CN106271063B - A kind of method and device of the double vacuoles of induced with laser - Google Patents
A kind of method and device of the double vacuoles of induced with laser Download PDFInfo
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- CN106271063B CN106271063B CN201610765719.3A CN201610765719A CN106271063B CN 106271063 B CN106271063 B CN 106271063B CN 201610765719 A CN201610765719 A CN 201610765719A CN 106271063 B CN106271063 B CN 106271063B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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Abstract
The present invention discloses a kind of method and device of the double vacuoles of induced with laser.When bombardment with laser beams is in liquid medium, at Laser Focusing and material surface to be processed produces vacuole simultaneously, therefore the vacuole in liquid medium induces both strong shock waves superposition caused by strong shock wave and material surface vacuole to be processed induction, material surface to be processed is acted on repeatedly or simultaneously, improve the characteristics such as material surface intensity, with the advantage such as impact pressure is high, material oxidation degree is low, therefore the apparatus and method based on a kind of double vacuoles of induced with laser are with a wide range of applications.
Description
Technical field
The invention belongs to laser technology field, more particularly to a kind of method and device of the double vacuoles of induced with laser.
Background technology
Induced with laser vacuole process technology is using cavitation oscillation and shock wave caused by crumbling and fall is in workpiece surface, with
Laser processing technology compares in air, has material oxidation degree low, fuel factor influences the features such as small.Induced with laser is empty at present
Bubble technology mainly produces vacuole comprising induced with laser liquid medium and is processed and the material to be processed in Laser Focusing liquid medium
Material surface is processed.The former has the advantages such as good controllability, position registration and impact pressure height;The latter is situated between by liquid
Matter attachment surface plasma extends, good with processing effect, the advantage such as efficiency height.
Due to laser and the complexity of liquid medium interaction, it is difficult to thorough Study of Laser induction vacuole technology.If
Two kinds of induced with laser vacuole technologies can be comprehensively utilized, produce double vacuoles, the shock wave of stackable double vacuole inductions, processing effect times
Increase.
The content of the invention
The purpose of the present invention is to provide a kind of method and device of the double vacuoles of induced with laser regarding to the issue above.Work as laser beam
Radiate in liquid medium, at Laser Focusing and material surface to be processed produces vacuole, therefore the vacuole in liquid medium simultaneously
Both strong shock waves superposition caused by strong shock wave and material surface vacuole to be processed induction is induced, acts on repeatedly or simultaneously and treats
Rapidoprint surface, improve the characteristics such as material surface intensity, there is the advantages such as impact pressure is high, material oxidation degree is low, therefore
Apparatus and method based on a kind of double vacuoles of induced with laser are with a wide range of applications.
The present invention is to realize above-mentioned technical purpose by following technological means.
A kind of method of the double vacuoles of induced with laser, it is characterised in that:Material immersion to be processed is fixed in liquid medium, is swashed
Light acts perpendicularly to liquid medium and material surface to be processed, and meets:
J=J0+J1+ KH+Q and H>R0+R1
Double vacuoles are produced in Laser Focusing point and material surface to be processed;
Wherein:J is laser energy, J0It is the breakdown threshold of liquid medium, J1For the breakdown threshold of material surface to be processed, K
For laser, unit length loss factor, Q are laser energy degree more than needed in liquid medium, and H is Laser Focusing point to material to be processed
Expect the distance on surface, R0It is J for laser energy0Laser action in liquid medium caused vacuole radius, R1For laser energy
For J1Laser action in the radius of vacuole caused by material surface to be processed.
Preferably, the Q values are 0-200mJ/cm2。
Preferably, the material to be processed is one kind in aluminium, copper, iron, zinc or titanium alloy.
Preferably, the liquid medium is one kind in water, silicone oil or electrolyte solution.
A kind of device of the double vacuoles of induced with laser, including laser control panel, laser, speculum, laser beam expanding system
System, the laser beam expanding system include laser beam expander and condenser lens, it is characterised in that:The laser control panel is with swashing
Light device is connected, and controls the output of laser device laser;The light beam that the laser is sent reflexes to laser beam expanding by speculum
On device;It is at H that the output beam of laser beam expander is focused on distance above material surface to be processed by the condenser lens;It is described
Material immersion to be processed is fixed in the container for holding liquid medium;Laser energy parameter is set by laser control panel
For:
J=J0+J1+ KH+Q, adjust the container position and meet H>R0+R1;
Wherein:J is laser energy parameter, J0It is the breakdown threshold of liquid medium, J1For the breakdown threshold of material surface to be processed
Value, K be laser unit length loss factor in liquid medium, and Q is laser energy degree more than needed, and H is Laser Focusing point to be added
The distance of work material surface, R0It is J for laser energy0Laser action in liquid medium caused vacuole radius, R1For laser
Energy is J1Laser action in the radius of vacuole caused by material surface to be processed.
Preferably, the device also includes computer, and the computer is connected with the laser control panel.
Preferably, the device also includes three-dimensional mobile platform and three-dimensional mobile platform control panel, and the container is as three
Tie up on mobile platform, the three-dimensional mobile platform control panel is connected with the computer and the three-dimensional mobile platform respectively.
Preferably, the device also includes expanding focusing system control panel, described to expand focusing system control panel difference
With the computer and the laser beam expanding system.
Preferably, the material to be processed is titanium alloy, and the liquid medium is aqueous medium, wherein J=150mJ, H=
10mm。
Because processing operation is carried out in liquid medium, the method and devices of the double vacuoles of induced with laser a kind of has and following had
Beneficial effect:
1. Compound Machining effect is good:Double vacuoles in liquid medium are in expansion and compression process, caused strong shock wave
Both superpositions, act on material surface to be processed, realize the Compound Machining of material repeatedly or simultaneously.Due to it is caused be double empty
Bubble, shock strength is strong, acts on great efforts, and treating the pattern modification on rapidoprint surface etc. has positive role.
The regulation of 2.H values-more obvious double vacuoles can be produced:The compound of material to be processed that be produced as of double vacuoles adds
Work provides condition.Suitable H values are obtained by regulation, more obvious double vacuoles can be produced, shock strength is stronger, for
The high material to be processed of some hardness, still with well processed effect.
3. reduce material oxidation degree:Because processing operation is carried out in liquid medium, oxygen content is low, process
In, it is small large area material oxidation probability to be processed occur, reduces the degree of oxidation of material.
4. fuel factor is small.The good heat conduction effect of liquid medium, laser are exported, treated quickly with heat caused by material effects
Rapidoprint surface heat reduces rapidly.
Brief description of the drawings
Fig. 1 is a kind of double vacuole installation drawings of induced with laser of the present invention;
Fig. 2 (a) and Fig. 2 (b) is existing induced with laser list vacuole schematic diagram;
Fig. 3 is double vacuole producing method schematic diagrames in liquid medium;
Fig. 4 is Laser Focusing cavitation pitting shock wave detection figure;
Fig. 5 is material surface vacuole shock wave to be processed detection figure;
Fig. 6 is that double vacuoles detect pulse train figure in liquid medium;
Fig. 7 is that single vacuole detects pulse train figure in liquid medium;
Fig. 8 is that material surface list vacuole to be processed detects pulse train figure in liquid medium.
In figure:1- computers;2- laser control panels;3- lasers;4- speculums;5- expands focusing system;51- swashs
Light beam expander;52- condenser lenses;6- glass containers;7- liquid mediums;8- materials to be processed;9- three-dimensional mobile platforms;10- tri-
Tie up mobile platform control panel;11- expands focusing system control panel;12- material surface vacuoles to be processed;13- Laser Focusings
Cavitation pitting.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is further illustrated, but protection scope of the present invention is simultaneously
Not limited to this.
Technical solution of the present invention is further described below with reference to embodiment.
It is as shown in Figure 1 a kind of installation drawing of the double vacuoles of induced with laser of the present invention, including computer 1, laser control
Panel 2 processed, laser 3, speculum 4, expand focusing system 5, laser beam expander 51, condenser lens 52, glass container 6, liquid
Medium 7, material to be processed 8, three-dimensional mobile platform 9, three-dimensional mobile platform control panel 10 and expand focusing system control panel
11.The connecting laser control panel 2 of computer 1, three-dimensional mobile platform control panel 10 and expand focusing system chain of command
Plate 11, directly to laser control panel 2, three-dimensional mobile platform control panel 10 and the tune for expanding focusing system control panel 11
Control, the laser output of indirect control laser 3, the light beam for moving and expanding focusing system 5 of the three-dimensional of three-dimensional mobile platform 9
Expand and focus on.The laser control panel 2 is connected with computer 1 and laser 3 respectively, the control laser of laser 3
Output.The laser 3 is located at the high order end of light path, and the light beam that laser 3 is sent reflexes to by speculum 4 expands focusing system
On system 5.The focusing system 5 that expands includes laser beam expander 51 and condenser lens 52, and the reflected beams successively pass through laser beam expanding
Device 51 and condenser lens 52, are radiated in liquid medium 7, and now the spot size of light beam becomes big, beneficial to the spherical vacuole of generation.Institute
State glass container 6 and fill with liquid medium 7, be placed in three-dimensional mobile platform 9 fixed.The material to be processed 8 is placed in glass container 6
Interior fixation.The three-dimensional mobile platform 9 is connected with three-dimensional mobile platform control panel 10, realizes the three-dimensional of glass container 6
It is mobile.The three-dimensional mobile platform control panel 10 is connected with computer 1 and three-dimensional mobile platform 9 respectively, for controlling three-dimensional
The three-dimensional of mobile platform 9 is mobile.It is described to expand focusing system control panel 11 respectively with computer 1 and expanding the phase of focusing system 5
Even, for controlling the shape of vacuole.
A kind of method of the double vacuoles of induced with laser of the present invention, is to be placed in glass container 6 in three-dimensional mobile platform 9 admittedly
Fixed, material 8 to be processed is put into glass container 6 and fixed, and injects in liquid medium 7 to glass container 6, and laser is by expanding focusing
When liquid medium 7 to 8 surface of material to be processed is passed through after system 5, the suitable H values and laser parameter chosen via above-mentioned steps
J, vacuole can be produced simultaneously with the surface region of material 8 to be processed at the surface H of material 8 to be processed, i.e. induced with laser is double empty
Steep, then the vacuole in liquid medium 7 induces strong shock wave two caused by strong shock wave and the induction of the surface cavitation of material to be processed 8
Person is superimposed, and acts on the surface of material 8 to be processed repeatedly or simultaneously, realizes the processing of material surface to be processed.
Shock wave is much stronger than single vacuole caused by the double vacuoles of induced with laser.It is illustrated in figure 2 existing induced with laser list vacuole
Schematic diagram, two kinds are shared, first, the material to be processed 8 as shown in Fig. 2 (a) is horizontally placed in glass container 6, second, such as figure
Material to be processed 8 shown in 2 (b) is vertically placed in glass container 6, is brought into close contact in the left wall of glass container 6.Both sides
Formula can produce single vacuole, using single cavitation oscillation and crumble and fall caused strong shock wave, realize the laser of material surface to be processed
Processing.
Double vacuole schematic diagrames are illustrated in figure 3 in liquid medium.When the suitable laser energy density of selection, liquid medium 7
It is breakdown in focal point, produce material surface vacuole 12 and Laser Focusing cavitation pitting 13 to be processed, thump caused by two vacuoles
Ripple is superimposed, and acts on the surface of material 8 to be processed repeatedly or simultaneously, has the characteristics that impact pressure is high, material oxidation degree is low.
As shown in Figure 4 and Figure 5, respectively Laser Focusing cavitation pitting shock wave detection figure and with material surface vacuole to be processed
Shock wave detection figure.Due to the visual field limitation of high-frequency detection light beam, the shock wave of two positions can only be separately detected, it is directly anti-
High high forces can be produced by mirroring the shock wave of the double vacuoles of induced with laser, realize the impact processing of the double vacuoles of induced with laser.
A kind of double vacuole laser processings of the present invention, specifically comprise the following steps:
1) putting equipment:Put according to installation drawing, connect equipment, and after glass container 6 is placed in three-dimensional mobile platform 9
It is fixed;
2) fixed material to be processed:Material 8 to be processed is put into glass container 6 fixed.
3) H values are adjusted:H values refer to Laser Focusing point to the distance on material effects surface to be processed.By adjusting three-dimensional move
Moving platform 9 realizes different H values.Notice that H values somewhat take greatly, H should be met>R0+R1, R0It is J for laser energy0Laser
Act on caused vacuole radius, R in liquid medium1It is J for laser energy1Laser action produced in material surface to be processed
Vacuole radius;
4) liquid medium is injected:It is slowly injected into using measuring cup in liquid medium 7 to glass container 6, avoids liquid internal empty
Bubble produces, and liquid level is located at glass container 6 topmost;
5) laser parameter is set:Laser energy parameter J is set, makes J=J0+J1+ KH+Q, J0It is the laser of liquid medium 7
Breakdown threshold, J1For the laser breakdown threshold value of material surface to be processed, K is laser unit length loss system in liquid medium 7
Number, Q are laser energy degree more than needed, are obtained by limited trials, general value is 0-200mJ/cm2;
6) double vacuoles are produced:According to the parameter value of above-mentioned setting, laser, input parameter value are opened.Laser beam focus liquid
After body medium 7, radiate in material surface to be processed, while produce double vacuoles.Caused by double vacuoles strong shock wave superposition simultaneously or
It is iteratively operating on material surface to be processed.
Embodiment 1
Implement the laser of processing, λ=1064nm, pulsewidth 10ns, laser repetition rate 1Hz.
Titanium alloy is chosen as material to be processed, liquid medium is aqueous medium.
Glass container is placed in three-dimensional mobile platform and fixed.Material horizontal to be processed is positioned in glass container simultaneously
It is fixed.H values are adjusted by three-dimensional mobile platform, it is the experiment experience value for producing double vacuoles to take H=10mm.Slowly noted using measuring cup
Enter in liquid medium to glass container, avoid liquid internal vacuole from producing, liquid level is located at glass container topmost, fills aqueous medium
Full whole glass container.
Regulation expands focusing system, and experiment measures the breakdown threshold J of aqueous medium0=68mJ, the laser breakdown threshold of titanium alloy
It is worth for 55mJ, consults reference materials and understand that 1064nm infrared laser attenuation coefficient is 0.8-0.9/m, therefore the transmission loss in water is
8-9mJ, it is 18mJ to test the conventional angle value more than needed measured, according to J=J0+J1+ KH+Q, laser energy J=150mJ is set.
According to the parameter value of above-mentioned setting, laser, input parameter value are opened.Using high-speed camera Phantom
V2511 detects cavitation oscillation sequence chart, if Fig. 6 is that double vacuoles detect pulse train figures in liquid medium, due in Laser Focusing
Point and material surface to be processed puncture simultaneously, and the plasma for sending white light, while plasma pair are produced in the region of breakdown
Outer high speed expands, liquid medium 7 near continued compression, produces shock wave and double cavitation phenomenas.Pressure is high in initial vacuole bubble
In the liquid medium 7 of surrounding, it is big to expand outwardly change for vacuole under pressure difference effect.When vacuole radius reaches maximum, by the external world
Under pressure and surface tension constraint, vacuole starts to be compressed.When being compressed to minimum, bubble internal pressure is powerful in surrounding liquid medium 7
Static pressure, vacuole starts to rebound, and so on.Reciprocal time is more, and loss is bigger, until bubble collapse.
Embodiment 2
It is 80mJ to take laser energy value, slightly larger than the threshold value of laser breakdown aqueous medium, considers that laser is situated between in device and liquid
The loss transmitted in matter, other specification setting is identical with embodiment with device, detects single cavitation oscillation in liquid medium
Sequence chart such as Fig. 7.Now laser energy can only puncture liquid medium, when beam transmission to material surface to be processed, examine
Consider the absorption of liquid medium 7 and the breakdown threshold of material surface to be processed, have not been able to produce at material surface to be processed
Raw vacuole, therefore form single vacuole.
Embodiment 3
H values are adjusted by three-dimensional mobile platform, take H=0mm.Laser energy is arranged to 60mJ, other specification and embodiment 1
It is identical.Detect list cavitation oscillation sequence such as Fig. 8 at material surface to be processed.Now Laser Focusing point is in material table to be processed
Face, energy is big and exceedes the breakdown threshold of material surface to be processed, and other each point energy are smaller and are not enough to puncture liquid medium,
So only form vacuole in material surface to be processed.Because the barrier effect of material surface to be processed, the vacuole of formation is semicircle
Shape rather than circle.
It should be appreciated that although this specification is described according to each embodiment, not each embodiment only includes one
Individual independent technical scheme, this narrating mode of specification is only that those skilled in the art will should say for clarity
Bright book is as an entirety, and the technical solutions in the various embodiments may also be suitably combined, and forming those skilled in the art can be with
The other embodiment of understanding.
Those listed above is a series of to describe illustrating only for possible embodiments of the invention in detail,
They simultaneously are not used to limit the scope of the invention, all equivalent embodiments made without departing from skill spirit of the present invention or change
It should be included in the scope of the protection.
Claims (9)
- A kind of 1. method of the double vacuoles of induced with laser, it is characterised in that:Material immersion to be processed is fixed in liquid medium, laser Liquid medium and material surface to be processed are acted perpendicularly to, and is met:J=J0+J1+ KH+Q and H>R0+R1Double vacuoles are produced in Laser Focusing point and material surface to be processed;Wherein:J is laser energy, J0It is the breakdown threshold of liquid medium, J1For the breakdown threshold of material surface to be processed, K is sharp Light unit length loss factor in liquid medium, Q are laser energy degree more than needed, and H is Laser Focusing point to material table to be processed The distance in face, R0It is J for laser energy0Laser action in liquid medium caused vacuole radius, R1It is J for laser energy1 Laser action in the radius of vacuole caused by material surface to be processed.
- A kind of 2. method of the double vacuoles of induced with laser according to claim 1, it is characterised in that:The Q values are 0- 200mJ/cm2。
- A kind of 3. method of the double vacuoles of induced with laser according to claim 1, it is characterised in that:The material to be processed is One kind in aluminium, copper, iron, zinc or titanium alloy.
- A kind of 4. method of the double vacuoles of induced with laser according to claim 1, it is characterised in that:The liquid medium is One kind in water, silicone oil or electrolyte solution.
- 5. a kind of device for the method for realizing the double vacuoles of induced with laser described in claim 1, including laser control panel, laser Device, speculum, laser beam expanding system, the laser beam expanding system include laser beam expander and condenser lens, it is characterised in that:Institute State laser control panel with laser to be connected, control the output of laser device laser;The light beam that the laser is sent passes through Speculum is reflexed on laser beam expander;The output beam of laser beam expander is focused on material table to be processed by the condenser lens Distance is at H above face;The material immersion to be processed is fixed in the container for holding liquid medium;Pass through laser control face It is J=J that plate, which sets laser energy parameter,0+J1+ KH+Q, adjust the container position and meet H>R0+R1;Wherein:J is laser energy parameter, J0It is the breakdown threshold of liquid medium, J1For the breakdown threshold of material surface to be processed, K For laser, unit length loss factor, Q are laser energy degree more than needed in liquid medium, and H is Laser Focusing point to material to be processed Expect the distance on surface, R0It is J for laser energy0Laser action in liquid medium caused vacuole radius, R1For laser energy For J1Laser action in the radius of vacuole caused by material surface to be processed.
- 6. device according to claim 5, it is characterised in that:Also include computer, the computer and the laser Control panel connects.
- 7. device according to claim 6, it is characterised in that:Also include three-dimensional mobile platform and three-dimensional mobile platform controls Panel, the container are placed in three-dimensional mobile platform, the three-dimensional mobile platform control panel respectively with the computer and institute State three-dimensional mobile platform connection.
- 8. device according to claim 6, it is characterised in that:Also include expanding focusing system control panel, it is described to expand Focusing system control panel respectively with the computer and the laser beam expanding system.
- 9. device according to claim 6, it is characterised in that:The material to be processed is titanium alloy, the liquid medium For aqueous medium, wherein J=150mJ, H=10mm.
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CN107585756B (en) * | 2017-07-31 | 2020-03-31 | 江苏大学 | Device and method for preparing graphene by laser impact of carbon material in liquid medium |
CN107363796B (en) * | 2017-08-29 | 2019-06-28 | 江苏大学 | A kind of antarafacial multi-laser beam induces the device of more vacuoles |
CN107984086B (en) * | 2017-11-28 | 2019-12-31 | 江苏大学 | Method for manufacturing ultramicro group holes based on laser-induced cavitation collapse water jet |
CN108817673B (en) * | 2018-06-12 | 2020-11-20 | 江苏大学 | Laser cavitation bubble surface pretreatment device and method |
CN110640301A (en) * | 2019-08-26 | 2020-01-03 | 江苏大学 | Device and method for laser-induced large-area cavitation forming |
CN114425665B (en) * | 2022-02-14 | 2023-11-10 | 上海赛卡精密机械有限公司 | Water-guided laser system and double-layer material cutting method |
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