure directly on a surface, utilizes three-dimensional mobile platform (4) after tightly focused simultaneously
Mobile transparent dielectric material so that the position of ablation concentric circular rail along the odd number or even loop band structure of Fresnel zone plate
Mark moves, thus in transparent dielectric material ablated surface single Fresnel chip architecture；Then by two dimension electronic control translation stage
(5) transparent dielectric material is moved, process Fresnel chip arrays according to given spatial arrangements mode.
Described transparent dielectric material is the transparent medium thin slice of polishing both surfaces.Described transparent medium thin slice includes melting
Quartz glass, BK7 glass or lithium columbate crystal, but it is not limited only to this different materials.
Invention also provides the application in directly processing micro-nano structure of the described Fresnel chip arrays, should
Include by method: femtosecond laser (1) is focused into many focal spots array after described Fresnel chip arrays (2), these many focal spots
Array is direct ablation loose structure on sample surfaces to be processed, controls sample to be processed (3) by pre-by three-dimensional mobile platform
Fixed track moves the micro-nano structure array obtaining required figure.
Described sample to be processed includes metal film, quasiconductor, transparent medium or metal material.
The array structure that micro-nano structure display is various figures processed, including rectangular array structure, circular array
Structure or oval-shaped array structure.
Principle illustrates:
For processing micro structure expeditiously, we machined and are arranged according to certain rules by multiple identical Fresnel zone plates
The Fresnel chip arrays (2) of row, and utilize this array femtosecond laser (1) to be focused into the focal spot battle array being made up of multiple hot spots
Row；For processing micro structure quickly and easily, we directly utilize this spot array in material surface (3) ablation micro structure.And
For the single Fresnel zone plate in Fresnel chip arrays, it is made up of multiple zonary structures, and the most adjacent two
Phase place or the amplitude of annulus (odd number annulus and even number annulus) are different, and the radius ρ of each ringn(represent sequentially from interior to
The radius of outer n-th ring, n=56 in the present invention) it is represented by:
Then its principal focal distance is f=ρ1 2(wherein λ is lambda1-wavelength to/λ, ρ1It is the internal ring radius of first annulus), numerical value
Aperture NA=ρN/f(ρNFor zone plate outer shroud radius).Therefore pledge love at zone plate outermost ring size (effective clear aperature)
Under condition, when the first girdle radius more hour, the annulus number of zone plate is the most, and focal length is the least, and numerical aperture is the biggest, then its main focal spot
Size is the least.
We process the method for zone plate and mainly by microcobjective, femto-second laser pulse are focused on transparent medium material
Behind material surface, the energy and the switch that control femto-second laser pulse carry out ablation (material is removed) to transparent dielectric material surface,
Controlling sample by three-dimensional mobile platform (4) to move by circuit orbit, its circuit orbit radius is in even number or odd loop simultaneously
In band radius, and the spacing of the most adjacent two circuit orbit radiuses is about 300nm in each annulus.
Controlled the movement of transparent dielectric material by two dimension electronic control translation stage (5), make femtosecond laser at transparent dielectric material
The diverse location on surface processes multiple Fresnel zone plates arranged according to certain rules, and these zone plates constitute Fresnel zone plate
Array, such as the Fresnel chip arrays of the cubic symmetric arrays mode shown in Fig. 2.Femtosecond laser is after collimation, contracting bundle
Incide Fresnel chip arrays and be focused into the spot array being made up of multiple focal spots, this spot array arrangement mode and institute
The Fresnel chip arrays arrangement mode used is identical, if these spot arrays are positioned on sample surfaces, swashs at incident femtosecond
Sample surfaces can be carried out ablation in the case of optical pulse energy is sufficiently strong, then obtain hole array at sample surfaces.If flown
Second laser pulse carries out ablation through Fresnel chip arrays to sample surfaces, controls sample by three-dimensional mobile platform (4) simultaneously
Product are moved by certain track, then can obtain multiple (this rule and Fresnel chip arrays row according to certain rules at sample surfaces
Row rule is identical) graphic array that arranges, the such as rectangular array pattern of the cubic symmetric arrays mode shown in Fig. 3.
Advantages of the present invention and beneficial effect
(1) being that parallel fabrication processes multiple structure the most simultaneously due to the method, therefore working (machining) efficiency is high；
(2) this processing method required device is few, and operating process is simple；
(3) compared with photoetching, the course of processing of the method without other auxiliary materials and technical process, and to environment without
Polluting, unharmful substance discharges.
(4) due to can different Fresnel zone plate parameter (such as annulus number, the radius of first ring, the ripple of flexible design
The size of strap) and the Fresnel chip arrays of various zone plate arrangement mode, and control sample by mobile platform
Movement process various micro structure, therefore the method has extraordinary motility.
Accompanying drawing explanation
Fig. 1 is the direct processing method schematic diagram of femtosecond laser parallel based on fresnel lens array, and 1 is that incident femtosecond swashs
Light pulse, 2 is Fresnel chip arrays, and 3 is sample to be processed, and 4 is that (precision is high but moving range for three-dimensional mobile platform
Little), 5 is two dimension electronic control translation stage (precision is relatively low but moving range is big).
Fig. 2 is that the Fresnel chip arrays combined in four directions symmetric arrays mode by 25 Fresnel zone plates shows
It is intended to.
Fig. 3 is rectangular array pattern schematic diagram.
Fig. 4 is to utilize femto-second laser pulse Fresnel zone plate array optical microgram of direct ablation on glass, its
In a diameter of 200nm of each Fresnel zone plate；Wherein, (a) is artwork, (b) be (a) amplifies in white dashed line frame after
Single Fresnel zone plate optical microscopy map.
Fig. 5 is to utilize Fresnel zone plate rectangular array figure of direct ablation on copper film, whole figure a size of 1mm ×
1mm。
Detailed description of the invention
In conjunction with drawings and Examples, the present invention is described in more detail, it is noted that but the invention is not limited in
These embodiments.
Embodiment 1, Fresnel zone plate display makes
In order to process Fresnel chip arrays as shown in Figure 2.First, we utilize numerical aperture be 0.75 micro-
Femto-second laser pulse, (coming from the femtosecond laser of relevant company, its centre wavelength 800nm, pulse recurrence frequency is object lens
1kHz, individual pulse width is 35fs) focus on BK7 glass sheet surface (two surfaces being perpendicular to incident illumination are polished).Secondly,
Control sheet glass by three-dimensional mobile platform (PI Corp. produces, and model is P-562.3CD) to move according to our required track
Move and i.e. move along circular concentric track in the even number annulus of Fresnel zone plate, and adjacent two circular rail in each annulus
The spacing of road radius is about 300nm so that the femtosecond laser focal spot after focusing in Fresnel even loop band structure to glass
Glass surface carries out ablation, has obtained the single Fresnel zone plate as shown in Fig. 4 (b).Femtosecond laser ablation shown in Fig. 4 (b)
The a diameter of 200nm of Fresnel zone plate, processed annulus number is 28, and the internal ring radius ρ of first annulus1For
13.36μm.Finally, by two dimension electric control platform, (two models coming from Beijing Zolix Instrument Co., Ltd. are PSA-
The one-dimensional electronic control translation stage of 100-11-x combines) movement of control sheet glass, machined as shown in Fig. 4 (a) by four
Symmetrical compact arranged 5 × 5 Fresnel chip arrays in side.
Embodiment 2, processing micro structure
As it is shown in figure 1, after we restraint (spot diameter is become 1.6mm from 8mm) collimated for femto-second laser pulse 1, contracting, and
Impinge perpendicularly on Fresnel chip arrays 2 (as shown in Fig. 4 (a)).Impinge perpendicularly on the femtosecond of Fresnel chip arrays
Laser focusing becomes multiple focal spot, and this focal spot incides on sample (copper film) 3 to be processed.By changing incident femtosecond laser
Pulse energy so that it is reach the ablation threshold of copper film, thus copper film is removed, makes to be added by moving three dimension sample stage 4 simultaneously
Work sample is moved by rectangle track, obtains rectangular array pattern as shown in Figure 5.
Claims (6)
1. the manufacture method of a Fresnel chip arrays based on femtosecond laser, it is characterised in that the making step of the method
As follows: femtosecond laser (1) in transparent dielectric material ablation pore structure directly on a surface, utilizes three-dimensional mobile after tightly focused simultaneously
The mobile transparent dielectric material of platform (4) so that the position of ablation is along the odd number or even loop band structure of Fresnel zone plate
Concentric circular tracks moves, thus in transparent dielectric material ablated surface single Fresnel chip architecture；Then by two dimension electricity
Transparent dielectric material is moved by control translation stage (5), processes Fresnel zone plate battle array according to given spatial arrangements mode
Row.
Manufacture method the most according to claim 1, it is characterised in that described transparent dielectric material is the saturating of polishing both surfaces
Bright media sheet.
Manufacture method the most according to claim 2, it is characterised in that described transparent medium thin slice be fused silica glass,
BK7 glass or lithium columbate crystal, but it is not limited only to this different materials.
4. the application in directly processing micro-nano structure of the Fresnel chip arrays described in any one of claims 1 to 3, it is special
Levy and be to include: femtosecond laser (1) is focused into many after the Fresnel chip arrays (2) described in any one of claims 1 to 3
Focal spot array, this many focal spots array is direct ablation loose structure on sample surfaces to be processed, by three-dimensional mobile platform control
Sample to be processed (3) is moved the micro-nano structure array obtaining required figure by desired trajectory.
Application the most according to claim 4, it is characterised in that described sample to be processed includes metal film, quasiconductor, thoroughly
Bright medium or metal material.
6. according to the application described in claim 4 or 5, it is characterised in that the battle array that micro-nano structure display is various figures processed
Array structure, including rectangular array structure, circular array structure or oval-shaped array structure, but is not limited only to these structures.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511551A (en) * | 2018-05-18 | 2018-09-07 | 华侨大学 | A kind of concentrating solar battery of integrated Fresnel zone plate |
| CN109633917A (en) * | 2019-01-11 | 2019-04-16 | 珠海迈时光电科技有限公司 | A kind of laser beam splitter |
| CN109702329A (en) * | 2019-03-06 | 2019-05-03 | 广东工业大学 | A kind of array laser processing method |
| CN112596251A (en) * | 2020-12-22 | 2021-04-02 | 吉林大学 | Flexible adjustable diffractive optical element for shaping laser spots, and preparation method and application thereof |
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