CN101551476A - Laser three-dimensional preparing method of non-spherical micro-lens - Google Patents
Laser three-dimensional preparing method of non-spherical micro-lens Download PDFInfo
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- CN101551476A CN101551476A CNA2009100669185A CN200910066918A CN101551476A CN 101551476 A CN101551476 A CN 101551476A CN A2009100669185 A CNA2009100669185 A CN A2009100669185A CN 200910066918 A CN200910066918 A CN 200910066918A CN 101551476 A CN101551476 A CN 101551476A
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Abstract
The present invention belongs to the technical field of micro-manufacturing, and specifically to a method for preparing non-spherical micro-lens and micro-lens array with laser three-dimensional processing. Firstly computer software is compiled for obtaining the point cloud data of non-spherical micro-lens model. Then the curable material is coated on the surface of hard substrate. Then the curable material is gradually scanned and solidified under the control of computer program through a laser three-dimensional processing system according to the point cloud data of non-spherical micro-lens model. The non-spherical micro-structure is obtained after developing. The micro-structure is used as a stencil. The non-spherical micro-lens and array of substrate material are obtained through etching. The method of the invention overcomes the boundary that a hot melting method only can prepare the spherical micro-lens and the diamond milling method is hard for preparing the micro-lens array. The non-spherical micro-lens and array with random profile in the vertical and horizontal direction can be obtained. 100% filling probability can be realized for the micro-lens array. Simultaneously the adjustable non-spherical micro-lens and array with the numerical aperture of 0-1 can be obtained.
Description
Technical field
The present invention relates to the preparation method in little manufacturing field, specifically relate to a kind of laser three-D processing and preparing aspherical microlens and microlens array preparation method of utilizing.
Technical background
Micro-optic one speech is at first proposed in 1981 by field in the Nippon Electric Company, Ltd. auspicious two, mainly refers to variable refractivity lens and lenticule at that time.Through nearly 30 years development, micro-optic has become of contemporary optics and has enlivened branch.The micro optical element that is in micro-optic research core status is contained refractive and diffraction type two big classes, and the former mainly comprises graded index lenticule and array and common lenticule and array; The latter mainly comprises optimum phase element, binary optical elements, Fresnel Lenses and optical grating construction etc.No matter be design theory or job operation, micro-optic has been different from traditional macroscopical optics fully, becomes the new science that optics, microelectronics, optoelectronics and micro mechanical technology interpenetrate, intersect, merge.And micro optical element has become the crucial composed component of low profile photovoltaic subsystem, it has that volume is little, light weight, cost are low, be easy to advantages such as array, and function such as small, the array that can realize that the ordinary optical element is difficult to realize, integrated, imaging and corrugated conversion.In nearly all engineering application, as optical fiber communication, information processing, space flight and aviation, biomedicine, Laser Processing, photometry calculation, optical storage etc., micro optical element all demonstrates more and more significant values and wide application prospect.
Micro-optic research and application are support with the micro-processing technology.With element-lenticule the most basic in the micro-optical systems and array thereof is example, and the preparation method who has adopted at present comprises: (1) has planar technology ion exchange process, fotoceram method, holography method, Fresnel zone lens method, sol-gel process, photoresist fusion method, PMMAX rayed and fusion method etc. for the refractive element.The secondary forming facture of micro lens respond ion etching method, electron beam lithography and laser ablation method; (2) for the diffraction type lenticule, its manufacturing technology mainly contains: based on binary optical technique, bundle energy direct writing technology and the gray scale mask technology etc. of plane photoetching.These development of technology have promoted miniaturization, the array and integrated of optical system and photoelectric instrument significantly.Meanwhile, engineering from medical science health to every field such as space flight national defence is used and conversely little technology of preparing has been proposed a series of higher requirements again, wherein demand is the most urgent, and the insoluble problem of prior art is exactly, and how to realize aspherical microlens and array.
People can trace back to flute card in 1638 for the understanding of non-spherical lens and propose the no spherical aberration aplantic lens that is made of protruding ellipsoid and concave spherical surface first.1663 subsequently Ge Ligao have proved that conic section can correct spherical aberration, and newton's in 1671 parabolic telescope and Xiao Te in 1732 have made the Ge Ligao telescope with parabolic and ellipsoid.Since then, aspherical optical element begins to be applied in telescope.Up to the sixties in 20th century, because the appearance of technology such as space flight, aviation, astronomy, electronics, communication and laser, increase suddenly for the demand of non-spherical lens.In optical system, adopt aspherical optical element, have the incomparable advantage of spherical optics element, as can spherical aberration corrector, coma, astigmatism and distortion; The lens combination that can use single lens to replace a plurality of spherical mirrors to form reduces optical energy loss, and increase effect distance obtains high-quality image effect and high-quality optical characteristics; Use aspherical optical element simplified structure significantly, reduce the size and the weight of optical system.For example, the space remote sensing camera in the KH-11 satellite uses on-plane surface from axle three anti-anastigmatic systems, and ground resolution GSD reaches 0.15 meter; Present U.S.'s reconnaissance satellite even reached 0.0125 meter; Laser aid in the military products, thermal imaging device, scanner, night vision device, fire control system have all been used a large amount of on-plane surface optical elements, a survey report of AUS shows, 23.46 ten thousand of military laser of-nineteen ninety in 1980 U.S. and aspherical optical elements that thermal imaging product has consumed.In a large amount of optical elements that use in the civilian goods,, all contain a large amount of aspherical optical elements as digital camera (3.5 hundred million slices/year), projector (1,200 ten thousand slices/year) and optical read head (1,000,000,000 slices/year).But it must be noted that the aspherical optical element in the above-mentioned application all is the element of large scale or general size, but not micro optical element.Because processing difficulties, optical system still can't satisfy for the heavy demand of aspheric surface micro optical element.
The processing of aspherical optical element is a difficult problem of generally acknowledging both at home and abroad.For the high problem of difficult processing, cost that solves aspherical optical element, the job operation that works out has at present had tens kinds, from developing history, be the machining process that develops into the track moulding from manual job operation substantially, digital control processing up till now again (as the aspheric surface milling of diamond lathe).Yet owing to conspicuous reason, these methods are difficult to be applicable to that the minimum micro optical element of size prepares.
The processing of laser micro-nano is a kind of non-linear process technology, be used to prepare microstructures such as micro optical element, micromechanics, the following remarkable advantage that has: (1) very three-dimensional, can design, can be integrated: adopt wavelength to be positioned at the red sector or the near-infrared wavelength of the visible light of a lot of material transparent windows, can make the loss-free material internal that focuses on of laser, thereby the three-dimensional working ability with intrinsic, complicated three-dimension device structure can be according to CAD (Computer-Aided Design) design one-shot forming; (2) high-resolution, stride yardstick: because the absorption cross section of non-linear process such as multi-photon absorption etc. is very little, the photochemical reaction that processing needs is rigidly adhered near the high photon density zone minimum focus; In addition, because excitation process ultrafast (about representative value-time domain pulse width 100 femtoseconds) has been avoided hot slow Henan (typical time constant is that nanosecond is to hundred psecs),, femtosecond becomes a quasi-adiabatic process thereby being excited; The 3rd carry out 3-D scanning owing to use piezoelectric ceramics (PZT) to wait, can obtain the nanometer scale mobile accuracy, more than three promises the high machining resolution of femtosecond laser processing breakthrough diffraction limit until tens to tens nanometers.Certainly, increase the focal beam spot diameter, cause the preparation of large scale structure naturally, thereby this technology is natural possesses the yardstick of striding manufacturing capacity; (3) material wide spectrum, antivacuum:, can interact with any material almost, thereby it is restricted hardly to can be used for laser micro-nano material processed because the instantaneous power of femto-second laser pulse is very big.The most important mechanism of two classes wherein, the one, the inside of transparent solid is carried out the local material modification of micro-nano precision; Another is the two-photon pointwise photopolymerization of liquid resin material, and the two is all realized under atmospheric conditions, does not need high vacuum, thereby has the industrial applications prospect.Therefore utilize laser micro-nano process technology to prepare microcomponent and be considered to one of the most effective means, have huge application potential and tempting development prospect.
Summary of the invention
The object of the present invention is to provide a kind of preparation method who utilizes the laser three-D process technology to obtain aspherical microlens and array (length of lenticular dimensional parameters: x, y, z direction is 100nm～1mm, and its tangent plane vertical and horizontal direction can be irregular any profile).
This aspherical microlens is to utilize the accurate design outline of computer software, in conjunction with the high precision of laser micro-nano process technology, true processing characteristic such as three-dimensional, broken through hot melt and can only prepare the limitation that spherical microlens, adamas milling method are difficult to prepare microlens array; Can obtain the aspherical microlens and the array of vertical and any profile of horizontal direction, can realize that for microlens array 100% fills probability, can obtain aspherical microlens adjustable between the numerical aperture 0～1 and array thereof simultaneously.
The present invention is achieved by the following technical solutions: at first work out the cloud data that computer software obtains the aspherical microlens model, then curable materials is coated on the hard substrate surface, under computer program control, utilize laser three-D system of processing point by point scanning cure curable material again, after developing, obtain the aspheric surface microstructure, with this microstructure is masterplate, obtains the aspherical microlens and the array of base material through etching.
The method of the invention, more specifically step is as follows for it:
(1) the establishment computer software obtains aspherical microlens model point cloud data
Described computer software is meant and utilizes programming language to work out.
Described programming language comprises Visual Basic, C language, Fortran, Cobol, Pascal/Delphi, LISP, Java, Power Builder etc.
The described Visual of utilization Basic establishment computer software is meant by the design window interface, the attribute of various objects in the interface, " process " carried out when being defined in by certain " incident " activation for object is set, by certain complete model point cloud data of algorithm establishment.
Described C language comprises Visual C++, Borland C++, Watcom C++, Borland C++, Borland C++Builder, Borland C++3.1.
The described Visual of utilization C++ establishment computer software is meant the project of setting up, utilize editing machine creation facilities program (CFP) code file, comprise header file, code file, resource file etc., class at program's code file inediting point, ring, face, according to its object of class definition, carry out the write-in functions of object, obtain the model point cloud data.
Described aspherical microlens cloud data is made of different closed surfaces, and from down to up, the area of closed surface is decreased to zero gradually.
(2) build laser-processing system
Build in order to implement the laser three-D system of processing of scanning of laser microcell and material cured.Described laser three-D system of processing comprises: light-source system, software control system, three-dimensional accurate mobile system and real-time monitoring system.
The light source of described light-source system is chosen as femtosecond pulse system, picosecond pulse laser system, ps pulsed laser and ns pulsed laser system or continuous laser system, produces the light beam that is used for three-dimensional laser processing; The wavelength coverage of femtosecond pulse system is 200～2600nm, and pulse width range is 10fs～900fs, and repetition frequency range is 1Hz～1GHz, single pulse energy weight range 10pJ～1mJ; The wavelength coverage of picosecond pulse laser system is 200～2600nm, and pulse width range is 0.9ps～900ps, and repetition frequency range is 1Hz～1GHz, single pulse energy weight range 1nJ～1J; The wavelength coverage of ps pulsed laser and ns pulsed laser system is 200～2000nm, and pulse width range is 0.9ns～900ns, and repetition frequency range is 1Hz～10KHz, single pulse energy weight range 10pJ～1J.
The control program that software control system utilizes Visual Basic to write reads above-mentioned cloud data, and then by the three-dimensional accurate mobile system of the serial port drive that links to each other with computing machine.
Three-dimensional accurate mobile system is used for controlling the three-dimensional motion of laser focusing point at curable materials, can be divided into two classes, one class is made up of two-dimensional high speed scanning mirror and two kinds of elements of high technology ceramics piezoelectricity platform, tilting mirror control laser level x, y direction move, and piezoelectricity platform control sample z direction moves up and down; Another kind of is only to be made of a kind of element of the mobile piezoelectricity platform of three-dimensional, and the control sample moves on x, y, z direction.Tilting mirror and the mobile of piezoelectricity platform are controlled by software control system, and the precision of two type systematics all can be reached for 1nm.Adopt the tilting mirror of the T8306 model of Beijing Century Nissan company limited can make laser moving range on x, y direction be respectively 100 μ m, 100 μ m; Adopting high technology ceramics piezoelectricity platform moving range on the z direction of the German Physik Instrumente P622 of company model is 250 μ m; Perhaps adopt three-dimensional mobile piezoelectricity platform moving range on x, y, z direction of the German Physik Instrumente P517.3 of company model to be respectively 100 μ m, 100 μ m, 20 μ m.
The general lighting light source of real-time monitoring system (as 15 among Fig. 1) is positioned at piezoelectricity platform and sample top, its visible light that sends, by dielectric mirror (as 10 among Fig. 1), through catoptron (as 13 among Fig. 1), enter CCD camera (as 16 among Fig. 1), in laser processing procedure, utilize the refractive index difference of material photocuring front and back to light, make the CCD imaging, directly monitor the processing imaging, whole process is monitored in real time.
Employed equipment, optical device etc. are conventional products in the top step.Catoptron is the multilayer dielectric film catoptron, and the scope of the translational speed of laser facula is 1nm/s～1cm/s.
(3) the Laser Processing curable materials solidifies, and the back of developing obtains the aspheric surface microstructure
Curable materials is coated on plane, and coating thickness is 100nm～2mm, and substrate is fixed on the piezoelectricity platform; Software control system sends instruction, the open and close of the break-make of control optical gate and then control laser beam; Software control system drives three-dimensional accurate mobile system, and then makes laser spot point by point scanning in curable materials of focusing, and laser scanning place curable materials solidifies, and realizes solidifying according to the microstructure model selectivity in curable materials.Uncured portion promptly obtains microstructure after developing.
According to base material the ability that sees through of light is inverted processing or is just being put processing; Be inverted processing and be meant that laser focuses in the curable materials through base material earlier again, just putting processing and be meant that laser directly focuses in the curable materials without base material.
Described curable materials is meant that liquid or viscous material become the material of solid after light or heat effect, comprise photo-curing material and thermosetting material.
Described photo-curing material is meant under light action can cause chemical reactions such as material polymerization, reduction, isomerization, thereby makes material become solid state, comprises photosensitive resin, light-cured resin, photoresist, photoresist etc.;
Described photo-curing material is polymerization reaction take place under light action, and polymerization mechanism comprises free radical polymerization, cationic polymerization, anionic polymerisation, and polymeric type comprises ring-opening polymerization, olefinic polymerization etc.
Thereby being meant generation physical change of thermal induction material and chemical reaction, described thermosetting material make material become solid state by liquid condition.
Described developing process is to utilize solvent that uncured material is washed, and solvent comprises acetone, tetrahydrofuran, chloroform, toluene, benzene, methylene chloride, ethanol, methyl alcohol etc. or other developer corresponding with curable materials.
(4) obtain the microlens structure of base material through etching
Utilize lithographic technique that the curable materials aspheric surface microstructure that above-mentioned Laser Processing obtains is carried out etching, thereby obtain the aspherical microlens or the aspherical microlens array of base material, adjust etching condition and can change lenticular numerical aperture.
Described lithographic technique comprises: lithographic techniques such as reactive ion etching, plasma etching, reactive plasma etching, ion beam etching, reactive ion beam etching (RIBE).
The gas that described reactive ion etching is selected for use comprises that argon gas, oxygen, special gas and two or more gas mix.
Described special gas comprises CF
4, CHF
3, CCl
2F
2, CCl
4, BCl
3, C
2F
6, SF
6, HBr, H
2, Cl
2Deng;
Described mixed gas comprises CF
4+ H
2, SF
6+ O
2, CCl
4+ Ar, CCl
4+ Cl
2, BCl
3+ Cl
2, CCl
4+ O
2, CF
4+ O
2, CF
4+ O
2, CCl
2F
2+ CF
4+ O
2+ Ar etc.;
Described base material comprises: glass, quartz, semiconductor and metal material etc.
Described semiconductor material comprises: Si, Ge, Si
3N
4, GaAs, GaP, GaSb, InP, GalnAsP, TeCdHg, SiC etc.
Described metal material comprises: Cr, Ti, Ta, Nb, Al, Mo, W, V etc.
The thickness of described base material is usually greater than 80 μ m.
Description of drawings
Fig. 1: laser-processing system synoptic diagram;
Fig. 2: (a) ellipsoid lacks lenticular SEM image; (b) vertical substrate direction tangent plane profile is parabola shaped lenticular SEM image; (c), the Theoretical Calculation silhouette contrast of (d) SEM lenticule topography measurement profile and mathematical formulae.
Fig. 3: the aspherical microlens array of square arrangement, (a) and (b) are respectively the overall picture and local scanning electron microscope (SEM) picture of 10 * 10 microlens arrays, (c) microlens array absorption spectrum is (d) at the focus chart picture of focal plane place square microlens.
Fig. 4: the multiple array that square aspherical microlens is formed.(a), (c) is respectively the SEM image of pattern " OLED ", " 1+1=2 ".(b), (d) is respectively the focus chart picture of two pattern correspondences.
Fig. 5: sexangle aspherical microlens, (a) and (b) are respectively from the top and the part of 11 * 13 microlens arrays that tilts 35 ° the time and amplify the SEM picture.(c) the lenticular imaging character of sexangle is placed letter " F " at the focal plane position place, and the sexangle lenticule can be the picture of " F " letter.(d) focus imaging of locating in the focal plane.
Fig. 6: the sexangle aspherical microlens array of three kinds of numerical apertures, (a), (c), (e) are the SEM image of the sexangle aspherical microlens array of 5 μ m, differing heights for the length of side, lenticular height is respectively 1.2,1.8 and 2.4 μ m, (b), (d), (f) be that the SEM image is amplified in the part of these microlens array correspondences.
Fig. 7: the optical characterisation of the sexangle microlens array of different numerical apertures; (a), (c), (e) are at the focus imaging of focal plane; (b), (d), the lenticular imaging character of (f) sexangle, place letter " F " at the focal plane position place, the sexangle lenticule can be picture of " F " letter.
As shown in Figure 1, each parts is: 1 light-source system, 2 attenuators, 3 optical gates, 4 catoptrons, 5 catoptrons, 6 catoptrons, 7 convex lens, 8 convex lens, 9 tilting mirrors, 10 dielectric mirror, 11 object lens, 12 piezoelectricity platforms, 13 catoptrons, 14 lens, 15 lighting sources, 16 is the CCD camera.Fig. 1,2,3,4 is corresponding to embodiment 1, and Fig. 1,5,6,7 is corresponding to embodiment 2.
Embodiment
Embodiment 1:
(1) utilize Visual Basic programming language to work out the cloud data of segment shape lenticule model
The lenticule program that the establishment ellipsoid lacks, it is that 10 μ m, height H are 10.5 μ m that ellipsoid lacks the bottom surface radius r.At first utilize formula x
2+ y
2+ [0.95z+ (r
2+ H
2/ 2H)-H]
2=(r
2+ H
2/ 2H)
2The lenticule mould shapes of the scarce shape of acquisition ellipsoid (0＜x, y≤r, 0＜z≤H).Then this model is carried out horizontal direction slicing treatment (slice thickness is 100nm), each section is made up of the annulus (radius is 100nm at interval) of some same centers of circle, different radii, each annulus is made up of some point of contacts (point of contact is 100nm at interval) again, each point of contact in each section is write cloud data, and then obtain the cloud data that ellipsoid lacks shape lenticule model.
Establishment vertical direction tangent plane profile is parabola shaped lenticule program, and lenticule bottom surface radius r is 10 μ m, and height H is 10 μ m.At first utilize formula z=-a (x
2+ y
2)+H[a=0.06, H=10,0＜x, y≤r, 0≤z≤H] to obtain tangent plane be parabola shaped lenticule mould shapes, then this model is carried out horizontal direction slicing treatment (slice spacings 100nm), each section is made up of some same centers of circle, different radii annulus (radius is 100nm at interval), and each annulus is made up of some point of contacts (point of contact is 100nm at interval), each point of contact in each section is write cloud data, obtain the cloud data that tangent plane is parabola shaped lenticule model.
The establishment length of side is that 7 μ m, height H are the model data of the square aspherical microlens array of 1.5 μ m.At first utilize formula z=-a (x
2+ y
2)+H[a=0.06, H=1.5,0＜x, y≤50＜z≤H] obtain the lenticule mould shapes, then this model is carried out horizontal direction slicing treatment (slice spacings 100nm).Each section is made up of some same centers of circle, different radii annulus (radius is 100nm at interval), each annulus is made up of some point of contacts (point of contact is 100nm at interval), judge for each point of contact in each section whether it is being in the square area of 7 * 7 μ m in center, this slice plane with the lenticule center, if this point is in square area then write cloud data, if this point not in square area then do not write, obtains the cloud data of a square aspherical microlens model thus.Duplicate, move to assigned address and obtain the array of a plurality of lenticule models or the cloud data of combination through lenticular again; Comprise 10 * 10 square microlens arrays, form letter " OLED " printed words and " 1+1=2 " pattern of forming by 50 lenticules by 53 lenticules.
The following is the Visual Basic programming language establishment n * n square microlens Array Model program of utilizing:
Public?Function?MicroLensArray(ByVal?n?As?Long，ByVal?h?As?Long，pa()As?Point，ByVal?Rs?As?Long，ByVal?stp_dot?As?Long，ByVal?stp_line?As?Long，ByVal?stp_layer?As?Long)
Dim?r_tmp?As?Long
ReDim?pa(n，n)
For?i＝0?To?n-1
For?j＝0?To?n-1
pa(i，j).X＝i＊Sqr(2)＊Rs-(n-1)＊1.414＊Rs/2
pa(i，j).Y＝j＊Sqr(2)＊Rs-(n-1)＊1.414＊Rs/2
Next?j
Next?i
For?k＝0?To?h?Step?stp_layer
For?i＝0?To?n-1
For?j＝0?To?n-1
pa(i，j).Z＝k
r_tmp＝Rs＊Sqr(h-k)/Sqr(h)
Call?ring(pa(i，j)，1，r_tmp，stp_dot，stp_line)
Next?j
Next?i
Next?k
pa(i，j).Z＝h
Call?ring(pa(i，j)，1，stp_dot，stp_dot，stp_line)
End?Function
Public?Function?ring(p?As?Point，r1?As?Long，r2?As?Long，stp_dot?As?Long，stp_line?As?Long)
Dim?r?As?Long
Write?#1，p.X，p.Y，p.Z
For?r＝r1To?r2Step?stp_line
Call?circle1(p，r，stp_dot)
Next?r
Call?circle1(p，r2，stop_dot)
End?Function
Public?Function?circle1(p?As?Point，r?As?Long，stp_dot?As?Long)As?Long
Dim?i?As?Long
Dim?arf?As?Long
Dim?x_tmp，y_tmp?As?Long
i＝0
Do?While?i＊stp_dot＜＝2＊pi＊r
If?r＝0?Then?r＝1
x_tmp＝r＊Cos(i＊stp_dot/r)
X＝p.X+x_tmp
y_tmp＝r＊Sin(i＊stp_dot/r)
Y＝p.Y+y_tmp
Z＝p.Z
If?Abs(x_tmp)＜Rs＊Sqr(0.5)And?Abs(y_tmp)＜Rs＊Sqr(0.5)Then
Write?#1，CLng(X)，CLng(Y)，CLng(Z)
End?If
i＝i+1
Loop
End?Function
(2) build the femtosecond pulse system of processing.Laser is built synoptic diagram as shown in Figure 1, through femtosecond pulse system 1 (as Spectra-Physics, Ti-sapphire mode-locked laser) (centre wavelength is 790nm to Shu Chu femtosecond pulse, pulse width is 120fs, repetition frequency is 80MHz, 1.2 watts of average powers) through attenuator 2 (OD2 type, light intensity after the decay can be 1%～100% of original light intensity, in this example the decay after light intensity be original light intensity 12%), optical gate 3 and three catoptrons 4 that are used to adjust light path, 5, enter the convex lens 7 that are used to focus on after 6, making beam spread through another convex lens 8 again is the bigger parallel beam of spot diameter, convex lens 7, distance between 8 is two focal length of lens sums, spot diameter is 1～2mm before the diffusion, diffusion back spot diameter is 5mm～2cm), pass through tilting mirror 9 again, tilting mirror scalable laser spot X, the Y-axis position, after dielectric mirror 10 enters object lens 11, focus in the sample on the piezoelectricity platform 12, the spot diameter that focuses on is about 500nm, light spot energy is about 100 μ J, by moving of computer program control piezoelectricity platform sample is carried out Laser Processing, sample is the substrate that surface-coated has curable materials.
Used dielectric mirror 10 can make the energy of laser beam 99% reflect to be used for processing, and makes the lighting source visible light emitted total transmissivity of real-time monitoring system be used for monitoring.The general lighting light source of real-time monitoring system (as 15 among Fig. 1) is positioned at piezoelectricity platform and sample top, put an aluminium sheet on the piezoelectricity platform, aluminium sheet hollow out one zone, edge position of keeping to the side, about 2cm * 3cm, substrate is placed in the top by the hollow out place, substrate and sample are transparent, visible light by dielectric mirror (10 among Fig. 1), through catoptron (13 among Fig. 1), enter CCD camera (as 16 among Fig. 1).The scanned position curable materials of laser spot solidifies, and utilizes to solidify the refractive index different CCD imagings of front and back material to light, before the material cured, does not have lenticular picture in CCD; Material cured, refractive index changes, and observes the picture of processing in CCD, and whole process is monitored in real time.
The focal length of used convex lens 7 is 30mm, and the focal length of convex lens 8 is 200mm, and object lens 11 are that 100 multiple value apertures are 1.4 immersion oil object lens.
(3) Laser Processing obtains square aspherical microlens.Select for use the SU8 of microchem company photoresist as photo-curing material.The SU8 photoresist evenly is coated on the cover glass surface that thickness is 120 μ m, and (surface size 3cm * 5cm), the SU8 coating thickness is 50 μ m, 95 ℃ of temperature conditions oven dry processing down.Cover glass is fixed on the piezoelectricity platform, adopts upside down processing.Above-mentioned femtosecond pulse focuses on SU8 photoresist inside through the light path among Fig. 1, according to the point by point scanning in the SU8 photoresist of foregoing square aspherical microlens program femtosecond pulse luminous point, the two-photon absorption of the initiating agent that the site of scanning contains through SU8 and make the polymerization of SU8 photoresist, curing.Utilize developer to develop, obtain microstructure
Fig. 2 for ellipsoid lack shape lenticule (a) and vertical substrate direction tangent plane profile be parabola shaped lenticule (b) be 90 SEM pictures when spending angles with base plane.Fig. 2 (c) and Fig. 2 (d) show that the wide Theoretical Calculation with mathematical formulae of lens pattern measuring wheel compares.Can see, mathematical computations and experimental result basically identical, average error is less than 17.3nm, and relative error is less than 0.2%., much smaller than the average error of hot melt 8%.
Further obtain 10 * 10 square microlens arrays [Fig. 3 (a) and (b)], " OLED " printed words and " 1+1=2 " pattern [Fig. 4 (a), (c)].Wherein each lenticular length of side is 7 μ m, and central point is 1.5 μ m apart from the bottom surface height.This aspherical microlens has good printing opacity function, can allow it to see through [Fig. 3 (c)] more than 99% for 360-1100nm wave band electromagnetic wave.Utilize microcobjective to can observe the focusing function [Fig. 3 (d) Fig. 4 (b) (d)] of these lens.
(4) reactive ion etching obtains glass square aspherical microlens
Utilize reactive ion etching technology to remove above-mentioned polymkeric substance aspherical microlens, etching gas is CF
4-O
2(O
2Percent by volume be 40%) mixed gas, pressure is 33Pa in the removal process, power is 100W, gas flow is 500sccm.Etching finishes the back and obtain glass aspherical microlens array, letter or number on substrate of glass, and wherein the average length of side of each lens still is 7 μ m, and central point is 1.4 μ m apart from the height of bottom surface.
Embodiment 2:
(1) utilizing the Visual C++ programming language establishment length of side is the cloud data of 5 μ m, highly different sexangle aspherical microlens array model.
At first utilize formula z=-a (x
2+ y
2)+H[0＜x, y≤5H are height, a=H/25] obtain the aspherical microlens mould shapes, then this model is carried out horizontal direction slicing treatment (slice spacings 100nm).Each section is made up of some same centers of circle, different radii annulus (radius is 100nm at interval), each annulus is made up of some point of contacts (point of contact is 100nm at interval), judge for each point of contact in each section whether it is being that the length of side is in the equilateral hexagon zone of 5 μ m in center, this slice plane with the lenticule center, if this point is in hexagonal region then write cloud data, if this point not in hexagonal region then do not write, obtains the cloud data of a sexangle aspherical microlens model thus.Obtain the array of a plurality of lenticule models or the cloud data of combination through the translation of lenticule replication of Model again, comprise 11 * 13 microlens arrays, form equilateral hexagon pattern by 99 lenticules.
(2) build the femtosecond pulse system of processing.Identical with embodiment 1.
(3) Laser Processing obtains the sexangle aspherical microlens.Select for use the NOA61 of Norland company ultraviolet cured adhesive as photo-curing material.NOA61 is coated on the piezoid surface that thickness is 120 μ m, and piezoid is fixed on the piezoelectricity platform.Adopt the light path of being inverted among the above-mentioned femtosecond pulse process of processing mode Fig. 1 to focus on NOA61 photoresist inside, according to the point by point scanning in the NOA61 photoresist of foregoing sexangle aspherical microlens program femtosecond pulse luminous point, the site of scanning makes the polymerization of NOA61 photoresist, curing through the two-photon absorption of initiating agent, obtains the sexangle aspherical microlens.The microlens structure of being processed microphotograph such as Fig. 5, shown in Figure 6 after developer develops comprises 11 * 13 microlens arrays, forms the equilateral hexagon array by 99 lenticules.Each lenticular length of side is 5 μ m in Fig. 5 array, and central point is 1.5 μ m apart from the bottom surface height, utilizes microcobjective to can be observed the imaging and the focus chart picture of letter " F ".Fig. 6 (a) (c) (e) lenticular length of side equates to be 5 μ m, highly be respectively 1.2,1.8 and 2.4 μ m, lenticular numerical aperture is respectively 0.28,0.40 and 0.52, increase gradually, cause focusing on focus and reduce [Fig. 7 (a) is (e) (c)], imaging clear gradually [Fig. 7 (b) is (f) (d)] gradually.
(4) reactive ion etching obtains quartzy aspherical microlens
Utilize reactive ion etching technology etching N OA61 solidfied material lenticule, selecting the length of side for use is 5um, highly is that the aspherical microlens of the hexagonal array of 1.2 μ m carries out etching.Etching gas is CF
4-O
2(O
250%) mixed gas, pressure is 36Pa in the removal process, and power is 100W, and gas flow is 500sccm.Etching finishes to obtain the quartzy aspherical microlens array of corresponding hexagonal, and wherein the average length of side of each lens is constant still is 5 μ m, and central point is 1.1 μ m apart from the height of bottom surface.
Claims (10)
1, the preparation method of aspherical microlens, its step is as follows: at first work out the cloud data that computer software obtains the aspherical microlens model, then curable materials is coated on the hard substrate surface, cloud data according to the aspherical microlens model utilizes laser three-D system of processing point by point scanning cure curable material under computer program control again, after developing, obtain the aspheric surface microstructure, with this microstructure is masterplate, obtains the aspherical microlens and the array of base material through etching.
2, the preparation method of aspherical microlens as claimed in claim 1 is characterized in that: the length of lenticule x, y, z direction is 100nm～1mm, and its and tangent plane horizontal direction vertical with substrate be regular or irregular any profile.
3, the preparation method of aspherical microlens as claimed in claim 2 is characterized in that: lenticule is that lenticule, the vertical substrate direction tangent plane profile that ellipsoid lacks is parabola shaped lenticule, square aspherical microlens array or sexangle aspherical microlens array.
4, the preparation method of aspherical microlens as claimed in claim 1, it is characterized in that: described computer software is meant and utilizes programming language to work out that described programming language is VisualBasic, C language, Fortran, Cobol, Pascal/Delphi, LISP, Java or PowerBuilder.
5, the preparation method of aspherical microlens as claimed in claim 1 is characterized in that: the laser three-D system of processing comprises light-source system, software control system, three-dimensional accurate mobile system and real-time monitoring system.
6, the preparation method of aspherical microlens as claimed in claim 5 is characterized in that:
1) light source of light-source system is femtosecond pulse system, picosecond pulse laser system, ps pulsed laser and ns pulsed laser system or continuous laser system, produces the light beam that is used for three-dimensional laser processing;
2) the software control system control program that utilizes Visual Basic to write reads the cloud data of aspherical microlens model, and then by the three-dimensional accurate mobile system of the serial port drive that links to each other with computing machine;
3) three-dimensional accurate mobile system is used for controlling the three-dimensional motion of laser focusing point at curable materials, be divided into two classes, one class is made up of two-dimensional high speed scanning mirror and two kinds of elements of high technology ceramics piezoelectricity platform, tilting mirror control laser level x, y direction move, and piezoelectricity platform control sample z direction moves up and down; Another kind of is only to be made of a kind of element of the mobile piezoelectricity platform of three-dimensional, and the control sample moves on x, y, z direction, and tilting mirror and the mobile of piezoelectricity platform are controlled by software control system;
4) real-time monitoring system is made up of lighting source, dielectric mirror, catoptron, CCD camera, and whole process is monitored in real time.
7, the preparation method of aspherical microlens as claimed in claim 1 is characterized in that: curable materials is photo-curing material or thermosetting material.
8, the preparation method of aspherical microlens as claimed in claim 7 is characterized in that: photo-curing material is photosensitive resin, light-cured resin, photoresist or photoresist.
9, the preparation method of aspherical microlens as claimed in claim 1, it is characterized in that: development is to utilize solvent that uncured material is washed, and solvent is acetone, tetrahydrofuran, chloroform, toluene, benzene, methylene chloride, ethanol, methyl alcohol or other developer corresponding with curable materials.
10, the preparation method of aspherical microlens as claimed in claim 1 is characterized in that: lithographic technique is reactive ion etching, plasma etching, reactive plasma etching, ion beam etching or reactive ion beam etching (RIBE).
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